CN111105001B - Non-contact module packaging intelligent card and preparation method thereof - Google Patents
Non-contact module packaging intelligent card and preparation method thereof Download PDFInfo
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- CN111105001B CN111105001B CN201911189635.XA CN201911189635A CN111105001B CN 111105001 B CN111105001 B CN 111105001B CN 201911189635 A CN201911189635 A CN 201911189635A CN 111105001 B CN111105001 B CN 111105001B
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- 238000002360 preparation method Methods 0.000 title abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 239000003990 capacitor Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 238000002955 isolation Methods 0.000 claims abstract description 16
- 238000009413 insulation Methods 0.000 claims abstract description 14
- 238000004080 punching Methods 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 81
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a non-contact module packaging intelligent card and a preparation method thereof, wherein the preparation method comprises the following steps: the method comprises the steps that 1/3 of a module frame is provided with an isolation line, and the periphery of the module frame is provided with a connecting rib; a contact is arranged on the first surface of the module, and insulation treatment is carried out; the resistor and the capacitor are respectively connected with LA and LB on the module frame through a flip-chip technology by dispensing conductive adhesive, and the wafer chip is fixed with the module frame through back adhesive; the non-contact wafer chip is respectively subjected to pressure welding with the contacts reserved on the module frame in a pressure welding mode by using wires, or gold balls are arranged on LA and LB of the wafer chip, the contacts of the LA and LB of the wafer chip are downwards connected with the contacts reserved on the frame in a conductive adhesive mode, then the non-contact functional module is manufactured by injecting epoxy resin materials through a die, and finally the intelligent card is formed by punching cards. On the premise of ensuring the performance of the smart card, the preparation process is simple and efficient, and the thickness and the appearance of the prepared card have market competitiveness.
Description
Technical Field
The invention belongs to the technical field of smart cards, and particularly relates to a non-contact module packaging smart card and a preparation method thereof.
Background
Along with the wider and wider application of cards, market demands develop in a diversified way, and the requirements on radio frequency performance, product appearance and external dimensions of products are higher in addition to the application environment complexity of the market. The non-contact special-shaped card with MCC8+ winding in the prior art has better performance without adding harmonic capacitance and resistance.
Referring to fig. 1 and 2, an interposer for soldering MCC8 modules, capacitors and resistors on a PCB board appears in the market, and a special-shaped card is formed by winding. But also has drawbacks: 1. the method adds the steps of the product manufacturing realization process, and comprises the following steps: PCB plate making processing, module, capacitor and resistance welding, punching a PCB plate to form a hollowed-out base layer in lamination and the like; 2. the difficulty in manufacturing control is increased; the overall structure thickness is much thicker than the original direct butt-welding of MCC8 modules into the sandwich of the product due to the need to increase capacitance, resistance, PCB board thickness, and thus the thickness, appearance on the laminate of the card is difficult to control. Major disadvantages, such as: lamination imprinting, thickness superscalar, etc.; with the increasing competition of the sales price of the intelligent card and the increasing demand of customers on the appearance and the size, the sales of the product is directly influenced.
The invention realizes resonance and Q value adjustment in the non-contact module by processing the non-contact module; thereby realizing the cost and quality advantages of the product and meeting the market demands.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a non-contact module packaging intelligent card and a preparation method thereof, and the preparation process is simple and efficient on the premise of ensuring the performance of the intelligent card, and the thickness and the appearance of the prepared card have market competitiveness
In order to achieve the above purpose, the invention adopts the technical scheme that: a preparation method of a non-contact module packaging smart card comprises the following steps:
(1) A coil is arranged on the base material, and hollow holes with the same size and style as those of the epoxy resin in the non-contact module are arranged according to the position requirement of the coil;
(2) Adjusting the resonant frequency and the Q value through the capacitor and the resistance value according to the corresponding coil shape and the used wafer chip;
(3) Preparing a non-contact module:
3.1, arranging an isolation line at the 1/3 position of the module frame, wherein the width of the isolation line is required to be smaller than the size of the middle insulation size of two welding points of a capacitor and a resistor, and connecting the module frames separated into two parts at the periphery of the module frame through connecting ribs;
3.2, arranging non-contact wafer chips, capacitor and resistor contacts on the first surface of the module frame, and performing insulation treatment in the area except the contacts;
3.3, setting the positions of the non-contact wafer chip, the capacitor and the resistor on the first surface of the module frame, dispensing conductive adhesive, respectively connecting the resistor and the capacitor with LA and LB on the module frame through a flip-chip process, and fixing the wafer chip with the module frame through back adhesive;
3.4, using wires to respectively weld the non-contact wafer chip and the contact reserved on the module frame in a pressure welding manner, and forming a non-contact functional module on the surfaces of the capacitor, the resistor and the wafer chip by injection molding epoxy resin materials through a die;
(4) Placing the non-contact functional module in the hollowed-out hole and performing butt-welding combination with the coil; pressing the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through a hot pressing and cold pressing process; the card punching device forms a smart card with a non-contact function.
Further, in the step 3.2, the disposing the non-contact wafer chip, the capacitor and the resistor on the first surface of the module specifically includes:
the capacitor and the resistor are respectively connected with the non-contact wafer chips LA and LB in parallel, and the non-contact wafer chips are arranged at one 2/3 end.
Further, the insulating treatment in the area except the contact in step 3.2 specifically includes:
and performing oxidation insulation or spraying nano materials or a cushion layer.
Further, the preparing a non-contact module further includes:
4.1, arranging an isolation line on the flip layer, wherein the width of the isolation line is required to be smaller than the size of the insulating dimension between two welding spots of the capacitor and the resistor;
4.2, arranging non-contact wafer chips, capacitor and resistor contacts on the first surface of the flip-chip layer, and performing insulation treatment in the area except the contacts;
4.3, adding a supporting layer under the flip layer, and connecting the supporting layer with the back surface of the flip layer by using an insulating resin material to avoid short circuit between the upper layer and the lower layer;
4.4, arranging positions of non-contact wafer chips, capacitors and resistors on the first surface of the flip layer, dispensing conductive adhesive, respectively connecting the resistors and the capacitors with LA and LB on the module frame through a flip technology, fixing the non-contact wafer chips with the module frame through back adhesive, arranging gold balls on LA and LB of the wafer chips, and connecting the LA and LB contacts of the wafer chips downwards with reserved contacts on the frame in a conductive adhesive mode; and injecting epoxy resin material on the surfaces of the capacitor, resistor and wafer chip through a mold to form the non-contact functional module.
Further, the step 4.3 of connecting the support layer with the back surface of the flip-chip layer by using an insulating resin material specifically includes:
The outer diameter of the insulating layer is larger than that of the flip-chip layer and the supporting layer, and the minimum requirement is that the insulating layer is kept to be more than 0.1mm or the same as the supporting layer in size and is larger than that of the flip-chip layer by more than 0.1 mm.
Further, the substrate is PVC or PETG.
In order to achieve the above purpose, the invention adopts the technical scheme that: a non-contact module packaged smart card comprising a substrate, a coil, and a non-contact module according to any one of claims 1-6 disposed in a hollowed-out hole in the substrate.
The invention has the advantages that the preparation process is simple and efficient on the premise of ensuring the performance of the smart card, and the thickness and the appearance of the prepared smart card have market competitiveness.
Drawings
FIG. 1 is a schematic diagram of a contactless module package smart card according to an embodiment of the prior art;
FIG. 2 is a schematic diagram of another embodiment of a contactless module package smart card according to the prior art;
FIG. 3 is a schematic flow chart of a method for manufacturing a non-contact module packaged smart card according to the present invention;
FIG. 4 is a schematic view of a structure of a substrate punched hole and wound according to the present invention;
FIG. 5 is a schematic view of the structure of the module frame and surrounding connection bars of the present invention;
FIG. 6 is a schematic diagram of a module frame insulation process according to the present invention;
FIG. 7 is a schematic diagram of the structure of the treatment of the conductive adhesive in the present invention;
FIG. 8 is a schematic diagram of the structure of the wafer chip, resistor, and capacitor processing according to the present invention;
FIG. 9 is a schematic diagram of a wafer die bonding process according to the present invention;
FIG. 10 is a schematic diagram of a module packaging process according to the present invention;
FIG. 11 is a schematic diagram of an embodiment of a smart card according to the present invention;
FIG. 12 is a schematic diagram of a flip-chip process according to the present invention;
FIG. 13 is a schematic view of the structure of the support layer added in the present invention;
fig. 14 is a schematic structural diagram of another embodiment of the smart card according to the present invention.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the embodiment of the invention will be further described in detail with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Referring to fig. 3, fig. 3 is a flow chart of a method for manufacturing a non-contact module package smart card according to the present invention. The preparation method of the non-contact module packaging intelligent card provided by the invention comprises the following steps:
step 101: the base material is provided with a coil, and hollow holes with the same size and style as the epoxy resin in the non-contact module are arranged according to the position requirement of the coil.
It should be noted that the substrate used in the present invention is PVC or PETG. The hollowed-out holes are grooves with the same shape as the epoxy resin, and in order to avoid short circuit, the thickness of the base material is larger than that of the epoxy resin. Referring to fig. 4, the size and shape of the coil (e.g., circular, rectangular, elliptical, square, anisotropic …, etc.) are designed to determine the position of the hollowed-out hole according to the coil position requirement of the coil.
Step 102: and adjusting the resonant frequency and the Q value according to the corresponding coil shape and the capacitance and the resistance value of the wafer chip.
And adjusting the resonant frequency and the Q value through the capacitor and the resistance value according to the corresponding coil shape and the used wafer chip, so as to ensure that the resonant frequency and the Q value meet the test standard and the design requirement.
Step 103: a non-contact module is prepared.
It is also emphasized that in the preparation method provided by the invention, two schemes are included in the preparation of the non-contact module.
Scheme one includes the following steps:
and 1, arranging an isolation line at the 1/3 position of the module frame, wherein the width of the isolation line is required to be smaller than the size of the insulating dimension between two welding points of the capacitor and the resistor, and connecting the modules separated into two parts at the periphery of the module frame through connecting ribs.
I.e. the module frame is divided into two parts by means of the isolation wires. Preferably, the isolation lines are located at 1/3 of the module frame. Referring to fig. 5, the modules divided into two parts are connected by providing connection ribs at the periphery of the module frame. The capacitor and the resistor are generally packaged according to an ultrathin package 0201, and the numerical value of a parting line is set to be 0.3mm.
And 2, arranging non-contact wafer chips, capacitor and resistor contacts on the first surface of the module, and performing insulation treatment in the area except the contacts.
Referring to fig. 6, preferably, the capacitor and the resistor are respectively connected in parallel with the non-contact wafer chip la\lb, and the non-contact wafer chip is disposed at one 2/3 end, so that the non-contact wafer chip is protected.
The manner of performing the insulation treatment in the area other than the contact includes: and performing oxidation insulation or spraying nano materials or a cushion layer.
And 3, arranging positions of non-contact wafer chips, capacitors and resistors on the first surface of the module, dispensing conductive adhesive, respectively connecting the resistors and the capacitors with LA and LB on the module frame through a flip-chip process, and fixing the wafer chips with the module frame through back adhesive.
The conductive paste is dispensed at the locations of the non-contact wafer chip, capacitor and resistor, see fig. 7. The resistor and the capacitor are respectively connected with the non-contact wafer chips LA and LB through the flip-chip process, see fig. 8. Ensuring that the position of the non-contact wafer chip on the frame does not affect the subsequent process
And 4, respectively performing pressure welding on the non-contact wafer chip and the contact reserved on the module frame in a pressure welding mode by using wires, and performing injection molding of epoxy resin materials on the surfaces of the capacitor, the resistor and the wafer chip through a die to form the non-contact functional module.
Referring to fig. 9, the non-contact wafer chips are respectively pressure-welded with contacts reserved on the module frame by using wires in a pressure welding manner. The performance is prevented from being affected, referring to fig. 10, the surfaces of the capacitor, the resistor and the wafer chip are coated and protected by corresponding epoxy resin materials through mold injection, and la\lb on the frame is connected into a whole, so that a non-contact functional module with a strip is formed.
The scheme II comprises the following steps:
And 1, arranging an isolation line on the flip layer, wherein the width of the isolation line is required to be smaller than the size of the insulating dimension between two welding spots of the capacitor and the resistor.
Referring to fig. 12, the flip layer is divided, so that the division line is smaller than the contact spacing of la\lb, and the contacts of la\lb, capacitor and resistor are ensured to meet the corresponding standard specification requirements during flip; the positions of the dividing lines will be different according to the wafer chip LA/LB contact determination patterns.
And 2, arranging the contact points of the non-contact wafer chip, the capacitor and the resistor on the first surface of the flip-chip layer, and performing insulation treatment in the area except for the contact points.
And 3, adding a supporting layer below the flip layer, and connecting the supporting layer with the back surface of the flip layer by using an insulating resin material to avoid short circuits of the upper layer and the lower layer.
Referring to fig. 13, a support layer is added under the flip-chip layer, and the support layer is connected to the back surface of the flip-chip layer with an insulating resin material. In order to avoid short circuits between the upper layer and the lower layer in the manufacturing process, the outer diameter of the insulating layer is larger than that of the flip-chip layer and the supporting layer, and the large size is required to be kept to be more than 0.1mm or the same as that of the supporting layer and larger than that of the flip-chip layer by more than 0.1 mm.
And 4, arranging positions of non-contact wafer chips, capacitors and resistors on the first surface of the flip layer, dispensing conductive adhesive, respectively electrically connecting the resistors and the capacitors with LA and LB on the module frame through a flip technology, fixing the non-contact wafer chips with the module frame through back adhesive, and connecting the LA and LB contacts of the wafer chips downwards through the conductive adhesive with reserved contacts on the frame through arranging gold balls on the LA and LB of the wafer chips. In order to avoid the performance being influenced, the surfaces of the capacitor, the resistor and the wafer chip are required to be coated and protected by corresponding epoxy resin materials through mold injection, so that a non-contact functional module is formed.
Step 104: placing the non-contact functional module in the hollowed-out hole and performing butt-welding combination with the coil; pressing the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through a hot pressing and cold pressing process; the card punching device forms a smart card with a non-contact function.
Referring to fig. 11 and 14, the surface of the non-contact functional module with the epoxy resin is placed into the hollowed-out hole to be combined with the coil in a butt-welding manner; pressing the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through a hot pressing and cold pressing process; the card punching device forms a smart card with a non-contact function.
The invention also discloses a non-contact module packaging intelligent card. Referring to fig. 11 and 14, the smart card includes: a base material provided with a coil and a hollow hole, wherein a non-contact module is placed in the hollow hole. In a specific embodiment, referring to fig. 11, the non-contact module includes, in order from bottom to top: a module; an insulating layer; a conductive adhesive layer; a non-contact wafer chip, a capacitor, a resistor layer and an epoxy resin layer. The module is divided into two parts by an isolation line at 1/3 position, and the outer edge of the module is surrounded by a connecting rib. The resistor and the capacitor are respectively connected with the non-contact wafer chips LA and LB through a flip-chip technology, and the wafer chips are fixed with the module frame through back adhesive. The non-contact wafer chips are respectively connected with contacts reserved on the module frame in a pressure welding mode through wires. The capacitor and the resistor are respectively connected with the non-contact wafer chip LA\LB in parallel, and the non-contact wafer chip is arranged at one end of 2/3. The insulating layer is an oxide layer or a nano material layer or a cushion layer.
In a specific embodiment, referring to fig. 14, the non-contact module includes, in order from bottom to top: the semiconductor device comprises a supporting layer, a first insulating layer, a flip-chip layer, a second insulating layer, a conductive adhesive layer, a non-contact wafer chip, a capacitor, a resistor layer and an epoxy resin layer. The outer diameter of the insulating layer is larger than that of the flip-chip layer and the supporting layer, and the large size is required to be kept more than 0.1mm at minimum or the same as that of the supporting layer and is larger than that of the flip-chip layer by more than 0.1 mm.
Compared with the prior art, the non-contact module packaging smart card and the preparation method thereof provided by the invention have the advantages that the preparation process is simple and efficient on the premise of ensuring the performance of the smart card, and the thickness and the appearance of the prepared card have market competitiveness.
It will be appreciated by persons skilled in the art that the circuit of the present invention is not limited to the embodiments described in the detailed description, which has been given for the purpose of illustration only and not for the purpose of limitation. Other embodiments will occur to those skilled in the art from a consideration of the specification and practice of the invention as claimed and as claimed in the claims and their equivalents.
Claims (7)
1. A method for manufacturing a contactless module-packaged smart card, the method comprising:
(1) A coil is arranged on the base material, and hollow holes with the same size and style as those of the epoxy resin in the non-contact module are arranged according to the position requirement of the coil;
(2) Adjusting the resonant frequency and the Q value through the capacitor and the resistance value according to the corresponding coil shape and the used wafer chip;
(3) Preparing a non-contact module:
3.1, arranging an isolation line at the 1/3 position of the module frame, wherein the width of the isolation line is required to be smaller than the size of the middle insulation size of two welding points of a capacitor and a resistor, and connecting the module frames separated into two parts at the periphery of the module frame through connecting ribs;
3.2, arranging non-contact wafer chips, capacitor and resistor contacts on the first surface of the module frame, and performing insulation treatment in the area except the contacts;
3.3, setting the positions of the non-contact wafer chips, the capacitors and the resistors on the first surface of the module frame, dispensing conductive adhesive, respectively connecting the resistors and the capacitors with the wafer chips LA and LB on the module frame through a flip-chip process, and fixing the wafer chips with the module frame through back adhesive;
3.4, using wires to respectively weld the non-contact wafer chip and the contact reserved on the module frame in a pressure welding manner, and forming a non-contact functional module on the surfaces of the capacitor, the resistor and the wafer chip by injection molding epoxy resin materials through a die;
(4) Placing the non-contact functional module in the hollowed-out hole and performing butt-welding combination with the coil; pressing the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through a hot pressing and cold pressing process; the card punching device forms a smart card with a non-contact function.
2. The method for manufacturing the non-contact module package smart card according to claim 1, wherein the step 3.2 of disposing the non-contact wafer chip, the capacitor and the resistor contacts on the first surface of the module specifically includes:
the capacitor and the resistor are respectively connected with the non-contact wafer chips LA and LB in parallel, and the non-contact wafer chips are arranged at one 2/3 end.
3. The method for manufacturing the non-contact module package smart card according to claim 1, wherein the insulating treatment in the area except the contact in step 3.2 specifically comprises:
and performing oxidation insulation or spraying nano materials or a cushion layer.
4. A method for manufacturing a contactless module-packaged smart card, the method comprising:
(1) A coil is arranged on the base material, and hollow holes with the same size and style as those of the epoxy resin in the non-contact module are arranged according to the position requirement of the coil;
(2) Adjusting the resonant frequency and the Q value through the capacitor and the resistance value according to the corresponding coil shape and the used wafer chip;
(3) Preparing a non-contact module:
4.1, arranging an isolation line on the flip layer, wherein the width of the isolation line is required to be smaller than the size of the insulating dimension between two welding spots of the capacitor and the resistor;
4.2, arranging non-contact wafer chips, capacitor and resistor contacts on the first surface of the flip-chip layer, and performing insulation treatment in the area except the contacts;
4.3, adding a supporting layer under the flip layer, and connecting the supporting layer with the back surface of the flip layer by using an insulating resin material to avoid short circuit between the upper layer and the lower layer;
4.4, arranging positions of non-contact wafer chips, capacitors and resistors on the first surface of the flip layer, dispensing conductive adhesive, respectively connecting the resistors and the capacitors with the wafer chips LA and LB through a flip technology, fixing the non-contact wafer chips with a module frame through back adhesive, arranging gold balls on the LA and LB of the wafer chips, and connecting contacts of the wafer chips LA and LB downwards with reserved contacts on the frame in a conductive adhesive mode; and injecting epoxy resin material on the surfaces of the capacitor, resistor and wafer chip through a mold to form the non-contact functional module.
5. The method for manufacturing a non-contact module packaged smart card according to claim 4, wherein the step 4.3 of connecting the support layer and the back surface of the flip layer with an insulating resin material specifically comprises:
The outer diameter of the insulating layer is larger than that of the flip-chip layer and the supporting layer, and the large size is required to be kept more than 0.1mm at minimum or the same as that of the supporting layer and is larger than that of the flip-chip layer by more than 0.1 mm.
6. The method for manufacturing a non-contact module package smart card according to claim 1, wherein the base material is PVC or PETG.
7. A non-contact module packaged smart card, wherein the smart card comprises a substrate, a coil, and the non-contact module of any one of claims 1-6 positioned in a hollowed-out hole of the substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911189635.XA CN111105001B (en) | 2019-11-28 | 2019-11-28 | Non-contact module packaging intelligent card and preparation method thereof |
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| CN201911189635.XA CN111105001B (en) | 2019-11-28 | 2019-11-28 | Non-contact module packaging intelligent card and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM297502U (en) * | 2006-03-27 | 2006-09-11 | Taiwan Name Plate Co Ltd | Access control card with printing antenna |
| JP2007048183A (en) * | 2005-08-12 | 2007-02-22 | Dainippon Printing Co Ltd | Non-contact ic tag label |
| CN103839912A (en) * | 2012-11-22 | 2014-06-04 | 上海长丰智能卡有限公司 | Frameworks and framework tape used for minisize molded package card |
| CN207731308U (en) * | 2017-09-19 | 2018-08-14 | 广西申能达智能科技有限公司 | A kind of reading and writing device antenna device |
| CN109816079A (en) * | 2017-11-21 | 2019-05-28 | 北京握奇智能科技有限公司 | A kind of radio frequency payment mould group and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104361386B (en) * | 2014-11-06 | 2016-05-18 | 北京豹驰智能科技有限公司 | A kind of multilayer wiring formula manifold type double-interface card carrier band module |
-
2019
- 2019-11-28 CN CN201911189635.XA patent/CN111105001B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048183A (en) * | 2005-08-12 | 2007-02-22 | Dainippon Printing Co Ltd | Non-contact ic tag label |
| TWM297502U (en) * | 2006-03-27 | 2006-09-11 | Taiwan Name Plate Co Ltd | Access control card with printing antenna |
| CN103839912A (en) * | 2012-11-22 | 2014-06-04 | 上海长丰智能卡有限公司 | Frameworks and framework tape used for minisize molded package card |
| CN207731308U (en) * | 2017-09-19 | 2018-08-14 | 广西申能达智能科技有限公司 | A kind of reading and writing device antenna device |
| CN109816079A (en) * | 2017-11-21 | 2019-05-28 | 北京握奇智能科技有限公司 | A kind of radio frequency payment mould group and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 倒装焊接在压力敏感芯片封装工艺中的研究;金忠;谢锋;何迎辉;谢贵久;陈云峰;张川;潘喜成;杨毓彬;;电子与封装;20120920(第09期);全文 * |
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