CN111063619A - Electroplating method - Google Patents
Electroplating method Download PDFInfo
- Publication number
- CN111063619A CN111063619A CN201911417005.3A CN201911417005A CN111063619A CN 111063619 A CN111063619 A CN 111063619A CN 201911417005 A CN201911417005 A CN 201911417005A CN 111063619 A CN111063619 A CN 111063619A
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- metalized
- electroplating
- connecting line
- electroplated
- printed
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- 238000009713 electroplating Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- 206010017076 Fracture Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004814 ceramic processing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention is suitable for the technical field of electroplating, and provides an electroplating method, which is used for electroplating a metalized area to be electroplated on a target substrate, wherein the metalized area comprises an island, and the electroplating method comprises the following steps: printing a connecting line to communicate with a metalized area to be electroplated on the target substrate, electrifying the communicated metalized area to carry out electroplating, and breaking the printed connecting line after the electroplating is finished. The invention can avoid the damage to the coating of the metalized area, thereby avoiding the reduction of the available area in the metalized area and ensuring the use efficiency of the substrate.
Description
Technical Field
The invention belongs to the technical field of electroplating, and particularly relates to an electroplating method.
Background
The development of the system-in-package comprises a digital and radio frequency mixed signal design, is an integrator of the current packaging technology, and can realize the integration of various signals such as digital, analog, microwave and the like.
When the metalized area on the substrate is electroplated, in the prior art, the metalized area is communicated by using a gold wire bonding mode, then current is applied to the metalized area to electroplate the communicated metalized area, but the bonding part occupies a metalized partial area, and after the electroplating is finished, the plating layer of the bonding part is damaged when the bonding part is removed, so that the area of the usable area in the metalized area on the substrate is reduced, and the use efficiency of the substrate is influenced.
Disclosure of Invention
In view of the above, the present invention provides an electroplating method, which aims to solve the problem that the available area of a metalized area is reduced after electroplating the metalized area on a substrate in the prior art.
A first aspect of an embodiment of the present invention provides an electroplating method, configured to electroplate a metalized area to be electroplated on a target substrate, where an island area exists in the metalized area to be electroplated, where the electroplating method includes:
printing a connecting line to communicate with a metalized area to be electroplated on the target substrate;
electrifying the communicated metalized areas for electroplating;
after the plating is completed, the printed connecting line is broken.
Optionally, before the power is applied to the connected metalized area for electroplating, the method further includes:
and printing an insulating medium layer on the printed connecting line to cover the connecting line.
Optionally, after the insulating medium layer is printed on the printed connection line to cover the connection line, the method further includes:
and sintering the printed connecting line and the insulating medium layer covering the printed connecting line into a whole.
Optionally, the energizing the connected metalized areas for electroplating includes:
electrifying the communicated metalized areas, and electroplating a nickel layer on the communicated metalized areas;
after the nickel plating is completed, the metallized regions after the nickel plating are electroplated with a gold layer.
Optionally, a terminal is disposed on the target substrate, and the printing of the connection line to communicate with a metalized area to be plated on the target substrate includes:
and printing connecting lines to enable the metalized areas to be electroplated on the target substrate to be communicated to the wiring terminals.
Optionally, after the electroplating is completed, the breaking the printed connecting line includes:
after the plating is completed, the printed connecting line is cut off by a laser.
Alternatively, after breaking the printed connection line, a groove for cutting the connection line is formed at the break of the connection line.
Optionally, the length of the groove is greater than or equal to the width of the connecting line.
Optionally, the width of the connecting line ranges from 0.075mm to 0.3mm, and the length of the groove is greater than 0.075mm and less than 0.5 mm.
Compared with the prior art, the invention has the following beneficial effects:
the electroplating method is used for electroplating a metalized area to be electroplated on a target substrate, wherein the metalized area comprises an island, and the electroplating method comprises the following steps: printing a connecting line to communicate with a metalized area to be electroplated on the target substrate, electrifying the communicated metalized area to carry out electroplating, and breaking the printed connecting line after the electroplating is finished. The electroplating method of the invention uses the mode of printing the connecting line to connect the metalized areas to be electroplated on the target substrate, the printed connecting line does not occupy the metalized areas, and after the electroplating is finished, the connecting line is broken to disconnect the electroplated metalized areas without operating the metalized areas, thus avoiding the damage to the coating of the metalized areas, further avoiding the reduction of the available areas in the metalized areas and ensuring the use efficiency of the substrate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a prior art structure for connecting metallization regions by gold wire bonding;
FIG. 2 is a flow chart of an implementation of an electroplating method according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a connecting line connected metallization region provided in an embodiment of the present invention;
fig. 4 is a cross-sectional view of a substrate after a connecting line has been broken, according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Integrated microsystems technology has become an important approach to miniaturization and performance improvement of complete machine modules. The system comprises a million-gate-level FPGA, a high-speed A/D, D/A, a radio frequency chip and other various components. The development of the system-level packaging shell comprises digital and radio frequency mixed signal design, is an integrator of the current shell technology, can realize the integration of various signals such as digital, analog and microwave, and meets the requirement of reliable application of equipment. The system-in-package packages a substrate, on which a plurality of chips and resistance-capacitance elements are required to be placed, and the chips and the resistance-capacitance elements are mounted in respective metalized areas. The metallized areas are connected to terminals of the substrate and the metallized areas are not connected to the terminals, wherein the metallized areas not connected to the terminals are called islands.
Referring to fig. 1, there is shown a schematic structural diagram of a prior art method for connecting metallization regions by gold wire bonding, which is detailed as follows:
in the prior art, when the metalized regions 11 and 12 on the target substrate are electroplated, the metalized regions on the substrate are firstly communicated by using a gold wire bonding mode, and then the communicated metalized regions 11 and 12 are charged for electroplating, one end of a gold bonding wire 13 is arranged in a bonding region 111 in the metalized region 11, the other end of the gold bonding wire 13 is arranged on a bonding region 121 in the metalized region 12, after the electroplating is completed, the bonding region 111 and the bonding region 121 need to be removed, so that the plating layer of the bonding region 111 and the plating layer of the bonding region 121 are easily damaged, and the available regions of the metalized region 11 and the metalized region 12 are reduced. And if hundreds of positions on the target substrate need to be bonded and connected, bonding is needed one by one, the workload of the bonding wire is large, the efficiency is low, in the electroplating process, the operations such as washing, vibration and the like can be carried out, the bonding wire is easy to break, the electroplating is ineffective, and the product is scrapped.
The electroplating method of the invention uses the mode of printing the connecting line to communicate the metalized area to be electroplated, and the connecting line is broken after the metalized area is electroplated, and the plated layer of the metalized area after electroplating can be prevented from being damaged because the printed connecting line does not occupy the metalized area, thereby preventing the available area of the metalized area from being reduced.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following description is made by way of specific embodiments with reference to the accompanying drawings.
Referring to fig. 2 and fig. 3, fig. 2 shows an implementation flowchart of an electroplating method provided by an embodiment of the present invention, and fig. 3 shows a schematic structural diagram of a connecting line connected metallization region provided by an embodiment of the present invention, which is detailed as follows:
the electroplating method is used for electroplating a metalized area to be electroplated on a target substrate, wherein an island area exists in the metalized area to be electroplated, and the electroplating method is characterized by comprising the following steps of:
s201: printing a connecting line to communicate with a metalized area to be electroplated on the target substrate;
before the metalized areas are electroplated, the metalized areas to be electroplated need to be communicated, and the communicated metalized areas can be electrified to perform electroplating operation. Referring to fig. 3, the printed connecting lines 33 only occupy the area between the metalized areas 31 and 32, and do not occupy the area of the metalized areas 31 and 32.
In an embodiment of the present invention, a connecting line and a metalized area to be plated may be printed on a target substrate, and the connecting line is used for communicating with the metalized area to be plated. The target substrate can be a ceramic medium, the connecting wire and the metalized area to be electroplated can be printed on the target substrate simultaneously during green ceramic processing of the ceramic medium, the processing mode improves the processing speed, and the connecting wire and the metalized area are sintered into a whole during sintering, so that the connecting wire and the metalized area are conductive.
Optionally, a terminal is disposed on the target substrate, and the printing of the connection line to communicate with a metalized area to be plated on the target substrate includes:
and printing connecting lines to enable the metalized areas to be electroplated on the target substrate to be communicated to the wiring terminals.
In the embodiment of the invention, the target substrate is provided with terminals, a part of metalized areas on the target substrate are connected with the terminals, and the rest metalized areas are not connected with the terminals, wherein the metalized areas which are not connected with the terminals are called islands, when the connecting lines are printed, the connecting lines can be printed between each island and the island which is closest to the island, then the metalized areas which are connected with the terminals are connected with the island which is closest to the island, or the islands are connected with the metalized areas which are connected with the terminals, and when the terminals are electroplated, all the metalized areas to be electroplated on the substrate are electrified by electrifying the terminals. And the mode of printing the connecting wire can once be accomplished, and efficiency is higher, and the connecting wire of printing does not have the fracture risk, and the reliability is higher.
S202: electrifying the communicated metalized areas for electroplating;
in the embodiment of the invention, after the metalized areas to be electroplated on the target substrate are communicated, the communicated metalized areas are electrified, and the communicated metalized areas are electroplated.
Optionally, the energizing the connected metalized areas for electroplating includes:
electrifying the communicated metalized areas, and electroplating a nickel layer on the communicated metalized areas;
after the nickel plating is completed, the metallized regions after the nickel plating are electroplated with a gold layer.
In the embodiment of the invention, the metalized area on the substrate can be placed into an electroplating bath of a solution containing nickel, a nickel layer can be plated on the metalized area after the connected metalized area is electrified, the metalized area plated with the nickel layer is placed into the electroplating bath of the solution containing gold after the nickel layer is electroplated, a gold layer is electroplated on the metalized area, a nickel layer is formed on the surface of the metalized area after the electroplating, and a gold layer is formed on the surface of the nickel layer.
S203: after the plating is completed, the printed connecting line is broken.
In the embodiment of the invention, after the metalized area needing electroplating is electroplated, the printed connecting line is broken, and a broken part is formed on the connecting line.
Optionally, after the electroplating is completed, the breaking the printed connecting line includes:
after the plating is completed, the printed connecting line is cut off by a laser.
In the embodiment of the present invention, the printed connection line may be broken by cutting the connection line with a laser. Laser cutting forms a break in the connecting line. The laser interruption mode has high processing speed, meets the requirement of batch processing, has beautiful appearance and has no influence on the performance of a metalized area.
Referring to fig. 3 and 4, 40 in fig. 4 is a target substrate, 31 and 32 are metallization regions, 33 is a connection line, 41 and 43 are electroplated nickel layers, 42 and 44 are electroplated gold layers, 45 and 46 are insulating dielectric layers, and 47 is a trench formed at the break.
From the above, the electroplating method of the present invention is used for electroplating a metalized area to be electroplated on a target substrate, where the metalized area includes an island, and the electroplating method includes: printing a connecting line to communicate with a metalized area to be electroplated on the target substrate, electrifying the communicated metalized area to carry out electroplating, and breaking the printed connecting line after the electroplating is finished. The electroplating method of the invention uses the mode of printing the connecting line to connect the metalized areas to be electroplated on the target substrate, the printed connecting line does not occupy the metalized areas, and after the electroplating is finished, the connecting line is broken to disconnect the electroplated metalized areas without operating the metalized areas, thus avoiding the damage to the coating of the metalized areas, further avoiding the reduction of the available areas in the metalized areas and ensuring the use efficiency of the substrate.
Optionally, before the power is applied to the connected metalized area for electroplating, the method further includes:
and printing an insulating medium layer on the printed connecting line to cover the connecting line.
In the embodiment of the invention, before the connected metalized areas are electrified to be electroplated, the connecting wires are covered by printing the insulating medium layers on the connecting wires, the insulating medium layers can be made of ceramic materials, the thickness of the insulating medium layers can be 7-50 micrometers, the insulating medium layers have the function of preventing the metalized areas on the two sides of the connecting wires from being broken, for example, when the connecting wires are broken by laser, the gold layers electroplated in the metalized areas can be easily corroded, and the ceramic media can protect the gold layers in the metalized areas from being corroded by the laser, so that the integrity of the gold layers in the metalized areas is maintained, and the use reliability of the metalized areas is met.
In the embodiment of the invention, the shapes of the printed connecting lines and the insulating medium layer are not limited, and can be circular, triangular, rectangular, square and the like.
Optionally, after the insulating medium layer is printed on the printed connection line to cover the connection line, the method further includes:
and sintering the printed connecting line and the insulating medium layer covering the printed connecting line into a whole.
In the embodiment of the invention, the printed connecting wire and the insulating medium layer covering the printed connecting wire are sintered into a whole, and the printed connecting wire can be conducted by high-temperature sintering. High temperature sintering increases the overall connectivity of the insulating media.
In the embodiment of the invention, the substrate, the metalized region, the printed connecting line and the insulating medium layer covering the connecting line can be sintered into a whole, the metalized region and the connecting line can be printed on the substrate at the same time, the substrate can be made of a ceramic medium, the ceramic medium can be made of an aluminum oxide or aluminum nitride material, the insulating medium layer can be made of the same material as the substrate, and the ceramic medium can be processed into a porcelain from a raw porcelain through high-temperature sintering, so that the conductivity of the metalized region and the connecting line can be enhanced, and the overall connectivity of the substrate, the metalized region, the printed connecting line and the connecting line can be enhanced.
Alternatively, after breaking the printed connection line, a groove for cutting the connection line is formed at the break of the connection line.
In the embodiment of the invention, the length of the groove formed at the break is greater than or equal to the width of the connecting line. The depth of the groove is greater than the thickness of the connecting line, and the width of the connecting line ranges from 0.075mm to 0.3 mm. The width of the connecting line is thinner, and the occupied area between the metalized areas is smaller.
The depth of the grooves may be less than 0.2mm and the length of the grooves is greater than 0.075mm and less than 0.5 mm. The length direction of the groove is perpendicular to the connection direction of the connecting lines, and the width of the groove is larger than that of the connecting lines0mm and less than 0.5 mm. To realize the insulation resistance of the trench of 1 × 10 or more10Ω(DC 500V)。
In the embodiment of the invention, the electroplating method can be used for substrate products or shell products, the number of the metalized areas is less than or equal to 10000, and the minimum insulation distance between the metalized areas can be 0.1 mm. The connecting wire does not occupy a metalized area used by a user, has attractive appearance and has no influence on the performance and reliability of products.
The electroplating method is used for electroplating a metalized area to be electroplated on a target substrate, wherein the metalized area comprises an island, and the electroplating method comprises the following steps: printing a connecting line to communicate with a metalized area to be electroplated on the target substrate, electrifying the communicated metalized area to carry out electroplating, and breaking the printed connecting line after the electroplating is finished. The electroplating method of the invention uses the mode of printing the connecting line to connect the metalized areas to be electroplated on the target substrate, the printed connecting line does not occupy the metalized areas, and after the electroplating is finished, the connecting line is broken to disconnect the electroplated metalized areas without operating the metalized areas, thus avoiding the damage to the coating of the metalized areas, further avoiding the reduction of the available areas in the metalized areas and ensuring the use efficiency of the substrate.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. An electroplating method for electroplating a metalized area to be electroplated on a target substrate, wherein an island area exists in the metalized area to be electroplated, the electroplating method comprises the following steps:
printing a connecting line to communicate with a metalized area to be electroplated on the target substrate;
electrifying the communicated metalized areas for electroplating;
after the plating is completed, the printed connecting line is broken.
2. The electroplating method of claim 1, further comprising, prior to energizing the interconnected metalized areas for electroplating:
and printing an insulating medium layer on the printed connecting line to cover the connecting line.
3. The electroplating method according to claim 2, wherein after the step of printing an insulating medium layer on the printed connecting line to cover the connecting line, the method further comprises the following steps:
and sintering the printed connecting line and the insulating medium layer covering the printed connecting line into a whole.
4. The electroplating method of any one of claims 1 to 3, wherein the energising of the interconnected metallised regions for electroplating comprises:
electrifying the communicated metalized areas, and electroplating a nickel layer on the communicated metalized areas;
after the nickel plating is completed, the metallized regions after the nickel plating are electroplated with a gold layer.
5. The electroplating method according to claim 4, wherein the target substrate is provided with terminals, and the step of printing connecting lines to communicate with metalized areas to be electroplated on the target substrate comprises the following steps:
and printing connecting lines to enable the metalized areas to be electroplated on the target substrate to be communicated to the wiring terminals.
6. Electroplating method according to claim 4, wherein the breaking of the printed connection line after electroplating is completed comprises:
after the plating is completed, the printed connecting line is cut off by a laser.
7. An electroplating method according to claim 4, wherein after breaking the printed connection line, a groove for cutting the connection line is formed at the break of the connection line.
8. The plating method as recited in claim 7, wherein the length of the groove is equal to or greater than the width of the connecting line.
9. The electroplating method of claim 8, wherein the connecting line width is in the range of 0.075mm to 0.3mm, and the length of the groove is greater than 0.075mm and less than 0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911417005.3A CN111063619B (en) | 2019-12-31 | 2019-12-31 | Electroplating method |
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| CN201911417005.3A CN111063619B (en) | 2019-12-31 | 2019-12-31 | Electroplating method |
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| CN111063619A true CN111063619A (en) | 2020-04-24 |
| CN111063619B CN111063619B (en) | 2021-12-24 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW587103B (en) * | 2001-04-06 | 2004-05-11 | Phoenix Prec Technology Corp | Circuit board Ni/Au electroplating process without electroplated wires |
| TW200541422A (en) * | 2004-06-11 | 2005-12-16 | Advanced Semiconductor Eng | Fabrication method of a printed circuit board |
| CN103165560A (en) * | 2013-02-06 | 2013-06-19 | 日月光半导体制造股份有限公司 | Substrate and semiconductor structure applying the same |
| CN103236415A (en) * | 2012-12-31 | 2013-08-07 | 中国电子科技集团公司第四十一研究所 | Thin film hybrid integrated circuit electroplating method |
| CN105244324A (en) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | Ceramic insulator for electronic packaging and manufacturing method thereof |
| CN109686514A (en) * | 2018-12-24 | 2019-04-26 | 河北中瓷电子科技有限公司 | Ceramic insulator route coating method |
-
2019
- 2019-12-31 CN CN201911417005.3A patent/CN111063619B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW587103B (en) * | 2001-04-06 | 2004-05-11 | Phoenix Prec Technology Corp | Circuit board Ni/Au electroplating process without electroplated wires |
| TW200541422A (en) * | 2004-06-11 | 2005-12-16 | Advanced Semiconductor Eng | Fabrication method of a printed circuit board |
| CN103236415A (en) * | 2012-12-31 | 2013-08-07 | 中国电子科技集团公司第四十一研究所 | Thin film hybrid integrated circuit electroplating method |
| CN103165560A (en) * | 2013-02-06 | 2013-06-19 | 日月光半导体制造股份有限公司 | Substrate and semiconductor structure applying the same |
| CN105244324A (en) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | Ceramic insulator for electronic packaging and manufacturing method thereof |
| CN109686514A (en) * | 2018-12-24 | 2019-04-26 | 河北中瓷电子科技有限公司 | Ceramic insulator route coating method |
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| CN111063619B (en) | 2021-12-24 |
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