CN111092042A - 晶圆承盘标示方法及其结构 - Google Patents

晶圆承盘标示方法及其结构 Download PDF

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CN111092042A
CN111092042A CN201811234126.XA CN201811234126A CN111092042A CN 111092042 A CN111092042 A CN 111092042A CN 201811234126 A CN201811234126 A CN 201811234126A CN 111092042 A CN111092042 A CN 111092042A
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王智
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

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Abstract

一种晶圆承盘标示的成型方法，包含有下列步骤：一成型步骤为以塑料成型为一承盘本体，该承盘本体一侧为一承载面，另一侧为一底面，一周面位在该承载面与该底面间，且该周面连结该承载面及该底面。一被覆步骤为在该承盘本体的该周面或该底面设置一被覆层，该被覆层的颜色相异于该承盘本体的颜色。一标示构造为复数镂空的组合，各该镂空形成在该被覆层，且该承盘本体的表面颜色可透出各该镂空，致使各该镂空所组成的该标示构造为可视及/或可扫描。

Description

晶圆承盘标示方法及其结构
技术领域
本发明是关于一种标示的成型方法，尤其是晶圆承盘标示的成型方法。
背景技术
随着高科技制造产业的发展，晶圆在运送的过程中大多依赖自动化输送系统来运送。而在晶圆的制造流程或搬运过程中，通常是将晶圆容置于一承盘的容槽内，通过承盘来防止晶圆受到外力撞击而受到损伤。
而晶圆在大量制造的情况下，需要数以百计甚至更多的承盘来承载晶圆，且为了加以分辨通过不同加工制程的晶圆，使用者在数量如此众多的承盘中，需在承载晶圆的承盘上，逐一标注有关制程的相关详细讯息。
已知的标示方法为在晶圆承盘的其中一侧面贴上用于识别的标签，然而，该晶盘在封装过程中是同时经过封装制程中的烘烤、清洗工序，并持续地被重复使用，且晶盘在每次的封装制程中必须承受烘烤的高温，因此，在经过多次使用的晶圆承盘，用于识别的标签会发生与晶圆承盘分离的问题，如此便造成使用者极大的困扰。
发明内容
本发明的主要目的在于提供一种晶圆承盘结构及晶圆承盘标示的成型方法，其具有帮助使用者达到识别晶圆承盘的目的。
为达上述目的及功效，本发明提供一种晶圆承盘结构，其包含：
一承盘本体，其具有一承载面及一底面，该承载面相对该底面，一承载部形成在该承载面且延伸朝向该底面，一周面位在该承载面及该底面间，且该周面连结该承载面及该底面；
一被覆层，其设置在该承盘本体的该周面或该底面；
一标示构造，为复数镂空的组合，各该镂空形成在该被覆层，且该承盘本体的表面颜色可透出各该镂空，致使各该镂空所组成的该标示构造为可视及/或可扫描。
在一实施例中，各该镂空所组成的该标示构造为选自一维条码或二维条码。
在一实施例中，各该镂空所组成的该标示构造为选自文字或数字。
本发明所揭示的晶圆承盘标示的成型方法，包含有下列步骤：
一成型步骤，为以塑料成型为一承盘本体，该承盘本体一侧为一承载面，另一侧为一底面，一周面位在该承载面与该底面间，且该周面连结该承载面及该底面。
一被覆步骤，为在该承盘本体的该周面或该底面设置一被覆层，该被覆层的颜色相异于该承盘本体的颜色。
一标记成型步骤，为移除部分的该被覆层，且每一被移除的位置形成一镂空，藉此该被覆层具有复数该镂空，且该承载盘本体的表面颜色可透出各该镂空以形成一标示构造。
在一实施例中，其中该被覆步骤中，以镀膜或溅镀的方式设置该被覆层。
在一实施例中，其中该标记成型步骤中，通过镭射雕刻方式移除该被覆层的部分位置以形成一镂空。
本发明的有益效果在于：
本发明提供一种晶圆承盘结构及晶圆承盘标示的成型方法，该晶圆承盘结构及晶圆承盘标示的成型方法具有帮助使用者达到识别晶圆承盘的目的。
附图说明
图1为本发明较佳实施例的立体图。
图2为本发明被覆层的示意图。
图3为本发明镂空区域的示意图。
图4为本发明镂空区域的另一示意图。
图5为本发明的流程图。
附图标记
10：承盘本体；12：承载面；14：周面；16：底面；18：承载部；20：被覆层；22：标示构造；24：镂空；A：成型步骤；B：被覆步骤；C：标记成型步骤。
具体实施方式
请参阅图1，为本发明较佳实施例所提供的晶圆承盘结构，其包含有一承盘本体10及一被覆层20。
该承盘本体10为一矩形板状，该承盘本体10具有一承载面12、一周面14及一底面16，该承载面12相对该底面16，该周面14位在该承载面12及该底面16间，且该周面14连结该承载面12及该底面16。该承盘本体10更具有一承载部18，该承载部18形成在该承载面12且延伸朝向该底面16。
请参阅图2，该被覆层20设置在该承盘本体10的该周面14或该底面16。在本实施例中，该被覆层20可以是利用镀膜或溅镀的方式设置于该承盘本体10的该周面14。
请参阅第3、4图，一标示构造22形成在该被覆层20。更进一步地说，该标示构造22为复数镂空24的组合，各该镂空24形成在该被覆层20。值得注意的是，该承盘本体10的材质颜色为黑色，该被覆层20的材质颜色为白色，利用镭射雕刻的方式将该承盘本体10表面预定位置的该被覆层20(白色)刻除以形成该镂空24，如此该承盘本体10的表面(黑色)颜色可透出各该镂空24，致使各该镂空24所组成的该标示构造22为可视及/或可扫描。
在此要特别说明的是，在本实施例中，由于该标示构造22选自文字、数字、一维条码或二维条码。因此使用者可通过扫描该标示构造22所显示的资讯，进而得知该承盘本体10所承载晶圆的详细资料，例如批号或制造日期。
请参阅图4，为本发明所提供的晶圆承盘标示的成型方法，包含有下列步骤：一成型步骤A、一被覆步骤B及一标记成型步骤C。
该成型步骤A为将一塑料加热熔化后注入一闭合模具内，经过一定时间的冷却定型后，开启模具以得该承盘本体10的制品。该承盘本体10具有该承载面12、该周面14及该底面16，该承载面12相对该底面16，该周面14位在该承载面12及该底面16间，且该周面14连结该承载面12及该底面16。
被覆步骤B为该被覆层20可以是利用镀膜或溅镀的方式设置于该承盘本体10的该周面14或该底面16。
该标记成型步骤C通过镭射雕刻移除部分的该被覆层20，且每一被移除的位置形成该镂空24，藉此该被覆层20具有复数该镂空24，且该承盘本体10的表面颜色可透出各该镂空24以形成该标示构造22。
以上所述仅为说明本发明的例示，并非对本发明做任何形式上的限制，本发明所主张的权利范围自应以权利要求书所述为准，而非仅限于上述实施例。任何所属技术领域中技术人员，在不脱离本发明技术方案的范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明的技术方案的内容，均仍属于本发明技术方案的范围内。

Claims (6)

1.一种晶圆承盘结构，其特征在于，包含：
一承盘本体，其具有一承载面及一底面，该承载面相对该底面，一承载部形成在该承载面且延伸朝向该底面，一周面位在该承载面及该底面间，且该周面连结该承载面及该底面；
一被覆层，其设置在该承盘本体的该周面或该底面；
一标示构造，为复数镂空的组合，各该镂空形成在该被覆层，且该承盘本体的表面颜色可透出各该镂空，致使各该镂空所组成的该标示构造为可视及/或可扫描。
2.如权利要求1所述的晶圆承盘结构，其特征在于，各该镂空所组成的该标示构造为选自一维条码或二维条码。
3.如权利要求1所述的晶圆承盘结构，其特征在于，各该镂空所组成的该标示构造为选自文字或数字。
4.一种晶圆承盘标示的成型方法，其特征在于，包含有下列步骤：
一成型步骤，为以塑料成型为一承盘本体，该承盘本体一侧为一承载面，另一侧为一底面，一周面位在该承载面与该底面间，且该周面连结该承载面及该底面；
一被覆步骤，为在该承盘本体的该周面或该底面设置一被覆层，该被覆层的颜色相异于该承盘本体的颜色；
一标记成型步骤，为移除部分的该被覆层，且每一被移除的位置形成一镂空，藉此该被覆层具有复数该镂空，且该承载盘本体的表面颜色可透出各该镂空以形成一标示构造。
5.如权利要求4所述的晶圆承盘标示的成型方法，其特征在于，该被覆步骤中，以镀膜或溅镀的方式设置该被覆层。
6.如权利要求4所述的晶圆承盘标示的成型方法，其特征在于，该标记成型步骤中，通过镭射雕刻方式移除该被覆层的部分位置以形成一镂空。
CN201811234126.XA 2018-10-23 2018-10-23 晶圆承盘标示方法及其结构 Pending CN111092042A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1373463A (zh) * 2000-11-14 2002-10-09 东陶机器株式会社 标记形成的方法以及用该方法获得的制品
CN203386734U (zh) * 2012-10-23 2014-01-08 鉅仑科技股份有限公司 Rfid标志载盘与具rfid标志载盘的晶圆处理装置
CN107949172A (zh) * 2017-11-22 2018-04-20 厦门弘信电子科技股份有限公司 柔性线路板制程追溯二维码钻孔制作方法
CN108256613A (zh) * 2018-02-08 2018-07-06 科大讯飞股份有限公司 二维码制备方法及带有二维码的设备
WO2018135707A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지 제조용 트레이

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1373463A (zh) * 2000-11-14 2002-10-09 东陶机器株式会社 标记形成的方法以及用该方法获得的制品
CN203386734U (zh) * 2012-10-23 2014-01-08 鉅仑科技股份有限公司 Rfid标志载盘与具rfid标志载盘的晶圆处理装置
WO2018135707A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지 제조용 트레이
CN107949172A (zh) * 2017-11-22 2018-04-20 厦门弘信电子科技股份有限公司 柔性线路板制程追溯二维码钻孔制作方法
CN108256613A (zh) * 2018-02-08 2018-07-06 科大讯飞股份有限公司 二维码制备方法及带有二维码的设备

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