CN111105001A - Non-contact module packaging smart card and preparation method thereof - Google Patents
Non-contact module packaging smart card and preparation method thereof Download PDFInfo
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- CN111105001A CN111105001A CN201911189635.XA CN201911189635A CN111105001A CN 111105001 A CN111105001 A CN 111105001A CN 201911189635 A CN201911189635 A CN 201911189635A CN 111105001 A CN111105001 A CN 111105001A
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- 238000002360 preparation method Methods 0.000 title abstract description 13
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000003990 capacitor Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 238000002955 isolation Methods 0.000 claims abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 87
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000011229 interlayer Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 238000012858 packaging process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
Abstract
The invention provides a non-contact module packaging intelligent card and a preparation method thereof, wherein the preparation method comprises the following steps: an isolation line is arranged at the position of the module frame 1/3, and a connecting rib is arranged at the periphery of the module frame; arranging a contact on the first surface of the module, and carrying out insulation treatment; the resistor and the capacitor are respectively connected with LA and LB on the module frame through a flip-chip process by a point conductive adhesive, and the wafer chip is fixed with the module frame through a back adhesive; and respectively carrying out pressure welding on the non-contact wafer chip and the contacts reserved on the module frame by using a wire in a pressure welding mode or arranging gold balls on the LA and LB of the wafer chip, connecting the LA and LB contacts of the wafer chip downwards with the contacts reserved on the frame in a conductive adhesive mode, then making a non-contact functional module by using a mold injection molding epoxy resin material, and finally forming the blunderpunch card into the intelligent card. On the premise of ensuring the performance of the intelligent card, the preparation process is simple and efficient, and the thickness and the appearance of the prepared card have market competitiveness.
Description
Technical Field
The invention belongs to the technical field of smart cards, and particularly relates to a non-contact module packaged smart card and a preparation method thereof.
Background
With the wider application of cards, the market demand is diversified, and the requirements on radio frequency, product appearance and product overall dimension are higher due to the complexity of the application environment of the market. The non-contact special-shaped card with MCC8+ winding in the prior art has better performance without adding tuning capacitance and resistance.
Referring to fig. 1 and 2, a PCB with MCC8 modules, capacitors and resistors soldered thereon is available, and a special-shaped card is formed by winding. But there are also drawbacks: 1. the method adds the process steps of product manufacturing and realization, and comprises the following steps: PCB plate making processing, module, capacitor and resistance welding, punching a PCB plate, hollowing out a base layer in lamination and the like; 2. the manufacturing control difficulty is increased; due to the need to increase capacitance, resistance, PCB board thickness, the overall structure thickness is much thicker than originally by direct stitch bonding of MCC8 modules into the sandwich of the product, making thickness, appearance on lamination of cards difficult to control. Major disadvantages, such as: lamination marks, overproof thickness and the like; with the increasingly fierce competition of the selling price of the smart card and the increasingly high requirements of customers on appearance and size, the product selling is directly influenced.
The invention realizes resonance and Q value adjustment in the non-contact module by processing the non-contact module; thereby realizing the advantages of the product in cost and quality and meeting the market demand.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a non-contact module packaged intelligent card and a preparation method thereof, on the premise of ensuring the performance of the intelligent card, the preparation process is simple and efficient, and the thickness and the appearance of the prepared card have market competitiveness
In order to achieve the above purposes, the invention adopts the technical scheme that: a method for preparing a non-contact module packaged smart card comprises the following steps:
(1) the coil is arranged on the base material, and hollow holes with the same size and pattern as the epoxy resin in the non-contact module are arranged according to the position requirement of the coil;
(2) adjusting resonance frequency and Q value according to the corresponding coil shape and the used wafer chip through capacitance and resistance values;
(3) preparing a non-contact module:
3.1 arranging an isolation line at the position of a module frame 1/3, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding points of a capacitor and a resistor, and the module frame divided into two parts is connected with the periphery of the module frame through a connecting rib;
3.2 arranging a non-contact wafer chip, a contact of a capacitor and a resistor on the first surface of the module frame, and carrying out insulation treatment in the area outside the contact;
3.3 arranging positions of a non-contact wafer chip, a capacitor and a resistor on the first surface of the module frame, dispensing a conductive adhesive, respectively connecting the resistor and the capacitor with LA and LB on the module frame through a flip-chip process, and fixing the wafer chip with the module frame through back adhesive;
3.4, respectively carrying out pressure welding on the non-contact wafer chip and the contacts reserved on the module frame by using wires in a pressure welding mode, and injecting an epoxy resin material on the surfaces of the capacitor, the resistor and the wafer chip through a mould to form a non-contact functional module;
(4) placing the non-contact functional module in a hollow hole, and performing butt-welding combination with a coil; laminating the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through hot pressing and cold pressing; the card punching device forms an intelligent card with a non-contact function.
Further, the step 3.2 of setting the non-contact wafer chip, the capacitor and the resistor on the first surface of the module specifically includes:
the capacitor and the resistor are respectively connected with the non-contact wafer chip LA \ LB in parallel, and the non-contact wafer chip is arranged at one end of 2/3.
Further, the method for performing the insulation treatment on the region outside the contact in step 3.2 specifically includes:
and carrying out oxidation insulation or spraying a nano material or a cushion layer.
Further, the preparing the non-contact module further includes:
4.1, arranging an isolation line on the inverted layer, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding spots of a capacitor and a resistor;
4.2 arranging a non-contact wafer chip, a contact of a capacitor and a resistor on the first surface of the flip layer, and carrying out insulation treatment in an area outside the contact;
4.3 adding a supporting layer below the inverted layer, and connecting the supporting layer with the back of the inverted layer by using an insulating resin material to avoid short circuit of the upper layer and the lower layer;
4.4 arranging positions of a non-contact wafer chip, a capacitor and a resistor on the first surface of the flip layer, dispensing a conductive adhesive, respectively connecting the resistor and the capacitor with LA and LB on the module frame through a flip process, fixing the non-contact wafer chip with the module frame through back adhesive on the back surface, arranging gold balls on the LA and LB of the wafer chip, and connecting LA and LB contacts of the wafer chip downwards with contacts reserved on the frame in a conductive adhesive mode; and injecting an epoxy resin material on the surfaces of the capacitor, the resistor and the wafer chip through a mould to form a non-contact functional module.
Further, the step 4.3 of connecting the supporting layer and the back surface of the flip chip layer by using an insulating resin material specifically includes:
the outer diameter of the insulating layer is larger than the inverted layer and the supporting layer, and the minimum requirement is that the size of the insulating layer is kept more than 0.1mm or the size of the insulating layer is the same as that of the inverted layer and is larger than the inverted layer by more than 0.1 mm.
Further, the base material is PVC or PETG.
In order to achieve the above purposes, the invention adopts the technical scheme that: a contactless module packaged smart card comprising a substrate, a coil, and the contactless module of any one of claims 1-6 disposed in a through hole of the substrate.
The non-contact module packaged intelligent card and the preparation method thereof have the advantages that the preparation process is simple and efficient on the premise of ensuring the performance of the intelligent card, and the thickness and the appearance of the prepared card have market competitiveness.
Drawings
FIG. 1 is a schematic diagram of a contactless module packaged smart card according to one embodiment of the prior art;
FIG. 2 is a schematic diagram of another embodiment of a contactless module packaged smart card of the prior art;
FIG. 3 is a schematic flow chart of a method for manufacturing a contactless module packaged smart card according to the present invention;
FIG. 4 is a schematic view of the present invention for punching holes and winding on a substrate;
FIG. 5 is a schematic structural view of the module frame and the surrounding connecting ribs being processed in the present invention;
FIG. 6 is a schematic structural view of the module frame insulation process according to the present invention;
FIG. 7 is a schematic structural view of the treatment of the conductive paste according to the present invention;
FIG. 8 is a schematic diagram of a structure for processing a wafer chip, a resistor and a capacitor according to the present invention;
FIG. 9 is a schematic view of a wafer bonding process according to the present invention;
FIG. 10 is a schematic structural diagram illustrating a module packaging process according to the present invention;
FIG. 11 is a schematic structural diagram of an embodiment of a smart card according to the present invention;
FIG. 12 is a schematic diagram of the structure of the flip-chip process of the present invention;
FIG. 13 is a schematic view of the structure of the present invention with the addition of a support layer;
fig. 14 is a schematic structural diagram of another embodiment of the smart card according to the present invention.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be further described in detail with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a method for manufacturing a contactless module packaged smart card according to the present invention. The invention provides a preparation method of a non-contact module packaged intelligent card, which comprises the following steps:
step 101: the coil is arranged on the substrate, and the hollow holes with the same size and pattern as the epoxy resin in the non-contact module are arranged according to the position requirement of the coil.
It should be noted that the substrate used in the present invention is PVC or PETG. The hollow holes are grooves with the same shape as the epoxy resin, and in order to avoid short circuit, the thickness of the base material is larger than that of the epoxy resin. Referring to fig. 4, the required coil shape size and shape pattern (e.g., circle, rectangle, ellipse, square, special shape …, etc.) are designed, and the position of the hollowed-out hole is determined according to the coil position requirement of the coil.
Step 102: and adjusting the resonant frequency and the Q value according to the corresponding coil shape and the used wafer chip through the capacitance and the resistance value.
And adjusting the resonant frequency and the Q value according to the corresponding coil shape and the used wafer chip through the capacitance and the resistance value, and ensuring that the resonant frequency and the Q value meet the test standard and the design requirement.
Step 103: a non-contact module is prepared.
It is also emphasized that the present invention provides a method of manufacturing a non-contact module that includes two options.
The first scheme comprises the following steps:
1, arranging an isolation line at the position 1/3 of a module frame, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding points of a capacitor and a resistor, and the module frame is externally connected with the module divided into two parts by a connecting rib.
I.e. the module frame is divided into two parts by the separation lines. Preferably, the isolation lines are located at the location of module frame 1/3. Referring to fig. 5, the module divided into two parts is connected by providing a connection rib at the periphery of the module frame. The capacitor and the resistor are generally packaged according to the ultrathin package 0201, and the numerical value of a dividing line is set to be 0.3 mm.
2, arranging non-contact wafer chips, capacitors and resistors on the first surface of the module, and carrying out insulation treatment on the area except the contacts.
Referring to fig. 6, preferably, the capacitor and the resistor are respectively connected in parallel with the non-contact wafer chip LA \ LB, which is disposed at one end of 2/3, so as to protect the non-contact wafer chip.
The method for performing insulation treatment in the region outside the contact includes: and carrying out oxidation insulation or spraying a nano material or a cushion layer.
And 3, arranging positions of a non-contact wafer chip, a capacitor and a resistor on the first surface of the module, dispensing conductive adhesive, respectively connecting the resistor and the capacitor with LA and LB on the module frame through an inversion process, and fixing the wafer chip with the module frame through back gum.
And (5) dot conductive adhesive on the positions of the non-contact wafer chip, the capacitor and the resistor, and referring to fig. 7. The resistor and the capacitor are connected to the non-contact wafer chips LA and LB by a flip-chip process, respectively, as shown in fig. 8. Ensure that the position of the non-contact wafer chip on the frame does not influence the next process
And 4, respectively carrying out pressure welding on the non-contact wafer chip and the contacts reserved on the module frame by using wires in a pressure welding mode, and injecting an epoxy resin material on the surfaces of the capacitor, the resistor and the wafer chip through a mould to form a non-contact functional module.
Referring to fig. 9, the non-contact wafer chip is respectively pressure-welded to the contacts reserved on the module frame by using a wire material through a pressure welding method. To avoid performance influence, referring to fig. 10, the surfaces of the capacitor, the resistor and the wafer chip are wrapped and protected by injecting corresponding epoxy resin material through a mold, and LA \ LB on the frame are connected into a whole, so as to form a module with a non-contact function.
The second scheme comprises the following steps:
1, arranging an isolation line on the flip layer, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding spots of a capacitor and a resistor.
Referring to fig. 12, the flip layer is divided to ensure that the division line is smaller than the contact pitch of LA \ LB and ensure that the contacts of LA \ LB and the capacitor and the resistor meet the corresponding standard specification requirements during flip; the position of the dividing line will be different according to the determined pattern of LA \ LB contact of the wafer chip.
2, arranging a non-contact wafer chip, a capacitor and a resistor contact on the first surface of the flip-chip layer, and carrying out insulation treatment on the region except the contact.
3 add the supporting layer under the flip-chip layer, be connected the supporting layer with the flip-chip layer back with insulating resin material, avoid upper and lower layer short circuit.
Referring to fig. 13, a support layer is added under the flip chip layer, and the support layer is connected to the back surface of the flip chip layer with an insulating resin material. In order to avoid short circuit between an upper layer and a lower layer caused in the manufacturing process, the outer diameter of the insulating layer is larger than the inverted layer and the supporting layer, and the minimum requirement is that the size of the insulating layer is more than 0.1mm or the size of the insulating layer is the same as that of the inverted layer and is more than 0.1mm larger than that of the inverted layer.
4 set up the position of non-contact wafer chip, electric capacity and resistance at the first face of flip-chip layer to some conducting resin carries out electrical connection respectively with resistance, electric capacity through flip-chip technology and module frame on LA, LB, and non-contact wafer chip is fixed through back gum and module frame, through set up the gold ball on LA, LB at wafer chip, is connected wafer chip LA, LB contact down through the contact that the conducting resin form was reserved on with the frame. In order to avoid performance influence, the surfaces of the capacitor, the resistor and the wafer chip need to be wrapped and protected by injecting corresponding epoxy resin materials through a mold, so that a module with a non-contact function is formed.
Step 104: placing the non-contact functional module in a hollow hole, and performing butt-welding combination with a coil; laminating the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through hot pressing and cold pressing; the card punching device forms an intelligent card with a non-contact function.
Referring to fig. 11 and 14, the surface with the epoxy resin on the non-contact functional module is placed in the hollow hole and is subjected to butt-welding combination with the coil; laminating the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through hot pressing and cold pressing; the card punching device forms an intelligent card with a non-contact function.
The invention also discloses a non-contact module packaging smart card. Referring to fig. 11 and 14, the smart card includes: the non-contact module is arranged in the hollow hole. In a specific embodiment, referring to fig. 11, the non-contact module sequentially includes, from bottom to top: a module; an insulating layer; a conductive adhesive layer; non-contact wafer chip, electric capacity, resistive layer and epoxy layer. The module is divided into two parts by the separation line at 1/3, and the connecting rib is surrounded on the outer edge of the module. The resistor and the capacitor are respectively connected with the non-contact wafer chips LA and LB through a flip-chip process, and the wafer chips are fixed with the module frame through back glue. The non-contact wafer chip is connected with the contacts reserved on the module frame in a pressure welding mode through wires. The capacitor and the resistor are respectively connected with the non-contact wafer chip LA \ LB in parallel, and the non-contact wafer chip is arranged at one end of 2/3. The insulating layer is an oxide layer or a nano material layer or a cushion layer.
In a specific embodiment, referring to fig. 14, the non-contact module sequentially includes, from bottom to top: the chip comprises a supporting layer, a first insulating layer, a flip chip layer, a second insulating layer, a conductive adhesive layer, a non-contact wafer chip, a capacitor, a resistance layer and an epoxy resin layer. The outer diameter of the insulating layer is larger than the inverted layer and the supporting layer, and the minimum requirement is that the size of the insulating layer is kept more than 0.1mm or the size of the insulating layer is the same as that of the inverted layer and is larger than the inverted layer by more than 0.1 mm.
Different from the prior art, the non-contact module packaged intelligent card and the preparation method thereof provided by the invention have the advantages that the preparation process is simple and efficient on the premise of ensuring the performance of the intelligent card, and the thickness and the appearance of the prepared card have market competitiveness.
It will be appreciated by persons skilled in the art that the circuit of the present invention is not limited to the embodiments described in the detailed description, and the above detailed description is for the purpose of illustrating the invention and is not intended to limit the invention. Other embodiments will be apparent to those skilled in the art from the following detailed description, which is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A method for manufacturing a contactless module packaged smart card, the method comprising:
(1) the coil is arranged on the base material, and hollow holes with the same size and pattern as the epoxy resin in the non-contact module are arranged according to the position requirement of the coil;
(2) adjusting resonance frequency and Q value according to the corresponding coil shape and the used wafer chip through capacitance and resistance values;
(3) preparing a non-contact module:
3.1 arranging an isolation line at the position of a module frame 1/3, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding points of a capacitor and a resistor, and the module frame divided into two parts is connected with the periphery of the module frame through a connecting rib;
3.2 arranging a non-contact wafer chip, a contact of a capacitor and a resistor on the first surface of the module frame, and carrying out insulation treatment in the area outside the contact;
3.3 arranging positions of a non-contact wafer chip, a capacitor and a resistor on the first surface of the module frame, dispensing a conductive adhesive, respectively connecting the resistor and the capacitor with LA and LB on the module frame through a flip-chip process, and fixing the wafer chip with the module frame through back adhesive;
3.4, respectively carrying out pressure welding on the non-contact wafer chip and the contacts reserved on the module frame by using wires in a pressure welding mode, and injecting an epoxy resin material on the surfaces of the capacitor, the resistor and the wafer chip through a mould to form a non-contact functional module;
(4) placing the non-contact functional module in a hollow hole, and performing butt-welding combination with a coil; laminating the upper interlayer, the lower interlayer, the printing layer, the protective film and the coil base material with the non-contact module through hot pressing and cold pressing; the card punching device forms an intelligent card with a non-contact function.
2. The method for manufacturing a non-contact module packaged smart card according to claim 1, wherein the step 3.2 of providing the non-contact wafer chip, the capacitor and the resistor on the first surface of the module specifically comprises:
the capacitor and the resistor are respectively connected with the non-contact wafer chip LA \ LB in parallel, and the non-contact wafer chip is arranged at one end of 2/3.
3. The method for manufacturing a contactless module packaged smart card according to claim 1, wherein the insulation treatment in the region outside the contact in step 3.2 specifically includes:
and carrying out oxidation insulation or spraying a nano material or a cushion layer.
4. The method of manufacturing a contactless module packaged smart card according to claim 1, wherein the manufacturing the contactless module further comprises:
4.1, arranging an isolation line on the inverted layer, wherein the width of the isolation line is required to be smaller than the size of the middle insulation dimension of two welding spots of a capacitor and a resistor;
4.2 arranging a non-contact wafer chip, a contact of a capacitor and a resistor on the first surface of the flip layer, and carrying out insulation treatment in an area outside the contact;
4.3 adding a supporting layer below the inverted layer, and connecting the supporting layer with the back of the inverted layer by using an insulating resin material to avoid short circuit of the upper layer and the lower layer;
4.4 arranging positions of a non-contact wafer chip, a capacitor and a resistor on the first surface of the flip layer, dispensing a conductive adhesive, respectively connecting the resistor and the capacitor with the coils LA and LB through a flip process, fixing the non-contact wafer chip with the module frame through back adhesive on the back surface, arranging gold balls on the LA and LB of the wafer chip, and connecting the LA and LB contacts of the wafer chip downwards with the contacts reserved on the frame in a conductive adhesive mode; and injecting an epoxy resin material on the surfaces of the capacitor, the resistor and the wafer chip through a mould to form a non-contact functional module.
5. The method for manufacturing a contactless module packaged smart card according to claim 4, wherein the step 4.3 of connecting the supporting layer and the back surface of the flip layer with the insulating resin material specifically comprises:
the outer diameter of the insulating layer is larger than the inverted layer and the supporting layer, and the minimum requirement is that the size of the insulating layer is kept more than 0.1mm or the size of the insulating layer is the same as that of the inverted layer and is larger than the inverted layer by more than 0.1 mm.
6. The method of claim 1, wherein the substrate is PVC or PETG.
7. A contactless module packaged smart card, wherein the smart card comprises a substrate, a coil, and the contactless module according to any one of claims 1 to 6, which is located in a through hole of the substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911189635.XA CN111105001A (en) | 2019-11-28 | 2019-11-28 | Non-contact module packaging smart card and preparation method thereof |
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| CN201911189635.XA CN111105001A (en) | 2019-11-28 | 2019-11-28 | Non-contact module packaging smart card and preparation method thereof |
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| Title |
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| 金忠;谢锋;何迎辉;谢贵久;陈云峰;张川;潘喜成;杨毓彬;: "倒装焊接在压力敏感芯片封装工艺中的研究", 电子与封装, no. 09, 20 September 2012 (2012-09-20) * |
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