CN111040353A - Bulk molding compound prepared from polymethyl methacrylate powder and free of styrene component - Google Patents
Bulk molding compound prepared from polymethyl methacrylate powder and free of styrene component Download PDFInfo
- Publication number
- CN111040353A CN111040353A CN201911221369.4A CN201911221369A CN111040353A CN 111040353 A CN111040353 A CN 111040353A CN 201911221369 A CN201911221369 A CN 201911221369A CN 111040353 A CN111040353 A CN 111040353A
- Authority
- CN
- China
- Prior art keywords
- parts
- molding compound
- bulk molding
- polymethyl methacrylate
- styrene component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
A bulk molding compound without styrene component prepared by polymethyl methacrylate powder is prepared by, by weight, 1800-; the bulk molding compound produced by the method has high hardness, and the dirt resistance, the corrosion resistance and the aging resistance are greatly improved.
Description
Technical Field
The invention relates to the technical field of bulk molding compounds, in particular to a bulk molding compound without styrene component, which is prepared by polymethyl methacrylate powder.
Background
The bulk molding compound is a thermosetting composite material formed by mixing MMA resin, PMMA powder, functional addition auxiliary agents, curing agents, mineral fillers, chopped glass fibers and the like. The forming pressure and the forming temperature are both lower, the investment cost on equipment and a die can be reduced, and the method is suitable for processing large components with complex configurations.
The bulk molding compound sold in the market at present has low hardness, poor dirt resistance, corrosion resistance and aging resistance, and is difficult to adapt to the requirements of the market on the bulk molding compound.
Disclosure of Invention
The invention aims to provide bulk molding compound without styrene component prepared by polymethyl methacrylate powder, which solves the technical problems of lower hardness, poorer dirt resistance, corrosion resistance and aging resistance of the bulk molding compound in the prior art.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the bulk molding compound without styrene component is prepared from 1800-80 parts of MMA resin, 260-320 parts of polymethyl methacrylate powder, 53-66 parts of initiator, 29700-32500 parts of filler, 80-120 parts of color paste, 380-435 parts of glass fiber and 23-29 parts of assistant according to weight ratio.
Further, the initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
Further, the filler is aluminum hydroxide ATH.
Further, the length of the glass fiber is 8-11 mm.
Further, the auxiliary agent is an inhibitor HQ.
The invention has the following beneficial effects: the bulk molding compound without styrene component prepared by polymethyl methacrylate powder has high hardness, and the pollution resistance, corrosion resistance and aging resistance are greatly improved.
Detailed Description
The present invention will be further described in detail with reference to the following specific examples, but the scope of the present invention is not limited to the following examples. The procedures, conditions, reagents, experimental methods and the like for carrying out the present invention are general knowledge and common general knowledge in the art except for the contents specifically mentioned below, and the present invention is not particularly limited.
Example 1
A bulk molding compound without styrene component prepared from polymethyl methacrylate powder is prepared from 1800 parts of MMA resin, 260 parts of polymethyl methacrylate powder, 53 parts of initiator, 29700 parts of filler, 80 parts of color paste, 380 parts of glass fiber and 23 parts of auxiliary agent according to weight ratio.
The initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
The filler is aluminum hydroxide ATH.
The length of the glass fiber is 8 mm.
The auxiliary agent is HQ inhibitor
Example 2
The bulk molding compound without styrene component is prepared from 2000 parts of MMA resin, 300 parts of polymethyl methacrylate powder, 60 parts of initiator, 30000 parts of filler, 100 parts of color paste, 400 parts of glass fiber and 25 parts of auxiliary agent according to weight ratio.
The initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
The filler is aluminum hydroxide ATH.
The length of the glass fiber is 10 mm.
The auxiliary agent is HQ inhibitor
Example 3
The bulk molding compound without styrene component is prepared from 2100 parts of MMA resin, 275 parts of polymethyl methacrylate powder, 58 parts of initiator, 29990 parts of filler, 115 parts of color paste, 402 parts of glass fiber and 26 parts of auxiliary agent according to weight ratio.
The initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
The filler is aluminum hydroxide ATH.
The length of the glass fiber is 9 mm.
The auxiliary agent is HQ inhibitor
Example 4
The bulk molding compound is prepared from 2215 parts of MMA resin, 289 parts of polymethyl methacrylate powder, 57 parts of initiator, 31426 parts of filler, 117 parts of color paste, 409 parts of glass fiber and 26 parts of auxiliary agent according to the weight ratio.
The initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
The filler is aluminum hydroxide ATH.
The length of the glass fiber is 10 mm.
The auxiliary agent is HQ inhibitor
Example 5
The bulk molding compound without styrene component is prepared from, by weight, 2300 parts of MMA resin, 320 parts of polymethyl methacrylate powder, 66 parts of initiator, 32500 parts of filler, 120 parts of color paste, 435 parts of glass fiber and 29 parts of auxiliary agent.
The initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
The filler is aluminum hydroxide ATH.
The length of the glass fiber is 11 mm.
The auxiliary agent is HQ inhibitor.
Claims (5)
1. A bulk molding compound without styrene component prepared by polymethyl methacrylate powder is characterized in that: according to the weight ratio, the bulk molding compound is prepared from 1800-190 parts of MMA resin, 260-320 parts of polymethyl methacrylate PMMA powder, 53-66 parts of initiator, 29700-32500 parts of filler, 80-120 parts of color paste, 380-435 parts of glass fiber and 23-29 parts of auxiliary agent.
2. The bulk molding compound free of styrene component produced from polymethyl methacrylate powder according to claim 1, wherein: the initiator is a mixed solution of MMA resin and TBPB, wherein the mass ratio of the MMA resin to the TBPB is 2: 1.
3. The bulk molding compound free of styrene component produced from polymethyl methacrylate powder according to claim 1, wherein: the filler is aluminum hydroxide ATH.
4. The bulk molding compound free of styrene component produced from polymethyl methacrylate powder according to claim 1, wherein: the length of the glass fiber is 8-11 mm.
5. The bulk molding compound free of styrene component produced from polymethyl methacrylate powder according to claim 1, wherein: the auxiliary agent is HQ inhibitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911221369.4A CN111040353A (en) | 2019-12-03 | 2019-12-03 | Bulk molding compound prepared from polymethyl methacrylate powder and free of styrene component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911221369.4A CN111040353A (en) | 2019-12-03 | 2019-12-03 | Bulk molding compound prepared from polymethyl methacrylate powder and free of styrene component |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111040353A true CN111040353A (en) | 2020-04-21 |
Family
ID=70234509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911221369.4A Pending CN111040353A (en) | 2019-12-03 | 2019-12-03 | Bulk molding compound prepared from polymethyl methacrylate powder and free of styrene component |
Country Status (1)
Country | Link |
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CN (1) | CN111040353A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113549178A (en) * | 2021-07-14 | 2021-10-26 | 江苏华昇新材料科技有限公司 | High-strength BMC bulk molding compound prepared from PMMA powder and MMA monomer and preparation method thereof |
CN117069974A (en) * | 2023-07-18 | 2023-11-17 | 哈尔滨工业大学 | Methyl methacrylate resin system and method for forming fiber reinforced material by room-temperature in-situ dip transfer molding |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1259975A (en) * | 1997-05-14 | 2000-07-12 | 三菱丽阳株式会社 | (Meth) acrylic resin composition for thermoset injection molding, process for preparing same, and process for producing moldings of same |
CN1277573A (en) * | 1997-10-28 | 2000-12-20 | 三菱丽阳株式会社 | Acrylic SMC or BMC, processes for the preparation of the same, process for the production of acrylic synthetic marble, and thickening agent |
JP2011173969A (en) * | 2010-02-23 | 2011-09-08 | Panasonic Electric Works Co Ltd | Thermosetting (meth)acrylic resin composition, sheet molding compound using the same, bulk molding compound, and molded article |
CN102816420A (en) * | 2011-06-10 | 2012-12-12 | 泰州科逸新材料有限公司 | Jade-like bulk molding compound and preparation method thereof |
-
2019
- 2019-12-03 CN CN201911221369.4A patent/CN111040353A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1259975A (en) * | 1997-05-14 | 2000-07-12 | 三菱丽阳株式会社 | (Meth) acrylic resin composition for thermoset injection molding, process for preparing same, and process for producing moldings of same |
CN1277573A (en) * | 1997-10-28 | 2000-12-20 | 三菱丽阳株式会社 | Acrylic SMC or BMC, processes for the preparation of the same, process for the production of acrylic synthetic marble, and thickening agent |
JP2011173969A (en) * | 2010-02-23 | 2011-09-08 | Panasonic Electric Works Co Ltd | Thermosetting (meth)acrylic resin composition, sheet molding compound using the same, bulk molding compound, and molded article |
CN102816420A (en) * | 2011-06-10 | 2012-12-12 | 泰州科逸新材料有限公司 | Jade-like bulk molding compound and preparation method thereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113549178A (en) * | 2021-07-14 | 2021-10-26 | 江苏华昇新材料科技有限公司 | High-strength BMC bulk molding compound prepared from PMMA powder and MMA monomer and preparation method thereof |
CN113549178B (en) * | 2021-07-14 | 2022-08-05 | 江苏华昇新材料科技有限公司 | High-strength BMC bulk molding compound prepared from PMMA powder and MMA monomer and preparation method thereof |
CN117069974A (en) * | 2023-07-18 | 2023-11-17 | 哈尔滨工业大学 | Methyl methacrylate resin system and method for forming fiber reinforced material by room-temperature in-situ dip transfer molding |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200421 |