CN111112147B - Cob双站测试分编一体机 - Google Patents
Cob双站测试分编一体机 Download PDFInfo
- Publication number
- CN111112147B CN111112147B CN201911409620.XA CN201911409620A CN111112147B CN 111112147 B CN111112147 B CN 111112147B CN 201911409620 A CN201911409620 A CN 201911409620A CN 111112147 B CN111112147 B CN 111112147B
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- cob
- test
- test hole
- station
- cob material
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- 238000012360 testing method Methods 0.000 title claims abstract description 153
- 238000009954 braiding Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 167
- 238000003825 pressing Methods 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 238000007599 discharging Methods 0.000 claims description 17
- 238000002513 implantation Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 4
- 239000007943 implant Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011324 bead Substances 0.000 description 11
- 239000000523 sample Substances 0.000 description 11
- 239000002313 adhesive film Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 238000009940 knitting Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911409620.XA CN111112147B (zh) | 2019-12-31 | 2019-12-31 | Cob双站测试分编一体机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911409620.XA CN111112147B (zh) | 2019-12-31 | 2019-12-31 | Cob双站测试分编一体机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111112147A CN111112147A (zh) | 2020-05-08 |
CN111112147B true CN111112147B (zh) | 2023-12-29 |
Family
ID=70506570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911409620.XA Active CN111112147B (zh) | 2019-12-31 | 2019-12-31 | Cob双站测试分编一体机 |
Country Status (1)
Country | Link |
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CN (1) | CN111112147B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115069604B (zh) * | 2022-06-23 | 2023-07-25 | 深圳市标谱半导体股份有限公司 | 电子元件测试包装一体机 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201107321Y (zh) * | 2007-11-01 | 2008-08-27 | 德宏恩企业股份有限公司 | 具有检测转盘的检测机 |
CN101915763A (zh) * | 2010-07-23 | 2010-12-15 | 浙江晨丰灯头有限公司 | 一种灯头自动检测装置 |
CN202153213U (zh) * | 2011-07-27 | 2012-02-29 | 杨雅屹 | 扣件自动检测机 |
KR20130001284U (ko) * | 2011-08-17 | 2013-02-27 | 빈센트 양 | 체결부재 자동검출기 |
KR101342699B1 (ko) * | 2012-09-10 | 2013-12-20 | (주)에이피텍 | 엘이디 패키지 테스트 핸들러 |
CN105403576A (zh) * | 2015-12-03 | 2016-03-16 | 中银(宁波)电池有限公司 | 一种电池检测装置 |
CN105436100A (zh) * | 2015-12-25 | 2016-03-30 | 深圳市标谱半导体科技有限公司 | Smd led分光编带一体机 |
CN105964551A (zh) * | 2015-03-11 | 2016-09-28 | 万润科技股份有限公司 | 电子元件检测方法及装置 |
CN106950514A (zh) * | 2017-04-17 | 2017-07-14 | 山东晶泰星光电科技有限公司 | 用于测试led集成模组的测试机构及其分光机和编带机 |
JP2019012033A (ja) * | 2017-06-30 | 2019-01-24 | 日東精工株式会社 | 部品検査装置 |
CN109342019A (zh) * | 2018-10-23 | 2019-02-15 | 广州硅能照明有限公司 | 一种用于测试cob-led光源光斑的夹具及测试cob-led光源光斑的方法 |
CN211756991U (zh) * | 2019-12-31 | 2020-10-27 | 深圳市标谱半导体科技有限公司 | Cob双站测试分编一体机 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201537151A (zh) * | 2014-03-20 | 2015-10-01 | Ismeca Semiconductor Holding | 帶有遮光器的光學積分球 |
-
2019
- 2019-12-31 CN CN201911409620.XA patent/CN111112147B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201107321Y (zh) * | 2007-11-01 | 2008-08-27 | 德宏恩企业股份有限公司 | 具有检测转盘的检测机 |
CN101915763A (zh) * | 2010-07-23 | 2010-12-15 | 浙江晨丰灯头有限公司 | 一种灯头自动检测装置 |
CN202153213U (zh) * | 2011-07-27 | 2012-02-29 | 杨雅屹 | 扣件自动检测机 |
KR20130001284U (ko) * | 2011-08-17 | 2013-02-27 | 빈센트 양 | 체결부재 자동검출기 |
KR101342699B1 (ko) * | 2012-09-10 | 2013-12-20 | (주)에이피텍 | 엘이디 패키지 테스트 핸들러 |
CN105964551A (zh) * | 2015-03-11 | 2016-09-28 | 万润科技股份有限公司 | 电子元件检测方法及装置 |
CN105403576A (zh) * | 2015-12-03 | 2016-03-16 | 中银(宁波)电池有限公司 | 一种电池检测装置 |
CN105436100A (zh) * | 2015-12-25 | 2016-03-30 | 深圳市标谱半导体科技有限公司 | Smd led分光编带一体机 |
CN106950514A (zh) * | 2017-04-17 | 2017-07-14 | 山东晶泰星光电科技有限公司 | 用于测试led集成模组的测试机构及其分光机和编带机 |
JP2019012033A (ja) * | 2017-06-30 | 2019-01-24 | 日東精工株式会社 | 部品検査装置 |
CN109342019A (zh) * | 2018-10-23 | 2019-02-15 | 广州硅能照明有限公司 | 一种用于测试cob-led光源光斑的夹具及测试cob-led光源光斑的方法 |
CN211756991U (zh) * | 2019-12-31 | 2020-10-27 | 深圳市标谱半导体科技有限公司 | Cob双站测试分编一体机 |
Also Published As
Publication number | Publication date |
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CN111112147A (zh) | 2020-05-08 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Xiong Yajun Inventor after: Duan Xiongbin Inventor after: Xi Songtao Inventor before: Xiongyajun Inventor before: Duan Xiongbin Inventor before: Xi Songtao |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 1st-3rd, 5th-8th Floor, Building A, Tea Tree, Tongfuyu Industrial Park, Inner Ring Road, Sanwei Community, Hangcheng Street, Baoan District, Shenzhen, Guangdong, China Patentee after: Shenzhen Biaopu Semiconductor Co.,Ltd. Address before: Floor 9 and 10, Zone B, Chaxi Sanwei Second Industrial Zone, Xixiang Street, Bao'an District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address |