CN108753022A - A kind of UV-LED solidification repairing putty and preparation method thereof - Google Patents
A kind of UV-LED solidification repairing putty and preparation method thereof Download PDFInfo
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- CN108753022A CN108753022A CN201810609214.7A CN201810609214A CN108753022A CN 108753022 A CN108753022 A CN 108753022A CN 201810609214 A CN201810609214 A CN 201810609214A CN 108753022 A CN108753022 A CN 108753022A
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- 238000007711 solidification Methods 0.000 title claims abstract description 23
- 230000008023 solidification Effects 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 29
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000002270 dispersing agent Substances 0.000 claims abstract description 11
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 10
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 239000002562 thickening agent Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims description 8
- -1 hydroxyl ethyl Chemical group 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 239000012952 cationic photoinitiator Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 150000003254 radicals Chemical group 0.000 claims description 4
- 239000000440 bentonite Substances 0.000 claims description 3
- 229910000278 bentonite Inorganic materials 0.000 claims description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 claims description 2
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims description 2
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical class C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 claims 1
- IVXDDXAWVZEZKU-UHFFFAOYSA-N 2-hydroxyethyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(=O)OCCO IVXDDXAWVZEZKU-UHFFFAOYSA-N 0.000 claims 1
- NIYOXHRKDAIDSK-UHFFFAOYSA-N C(=O)SC.C1=CC=CC=C1 Chemical compound C(=O)SC.C1=CC=CC=C1 NIYOXHRKDAIDSK-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- 125000004386 diacrylate group Chemical group 0.000 claims 1
- 235000013312 flour Nutrition 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 1
- 150000003014 phosphoric acid esters Chemical class 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 18
- 230000001070 adhesive effect Effects 0.000 abstract description 18
- 239000002184 metal Substances 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 15
- 230000008602 contraction Effects 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract description 2
- 239000011152 fibreglass Substances 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- GRIOAXBQGCFYLV-UHFFFAOYSA-N (phenyl-$l^{2}-iodanyl)benzene Chemical group C=1C=CC=CC=1IC1=CC=CC=C1 GRIOAXBQGCFYLV-UHFFFAOYSA-N 0.000 description 1
- DTTDXHDYTWQDCS-UHFFFAOYSA-N 1-phenylcyclohexan-1-ol Chemical compound C=1C=CC=CC=1C1(O)CCCCC1 DTTDXHDYTWQDCS-UHFFFAOYSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LJRSZGKUUZPHEB-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxypropoxy)propoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COC(C)COC(=O)C=C LJRSZGKUUZPHEB-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical class CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention belongs to putty fields, and in particular to a kind of UV-LED solidification repairing putty and preparation method thereof.The UV-LED cures repairing putty by mass percentage, composed of the following components：Acrylic resin 10-40%, reactive diluent 5-20%, photoinitiator 0.5-5%, inorganic powder 30-70%, thickener 1-3%, dispersant 0.2-1%, adhesion promoter 0.5-2%.UV-LED solidifications repairing putty provided by the invention is not necessarily to hot setting, and i.e. curable by UV-LED illumination, solidification temperature is low, and the time is short, energy-saving, environment-friendly and high-efficiency；Cubical contraction is small, is shunk without apparent after doing solid work, repair efficiency is good；Easily construction, sag resistance is good, can be not only used for small area repairing, it can also be used to large surface mending；Adhesive force is good, also there is extremely strong adhesive force in the small metal surface of surface compact, effective contact interface, can be widely applied to railway carriage, yacht shell, passenger car, automobile case, furniture etc. and the various metal products for needing large area to fill and lead up repairing, woodwork, glass fiber reinforced plastics product etc..
Description
Technical field
The invention belongs to putty fields, and in particular to a kind of UV-LED solidification repairing putty and preparation method thereof.
Background technology
Tung oil gypsum putty, vinyl perchloride putty, alcoholic acid putty etc. tradition putty all have larger shrinkage, intensity difference,
The shortcomings of easy to crack and curing rate is slow.Although Unsaturated polyester putty curing rate is fast, strong adhesive force, does not crack, heat resistance
It is good, but be generally made of bi-component, use is very inconvenient, and styrenic component content volatile in putty is higher, and environment is dirty
Contaminate it is larger, it is very unfavorable to the health of construction personnel.In recent years, photocureable coating is as a kind of efficient, energy saving, pollution-free
Environmentally friendly machine, at home and abroad by most attention, application field is widened rapidly, but the research state of Photocurable putty
It is inside but still not affected by attention, such product sold on domestic market is mostly imported product, and price is also costly.Cause
This, studying Photocurable putty at home is highly desirable.
The putty of domestic many UV-LED solidifications at present is all mainly used on wood substrate, and since putty is in bases such as metals
Adhesive force on material is poor so that the application of putty in these areas is restricted.But in industries such as automobile, shipbuildings, no
By being the car body caused by various reasons or hull surface defect in manufacturing process, or due to car body caused by accident or
Hull is impaired, and underway painting will first be filled and led up with putty repairing with before finishing coat technique, and overall appearance is made to reach technological requirement.By
This visible repairing putty also has very important influence in car body or hull repairing.Therefore, exploitation one kind is both in wooden base
Material has good adhesion, and can have the repairing putty of good adhesion particularly significant on the base materials such as metal.
Invention content
In order to solve the problems, such as existing putty poor adhesive force on metal base, the invention discloses a kind of UV-LED solidifications
Repairing putty and preparation method thereof, the UV-LED cure repairing putty in different metal such as tinplate, stainless steel, galvanized sheet, aluminium
Preferable adhesive force is all had on the base materials such as piece and various plastic parts, marble, ceramic tile, woodenware.
To achieve the goals above, the present invention adopts the following technical scheme that:
A kind of UV-LED solidifications repairing putty, it is characterised in that：By mass percentage, composed of the following components：
Acrylic resin 10-40%
Reactive diluent 5-20%
Photoinitiator 0.5-5%
Inorganic powder 30-70%
Thickener 1-3%
Dispersant 0.2-1%
Adhesion promoter 0.5-2%.
Preferably, above-mentioned acrylic resin is epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin
One or more.
Preferably, above-mentioned acrylic resin is epoxy acrylic resin and polyurethane acrylic resin mass ratio is 1：1-2
Mixture.On the one hand, epoxy acrylic resin contains epoxy group, has higher reactivity and faster curing rate,
But its viscosity is larger, and hardness and brittleness are relatively high after film forming, poor adhesive force, and polyurethane acrylic resin flexibility is good, attached
Put forth effort, so both control ratio can obtain the repairing putty that modest viscosity, adhesive force are good, laser curing velocity is fast；It is another
Aspect, the ring opening of epoxy acrylic resin in the course of the polymerization process can cause volume expansion, and polyurethane acrylic resin exists
Volume can be shunk in polymerization process, thus both to control ratio occurs in the curing process to avoid repairing putty it is significantly swollen
It is swollen or shrink, to influence repair efficiency, and in case of serious volume contraction in solidification process, the internal stress of generation without
Method discharges, and can react on adhesive force of the film layer to metal base, reduces adhesive force.It is final to determine the two by adjusting repeatedly
Ratio can meet requirements above simultaneously with the epoxy acrylic resin and polyurethane acrylic resin of above-mentioned mass ratio.
Preferably, above-mentioned reactive diluent is the single functionalities acrylic acid such as hydroxy-ethyl acrylate and hydroxyethyl methacrylate
Bifunctionalities acrylate, the trimethylolpropanes such as ester, 1,6 hexanediyl esters and tri (propylene glycol) diacrylate
One or more of three-functionality-degrees acrylate such as triacrylate and pentaerythritol triacrylate.In reactive diluent
Hydroxyl can form hydrogen bond, adhesive force of the raising repairing putty in metal surface with metallic substrate surface.
Preferably, above-mentioned photoinitiator is that radical photoinitiator is used in compounding with cationic photoinitiator, the two
Mass ratio be 1:0.3-0.8.
Preferably, above-mentioned radical photoinitiator is 2- hydroxy-2-methyl -1- phenylacetones, 1- hydroxy-cyclohexyl benzene
Base ketone, 2,4,6- trimethylbenzoy-diphenies phosphine oxide, 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) benzene
One or more of base] -1- acetone, benzophenone and aided initiating, the cationic photoinitiator is diphenyl iodine
Salt, triphenyl sulfosalt, dialkyl benzene formyl methyl sulfosalt, one kind in η 6- isopropylbenzene cyclopentadienyl iron (II) hexafluorophosphate or
It is several.
Preferably, above-mentioned inorganic powder is one or more of the talcum powder of 400 mesh, 600 mesh and 800 mesh；It is described
Thickener is one or both of aerosil and bentonite.
Preferably, above-mentioned inorganic powder is nanomete talc powder.
Preferably, above-mentioned dispersant is the lipin polymer with carboxylic group；The adhesion promoter is phosphate
Class accelerating agent.Such as TEGO dispers 740W may be selected in dispersant, and the attachment of Carcel 6063 such as, which may be selected, in adhesion promoter makes every effort to promote
Into agent.Since acrylic resin strand contains a large amount of carboxyls, it is used as and is divided using the lipin polymer for equally containing carboxylic group
Powder can have good compatibility with matrix resin, and since the hydroxyl electronegativity of carboxyl and inorganic powder surface more connects
Closely, stronger with the binding force of powder surface, dispersant adsorption makes inorganic particle be easier to soak in inorganic powder surface, to
It is effectively improved the dispersion effect of system.In addition, the metal oxide that the carboxylic group in dispersant can also be formed with metal surface
It has an effect, improves the adhesive force of repairing putty.
Due to metallic substrate surface densification, effective contact interface is smaller, and unlike paper, wood surface is coarse and has hole,
Also unlike plastics can be swollen to form infiltration anchor structure by coating, so UV-LED solidification repairing putties are difficult in metal base table
Face osmotic absorption.In addition, since UV-LED cures repairing putty rapid curing, the internal stress that volume contraction generates cannot discharge,
Adhesive force of the film layer to metal base is reacted on, adhesive force can be made to decline.And phosphate can be bonded with metal surface, so energy
Improve the adhesive force to metal base, also there is good adhesion to glass substrate.
Preferably, the preparation method of above-mentioned UV-LED solidifications repairing putty includes the following steps：By acrylic resin, activity
Diluent, dispersant, photoinitiator and adhesion promoter are added sequentially in stirred tank, are filled under 400-600r/min rotating speeds
Divide stirring to dissolving dispersion, inorganic powder is then added, stirring adds thickener to being uniformly dispersed, and stirring is constant to consistency.
The present invention has following advantageous effect：(1) UV-LED solidification repairing putties provided by the invention are without passing through height
Temperature solidification, i.e. curable by UV-LED illumination, solidification temperature is low, and the time is short, energy-saving, environment-friendly and high-efficiency；(2) provided by the invention
UV-LED solidification repairing putty cubical contractions are small, shunk without apparent after doing solid work, repair efficiency is good；(3) UV- provided by the invention
LED solidification repairing putties are easily constructed, and sag resistance is good, can be not only used for small area repairing, it can also be used to large surface mending；(4) originally
The UV-LED solidification repairing putty adhesive force that invention provides is good, not only has good adhesive force in timber and frosting,
The small metal surface of surface compact, effective contact interface also has extremely strong adhesive force, can be widely applied to railway carriage, yacht
Shell, passenger car, automobile case, furniture etc. and the various metal products for needing large area to fill and lead up repairing, woodwork, fiberglass
Product etc.；(5) UV-LED solidification repairing putty single application thickness provided by the invention is up to 1.5mm, in coating thickness requirement
When higher, coating thickness requirement can reach by less application frequency；(6) UV-LED solidifications repairing provided by the invention is greasy
Son is one-component, and repeatable utilize is not concerned about Use Limitation.
Specific implementation mode
Presently in connection with embodiment, the present invention is described in further detail.
Embodiment 1
A kind of UV-LED solidifications repairing putty, it is by mass percentage, composed of the following components：Epoxy acrylic resin
20g, polyurethane acrylic resin 20g, hydroxy-ethyl acrylate 5g, 2- hydroxy-2-methyl -1- phenylacetones 0.5g, 600 mesh talcums
Powder 42g, 800 mesh talcum powder 10g, bentonite 1g, TEGO dispers 740W 1g, 6063 adhesion promoter 0.5g of Carcel.
The UV-LED solidification repairing putty preparation method be：Acrylic resin, reactive diluent, dispersant, light are drawn
Hair agent and adhesion promoter are added sequentially in stirred tank, and dissolving dispersion is stirred well under 400-600r/min rotating speeds,
Then be added inorganic powder, stir to being uniformly dispersed, add thickener, stirring to consistency it is constant to get.
Embodiment 2-7 is substantially the same manner as Example 1, the difference is that table 1.
Table 1
After the tinplate surface of 10cm × 5cm is surface-treated, brush prepared by embodiment 1-7 and comparative example 1-4
UV-LED cure repairing putty, obtain coating, testing result is listed in table 2.
Table 2
It is enlightenment with above-mentioned desirable embodiment according to the present invention, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to determine its technical scope according to right.
Claims (10)
1. a kind of UV-LED cures repairing putty, it is characterised in that：By mass percentage, composed of the following components：
Acrylic resin 10-40%
Reactive diluent 5-20%
Photoinitiator 0.5-5%
Inorganic powder 30-70%
Thickener 1-3%
Dispersant 0.2-1%
Adhesion promoter 0.5-2%.
2. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The acrylic resin is epoxy
The one or more of acrylic resin, polyurethane acrylic resin, polyester acrylate resin.
3. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The acrylic resin is epoxy
Acrylic resin and polyurethane acrylic resin mass ratio are 1：The mixture of 1-2.
4. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The reactive diluent is propylene
The single functionalities such as sour hydroxyl ethyl ester and hydroxyethyl methacrylate acrylate, 1,6 hexanediyl esters and two contractings 3 the third two
The bifunctionalities such as alcohol diacrylate acrylate, trimethylolpropane trimethacrylate and pentaerythritol triacrylate etc. three
One or more of degree of functionality acrylate.
5. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The photoinitiator is free radical
Type photoinitiator is used in compounding with cationic photoinitiator, and the mass ratio of the two is 1:0.3-0.8.
6. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The radical photoinitiator
For 2- hydroxy-2-methyl -1- phenylacetones, 1- hydroxycyclohexyl phenyl ketones, 2,4,6- trimethylbenzoy-dipheny oxygen
Change one kind in phosphine, 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, benzophenone and aided initiating
Or it is several, the cationic photoinitiator is diphenyl iodnium, triphenyl sulfosalt, dialkyl benzene formyl methyl sulphur
One or more of salt, η 6- isopropylbenzene cyclopentadienyl iron (II) hexafluorophosphate.
7. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The inorganic powder be 400 mesh,
One or more of the talcum powder of 600 mesh and 800 mesh；The thickener is one kind in aerosil and bentonite
Or two kinds.
8. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The inorganic powder is slided for nanometer
Mountain flour.
9. a kind of UV-LED as described in claim 1 cures repairing putty, it is characterised in that：The dispersant is with carboxyl
The lipin polymer of group, the adhesion promoter are phosphoric acid ester accelerating agent.
10. such as a kind of preparation method of UV-LED solidifications repairing putty of claim 1-9 any one of them, it is characterised in that packet
Include following steps：Acrylic resin, reactive diluent, dispersant, photoinitiator and adhesion promoter are added sequentially to stir
It mixes in kettle, dissolving dispersion is stirred well under 400-600r/min rotating speeds, inorganic powder is then added, stirring is equal to disperseing
It is even, thickener is added, stirring is constant to consistency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810609214.7A CN108753022A (en) | 2018-06-13 | 2018-06-13 | A kind of UV-LED solidification repairing putty and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810609214.7A CN108753022A (en) | 2018-06-13 | 2018-06-13 | A kind of UV-LED solidification repairing putty and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108753022A true CN108753022A (en) | 2018-11-06 |
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| CN201810609214.7A Pending CN108753022A (en) | 2018-06-13 | 2018-06-13 | A kind of UV-LED solidification repairing putty and preparation method thereof |
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| CN110804334A (en) * | 2019-11-29 | 2020-02-18 | 德汇新材料科技南通有限公司 | Quick-drying putty for automobile beauty treatment, preparation method and application |
| CN111378311A (en) * | 2018-12-29 | 2020-07-07 | 泰州市龙洋木业有限公司 | UV putty with high light guide performance for plate processing and preparation method thereof |
| CN113150597A (en) * | 2021-04-22 | 2021-07-23 | 山东润和新材料有限公司 | Matte cured flash-dried sheet metal putty and preparation method thereof |
| CN115160846A (en) * | 2022-08-11 | 2022-10-11 | 广东希贵光固化材料有限公司 | Dual-curing repair putty |
| CN115558326A (en) * | 2021-07-01 | 2023-01-03 | 深圳有为技术控股集团有限公司 | High-transparency collapse-resistant LED curing putty for deep curing pinhole filling and preparation method thereof |
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Application publication date: 20181106 |