CN114044985A - Modified nano-silicon fiber reinforced mold cleaning adhesive for semiconductor packaging mold - Google Patents
Modified nano-silicon fiber reinforced mold cleaning adhesive for semiconductor packaging mold Download PDFInfo
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Abstract
The invention discloses a modified nano silicon fiber reinforced mold cleaning adhesive for a semiconductor packaging mold, which utilizes the high strength and the anti-tear property of silicon fiber with the advantage of nano scale to be compounded with a mold cleaning agent to enhance the heat-resistant tearing capability of the mold cleaning adhesive and improve the mold cleaning effect; the mold cleaning adhesive for the semiconductor packaging mold provided by the invention mainly comprises the following raw materials in parts by mass: 100 parts of unvulcanized rubber, 2-6 parts of activating agent, 25-65 parts of reinforcing agent, 3-10 parts of modified nano silicon fiber, 5-30 parts of cleaning agent, 0.8-6 parts of mold cleaning assistant, 2-12 parts of adsorbent, 1-12 parts of coloring agent, 0.4-4 parts of vulcanizing agent and 0.2-3 parts of co-vulcanizing agent. The dirt on the surface of the semiconductor packaging mold is effectively removed by utilizing the viscosity of the mold cleaning glue, the softening and stripping effects of the cleaning agent and the mold cleaning auxiliary agent, the heat tearing resistance and the tearing resistance of the modified nano silicon fiber and the adsorption effect of the adsorbent. The mold cleaning adhesive has excellent mechanical property and thermal tear resistance, strong cleaning capability, complete rubber material after cleaning, convenient demolding and great improvement on production efficiency.
Description
Technical Field
The invention belongs to the technical field of cleaning of dies in the semiconductor packaging industry, and particularly relates to a modified nano silicon fiber reinforced mold cleaning adhesive for a semiconductor packaging die.
Background
In the production process of the semiconductor chip packaging industry, components such as epoxy molding compounds, release agents and the like can be adhered to a metal mold at high temperature, residues of epoxy resin and release agent volatile matters are easily adhered to the surface of the mold, serious dirt can be generated on the surface of the mold after repeated operation, the dirt can be further oxidized at high temperature to cause corrosion of the mold, the appearance quality of a product is influenced, and the exhaust holes of the mold are blocked seriously, so that the production efficiency is influenced. Therefore, the cleaning of the semiconductor package mold is very important.
At present, in order to remove pollutants remained on the surface of a mould, two modes are mainly adopted, one mode is to adopt a traditional thermosetting melamine mould cleaning material, dirt on the surface of the mould is removed by the self-adhesion of the melamine mould cleaning material, but the melamine mould cleaning material is poor in operability, the melamine resin is brittle and easy to break after being cured, the cleaning process time is increased, irritant harmful gases such as formaldehyde are generated by curing and decomposition of the melamine resin, the melamine mould cleaning material is matched with a lead frame when in use, and the comprehensive cost is high. The other method is to adopt unvulcanized rubber containing a cleaning agent, remove pollutants on the surface of the mold through the solidification of the unvulcanized rubber in the packaging mold and the infiltration, physical and chemical adsorption effects of the cleaning agent on dirt, complete the cleaning process after mold filling and vulcanization, realize in-situ cleaning and have no influence on the precision of the mold. From the viewpoint of efficiency, cost and environmental protection, the mold cleaning adhesive tape has obvious advantages, and the mold cleaning adhesive tape is gradually adopted to replace melamine in the packaging industry as a mold cleaning material of a semiconductor packaging mold. Therefore, the development of a high-performance mold cleaning adhesive tape is a development trend in the field of semiconductor packaging mold cleaning. Chinese patent publication No. CN108047694A discloses a mold cleaning material for a semiconductor packaging mold and a preparation method thereof, which is characterized in that the mold cleaning material comprises the following main raw materials: 45-65 parts of rubber (60-80% of polyurethane rubber, 10-20% of ethylene propylene rubber and 10-20% of butadiene rubber), 15-35 parts of modified filler, 1-4 parts of penetrating agent, 2-7 parts of cleaning agent and 0.5-2 parts of cross-linking agent. The mold cleaning material greatly reduces the residue on the mold, increases the mold cleaning effect and greatly reduces the cost of the mold cleaning material. With the development of the semiconductor packaging industry, the mold cleaning adhesive for the packaging mold has higher mechanical strength and tearing strength, is convenient to take out after vulcanization cleaning, and has good fluidity so as to be beneficial to cleaning more complex molds. However, no report is found about nanofiber reinforced clear mold adhesive at present.
Disclosure of Invention
The invention aims to provide a preparation method of modified nano-silicon fiber reinforced mold cleaning glue aiming at the defects of the prior art, which is characterized in that the problems of easy fragmentation, incompleteness and insufficient heat-resistant tearing performance after mold cleaning glue vulcanization are solved by utilizing the size advantage of the modified nano-silicon fiber and good compatibility with a rubber matrix, the elasticity and the anti-tearing capability of the mold cleaning glue are greatly improved, and meanwhile, the mold cleaning effect is effectively improved, the production efficiency is improved, and the service life of a mold is prolonged by matching with a mold cleaning agent.
The technical scheme adopted by the invention is as follows:
the mold cleaning adhesive for the semiconductor packaging mold comprises the following raw materials in parts by weight: 100 parts of unvulcanized rubber, 2-6 parts of activating agent, 25-65 parts of reinforcing agent, 3-10 parts of modified nano silicon fiber, 5-30 parts of cleaning agent, 0.8-6 parts of mold cleaning assistant, 2-12 parts of adsorbent, 1-12 parts of coloring agent, 0.4-4 parts of vulcanizing agent and 0.2-3 parts of co-vulcanizing agent.
The unvulcanized rubber is a mixed rubber material of ethylene propylene diene monomer, isoprene rubber and butadiene rubber, and mainly comprises the following components in percentage by mass: 50-85% of ethylene propylene diene monomer, 5-15% of isoprene rubber and 10-35% of cis-butadiene rubber.
The activating agent is one or two of zinc oxide, magnesium oxide, calcium oxide, stearic acid, zinc stearate and oleic acid.
The reinforcing agent is one or more of silicon dioxide, talcum powder, calcium carbonate, montmorillonite, dolomite and silicon micropowder.
The surface of the modified nano-silicon fiber is coated with an organic modifier with a certain thickness, wherein the organic modifier accounts for 1-10% of the mass percentage of the nano-silicon fiber, the diameter of the modified nano-silicon fiber is 5-60 nm, the average length is 0.3-2 mu m, and the specific surface area is 100-420 m2/g。
Preferably, the organic modifier is one of rhodanine, dopamine and tannic acid. The organic modifier is coated on the surface of the nano silicon fiber through oxidation polymerization reaction. The oxidative polymerization oxidant is one of ferric chloride, ferric sulfate, ammonium persulfate, potassium persulfate and sodium persulfate.
The cleaning agent is compounded by two or more of cocoyl monoethanolamine, triethanolamine, isopropanolamine, diethylenetriamine, ethylene glycol phenyl ether, diethylene glycol monomethyl ether, diethylene glycol butyl ether, N-methylethanolamine, N-methylpyrrolidone, benzyl alcohol, imidazole, 2-methylimidazole and 2-ethylimidazole.
The mold cleaning auxiliary agent is a compound of two or more of fatty alcohol-polyoxyethylene ether, fatty acid polyglycol ether, polyethylene glycol-glycidyl ether, neodecanoic acid glycidyl ether, sorbitan fatty acid ester, mineral oil and polydimethylsiloxane.
The adsorbent is one of zeolite molecular sieves 3A, 4A, 5A and 13X with the size of 2-8 mu m.
The vulcanizing agent is one of di-tert-butyl cumene peroxide, 2, 5-di-tert-butyl peroxy-2, 5-dimethylhexane, phenolic resin and p-quinone dioxime.
The auxiliary vulcanizing agent is one of triallyl cyanurate, triallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and 2-mercaptobenzothiazole.
The method for preparing the nano silicon fiber reinforced mold cleaning adhesive is characterized by comprising the following steps:
ultrasonically dispersing nano silicon fibers and distilled water according to the proportion of 1:10 to form dispersion liquid, wherein the ultrasonic power is 2000W; adding an oxidant with the mass percentage of 80-300% of the nano silicon fiber into the dispersion liquid, and violently stirring for 2-6 hours; then adding an organic modifier with the mass percentage of 1-10% of the nano silicon fiber into the dispersion, violently stirring for 3-30 min at 50-80 ℃, finally washing for 3-5 times by distilled water, centrifuging for 2-4 times, and drying at 50-80 ℃ to obtain the modified nano silicon fiber.
The method comprises the steps of plasticating unvulcanized rubber on an open mill for 2 min at room temperature, sequentially adding an activating agent, a reinforcing agent, modified nano silicon fibers, a cleaning agent, a mold cleaning auxiliary agent, an adsorbent and a coloring agent, uniformly mixing, alternately adding the reinforcing agent and the cleaning agent into the unvulcanized rubber, finally adding a vulcanizing agent and a co-vulcanizing agent, wrapping by a triangle, thinly feeding the mixture into a die, tabletting by a calender, cutting the mixture into strip-shaped products to obtain the semiconductor packaging die modified nano silicon fiber reinforced mold cleaning rubber, and standing for 24 hours for later use. The vulcanization conditions of the cleaning mold are that the vulcanization temperature is 160-180 ℃, the vulcanization pressure is 8-15 MPa, and the vulcanization time is 3-12 min.
The invention aims to prepare a semiconductor packaging mold modified nano silicon fiber reinforced mold cleaning adhesive, aims at solving the problems of insufficient heat-resistant tearing performance and limited mold cleaning effect of the conventional mold cleaning adhesive, and prepares a reinforced mold cleaning adhesive material by utilizing the scale advantage of nano silicon fibers through the exploration of the organic coating modification of the surface of a nano reinforced material and the compound use effect of the nano reinforced material and a cleaning agent, so that the heat-resistant tearing performance and the anti-tearing capability of the mold cleaning adhesive are greatly improved, the dirt removing effect is enhanced, the production efficiency is improved, and the service life of a mold is effectively prolonged. The prepared mold cleaning glue has the following advantages: the mold cleaning rubber is easy to demold after cleaning and vulcanizing, is complete and not easy to crack, and has excellent mechanical property, hot tearing resistance and breaking resistance; the cleaning agent has excellent cleaning effect, can clean dirt on the surface of the die by only cleaning 1-3 dies, reduces die cleaning cost, improves production efficiency, has stable product quality, and is beneficial to industrial production.
Drawings
FIG. 1 is a drawing showing a mold cleaning agent.
Detailed Description
The present invention is further illustrated by the following specific examples, which are intended to be only illustrative and not to be construed as limiting the scope of the invention, and those skilled in the art can make insubstantial modifications of the invention based on the above disclosure, and all other examples obtained without inventive step are within the scope of the invention.
The invention provides a modified nano silicon fiber reinforced mold cleaning adhesive for a semiconductor packaging mold, which comprises the following components in parts by mass: 100 parts of unvulcanized rubber, 2-6 parts of activating agent, 25-65 parts of reinforcing agent, 3-10 parts of modified nano silicon fiber, 5-30 parts of cleaning agent, 0.8-6 parts of mold cleaning assistant, 2-12 parts of adsorbent, 1-12 parts of coloring agent, 0.4-4 parts of vulcanizing agent and 0.2-3 parts of co-vulcanizing agent.
In a preferred embodiment of the present invention, the unvulcanized rubber is mainly composed of the following components in percentage by mass: 50-85% of ethylene propylene diene monomer, 5-15% of isoprene rubber and 10-35% of cis-butadiene rubber.
The unvulcanized rubber is mainly ethylene propylene diene monomer rubber with excellent ageing resistance and wear resistance, the isoprene rubber and the butadiene rubber are used for improving the overall strength and elasticity of the mold cleaning rubber, and the cleaning agent, the cleaning auxiliary agent and the adsorbent capable of adsorbing dirt volatile matters are matched to remove dirt on the surface of the semiconductor packaging mold through the heat-resistant tearing and tearing-resistant characteristics of the nano silicon fiber, so that the mold cleaning effect is greatly improved.
In a preferred embodiment of the present invention, wherein the activating agent is one or two of zinc oxide, magnesium oxide, calcium oxide, stearic acid, zinc stearate and oleic acid.
In a preferred embodiment of the present invention, the reinforcing agent is one or more of silica, talc, calcium carbonate, montmorillonite, dolomite, and silica micropowder.
In a preferred embodiment of the present invention, the surface of the modified nano-silicon fiber is coated with a certain thickness of organic modifier, wherein the organic modifier accounts for 1% to 10% of the mass percentage of the nano-silicon fiber. Through the surface organic modification of the nano silicon fiber, the compatibility of the nano silicon fiber and unvulcanized rubber can be greatly improved, and the uniform dispersibility of the nano silicon fiber is improved, so that the mechanical property of the high-definition rubber is improved.
The organic modifier is one of rhodanine, dopamine and tannic acid. The wetting component in the organic modifier can also interact with the dirt of the mould, so that the cleaning effect is further enhanced. The diameter of the modified nano silicon fiber is 5-60 nm, the average length is 0.3-2 mu m, and the specific surface area is100-420 m2The water-based cleaning agent has excellent adsorption performance and can be used in combination with a cleaning agent.
The preparation method of the modified nano silicon fiber comprises the following steps: ultrasonically dispersing nano silicon fibers and distilled water according to the proportion of 1:10 to form dispersion liquid, wherein the ultrasonic power is 2000W; adding an oxidant (one of ferric chloride, ferric sulfate, ammonium persulfate, potassium persulfate and sodium persulfate) with the mass percentage of 80-300% of the nano silicon fiber into the dispersion, and violently stirring for 2-6 h; then adding an organic modifier with the mass percentage of 1-10% of the nano silicon fiber into the dispersion, violently stirring for 3-30 min at 50-80 ℃, finally washing for 3-5 times by distilled water, centrifuging for 2-4 times, and drying at 50-80 ℃ to obtain the modified nano silicon fiber.
In a preferred embodiment of the present invention, wherein the adsorbent is one of zeolite molecular sieves 3A, 4A, 5A and 13X having a size of 2 to 8 μm.
In a preferred embodiment of the present invention, the cleaning agent is a mixture of two or more of cocoyl monoethanolamine, triethanolamine, isopropanolamine, diethylenetriamine, ethylene glycol phenyl ether, diethylene glycol monomethyl ether, diethylene glycol butyl ether, N-methylethanolamine, N-methylpyrrolidone, benzyl alcohol, imidazole, 2-methylimidazole and 2-ethylimidazole.
In a preferred embodiment of the present invention, wherein the colorant is one of titanium dioxide, pearl mica powder and zinc oxide.
In a preferred embodiment of the present invention, the mold cleaning assistant is a mixture of two or more of fatty alcohol polyoxyethylene ether, fatty acid polyglycol ether, polyethylene glycol monoglycidyl ether, neodecanoic acid glycidyl ether, sorbitan fatty acid ester, mineral oil and polydimethylsiloxane.
In a preferred embodiment of the present invention, the vulcanizing agent is one of di-tert-butyl cumyl peroxide, 2, 5-di-tert-butyl peroxy-2, 5-dimethylhexane, phenol resin and p-quinonedioxime.
In a preferred embodiment of the present invention, wherein the co-vulcanizing agent is one of triallyl cyanurate, triallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and 2-mercaptobenzothiazole.
The invention is described in detail by the following embodiments, in the following embodiments, the preparation method of the semiconductor packaging mold modified nano silicon fiber mold cleaning glue is as follows:
firstly plasticating unvulcanized rubber on an open mill for 2 min, then sequentially adding an activating agent, a reinforcing agent, modified nano silicon fibers, a cleaning agent, a mold cleaning auxiliary agent, an adsorbent and a coloring agent, uniformly mixing, alternately adding the reinforcing agent and the cleaning agent, finally adding a vulcanizing agent and a co-vulcanizing agent, performing left-right triangular packaging for 6 times, performing thinly passing for 2 times, then obtaining uniform rubber compound, and controlling the whole operation temperature to be between 30 and 40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber.
And finally, placing the prepared mold cleaning adhesive on a semiconductor packaging mold, closing the mold, pressurizing, heating to 160-180 ℃, cleaning the mold, maintaining the pressure of 8-15 MPa, keeping for 3-12 min, then opening the mold, completely taking down the film, adhering residues on the mold to the film, realizing the cleaning process of the mold, and for the mold with serious dirt, repeatedly cleaning 2-3 molds to complete the cleaning process of the mold.
Example 1
Firstly plasticating 100 parts of unvulcanized rubber on an open mill for 2 min, then sequentially adding 5 parts of activating agent, 50 parts of reinforcing agent, 5 parts of modified nano-silicon fiber, 25 parts of cleaning agent, 6 parts of mold cleaning assistant, 5 parts of adsorbent and 10 parts of coloring agent, uniformly mixing, alternately adding reinforcing agent and cleaning agent, finally adding 2 parts of vulcanizing agent and 1 part of co-vulcanizing agent, performing triangular packaging for 6 times from left to right, performing thinness passing for 2 times, then obtaining uniform rubber mixing by sheet discharging, and controlling the whole operation temperature to be 30-40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber. The tensile strength of the mold cleaning glue is 12.1 MPa, the elongation at break is 512%, the Shore hardness is 63, the tearing strength is 49N/m, and the mold cleaning effect is good.
Example 2
Firstly plasticating 100 parts of unvulcanized rubber on an open mill for 2 min, then sequentially adding 3 parts of activating agent, 40 parts of reinforcing agent, 6 parts of modified nano-silicon fiber, 22 parts of cleaning agent, 5 parts of mold cleaning assistant, 3 parts of adsorbent and 8 parts of coloring agent, uniformly mixing, alternately adding reinforcing agent and cleaning agent, finally adding 2 parts of vulcanizing agent and 1 part of co-vulcanizing agent, performing triangular packaging for 6 times from left to right, performing thinness passing for 2 times, then obtaining uniform rubber mixing by sheet discharging, and controlling the whole operation temperature to be 30-40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber. The tensile strength of the test mold cleaning glue is 13.1 MPa, the elongation at break is 540%, the Shore hardness is 66, the tearing strength is 50N/m, and the mold cleaning effect is good.
Example 3
Firstly plasticating 100 parts of unvulcanized rubber on an open mill for 2 min, then sequentially adding 2 parts of activating agent, 40 parts of reinforcing agent, 8 parts of modified nano-silicon fiber, 18 parts of cleaning agent, 5 parts of mold cleaning assistant, 10 parts of adsorbent and 7 parts of coloring agent, uniformly mixing, alternately adding reinforcing agent and cleaning agent, finally adding 2 parts of vulcanizing agent and 1 part of co-vulcanizing agent, performing triangular bag for 6 times left and right, performing thin passing for 2 times, then discharging to obtain uniform rubber compound, and controlling the whole operation temperature to be 30-40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber. The tensile strength of the mold cleaning glue is tested to be 13.6 MPa, the elongation at break is 562%, the Shore hardness is 68, the tearing strength is 54N/m, and the mold cleaning effect is good.
Example 4
Firstly plasticating 100 parts of unvulcanized rubber on an open mill for 2 min, then sequentially adding 3 parts of activating agent, 30 parts of reinforcing agent, 8 parts of modified nano-silicon fiber, 12 parts of cleaning agent, 6 parts of mold cleaning assistant, 8 parts of adsorbent and 12 parts of coloring agent, uniformly mixing, alternately adding reinforcing agent and cleaning agent, finally adding 1.5 parts of vulcanizing agent and 0.5 part of co-vulcanizing agent, performing triangular bag for 6 times left and right, performing thin-pass for 2 times, then discharging to obtain uniform rubber compound, and controlling the whole operation temperature to be 30-40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber. The tensile strength of the mold cleaning glue is 10.2 MPa, the elongation at break is 413 percent, the Shore hardness is 55, the tearing strength is 43N/m, and the mold cleaning effect is good.
Example 5
Firstly plasticating 100 parts of unvulcanized rubber on an open mill for 2 min, then sequentially adding 2 parts of activating agent, 50 parts of reinforcing agent, 3 parts of modified nano-silicon fiber, 20 parts of cleaning agent, 5 parts of mold cleaning assistant, 3 parts of adsorbent and 8 parts of coloring agent, uniformly mixing, alternately adding reinforcing agent and cleaning agent, finally adding 3 parts of vulcanizing agent and 1 part of co-vulcanizing agent, performing triangular bag for 6 times left and right, performing thin passing for 2 times, then obtaining uniform rubber compound by sheet discharging, and controlling the whole operation temperature to be 30-40 ℃. And tabletting the rubber compound by a calender and cutting the rubber compound into strip-shaped products to obtain the modified nano silicon fiber reinforced mold cleaning rubber. The tensile strength of the mold cleaning glue is tested to be 11.8 MPa, the elongation at break is 490%, the Shore hardness is 62, the tearing strength is 48N/m, and the mold cleaning effect is good.
From the above examples, the mechanical properties of the mold cleaning compound after vulcanization can be changed by adjusting the contents of the reinforcing agent, the modified nano-silicon fiber, the cleaning agent and the mold cleaning additive; along with the increase of the contents of the reinforcing agent and the modified nano silicon fiber, the mechanical strength, the elongation at break, the tearing strength and the hardness of the mold cleaning glue after vulcanization are increased, and the mold cleaning effect is improved; the mold cleaning effect is improved along with the increase of the content of the cleaning agent and the mold cleaning additive, but the mechanical strength, the elongation at break, the tearing strength and the hardness of the mold cleaning rubber after vulcanization are reduced.
The above description is the preferred embodiment of the present invention, and it is within the scope of the appended claims to cover all modifications of the invention which may occur to those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a modified nanometer silicon fiber reinforcing clear mould of semiconductor package mould is glued which characterized in that: the mold cleaning glue mainly comprises the following components in parts by mass: 100 parts of unvulcanized rubber, 2-6 parts of activating agent, 25-65 parts of reinforcing agent, 3-10 parts of modified nano silicon fiber, 5-30 parts of cleaning agent, 0.8-6 parts of mold cleaning assistant, 2-12 parts of adsorbent, 1-12 parts of coloring agent, 0.4-4 parts of vulcanizing agent and 0.2-3 parts of co-vulcanizing agent.
2. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the unvulcanized rubber is a mixed rubber material of ethylene propylene diene monomer, isoprene rubber and butadiene rubber, and mainly comprises the following components in percentage by mass: 50-85% of ethylene propylene diene monomer, 5-15% of isoprene rubber and 10-35% of cis-butadiene rubber.
3. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the activating agent is one or two of zinc oxide, magnesium oxide, calcium oxide, stearic acid, zinc stearate and oleic acid.
4. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the reinforcing agent is one or more of silicon dioxide, talcum powder, calcium carbonate, montmorillonite, dolomite and silicon micropowder.
5. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the modified nano-silicon fiber is coated with an organic modifier with a certain thickness on the surface through oxidative polymerization, wherein the organic modifier accounts for 1-10% of the mass percentage of the nano-silicon fiber, the diameter of the modified nano-silicon fiber is 5-60 nm, the average length is 0.3-2 mu m, and the specific surface area is 100-2/g;
The organic modifier is one of rhodanine, dopamine and tannic acid;
coating the organic modifier on the surface of the nano silicon fiber through oxidative polymerization;
the oxidative polymerization oxidant is one of ferric chloride, ferric sulfate, ammonium persulfate, potassium persulfate and sodium persulfate.
6. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the cleaning agent is compounded by two or more of cocoyl monoethanolamine, triethanolamine, isopropanolamine, diethylenetriamine, ethylene glycol phenyl ether, diethylene glycol monomethyl ether, diethylene glycol butyl ether, N-methylethanolamine, N-methylpyrrolidone, benzyl alcohol, imidazole, 2-methylimidazole and 2-ethylimidazole.
7. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the mold cleaning assistant is a compound of two or more of fatty alcohol-polyoxyethylene ether, fatty acid polyglycol ether, polyethylene glycol-glycidyl ether, neodecanoic acid glycidyl ether, sorbitan fatty acid ester, mineral oil and polydimethylsiloxane.
8. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the adsorbent is any one of zeolite molecular sieves 3A, 4A, 5A and 13X with the size of 2-8 mu m.
9. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the colorant is one of titanium dioxide, pearl mica powder and zinc oxide.
10. The semiconductor packaging mold modified nano-silicon fiber reinforced mold cleaning adhesive as claimed in claim 1, wherein: the vulcanizing agent is one of di-tert-butyl cumene peroxide, 2, 5-di-tert-butyl peroxy-2, 5-dimethylhexane, phenolic resin and p-quinone dioxime; the auxiliary vulcanizing agent is one of triallyl cyanurate, triallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and 2-mercaptobenzothiazole.
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