CN111052876A - 连接板、电路板组件及电子设备 - Google Patents
连接板、电路板组件及电子设备 Download PDFInfo
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- CN111052876A CN111052876A CN201880057169.7A CN201880057169A CN111052876A CN 111052876 A CN111052876 A CN 111052876A CN 201880057169 A CN201880057169 A CN 201880057169A CN 111052876 A CN111052876 A CN 111052876A
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- signal transmission
- circuit board
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- 230000005684 electric field Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
一种连接板(3),电路板组件(300)及电子设备(100),该连接板(3)包括板体(31)、信号传输部(32)及接地部(33)。板体(31)设有信号传输孔(311)和至少一个接地孔(312),信号传输孔(311)自板体(31)的一端(314)延伸至板体(31)的另一端(315),信号传输部(32)设于信号传输孔(311)内,至少一个接地孔(312)自板体(31)的一端(314)延伸至板体(31)的另一端(315),且与信号传输孔(311)延伸路径相同,至少一个接地孔(312)环绕信号传输孔(311)且与信号传输孔(311)间隔设置,接地部(33)设于至少一个接地孔(312)内。上述连接板(3)能够精确控制特性阻抗。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110337506.1A CN113194598A (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
CN202010231933.7A CN111356287B (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2018/079178 WO2019174007A1 (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010231933.7A Division CN111356287B (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
CN202110337506.1A Division CN113194598A (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111052876A true CN111052876A (zh) | 2020-04-21 |
Family
ID=67908684
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010231933.7A Active CN111356287B (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
CN201880057169.7A Pending CN111052876A (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
CN202110337506.1A Pending CN113194598A (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010231933.7A Active CN111356287B (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110337506.1A Pending CN113194598A (zh) | 2018-03-15 | 2018-03-15 | 连接板、电路板组件及电子设备 |
Country Status (4)
Country | Link |
---|---|
US (2) | US11166374B2 (zh) |
EP (1) | EP3755126A4 (zh) |
CN (3) | CN111356287B (zh) |
WO (1) | WO2019174007A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10419050B1 (en) * | 2018-05-29 | 2019-09-17 | Apple Inc. | Printed circuit board interposer for radio frequency signal transmission |
KR102526400B1 (ko) * | 2018-09-06 | 2023-04-28 | 삼성전자주식회사 | 5g 안테나 모듈을 포함하는 전자 장치 |
WO2020090230A1 (ja) * | 2018-11-01 | 2020-05-07 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
US20230361460A1 (en) * | 2022-05-06 | 2023-11-09 | Apple Inc. | System and method for ground fencing |
CN114945240A (zh) * | 2022-05-23 | 2022-08-26 | 维沃移动通信有限公司 | 转接板、电路板和电子设备 |
WO2024022699A1 (en) * | 2022-07-29 | 2024-02-01 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with signal conductive element and shielding conductive structure |
EP4312470A1 (en) * | 2022-07-29 | 2024-01-31 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with signal conductive element and shielding conductive structure |
CN117082723A (zh) * | 2023-10-11 | 2023-11-17 | 荣耀终端有限公司 | 电路板、电子设备及板制作方法 |
Citations (5)
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EP1182913A1 (en) * | 2000-08-25 | 2002-02-27 | Agere Systems Guardian Corporation | High speed circuit board interconnection |
US20100255690A1 (en) * | 2009-04-02 | 2010-10-07 | Qualcomm Incorporated | Spacer-connector and circuit board assembly |
US20120187550A1 (en) * | 2011-01-24 | 2012-07-26 | Industrial Technology Research Institute | Interconnection structure, apparatus therewith, circuit structure therewith |
US20150022986A1 (en) * | 2013-07-19 | 2015-01-22 | Motorola Mobility Llc | Circuit Assembly and Corresponding Methods |
CN105580196A (zh) * | 2013-09-24 | 2016-05-11 | 日本电气株式会社 | 印刷电路板及在印刷电路板上安装的方法 |
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-
2018
- 2018-03-15 CN CN202010231933.7A patent/CN111356287B/zh active Active
- 2018-03-15 WO PCT/CN2018/079178 patent/WO2019174007A1/zh unknown
- 2018-03-15 CN CN201880057169.7A patent/CN111052876A/zh active Pending
- 2018-03-15 US US16/980,174 patent/US11166374B2/en active Active
- 2018-03-15 EP EP18909634.0A patent/EP3755126A4/en active Pending
- 2018-03-15 CN CN202110337506.1A patent/CN113194598A/zh active Pending
-
2021
- 2021-09-28 US US17/487,988 patent/US11706871B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1182913A1 (en) * | 2000-08-25 | 2002-02-27 | Agere Systems Guardian Corporation | High speed circuit board interconnection |
US20100255690A1 (en) * | 2009-04-02 | 2010-10-07 | Qualcomm Incorporated | Spacer-connector and circuit board assembly |
US20120187550A1 (en) * | 2011-01-24 | 2012-07-26 | Industrial Technology Research Institute | Interconnection structure, apparatus therewith, circuit structure therewith |
US20150022986A1 (en) * | 2013-07-19 | 2015-01-22 | Motorola Mobility Llc | Circuit Assembly and Corresponding Methods |
CN105580196A (zh) * | 2013-09-24 | 2016-05-11 | 日本电气株式会社 | 印刷电路板及在印刷电路板上安装的方法 |
Also Published As
Publication number | Publication date |
---|---|
US11706871B2 (en) | 2023-07-18 |
CN111356287B (zh) | 2021-01-05 |
US11166374B2 (en) | 2021-11-02 |
EP3755126A4 (en) | 2021-03-03 |
US20220022320A1 (en) | 2022-01-20 |
US20210014971A1 (en) | 2021-01-14 |
EP3755126A1 (en) | 2020-12-23 |
CN111356287A (zh) | 2020-06-30 |
WO2019174007A1 (zh) | 2019-09-19 |
CN113194598A (zh) | 2021-07-30 |
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