CN111108581A - 高深宽比沉积 - Google Patents
高深宽比沉积 Download PDFInfo
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- CN111108581A CN111108581A CN201880061340.1A CN201880061340A CN111108581A CN 111108581 A CN111108581 A CN 111108581A CN 201880061340 A CN201880061340 A CN 201880061340A CN 111108581 A CN111108581 A CN 111108581A
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 42
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 5
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
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- ZTAJIYKRQQZJJH-UHFFFAOYSA-N n-methyl-n-triethylsilylmethanamine Chemical compound CC[Si](CC)(CC)N(C)C ZTAJIYKRQQZJJH-UHFFFAOYSA-N 0.000 description 1
- KAHVZNKZQFSBFW-UHFFFAOYSA-N n-methyl-n-trimethylsilylmethanamine Chemical compound CN(C)[Si](C)(C)C KAHVZNKZQFSBFW-UHFFFAOYSA-N 0.000 description 1
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- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3327—Coating high aspect ratio workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76837—Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
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- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
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- Organic Chemistry (AREA)
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- General Chemical & Material Sciences (AREA)
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- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
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| US201762561336P | 2017-09-21 | 2017-09-21 | |
| US62/561,336 | 2017-09-21 | ||
| PCT/US2018/047067 WO2019060069A1 (en) | 2017-09-21 | 2018-08-20 | High aspect ratio deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111108581A true CN111108581A (zh) | 2020-05-05 |
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| CN201880061340.1A Pending CN111108581A (zh) | 2017-09-21 | 2018-08-20 | 高深宽比沉积 |
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| US (1) | US20200216959A1 (enExample) |
| JP (1) | JP2020534692A (enExample) |
| KR (1) | KR20200045565A (enExample) |
| CN (1) | CN111108581A (enExample) |
| SG (1) | SG11202001592XA (enExample) |
| WO (1) | WO2019060069A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI847136B (zh) * | 2021-08-23 | 2024-07-01 | 日商國際電氣股份有限公司 | 半導體裝置之製造方法、基板處理方法、基板處理裝置及程式 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200381623A1 (en) * | 2019-05-31 | 2020-12-03 | Applied Materials, Inc. | Methods of forming silicon nitride encapsulation layers |
| KR20220025758A (ko) | 2019-06-06 | 2022-03-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 고에너지 저선량 플라즈마를 이용하여 실리콘 질화물계 유전체 막들을 후처리하는 방법들 |
| TWI853988B (zh) | 2019-07-29 | 2024-09-01 | 美商應用材料股份有限公司 | 原子層沉積之多層封裝堆疊 |
| US11276570B2 (en) * | 2020-07-22 | 2022-03-15 | Applied Materials, Inc. | Multi-layer deposition and treatment of silicon nitride films |
| US12131903B2 (en) * | 2020-08-06 | 2024-10-29 | Applied Materials, Inc. | Pulsed-plasma deposition of thin film layers |
| US12142459B2 (en) * | 2020-09-08 | 2024-11-12 | Applied Materials, Inc. | Single chamber flowable film formation and treatments |
| US11800824B2 (en) | 2021-03-24 | 2023-10-24 | Applied Materials, Inc. | Low temperature silicon nitride/silicon oxynitride stack film with tunable dielectric constant |
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| US20030049375A1 (en) * | 2001-09-10 | 2003-03-13 | Tue Nguyen | Nanolayer thick film processing system and method |
| US20060105106A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Tensile and compressive stressed materials for semiconductors |
| CN103180483A (zh) * | 2010-09-17 | 2013-06-26 | 应用材料公司 | 用于在高深宽比的特征结构中沉积金属的方法 |
| JP2016063232A (ja) * | 2014-09-17 | 2016-04-25 | エーエスエム アイピー ホールディング ビー.ブイ. | SiNの堆積 |
| US20170084448A1 (en) * | 2015-09-18 | 2017-03-23 | Applied Materials, Inc. | Low temperature conformal deposition of silicon nitride on high aspect ratio structures |
| WO2017147150A1 (en) * | 2016-02-26 | 2017-08-31 | Versum Materials Us, Llc | Compositions and methods using same for deposition of silicon-containing film |
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| JP4610080B2 (ja) * | 2000-12-25 | 2011-01-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7745346B2 (en) * | 2008-10-17 | 2010-06-29 | Novellus Systems, Inc. | Method for improving process control and film conformality of PECVD film |
| JP2012149278A (ja) * | 2011-01-17 | 2012-08-09 | Mitsui Chemicals Inc | シリコン含有膜の製造方法 |
| JP2012216631A (ja) * | 2011-03-31 | 2012-11-08 | Tokyo Electron Ltd | プラズマ窒化処理方法 |
| US9385318B1 (en) * | 2015-07-28 | 2016-07-05 | Lam Research Corporation | Method to integrate a halide-containing ALD film on sensitive materials |
| KR102395997B1 (ko) * | 2015-09-30 | 2022-05-10 | 삼성전자주식회사 | 자기 저항 메모리 소자 및 그 제조 방법 |
| KR20170092760A (ko) * | 2016-02-04 | 2017-08-14 | 주식회사 원익아이피에스 | 기판 처리 방법 및 장치 |
-
2018
- 2018-08-20 WO PCT/US2018/047067 patent/WO2019060069A1/en not_active Ceased
- 2018-08-20 CN CN201880061340.1A patent/CN111108581A/zh active Pending
- 2018-08-20 US US16/648,209 patent/US20200216959A1/en not_active Abandoned
- 2018-08-20 SG SG11202001592XA patent/SG11202001592XA/en unknown
- 2018-08-20 KR KR1020207010974A patent/KR20200045565A/ko not_active Ceased
- 2018-08-20 JP JP2020515916A patent/JP2020534692A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030049375A1 (en) * | 2001-09-10 | 2003-03-13 | Tue Nguyen | Nanolayer thick film processing system and method |
| US20060105106A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Tensile and compressive stressed materials for semiconductors |
| CN103180483A (zh) * | 2010-09-17 | 2013-06-26 | 应用材料公司 | 用于在高深宽比的特征结构中沉积金属的方法 |
| JP2016063232A (ja) * | 2014-09-17 | 2016-04-25 | エーエスエム アイピー ホールディング ビー.ブイ. | SiNの堆積 |
| US20170084448A1 (en) * | 2015-09-18 | 2017-03-23 | Applied Materials, Inc. | Low temperature conformal deposition of silicon nitride on high aspect ratio structures |
| WO2017147150A1 (en) * | 2016-02-26 | 2017-08-31 | Versum Materials Us, Llc | Compositions and methods using same for deposition of silicon-containing film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI847136B (zh) * | 2021-08-23 | 2024-07-01 | 日商國際電氣股份有限公司 | 半導體裝置之製造方法、基板處理方法、基板處理裝置及程式 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200045565A (ko) | 2020-05-04 |
| WO2019060069A1 (en) | 2019-03-28 |
| JP2020534692A (ja) | 2020-11-26 |
| SG11202001592XA (en) | 2020-04-29 |
| US20200216959A1 (en) | 2020-07-09 |
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