CN111106016A - Solid state disk packaging method - Google Patents
Solid state disk packaging method Download PDFInfo
- Publication number
- CN111106016A CN111106016A CN201911360517.0A CN201911360517A CN111106016A CN 111106016 A CN111106016 A CN 111106016A CN 201911360517 A CN201911360517 A CN 201911360517A CN 111106016 A CN111106016 A CN 111106016A
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- Prior art keywords
- substrate
- solid state
- packaging
- chip
- state disk
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The invention belongs to the field of solid state disks, and discloses a solid state disk packaging method, which comprises the following steps: s1: thinning and scribing an incoming wafer to form single chips, wherein the chip types at least comprise a Controller chip, a flash chip and a Dram chip; s2: attaching the component on the surface of the substrate according to the BOM requirement of the product; s3: picking up a plurality of chips of three types to the substrate with the attached components and curing; s4: performing gold wire bonding on the cured substrate according to a bonding design drawing; s5: performing Mold process plastic packaging on the whole substrate after the gold wires are bonded; s6: cutting a U-shaped groove at the edge of the golden finger of the substrate after plastic package; and then cutting the substrate into a plurality of solid state disks. The invention reduces two packaging processes, further reduces the use of packaging materials, reduces labor cost and equipment loss, and reduces packaging time.
Description
Technical Field
The invention belongs to the field of solid state disks, and relates to a solid state disk packaging method.
Background
The SSD (Solid State Disk or Solid State Drive for short) Solid State Drive is composed of a control unit and a storage unit, and the traditional SSD is formed by assembling a Controller chip, a flash chip, a Drive chip and components on a PCB (printed Circuit Board) through SMT (surface mount technology) patches.
Referring to fig. 1, the assembly method requires the steps of separately packaging three functional ICs, SMT mounting, and assembling a metal housing, which results in a complex manufacturing process flow of the SSD; meanwhile, due to the fact that three functional chips are packaged independently, the packaged size is large relative to a wafer chip, and packaging materials, labor cost, equipment loss, turnover period and the like are improved to a certain extent through three times of packaging, so that the volume of an SSD finished product is large, the SSD finished product is not easy to carry, and the cost is high.
Disclosure of Invention
The invention aims to overcome the defects that in the prior art, an SSD needs to be packaged with three functional ICs, SMT (surface mount technology) patches and metal shell assembly steps, so that the SSD finished product is large in size, not easy to carry and high in cost, and provides a solid state disk packaging method.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a solid state disk packaging method comprises the following steps:
s1: thinning and scribing an incoming wafer to form single chips, wherein the chip types at least comprise a Controller chip, a flash chip and a Dram chip;
s2: attaching the component on the surface of the substrate according to the BOM requirement of the product;
s3: picking up a plurality of chips of three types to the substrate with the attached components and curing;
s4: performing gold wire bonding on the cured substrate according to a bonding design drawing;
s5: performing Mold process plastic packaging on the whole substrate after the gold wires are bonded;
s6: cutting a U-shaped groove at the edge of the golden finger of the substrate after plastic package; and then cutting the substrate into a plurality of solid state disks.
The invention further improves the following steps:
the specific method for thinning and scribing in the step S1 comprises the following steps:
when the thickness of the incoming material wafer is less than 50um, an SDBG process is adopted for thinning and scribing;
when 50um < incoming wafer thickness <100um, thinning dicing was performed using a Gettering DP wheel grind.
The specific method of S2 is as follows:
and attaching the components to the surface of the substrate by an SMT (surface mount technology) patch process according to the BOM requirements of the product.
The specific method of S3 is as follows:
picking up a plurality of chips of three types to a substrate with attached components through DA equipment, selecting a baking curve according to the characteristics of a glue film between the chips and the substrate, and fixing the chips on the substrate through a baking process according to the baking curve to realize curing.
When the Mold process in the S5 is used for plastic package, the plastic package material is black, white or yellow.
The specific method of S6 is as follows:
cutting U-shaped grooves with the size of a USB interface on the edges of a plurality of golden fingers of the substrate after plastic packaging through laser cutting; and then cutting the substrate into a plurality of solid state hard disks by water jet cutting.
Compared with the prior art, the invention has the following beneficial effects:
pick up on the base plate through DA equipment simultaneously with Controller chip, flash chip and three kinds of chips of Dram chip, then bake solidification and gold thread bonding, with the whole plastic envelope of base plate behind the gold thread bonding, then cut out the USB interface for realize solid state hard disk's plug and play, then with a plurality of solid state hard disk splits on the whole base plate, obtain a plurality of independent plug and play's solid state hard disk. In the whole packaging method, three chips, namely a Controller chip, a flash chip and a Dram chip, are integrated in one packaging process, and compared with the existing process of independently packaging the three chips, the packaging method reduces two packaging processes, further reduces the use of packaging materials, reduces the labor cost and equipment loss, and reduces the packaging time; meanwhile, only one packaging process is needed, so that the size of the manufactured solid state disk is small, the size of the manufactured solid state disk can be reduced by about 30% compared with that of a solid state disk manufactured by a common packaging mode, and the manufactured solid state disk is light in weight, convenient to carry and better in product reliability.
Drawings
FIG. 1 is a schematic flow chart of a conventional packaging method;
FIG. 2 is a schematic flow chart of the present invention;
FIG. 3 is a front view of a packaged finished solid state disk of the present invention;
FIG. 4 is a back view of a packaged finished solid state disk of the present invention;
FIG. 5 is a block flow diagram of the present invention.
Wherein: 1-a substrate; 2-golden finger; 3-U type groove.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 2 to 5, the method for packaging a solid state disk of the present invention includes the following steps:
s1: and thinning and scribing the supplied wafer to prepare a single chip, wherein the chip type comprises a Controller chip (a main control chip), a flash chip (a flash memory chip) and a Dram chip (an operating memory chip).
Specifically, the Controller wafer, the flash wafer and the Dram wafer are respectively subjected to thinning and scribing to prepare a Controller chip, a flash chip and a Dram chip. The three different types of wafer chips are different in process thickness requirement, different thinning processing processes are selected, and when the thickness of an incoming wafer is smaller than 50um, an SDBG (Standard scribing for shaping) process is adopted for thinning and scribing; when the thickness of the supplied wafer is more than 50um and less than 100um, grinding by a Gettering DP (dry polishing process) grinding wheel to thin and scribe; for a Low-K (Low dielectric constant film) process wafer, a laser grooving process is adopted for thinning and scribing.
S2: the components are attached to the surface of the substrate 1 through an SMT (surface mount technology) process according to the BOM (Bill of Material Bill of materials) requirements of products, the components comprise components such as resistance, capacitance and inductance, and welding pads are reserved when the substrate 1 is designed. The SMT is a surface mounting technique, and SMT mounting refers to a short series of processes performed on the basis of the substrate 1.
S3: picking up the Controller chip, the flash chip and the Dram chip obtained in the step S1 to the substrate 1 with the attached components through a DA (Die attach) device, wherein the Controller chip, the flash chip and the Dram chip can be stacked or arranged in a plane staggered manner, then selecting a baking curve according to the characteristics of an adhesive film between the chips and the substrate 1, and fixing the Controller chip, the flash chip and the Dram chip on the substrate 1 through a baking process to obtain the substrate 1 with the cured upper sheet.
S4: and performing gold wire bonding on the substrate 1 after the upper piece is solidified according to a preset bonding design drawing, connecting the bonding pad on the surface of the chip with the gold finger 2 of the substrate 1 in a gold wire bonding mode, and connecting the different types of chip bonding pads with the chip bonding pads and the chip bonding pads with the substrate 1 to form a complete closed circuit.
S5: performing Mold sealing on the whole substrate 1 bonded by the gold wire of S4 by the Mold process, wherein each substrate 1 comprises a plurality of solid state disks, and the plastic sealing material can be selected from different colors according to requirements, is generally black, and can also be molded into white, yellow and the like.
S6: the whole plastic-encapsulated substrate 1 is provided with a U-shaped groove 3 through laser cutting to form an interface with a USB function, the USB interface is located beside a golden finger 2 of the substrate 1, and then the whole substrate 1 is divided into a plurality of solid state disks through water jet cutting, three points and one line, and straight line cutting, so that a plug-and-play solid state disk finished product is obtained.
The solid state disk packaging method comprises the steps of picking up three chips, namely a Controller chip, a flash chip and a Dram chip, on a substrate 1 through DA equipment at the same time, then baking, curing and bonding gold wires, carrying out integral plastic package on the substrate 1 subjected to gold wire bonding, then cutting out a USB interface through laser to realize plug and play of the solid state disk, and then splitting a plurality of solid state disks on the whole substrate 1 through linear cutting by a water jet knife to obtain a plurality of independent plug and play solid state disks. In the whole packaging method, three chips, namely a Controller chip, a flash chip and a Dram chip, are integrated in one packaging process, and compared with the existing process of independently packaging the three chips, the packaging method reduces two packaging processes, further reduces the use of packaging materials, reduces the labor cost and equipment loss, and reduces the packaging time; meanwhile, only one packaging process is needed, so that the size of the manufactured solid state disk is small, the size of the manufactured solid state disk can be reduced by about 30% compared with that of a solid state disk manufactured by a common packaging mode, and the manufactured solid state disk is light in weight, convenient to carry and better in product reliability.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (6)
1. A solid state disk packaging method is characterized by comprising the following steps:
s1: thinning and scribing an incoming wafer to form single chips, wherein the chip types at least comprise a Controller chip, a flash chip and a Dram chip;
s2: attaching the component on the surface of the substrate according to the BOM requirement of the product;
s3: picking up a plurality of chips of three types to the substrate with the attached components and curing;
s4: performing gold wire bonding on the cured substrate according to a bonding design drawing;
s5: performing Mold process plastic packaging on the whole substrate after the gold wires are bonded;
s6: cutting a U-shaped groove at the edge of the golden finger of the substrate after plastic package; and then cutting the substrate into a plurality of solid state disks.
2. The method for packaging a solid state disk according to claim 1, wherein the specific method for thinning the scribe in S1 is as follows:
when the thickness of the incoming material wafer is less than 50um, an SDBG process is adopted for thinning and scribing;
when 50um < incoming wafer thickness <100um, thinning dicing was performed using a Gettering DP wheel grind.
3. The method for encapsulating the solid state disk according to claim 1, wherein the specific method of S2 is as follows:
and attaching the components to the surface of the substrate by an SMT (surface mount technology) patch process according to the BOM requirements of the product.
4. The method for encapsulating the solid state disk according to claim 1, wherein the specific method of S3 is as follows:
picking up a plurality of chips of three types to a substrate with attached components through DA equipment, selecting a baking curve according to the characteristics of a glue film between the chips and the substrate, and fixing the chips on the substrate through a baking process according to the baking curve to realize curing.
5. The method for packaging a solid state disk according to claim 1, wherein when performing Mold packaging by a Mold process in S5, the molding compound is black, white or yellow.
6. The method for encapsulating the solid state disk according to claim 1, wherein the specific method of S6 is as follows:
cutting U-shaped grooves with the size of a USB interface on the edges of a plurality of golden fingers of the substrate after plastic packaging through laser cutting; and then cutting the substrate into a plurality of solid state hard disks by water jet cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911360517.0A CN111106016A (en) | 2019-12-25 | 2019-12-25 | Solid state disk packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911360517.0A CN111106016A (en) | 2019-12-25 | 2019-12-25 | Solid state disk packaging method |
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| Publication Number | Publication Date |
|---|---|
| CN111106016A true CN111106016A (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911360517.0A Pending CN111106016A (en) | 2019-12-25 | 2019-12-25 | Solid state disk packaging method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609497A (en) * | 2015-12-29 | 2016-05-25 | 合肥宏晶微电子科技股份有限公司 | System-level packaging technology for VGA/YPbPr-to-HDMI interface module |
| CN205751528U (en) * | 2016-05-05 | 2016-11-30 | 深圳佰维存储科技股份有限公司 | Mobile solid state hard disc |
| CN209401305U (en) * | 2018-12-06 | 2019-09-17 | 上海威固信息技术股份有限公司 | A kind of highly integrated single-chip solid state hard disk |
-
2019
- 2019-12-25 CN CN201911360517.0A patent/CN111106016A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609497A (en) * | 2015-12-29 | 2016-05-25 | 合肥宏晶微电子科技股份有限公司 | System-level packaging technology for VGA/YPbPr-to-HDMI interface module |
| CN205751528U (en) * | 2016-05-05 | 2016-11-30 | 深圳佰维存储科技股份有限公司 | Mobile solid state hard disc |
| CN209401305U (en) * | 2018-12-06 | 2019-09-17 | 上海威固信息技术股份有限公司 | A kind of highly integrated single-chip solid state hard disk |
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Application publication date: 20200505 |