CN111083338A

CN111083338A - Heat conduction support and electronic equipment

Info

Publication number: CN111083338A
Application number: CN201911416469.2A
Authority: CN
Inventors: 郑玉柱; 马原; 韩立通
Original assignee: Beijing Pengsi Technology Co Ltd
Current assignee: Beijing Pengsi Technology Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-28
Anticipated expiration: 2039-12-31
Also published as: CN111083338B

Abstract

The invention relates to a heat conduction support and electronic equipment. The heat-absorbing plate comprises a heat-absorbing plate facing a heating device, a heat-conducting plate is arranged at the side end of the heat-absorbing plate, and a heat-transfer medium plate is detachably connected onto the heat-conducting plate. The invention aims to provide a heat conduction support and electronic equipment, which solve the technical problem that internal devices are damaged because heat inside a shell of a security device and the like cannot be dissipated timely in the prior art through the structural design of the heat conduction support.

Description

Heat conduction support and electronic equipment

Technical Field

The invention relates to a heat conduction support and electronic equipment.

Background

Inside mainboard and the power strip of being equipped with of current security protection device, in operation, mainboard and power strip can produce a large amount of heats, especially the main chip heat yield of mainboard is high, and casing inner space is little, the leakproofness is good, the heat can't be effused fast, lead to the heat to gather in with the casing, lead to the inside temperature of whole casing to rise, the inside heat of casing is too high, probably lead to the device damage on mainboard or the power strip, lead to the unable normal work of whole security protection device, unable control, cause the control leak, and the cost is consumed in the improvement.

Disclosure of Invention

The invention aims to provide a heat conduction support and electronic equipment, which solve the technical problem that internal devices are damaged because heat in a shell cannot be dissipated in time in the prior art through the structural design of the heat conduction support.

The embodiment of the invention provides a heat conduction bracket which comprises a heat absorption plate facing a heating device, wherein a heat conduction plate is arranged at the side end of the heat absorption plate, and a heat transfer medium plate is detachably connected on the heat conduction plate.

In some embodiments, heat-conducting plates are arranged at both side ends of the heat-absorbing plate, a fixing plate mounting groove is arranged on each heat-conducting plate, a fixing plate mounting hole is arranged in each fixing plate mounting groove, and the heat-transfer medium plate is fixed on the heat-conducting plates through bolts.

In some embodiments, the heat transfer medium plate includes a fixing plate, a plurality of heat dissipation holes are arranged at intervals on the fixing plate, and an elastic plate is arranged on the inner wall of each heat dissipation hole.

In some embodiments, a thermal pad is attached to a surface of the heat sink plate facing the heat generating device.

In some embodiments, a plurality of micro channels are arranged at intervals in the heat absorbing plate, the heat dissipation outlets of the micro channels extend to the heat conducting plate and penetrate through the heat conducting plate, and the flow direction of heat in the micro channels and the heat entering direction outside the micro channels are arranged at an angle.

In some embodiments, the thickness of each microchannel is 0.2-0.8mm and the height of each microchannel is 0.05-0.12 mm.

In some embodiments, at least some of the two adjacent microchannels are in communication via a thermally conductive channel, each thermally conductive channel having a transverse width of 1-10 mm.

In some embodiments, the thermally conductive channel is filled with thermally conductive silicone.

In some embodiments, 20-80 micro channels are uniformly distributed along the height direction of the heat absorbing plate.

The embodiment of the invention also provides electronic equipment which comprises a machine shell, wherein the heat conduction support is arranged in the machine shell, a power panel is arranged on one side of a heat absorption plate, a main board is arranged on the other side of the heat absorption plate, a power panel heat conduction pad is arranged between the power panel and the heat absorption plate, a main board heat conduction pad is arranged between the main board and the heat absorption plate, and the power panel and the main board are detachably connected with the heat absorption plate.

Compared with the prior art, the heat conduction bracket and the security device using the same provided by the invention have the following advantages:

1. the invention provides a heat conduction bracket which can absorb heat generated by a power supply, a mainboard and other heating devices during working, the heat enters the heat absorption plate and moves towards the heat conduction plate, after reaching the heat conduction plate, the heat can be transferred to a shell body through a heat transfer medium plate due to the contact of the heat transfer medium plate and an external shell, so that the heat is dissipated to the outside of the shell, the effective dissipation and the normal working of the heat generated by the heating devices are ensured, and the service life is prolonged.

2. Through setting up the microchannel, further accelerated the heat flow in the absorber plate for derive the heat, control thermal direction of transfer, guarantee thermal effective effluvium.

3. The invention provides an electronic device, wherein a heat conduction support realizes the heat dissipation of a mainboard and a power panel, avoids the phenomenon that the heat is concentrated in a shell to cause overhigh heat in the shell, and reduces the service lives of a heat absorption plate and the power panel.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural view (perspective view) of a thermally conductive holder according to an embodiment;

FIG. 2 is a schematic structural view (perspective view) of a heat transfer medium plate according to an embodiment;

FIG. 3 is a schematic structural view (front view) of a thermally conductive holder according to an embodiment;

FIG. 4 is a schematic structural view (rear view) of a thermally conductive holder according to an embodiment;

fig. 5 is a schematic structural diagram (perspective view) of an electronic device according to an embodiment;

FIG. 6 is an exploded view of FIG. 5;

FIG. 7 is a schematic structural view (front view) of a second embodiment of the heat conductive bracket;

fig. 8 is a sectional view a-a of fig. 7.

Description of reference numerals:

1. a heat absorbing plate; 2. a heat conducting plate; 3. a heat transfer medium plate; 4. a micro flow channel; 31. a fixing plate; 32. heat dissipation holes; 33. a spring plate; 21. a fixing plate mounting groove; 22. a fixing plate mounting hole; 5. a heat conducting channel; 101. a main board mounting hole; 102. a power panel mounting hole; 6. a housing; 7. a power panel; 8. A main board; 9. a power panel heat conducting pad; 10. mainboard heat conduction pad.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The embodiment of the invention provides a heat conduction bracket, which comprises a heat absorption plate 1, wherein the surface of the heat absorption plate 1 faces a heating device; the side of the heat absorbing plate 1 is provided with a heat conducting plate 2, and the heat conducting plate 2 is detachably connected with a heat transfer medium plate 3.

In some embodiments, both the upper and lower surfaces of the heat sink 1 face the heat generating devices, e.g., one surface faces the power source, the other surface faces the motherboard, etc.

The heat conduction support provided by the invention can move heat generated by a heating device to the direction of the heat conduction plate 2 through the inside of the heat absorption plate 1, and after the heat reaches the heat conduction plate 2, as the heat transfer medium plate 3 is abutted against the shell of the electronic equipment, the heat can be transferred to the shell through the heat transfer medium plate 3, so that the heat is radiated to the outside of the shell, the heat of the heat absorption plate 1 is effectively reduced, the heat generated by the heating device is effectively radiated, and the normal work and the service life of the heating device are ensured.

In some embodiments, the heat absorbing plate 1 and the heat dissipating plate 2 are made of metal, for example, the heat absorbing plate 1 and the heat dissipating plate 2 are made of aluminum alloy, so that on the premise of ensuring the structural strength of the heat absorbing plate 1 and the heat dissipating plate 2, the heat can be absorbed and transferred quickly, and the heat can be dissipated effectively.

In some embodiments, the material of the heat transfer medium plate 3 is metal, such as copper, silver, etc., to improve the rapid heat transfer.

In some embodiments, the heat absorbing plate 1 and the heat dissipating plate 2 are integrally formed, so that the heat transfer effect is prevented from being reduced due to the splicing manner.

In some embodiments, the heat absorbing plate 1 is provided with heat conductive plates 2 at both left and right side ends thereof, each heat conductive plate 2 is provided with a fixing plate mounting groove 21, a fixing plate mounting hole 22 is provided in the fixing plate mounting groove 21, and the heat transfer medium plate 3 is fixed to the heat conductive plates 2.

The heat transfer medium plate 3 is fixed to the heat conductive plate 2 by a bolt structure, for example. In addition, other fixed connection structures, such as snap-fit connections, are also possible.

The heat conducting plates 2 are arranged at the two side ends of the heat absorbing plate 1, so that the whole support is of an I-shaped structure, and the stability and the strength of the whole structure of the support are improved. Through the demountable installation of heat transfer medium board 3, guarantee its installation and dismantle convenient, after using a terminal time, can dismantle heat transfer medium board 3, carry out the cleaing away of dust to heat-conducting plate 2, absorber plate 1.

In some embodiments, the heat transfer medium plate 3 includes a fixing plate 31, a plurality of heat dissipation holes 32 are spaced on the fixing plate 31, and spring plates 33 for overlapping with the inner wall of the casing are disposed on the inner walls of the heat dissipation holes 32.

Through a plurality of louvres 32 of having laid at the interval on the fixed plate 31, be equipped with on the louvre 32 inner wall be used for with the lapped design of playing board 33 of casing inner wall, realize thermal effective transmission, heat on the heat-conducting plate 2 is absorbed to fixed plate 31 to play board 33 with heat transfer, play board 33 gives the casing with heat transfer, thereby realizes thermal effluvium, structural design is simple, and the heat transfer is effectual, easy to assemble.

For example, the elastic plate 33 may be integrally formed or welded with the fixing plate 31, and protrude from the heat dissipation hole 32 in a direction facing the chassis of the electronic device, and may abut against a curved surface, an arc surface, or the like of the chassis in a use state, so as to facilitate installation of the heat conduction bracket in the chassis of the electronic device.

In some embodiments, the fixing plate mounting groove 21 of the heat conductive plate 2 is configured to at least partially receive the fixing plate 31. The fixing plate 31 may be put into a fixing plate mounting groove having an inner concave surface at the time of assembly.

This structural design makes the heat transfer medium plate 3 less space consuming.

In some embodiments, a thermal pad is attached to the heat absorbing plate 1 in a direction facing the heat generating device. For example, a power board heat conduction pad 9 and a motherboard heat conduction pad 10 are attached to the power board 7 and the motherboard 8, respectively.

The heat-conducting pad is usually made of heat-absorbing insulating materials such as silica gel, so that heat can be conducted to the heat-absorbing plate quickly, and meanwhile, the damage of devices on the main board caused by direct contact of the main board and the like with the support is avoided.

Further, the heat absorbing plate 1 has a groove on its surface in a direction facing the heat generating device, the groove being configured to at least partially attach and receive a heat conductive pad to reduce space occupation.

In some embodiments, a plurality of micro channels 4 are disposed at intervals in the heat absorbing plate 1, the heat dissipation outlets of the micro channels 4 extend to the heat conducting plate and penetrate through the heat conducting plate, and the flow direction of heat in the micro channels 4 is disposed at an angle to the heat entering direction outside the micro channels 4.

For example, the heat absorbing plate 1 faces the heat generating device in the longitudinal direction, and the microchannels 4 extend generally transversely through the heat conducting plate.

For example, the angled arrangement may be to form a 90 degree vertical.

Through setting up multiunit microchannel, and the heat flow direction in the microchannel is the angle setting with the outer heat entering direction of microchannel for can be fast derive the heat, control thermal direction of transfer, guarantee thermal effective effluvium.

In some embodiments, the thickness d of the micro flow channel 4 is 0.2-0.8 mm.

For example, the thickness d of the micro flow channel 4 is 0.45 to 0.7 mm.

For example, the micro flow channel 4 has a thickness of 0.5 mm.

In some embodiments, the height h of the microchannel 4 is 0.05-0.12 mm.

For example, the height h of the micro flow channel 4 is 0.1 mm.

Through the geometric specification design of the micro-channel, the rapid flow of the sucked heat is ensured, and the heat is conveniently and rapidly led out.

Tests carried out by the applicant show that under the condition of the same heat source of a heating device, the temperature reduction rate in the heat conduction structure is improved by 20% in unit time by adopting the structure design compared with the same heat conduction structure without using a micro flow channel.

As shown in FIG. 8, two adjacent microchannels 4 of this embodiment are communicated with each other by a heat-conducting channel 5, and the width of each heat-conducting channel 5 in the transverse direction (the width of the microchannel in the direction crossing the heat-conducting plate) is 1 to 10 mm.

For example, the transverse width is 4-8 mm.

For example, the transverse width is 5 mm.

In some embodiments, the heat conducting channel 5 is filled with heat conducting silica gel.

Through the design of two adjacent miniflow channels 4 through 5 intercommunications of heat conduction passageway, be convenient for thermal to the circulation of a plurality of directions, be filled with heat conduction silica gel in 5 intussuseptions of heat conduction passageway simultaneously, guarantee to thermal abundant absorption, improve thermal absorption rate, guarantee thermal quick flow.

The number of the micro flow channels can be adjusted by adjusting the distance between the adjacent micro flow channels. In some embodiments, 20-80 microchannels are equally spaced along the height direction of the heat absorbing plate 1, for example, 40-70 microchannels, 30-50 microchannels, etc. are equally spaced.

The unit distance may be set according to the type of electronic device used by the thermally conductive holder, and may be, for example, 5-10 mm.

The embodiment further includes an electronic device, which includes a housing 6, wherein the heat conducting bracket as described in any one of the above embodiments is installed in the housing 6, one side of the heat absorbing plate 1 is provided with a plurality of main board mounting holes 101, and the other side of the heat absorbing plate is provided with power board mounting holes 102, so that the power board 7 is fixed on one side of the heat absorbing plate 1, the main board 8 is fixed on the other side of the heat absorbing plate, a power board heat conducting pad 9 is attached between the power board 7 and the heat absorbing plate 1, and a main board heat conducting pad 10 is attached between the main.

For example, the electronic device may be a security camera.

For example, the casing is made of metal, such as aluminum alloy, so as to ensure the heat dissipation effect.

The security device provided by the invention can be used for dissipating the heat of the main board and the power panel, avoiding the phenomenon that the heat is concentrated in the shell to cause overhigh heat in the shell, and reducing the service life of the heat absorbing plate 1 and the power panel 7.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermally conductive support, comprising: the heat-absorbing plate comprises a heat-absorbing plate (1) facing a heating device, a heat-conducting plate (2) is arranged at the side end of the heat-absorbing plate (1), and a heat-transfer medium plate (3) is detachably connected onto the heat-conducting plate (2).

2. The thermally conductive bracket of claim 1, wherein: the heat absorption plate is characterized in that heat conduction plates (2) are arranged on two sides of the heat absorption plate (1), a fixing plate mounting groove (21) is formed in each heat conduction plate (2), a fixing plate mounting hole (22) is formed in each fixing plate mounting groove (21), and the heat transfer medium plate (3) is fixed on the heat conduction plates (2).

3. The thermally conductive bracket of claim 1, wherein: the heat transfer medium plate (3) comprises a fixing plate (31), a plurality of heat dissipation holes (32) are distributed on the fixing plate (31) at intervals, and elastic plates (33) are arranged on the inner walls of the heat dissipation holes (32).

4. The thermally conductive bracket of claim 1, wherein: a heat conducting pad (10) is attached to the surface of the heat absorbing plate (1) facing the heating device.

5. The thermally conductive bracket of claim 1, wherein: a plurality of micro channels (4) are arranged in the heat absorbing plate (1) at intervals, heat dissipation outlets of the micro channels (4) extend to the heat conducting plate and penetrate through the heat conducting plate, and the flow direction of heat in the micro channels (4) and the heat entering direction outside the micro channels (4) are arranged at an angle.

6. The thermally conductive bracket of claim 1, wherein: the thickness (d) of each micro flow channel (4) is 0.2-0.8mm, and the height (h) of each micro flow channel (4) is 0.05-0.12 mm.

7. The thermally conductive bracket of claim 6, wherein: at least part of two adjacent micro channels (4) are communicated through heat conducting channels (5), and the transverse width of each heat conducting channel (5) is 1-10 mm.

8. The thermally conductive bracket of claim 6, wherein: and heat-conducting silica gel is filled in the heat-conducting channel (5).

9. The thermally conductive bracket of claim 6, wherein: 20-80 micro channels are evenly distributed along the height direction of the heat absorbing plate (1).

10. An electronic device, characterized in that: comprising a casing (6), wherein the heat conducting bracket according to any one of claims 1 to 9 is installed in the casing (6), a power supply board (7) is installed on one side of the heat absorbing board (1), a main board (8) is arranged on the other side of the heat absorbing board, a power supply board heat conducting pad (9) is arranged between the power supply board (7) and the heat absorbing board (1), a main board heat conducting pad (10) is arranged between the main board (8) and the heat absorbing board (1), and the power supply board (7) and the main board (8) are both detachably connected with the heat absorbing board (1).