JPH1159040A - Radio module and radio card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radio module having excellent mass productivity, low cost and high reliability and a radio card having the module. SOLUTION: A first part of an antenna 12 is formed on a front surface 10a of a base plate 10, and a second part of the antenna is formed on a rear surface of the plate 10. An LSI 14 is mounted inside the first part of the antenna on the front surface of the plate, and connected to inside ends of the first and second parts of the antenna. Outside ends of the first and second parts of the antenna are conducted via a conducting part 16a. A dam pattern 22 is formed by a wiring pattern on a periphery of the LSI 14 on the front surface of the plate and functioned as locking at the time of filling sealing material. The pattern 22 is conducted with the first part of the antenna to constitute part of the antenna.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless module used for a thin electronic device for performing non-contact data communication and a wireless card including the same.

[0002]

2. Description of the Related Art As a thin electronic device of this type, for example, a wireless module incorporated in a wireless card is generally mounted on a board made of an insulating material, an antenna provided on the board, and mounted on the board. Electronic components such as an LSI and a capacitor connected to the antenna.

An LSI and a lead wire connecting the LSI and an antenna are covered and sealed with a sealing material such as a resin. The LSI sealing method is as follows: 1) A method of covering an LSI mounting portion on a substrate with a mold and pouring a resin into the space to cure the resin (injection molding). Alternatively, a method is generally used in which a dam is formed by attaching other members, and a resin is poured into the inside of the dam and cured.

[0004] The antenna of the wireless module is constituted by a wire-wound antenna or a wiring pattern formed on a substrate. The antenna is generally formed in a shape that matches the outer shape of the substrate.

As the capacitor, a chip capacitor mounted on a substrate or a capacitor built in an LSI is used. When the face-down method is used as the LSI mounting method, a plurality of connection pads are uniformly arranged on the surface of the LSI.

[0006]

However, in the case of sealing the LSI by injection molding in the above-described wireless module, since the resin to be poured is very high temperature, it is necessary to use a substrate having excellent heat resistance as the substrate. is there. In addition, equipment such as a molding apparatus and a sealing mold is required, which increases the manufacturing cost as a whole.

On the other hand, in a method of pouring a sealing material into a dam, as a method of forming a dam, a method of bonding a dam material to a substrate and a method of printing a resist layer at a predetermined position on a substrate are used. . In the former method, it is necessary to adhere the dam material to a predetermined position on the substrate, which makes mass production low and
In the latter method, when the wireless module is formed into a card, the resist layer has poor adhesiveness to an adhesive, so that the card may be peeled off at the resist layer portion after forming the card.

When a wound antenna is used as the antenna, it is difficult to secure the flatness of the card. When the antenna is formed only on one side of the substrate, the degree of freedom in arranging the LSI is reduced.

Further, in the conventional wireless module, a capacitor built in an LSI or a chip capacitor separately provided is used as a resonance capacitor. In the former case, the size of the LSI is increased, the mechanical strength is reduced, and the size of the entire wireless module is increased. In the latter case, the assemblability is reduced and the total thickness of the wireless module is increased.

The present invention has been made in view of the above circumstances, and has as its object to provide an inexpensive and highly reliable wireless module excellent in mass productivity, and a wireless card provided with the same.

Another object of the present invention is to provide a wireless module having a high degree of freedom in arranging electronic components and having excellent productivity, and a wireless card provided with the wireless module. Still another object of the present invention is to provide a wireless module having improved mechanical strength and excellent productivity, and a wireless card provided with the same.

[0012]

In order to achieve the above object, a wireless module according to the present invention comprises a substrate, a wiring pattern formed on the substrate, an antenna for performing data communication, and an antenna on the substrate. An electronic component mounted on the antenna and connected to the antenna, and a sealing material covering and sealing the electronic component, and the wiring pattern formed on the substrate is formed so as to surround the electronic component. And a dam pattern forming a dam of the sealing material.

The dam pattern is electrically connected to the antenna to form a part of the antenna, or is formed electrically independent of other wiring patterns and electronic components.

Further, according to the wireless module of the present invention, the sealing material dam for covering and sealing the electronic component has a ring shape formed so as to surround the electronic component by partially deforming the substrate. Characterized by a groove or a convex shape. Wireless module.

Further, according to another wireless module according to the present invention, the substrate has a recess formed by partially deforming the substrate and defining a sealing area, and the electronic component is mounted in the recess. In addition, the sealing material is filled in the sealing region to seal the electronic component.

According to the wireless module configured as described above, it is not necessary to form a dam on a substrate by printing or a separate member, so that it is possible to reduce manufacturing costs and improve mass productivity.

Further, another wireless module according to the present invention comprises a substrate having first and second surfaces opposed to each other, a wiring pattern formed on the substrate, and an antenna for performing data communication; An electronic component mounted on the first surface of the substrate and connected to the antenna; and a sealing material covering and sealing the electronic component. The antenna is provided on the first surface of the substrate. A first portion, and a second portion provided on a second surface of the substrate, wherein the first and second portions are connected to each other via a conductive portion provided on the substrate. It is characterized by:

Further, the conductive portion has first and second conductive portions for conducting between the first and second surfaces of the substrate, respectively, and the first portion of the antenna is connected to the first conductive portion. A second end of the antenna, the second end of the antenna being connected to one end of the first portion through the first conductive portion, and the second conductive portion being connected to one end of the first portion through the first conductive portion. And the other end connected to the electronic component via a.

According to the wireless module having the above-described configuration, the antennas are provided on both sides of the substrate, so that the area occupied by the antenna on each surface of the substrate is reduced, and the degree of freedom in mounting electronic components is improved. Further, according to the wireless module of the present invention, the wiring pattern formed on the first surface of the substrate has the first electrode connected to the electronic component, and the wiring pattern formed on the second surface of the substrate. Has a second electrode connected to the electronic component and opposed to the first electrode with the substrate interposed therebetween. The first and second electrodes and the substrate constitute a sheet capacitor.

Further, a wireless card according to the present invention includes a card base having first and second sheets facing each other at a predetermined interval, and an insulating layer provided between the first and second sheets. The wireless card described above is arranged and held in the insulating layer.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a radio module according to an embodiment of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, a wireless module M according to a first embodiment of the present invention
The antenna 12 and the LSI 14 as an electronic component are provided on the substrate.

The substrate 10 is made of, for example,
It is formed of polyethylene terephthalate (PET) having a size of 2 to 13 mm, a width of 15 to 16 mm, and a thickness of 0.025 mm. On the front surface (first surface) 10a and the back surface (second surface) 10b of the substrate 10, as a conductor, for example, 0.02
An aluminum foil having a thickness of mm is formed, and a desired wiring pattern is formed by patterning these aluminum foils.

The antenna 12 has a first portion 1 formed by a wiring pattern on the surface 10a of the substrate 10.
2a, and a second portion 12b constituted by a wiring pattern on the back surface 10b of the substrate 10.

The first portion 12a is coiled from the inside to the outside of the substrate surface 10a a plurality of times, for example, five times, and extends adjacent to the periphery of the substrate 10. The second portion 12b is wound in the same direction as the first portion, and is wound so as to return from the outside to the inside of the substrate back surface 10b. The second portion 12b also extends adjacent to the periphery of the substrate 10 and is arranged so as to overlap the first portion 12a.

As shown schematically in FIG. 2, the outer ends of the first and second portions 12a and 12b are electrically connected to each other via a first conductive portion 16a formed on the substrate 10.
More specifically, the first conduction portion 16a includes first and second
The substrate 1 formed at the outer ends of the portions 12a and 12b, respectively.
It has connection pads 17a and 17b opposed to each other with 0 interposed therebetween, and a plurality of, for example, three through holes 18 electrically connecting these connection pads.

The LSI 14 is mounted on the front surface 10 a of the substrate 10 and is arranged inside the first portion 12 a of the antenna 12. Then, one electrode 14 of the LSI 14
a is connected to a pad 20 provided at the inner end of the antenna first portion 12a.

The inner end of the antenna second portion 12b is connected to the second end provided on the substrate 10 inside the second portion.
It is guided to the substrate surface 10a side via the conductive portion 16b, and further connected to the electrode 14b of the LSI 14.

That is, similarly to the first conductive portion 16a, the second conductive portion 16b has a connection pad 21 formed on the inner end of the antenna second portion 12b and a connection pad 21 facing the connection pad 21 on the substrate surface 10a. It has the formed connection pad 23 and, for example, three through-holes 25 conducting between the connection pads 21 and 23. The connection pad 23 is connected to the electrode 14b of the LSI 14.

The electrodes 14a and 14b of the LS 14 are connected to the pads 20 and 21 by wire bonding using a metal wire 15. The entire LSI 14 mounted on the substrate 10 is covered and sealed by a sealing material 24 such as a thermosetting resin or an ultraviolet curable resin. When potting the liquid sealing material 24 on the LSI 14,
Since the sealing material flows on the surface 10a of the substrate 10, the sealing material unnecessarily spreads without stopping. Therefore, according to the present embodiment, the wiring pattern formed on the substrate surface 10a includes the annular dam pattern 22 formed so as to surround the LSI 14 and the second conductive portion 16b. Then, this dam pattern 22 is sealed with a sealing material 24.
The sealing material 2 can be used as a dam
It regulates the unnecessary spread of four. As a result, as shown in FIG. 3, the sealing material 24 flows only in a region surrounded by the dam pattern 22, that is, only in a desired sealing region B, and LS
I14 and the second conduction portion 16b are sealed.

Further, in the present embodiment, the dam pattern 22 is electrically connected to the antenna first portion 12a and forms a part of the antenna 12. On the other hand, the through holes 18 and 25 of the first and second conductive portions 16a and 16b are formed by, for example, a crimping connection method. The crimping connection method is a method of partially crimping one of a pair of connection pads of a conduction portion facing each other to the other connection pad side, thereby forming a through-hole conducting between the connection pads. A projection is formed on one surface side.

The second conductive portion 16b will be described as a representative.
As shown in FIG. 4, in the present embodiment, the connection pads 21 are partially crimped toward the connection pads 23 so that the protrusions 25 a formed at one end of each through hole 25 are formed on the surface of the substrate 10. 10a side, that is, LS
It is formed so as to protrude toward the surface on which I14 is mounted. In this case, the projections 25 of the conductive portions 16a and 16b
The increase in the total thickness of the wireless module M due to a can be suppressed. Further, the sealing member 24 is stopped by the projection 25a, and can be prevented from flowing out to the substrate back surface 10b through the through hole 25. The total thickness of the wireless module M is formed to be about 0.35 mm.

The wireless module M configured as described above
Has a function of performing data communication with an external read / writer alone without contact. Then, a wireless card is configured by embedding the wireless module M inside the card, and when used alone, it is used as a wireless tag.

FIG. 5 shows a wireless card 30 having a wireless module M. The wireless card 30 includes a card base 31 holding a wireless module M. The card base is provided between first and second rectangular sheets 32a and 32b facing each other at a predetermined interval, and between these decorative plates. An insulating layer 34 made of a filled synthetic resin or the like. Then, the wireless module M is embedded and sealed in the insulating layer 34.

According to the wireless module M according to the first embodiment, the antenna 12 includes the first and second portions 12a and 12b formed on both surfaces of the substrate 10, respectively.
, The mounting area of the antenna on each surface of the substrate 10 is reduced, and the LSI 14
The degree of freedom of arrangement can be increased.

Further, since the dam pattern 22 functioning as a pawl of the sealing material 24 is constituted by a part of the wiring pattern formed on the substrate, the manufacturing cost is lower than when printing or using another member. And the productivity can be improved.

The first and second conducting portions 16a and 16b are
Since the protrusions formed at one ends of the through holes 18 and 25 are configured to protrude toward the LSI 14 mounting surface side of the substrate 10, the total thickness of the wireless module M can be reduced. In addition, these protrusions can be used as pawls of the sealing material 24, and can prevent the sealing material from flowing out to the substrate back surface 10b side through the through holes 25.

Further, the second conducting portion 16b for guiding the antenna second portion 12a formed on the substrate back surface 10b side to the substrate surface 10a side is surrounded by the sealing region B of the substrate surface 10a, that is, the dam pattern 22. Since it is provided in the region, the connection between the antenna second portion 12a and the LSI 14 can be easily performed, and the manufacturing cost can be reduced.

FIG. 6 shows a wireless module M according to a second embodiment of the present invention. According to this embodiment, the dam pattern 22 is electrically connected to the antenna first portion 12a without conducting. It is formed as an electrically independent wiring pattern. The inner end of the antenna first portion 12a is connected to the LSI 14 via the third conductive portion 16c, the connection wiring pattern 36 formed on the back surface 10b of the substrate, and the fourth conductive portion 16d provided in the sealing region B. Electrode 14a
It is connected to the.

The third and fourth conducting portions 16c, 16c
The configuration of d includes the first and second conducting portions 16a,
6b. The other configuration is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference characters, and detailed description thereof will be omitted.

In the above embodiment, the substrate 10
Although the dam pattern is formed by a part of the upper wiring pattern, according to the third embodiment shown in FIG. 7, an annular ring having a width of about 0.5 to 1.0 mm surrounding the sealing region B is provided. A groove 40 is formed in the substrate 10 to form a dam for the sealing material 24. The groove 40 is formed by pressing the heated dam forming tool 41 from the substrate surface 10a side to a predetermined position on the substrate 10 to deform the substrate 10 and a part of the wiring pattern.

According to the fourth embodiment shown in FIG. 8, the heated dam forming tool 41 is pressed from the back surface 10b of the substrate to a predetermined position on the substrate 10, and the substrate 10 and a part of the wiring pattern are connected to the substrate. By deforming to the surface 10a side, an annular convex shape 42 having a width of about 0.5 to 1.0 mm surrounding the sealing region B is formed on the substrate 10 to form a dam of the sealing material 24.

According to the fifth embodiment shown in FIG. 9, the entire sealing region B of the substrate 10 is deformed into a concave shape to form a concave portion 44, in which the LSI 14 is mounted and a sealing material is formed. 24. The recess 44 is formed by pressing a heated recess forming tool 46 from the substrate surface 10a side to a predetermined position on the substrate 10 to deform the substrate 10 and a part of the wiring pattern.

In the third to fifth embodiments, other configurations are the same as those of the above-described first embodiment, and the same portions are denoted by the same reference characters and detailed description thereof is omitted. I do.

As described above, in any of the case where the dam of the sealing material 24 is formed by the groove 40 or the convex 42 formed by deforming a part of the substrate 10 and the case where the sealing region is formed by the recess. In addition, the manufacturing cost can be reduced and the productivity can be improved as compared with the case where printing or another member is used. In addition, in the third to fifth embodiments, the same operation and effect as those of the first embodiment can be obtained.

In the first to fifth embodiments, L
Although the SI 14 is configured to be connected to the antenna 12 by wire bonding, according to the sixth embodiment shown in FIG. 10, bumps 4 are formed on the electrodes 14a and 14b of the LSI 14.
6, and the LSI 14 is mounted on the substrate surface 10a by the face-down method. Bump 46 and substrate 10
The connection with the pads 20 and 23 on the side uses, for example, an anisotropic conductive film.

In general, an LSI is implemented by a face-down method.
Is mounted, bumps are arranged at four corners of the LSI surface so that the pressing pressure at the time of mounting acts on the LSI evenly. According to the present embodiment, the electrodes 14a, 14b,
And the bumps 46 are arranged collectively at one end of the LSI 14.

In this case, the number of electrodes of the LSI is small, and accordingly the area of the LSI is reduced, so that the manufacturing cost can be reduced and the mechanical strength can be improved. In the sixth embodiment, other configurations are the same as those of the above-described first embodiment, and substantially the same operation and effects as those of the first embodiment can be obtained.

According to the seventh embodiment shown in FIG.
The wireless module M includes a sheet capacitor 50 formed on the substrate 10 inside the antenna 12, and uses the sheet capacitor as a resonance capacitor.

More specifically, on the substrate surface 10a, a part of the dam pattern 22 is made wider to form the first electrode 5 having a rectangular shape.
2a are formed, and connection pads 21 are formed on the back surface 10b of the substrate.
Is extended to form a rectangular second electrode 52b. The first and second electrodes 52a and 52b are
0 are arranged opposite to each other. Then, the substrate 1 sandwiched between the first and second electrodes 52a, 52b
The first and second electrodes 52a, 52b, and the polyethylene terephthalate forming 0 are used as a dielectric.
The sheet capacitor 50 is constituted by the dielectric and the dielectric.

According to the seventh embodiment, the use of the sheet capacitor 50 as a resonance capacitor eliminates the need to build a resonance capacitor inside the LSI 14, thereby reducing the size of the LSI 14 and reducing the manufacturing cost. Reduction and improvement in mechanical strength can be achieved.

According to the eighth embodiment shown in FIG.
An inner end of the antenna first portion 12a is formed into a substantially rectangular first portion.
It is formed as an electrode 52a, and similarly, the antenna second portion 1
The inner end of 2b is formed as a substantially rectangular second electrode 52b facing the first electrode 52a. And the first,
The second electrode 52a, 52b and the substrate 10 constitute a sheet capacitor 50.

The LSI 14 is mounted on the first electrode 52a. In this case, the electrodes 14a of the LSI 14,
The bumps 46 are formed on the first electrodes 14b, and the LSI 14 is mounted on the first electrodes 52a by a face-down method. The mounting of the LSI 14 is not limited to the face-down method, and wire bonding may be used.

According to the eighth embodiment, similarly to the seventh embodiment, by using the sheet capacitor 50 as a resonance capacitor, there is no need to form a resonance capacitor inside the LSI 14, and Minute, LSI1
4, the manufacturing cost can be reduced and the mechanical strength can be improved. Further, according to the present embodiment,
By mounting the LSI 14 on the first electrode 52a,
It is possible to improve the mechanical strength of the LSI.

In the above-described seventh and eighth embodiments, the sheet capacitor 50 may be arranged not only inside the antenna 12 but also outside. Further, in the first to eighth embodiments, the LSI 14 is disposed inside the antenna first portion 12a, but may be disposed outside the antenna or between the antenna windings.

The first and second portions 12 of the antenna 12
The outer shapes of a and 12b do not necessarily need to be similar to the outer shape of the substrate 10. For example, as shown in FIG. 13A, the first and second antennas are
The portions 12a and 12b may be wound in a round shape, or the antenna first and second portions 12a and 12b may be wound in an elliptical shape with respect to a rectangular substrate 10 as shown in FIG. You can turn it.

In general, a round antenna is more excellent in communication stability than a square antenna. Therefore, when an antenna is formed in a rectangular IC card module, it is possible to use a round antenna instead of a square antenna. Good.

In addition, the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, the material of each part of the wireless module is not limited to the above-described embodiment, and can be variously changed as needed. Further, the dam pattern, the dam, and the sealing region are not limited to a rectangle, and may have other shapes.

[0058]

As described above, according to the present invention, a part of a wiring pattern formed on a substrate can be used.
Alternatively, since the substrate itself is deformed and a dam for stopping the sealing material is formed, compared to the case where the dam is formed by printing or another member, the mass production is inexpensive and highly reliable. A wireless module and a wireless card including the wireless module can be provided. Further, since the dam is formed by the wiring pattern or the substrate itself, the adhesiveness with the adhesive is not impaired when the wireless module is formed into a card.

Further, according to the present invention, since the antenna is provided not only on one side but also on both sides of the substrate,
A wireless module and a wireless card that have a high degree of freedom in arranging electronic components and are excellent in productivity can be provided.

By providing a conductive portion between the antenna first portion and the second portion inside the dam, the connectivity between the antenna and the electronic component is improved, and a wireless module and a wireless card excellent in productivity are provided. be able to.

In addition, the present invention provides a wireless module and a wireless card which can be made thinner and prevent the sealing material from leaking out, since the projection formed on the conductive portion projects toward the electronic component mounting surface of the substrate. be able to.

Further, according to the present invention, since the sheet capacitor is formed by using the substrate itself and the electrodes formed on the surface of the substrate, the size of the electronic component can be reduced and the mechanical strength can be improved. A wireless module and a wireless card with excellent productivity can be provided.

Further, by mounting the electronic component on the electrode of the sheet capacitor, a wireless module and a wireless card with improved mechanical strength of the electronic component can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view, a side view, a bottom view, and a cross-sectional view illustrating a wireless module according to a first embodiment of the present invention.

FIG. 2 is a plan view schematically showing an antenna, an LSI, and a conductive portion of the wireless module according to the first embodiment.

FIG. 3 is a plan view corresponding to FIG. 2, showing a state where a sealing material is potted in a sealing region of the wireless module.

FIG. 4 is a sectional view taken along line CC of FIG. 3;

FIG. 5 is a plan view and a cross-sectional view of a wireless card including the wireless module.

FIG. 6 is an exemplary plan view schematically showing an antenna, an LSI, and a conductive portion of a wireless module according to a second embodiment of the present invention.

FIG. 7 is a plan view schematically showing an antenna, an LSI, and a conductive portion of a wireless module according to a third embodiment of the present invention;
A sectional view and a sectional view of a dam formation rule.

FIG. 8 is a sectional view of a wireless module according to a fourth embodiment of the present invention.

FIG. 9 is a plan view schematically showing an antenna, an LSI, and a conductive portion of a wireless module according to a fifth embodiment of the present invention;
A sectional view and a sectional view of a dam formation rule.

FIGS. 10A and 10B are a plan view and a cross-sectional view schematically showing an antenna, an LSI, and a conductive portion of a wireless module according to a sixth embodiment of the present invention.

FIGS. 11A and 11B are a plan view and a cross-sectional view schematically showing an antenna, an LSI, a conductive portion, and a sheet capacitor of a wireless module according to a seventh embodiment of the present invention.

FIG. 12 is a plan view and a cross-sectional view schematically showing an antenna, an LSI, a conductive portion, and a sheet capacitor of a wireless module according to an eighth embodiment of the present invention.

FIG. 13 is a plan view of the wireless module showing a relationship between a substrate shape and an antenna shape of the wireless module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Substrate 10a ... Front surface 10b ... Back surface 12 ... Antenna 12a ... 1st part 12b ... 2nd part 14 ... LSI 16a ... 1st conductive part 16b ... 2nd conductive part 18, 25 ... Through hole 22 ... Dam pattern 24 ... Sealing Stopping material 25a Projection 30 Wireless card 32a First sheet 32b Second sheet 34 Insulating layer 40 Groove 42 Projection 44 Depression 46 Bump 50 Sheet capacitor 52a First electrode 52b Second Electrode M: Wireless module B: Sealed area

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01Q 7/00 G06K 19/00 H H04B 5/02 K

Claims (18)

[Claims] 1. A semiconductor device comprising: a substrate; and a wiring pattern formed on the substrate.
An antenna that performs data communication, an electronic component mounted on the substrate and connected to the antenna, and a sealing material that covers and seals the electronic component, wherein a wiring pattern formed on the substrate is A wireless module including a dam pattern formed so as to surround the electronic component and constituting a dam of the sealing material. 2. The wireless module according to claim 1, wherein the dam pattern is electrically connected to the antenna and forms a part of the antenna. 3. The wireless module according to claim 1, wherein the dam pattern is electrically independent from other wiring patterns and electronic components. 4. A semiconductor device comprising: a substrate; and a wiring pattern formed on the substrate.
An antenna for performing data communication, an electronic component mounted on the substrate and connected to the antenna, and a sealing material covering and sealing the electronic component, wherein the substrate partially deforms the substrate A wireless module having an annular groove or a convex shape formed so as to surround the electronic component and to constitute a dam of the sealing material. 5. A semiconductor device comprising: a substrate; and a wiring pattern formed on the substrate.
An antenna for performing data communication, an electronic component mounted on the substrate and connected to the antenna, and a sealing material covering and sealing the electronic component, wherein the substrate partially deforms the substrate And a recess defining a sealing area formed by the electronic component, wherein the electronic component is mounted in the recess, and the sealing material is filled in the sealing area. module. 6. A substrate having a first surface and a second surface facing each other, and a wiring pattern formed on the substrate.
An antenna that performs data communication; an electronic component mounted on the first surface of the substrate and connected to the antenna; and a sealing material that covers and seals the electronic component. A first portion provided on a first surface of the substrate, and a second portion provided on a second surface of the substrate, wherein the first and second portions are conductive portions provided on the substrate. Wireless modules connected to each other via a wireless LAN. 7. The conductive portion has first and second conductive portions for conducting between the first and second surfaces of the substrate, respectively, and the first portion of the antenna is connected to the first conductive portion. One end connected to one end of the first part via the first conductive part, and the second conductive part. The wireless module according to claim 6, further comprising: a second end connected to the electronic component via a second terminal. 8. The wireless device according to claim 7, wherein the second conductive portion is disposed in a sealing region of the first surface of the substrate, the sealing region being sealed by the sealing material. module. 9. The wiring pattern formed on the substrate,
9. The wireless module according to claim 8, further comprising a dam pattern formed so as to surround the electronic component and the second conductive portion, and forming a dam of the sealing material. 10. The substrate has an annular groove or a convex shape formed so as to surround the electronic component and the second conductive portion by partially deforming the substrate to form a dam of the sealing material. The wireless module according to claim 7, wherein: 11. Each of the first and second conductive portions is connected to a first pad that is connected to a first portion of the antenna and a second pad that is connected to a second portion of the antenna and sandwiches the substrate. A second pad facing the first pad and the second pad
A through-hole formed by crimping a part of the pad through the substrate to the first pad side and conducting the first and second pads; and a protrusion projecting from the through-hole to the first surface side of the substrate The wireless module according to any one of claims 7 to 10, further comprising: 12. The wiring pattern formed on a first surface of the substrate and connected to the electronic component, and a first electrode formed on a second surface of the substrate and sandwiching the substrate. 12. A second electrode facing the first electrode and electrically connected to the electronic component, the second electrode forming a sheet capacitor in cooperation with the first electrode and the substrate. The wireless module according to any one of the above. 13. The wireless module according to claim 12, wherein said electronic component is mounted on said first electrode. 14. The wireless module according to claim 1, wherein the electronic component is connected to the antenna by wire bonding. 15. The electronic component has first and second electrodes provided at one end of the electronic component adjacent to each other, and the first and second electrodes are connected to the antenna by a face-down method. The wireless module according to any one of claims 1 to 13, wherein the wireless module is mounted in an inclined state. 16. The antenna according to claim 1, wherein said substrate has an outer shape different from an outer shape of said antenna.
6. The wireless module according to claim 5. 17. A card base comprising: first and second sheets facing each other at a predetermined interval; and an insulating layer provided between the first and second sheets; embedded in the insulating layer. A wireless module, wherein the wireless module comprises a substrate, a wiring pattern formed on the substrate, an antenna for performing data communication, and an electronic component mounted on the substrate and connected to the antenna. And a sealing material covering and sealing the electronic component, wherein the wiring pattern formed on the substrate is formed so as to surround the electronic component and constitutes a dam of the sealing material. A wireless card comprising a pattern. 18. A card base comprising: first and second sheets facing each other at a predetermined interval; and an insulating layer provided between the first and second sheets; and a card substrate embedded in the insulating layer. A wireless module, wherein the first and second wireless modules face each other.
A substrate having a surface, an antenna configured by a wiring pattern formed on the substrate and performing data communication, an electronic component mounted on a first surface of the substrate and connected to the antenna, and And a sealing material that covers and seals the antenna, wherein the antenna includes: a first portion provided on a first surface of the substrate; and a second portion provided on a second surface of the substrate. A wireless card, wherein the first and second portions are connected to each other via a conductive portion provided on the substrate.