KR100792524B1 - Metal adhesive moulding method and the product made by the method - Google Patents
Metal adhesive moulding method and the product made by the method Download PDFInfo
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- KR100792524B1 KR100792524B1 KR1020070044976A KR20070044976A KR100792524B1 KR 100792524 B1 KR100792524 B1 KR 100792524B1 KR 1020070044976 A KR1020070044976 A KR 1020070044976A KR 20070044976 A KR20070044976 A KR 20070044976A KR 100792524 B1 KR100792524 B1 KR 100792524B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2055/00—Use of specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of main groups B29K2023/00 - B29K2049/00, e.g. having a vinyl group, as moulding material
- B29K2055/02—ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
도 1은 종래의 금속접착몰딩방법의 일 예를 나타내는 공정도이다.1 is a process chart showing an example of a conventional metal adhesive molding method.
도 2는 본 발명에 따른 접착제를 사용하는 금속접착몰딩방법을 나타내는 공정도이다.2 is a process chart showing a metal adhesive molding method using an adhesive according to the present invention.
본 발명은 접착제를 사용하는 금속접착몰딩방법 및 금속접착몰딩물에 관한 것으로서, 특히 사출시 금속과 수지 사이가 분리되는 경향을 억제할 수 있는 금속접착몰딩방법 및 금속접착몰딩물에 관한 것이다.The present invention relates to a metal adhesive molding method and a metal adhesive molding using an adhesive, and more particularly to a metal adhesive molding method and a metal adhesive molding that can suppress the tendency of separation between the metal and the resin during injection.
종래에는 스테인레스 스틸(SUS)나 알루미늄(Al)과 같은 재료로 이루어진 금속과 폴리카보네이트(PC)와 같은 소재로 이루어진 수지를 결합할 경우 인서트 사출법을 많이 사용했으나, 결합되는 재료의 이질성으로 인해 사출공정 후 분리되는 경우가 많았다.Conventionally, when combining a metal made of a material such as stainless steel (SUS) or aluminum (Al) and a resin made of a material such as polycarbonate (PC), the insert injection method was used a lot, but due to the heterogeneity of the material to be joined It was often separated after the process.
이를 방지하기 위해, 금속과 수지 사출물을 열융착 테이프를 이용하여 접합하는 이중 접합방법이 개시되어 있으며, 도 1을 참조하여 그 개략적인 구성을 순서 에 따라 설명하면 이하와 같다.In order to prevent this, a double bonding method for joining a metal and a resin injection molding using a heat fusion tape is disclosed, and the schematic configuration thereof will be described in order with reference to FIG. 1 as follows.
① 먼저, 금속을 프레스를 통한 성형가공이나 선반을 통한 절삭가공을 통해 소정의 형상으로 성형한다.① First, the metal is molded into a predetermined shape by forming through a press or cutting through a lathe.
② 그리고, 열융착 테이프를 마련한다.(2) Then, prepare a heat sealing tape.
③ 다음, 일반적인 사출을 통해 소정 형상의 수지 사출물을 마련한다.③ Next, a resin injection product of a predetermined shape is prepared through general injection.
④ 성형된 금속에 열융착 테이프를 부착시킨다.④ Attach the heat sealing tape to the formed metal.
⑤ 마지막으로, 상기 수지 사출물을 열융착 테이프에 접촉시킨 후 열을 가해 압접한다.(5) Finally, the resin injection molded product is brought into contact with the heat-sealed tape, and then heat-welded.
그러나, 이와 같은 경우, 수지 사출물의 금속에 대한 접착력은 높아질지 모르나 열융착 테이프를 사용하기 때문에 공정수와 인력 및 이에 따른 비용이 높아지는 문제점이 있었다.However, in such a case, the adhesive force to the metal of the resin injection may be increased, but there is a problem in that the number of processes, manpower, and costs accordingly increase due to the use of heat-sealed tape.
또한, 금속 모재의 형상이 다소 복잡한 경우 열융착 테이프를 균일하게 적용하는 것도 곤란하였다.In addition, when the shape of the metal base material is somewhat complicated, it is also difficult to apply the heat-sealing tape uniformly.
본 발명은 전술한 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 간단한 공정으로 소정 형상의 금속에 수지 사출물을 견고하게 결합시킬 수 있는 금속접착몰딩방법 및 금속접착몰딩물을 제공하는데 있다.The present invention has been made to solve the above-described problems, an object of the present invention is to provide a metal adhesive molding method and a metal adhesive molding that can be firmly bonded to the resin injection molding to a metal of a predetermined shape in a simple process.
전술한 목적을 달성하기 위해, 본 발명에 따른 금속접착몰딩방법은,In order to achieve the above object, the metal adhesive molding method according to the present invention,
금속의 표면에 접착제를 도포한 상태에서 사출금형 내에 삽입한 후, 합성수 지를 상기 접착제를 도포한 금속의 표면에 직사출시키는 것으로, 상기 접착제는 폴리아미드 70~80wt%, 석유수지 10~20wt%, 미네랄 오일 2~7wt%, 아미노 실란 3~7wt%로 구성된 것을 특징으로 한다.After inserting into the injection mold while the adhesive is applied to the surface of the metal, the synthetic resin is directly injected onto the surface of the metal coated with the adhesive, the adhesive is 70 to 80wt% polyamide, 10 to 20wt% petroleum resin , 2-7 wt% mineral oil, characterized in that consisting of 3-7 wt% amino silane.
여기서, 상기 금속은 스테인레스 스틸(SUS), 알루미늄(Al), 티타늄(Ti), 마그네슘(Mg), 아연(Zn) 중에서 선택된 어느 하나인 것을 특징으로 한다.Here, the metal is characterized in that any one selected from stainless steel (SUS), aluminum (Al), titanium (Ti), magnesium (Mg), zinc (Zn).
또한, 상기 합성수지는 폴리카보네이트(PC), 아크릴, ABS 중에서 선택된 어느 하나인 것을 특징으로 한다.In addition, the synthetic resin is characterized in that any one selected from polycarbonate (PC), acrylic, ABS.
또한, 상기 접착제는, 도포 후 20분 이상 상온에서 건조하고, 100~120℃의 온도에서 20~40분 동안 유지시킨 상태에서 사출하는 것을 특징으로 한다.In addition, the adhesive is dried at room temperature for 20 minutes or more after application, and characterized in that the injection in a state maintained for 20 to 40 minutes at a temperature of 100 ~ 120 ℃.
또한, 상기 접착제의 도포 두께는 40~80㎛의 범위에 있는 것을 특징으로 한다.Moreover, the coating thickness of the said adhesive is characterized by being in the range of 40-80 micrometers.
또한, 사출조건으로서, 사출 실린더의 온도는 280~300℃, 사출 실린더 압력은 58~65kgf/cm2의 범위에 있으며, 금형 온도 65~95℃ 및 냉각유지시간 8초 이상인 것을 특징으로 한다.In addition, as the injection conditions, the temperature of the injection cylinder is in the range of 280 ~ 300 ℃, the injection cylinder 58 ~ 65kgf / cm 2 , characterized in that the mold temperature 65 ~ 95 ℃ and cooling holding time 8 seconds or more.
한편, 본 발명에 따른 금속접착몰딩물은,On the other hand, the metal adhesive molding according to the present invention,
스테인레스 스틸 또는 알루미늄의 모재 표면과 폴리카보네이트가 접착제에 의해 부착된 상태로 구성된 금속접착몰딩물로서, 상기 접착제는 폴리아미드 70~80wt%, 석유수지 10~20wt%, 미네랄 오일 2~7wt%, 아미노 실란 3~7wt%로 구성된 것을 특징으로 한다.A metal adhesive molding comprising a surface of a base material of stainless steel or aluminum and a polycarbonate attached by an adhesive, wherein the adhesive is 70 to 80 wt% of polyamide, 10 to 20 wt% of petroleum resin, 2 to 7 wt% of mineral oil, and amino It is characterized by consisting of
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
도 1에 도시된 바와 같이, 본 발명에 따른 접착제를 사용하는 금속접착몰딩방법은, 수지와 결합되는 금속을 먼저 성형하고 접착제액을 상기 금속에 도포한 후, 도포된 금속을 사출금형에 삽입하여 직사출하는 것으로 구성되어 있다.As shown in Figure 1, the metal adhesive molding method using the adhesive according to the present invention, by first forming a metal to be combined with the resin and then applying the adhesive liquid to the metal, and then inserting the applied metal into the injection mold It consists of direct injection.
이 경우, 상기 금속은 스테인레스 스틸(SUS)나 알루미늄 등이 사용되며, 상기 금속의 성형은 프레스 성형가공이나 절삭가공 또는 주조 등 일반적인 성형법에 의해 제조된 것을 사용할 수 있다.In this case, the metal may be stainless steel (SUS), aluminum, or the like, and the metal may be formed by a general molding method such as press forming, cutting, or casting.
또한, 본 발명에서는 상기 금속의 표면에 사출되는 수지로서 폴리카보네이트(PC)가 사용된다.In the present invention, polycarbonate (PC) is used as the resin injected onto the surface of the metal.
그리고, 상기 접착제는 폴리아미드 70~80wt%, 석유수지 10~20wt%, 미네랄 오일 2~7wt%, 아미노 실란 3~7wt%로 구성되어 있다.The adhesive is composed of 70 to 80 wt% of polyamide, 10 to 20 wt% of petroleum resin, 2 to 7 wt% of mineral oil, and 3 to 7 wt% of amino silane.
먼저, 상기 폴리아미드는 기본수지로서 접착력을 유도하고 광범위한 표면에 대한 접착이 가능하게 하며 표면에너지 차이가 큰 이종 표면(SUS+PC, Al+PE 등)의 접착이 용이하게 한다. 만일, 폴리아미드가 70wt% 미만이면 그 효과가 충분하지 않고, 80wt%를 초과하면 더 이상의 효과 상승이 없으므로 70~80wt%의 조성비가 바람직하다.First, the polyamide induces adhesion as a base resin, enables adhesion to a wide range of surfaces, and facilitates adhesion of heterogeneous surfaces (SUS + PC, Al + PE, etc.) having a large surface energy difference. If the polyamide is less than 70wt%, the effect is not sufficient, and if it exceeds 80wt%, there is no further effect increase, so the composition ratio of 70 to 80wt% is preferable.
다음, 석유수지(petroleum resin)는 점착 부여 수지로서 접착제의 용융온도를 낮추고 경우에 따라 관능기를 부여하도록 하여 접착초기 젖음성(wetting)과 접착력을 향상시키며 고화시간 등의 조절을 가능하게 하는 역할을 수행한다. 만일, 석유수지가 10wt% 미만이면 전술한 효과가 나타나지 않고 20wt%를 초과하면 더 이상의 효과 개선은 없이 폴리아미드의 상대적 함유량만 줄이는 결과를 가져오므로, 그 조성비는 10~20wt%가 적절하다. 여기서, 젖음성이란 접착제가 플라스틱 사출물의 표면에 확산되면서 엉키는 성질을 가리킨다.Next, petroleum resin serves as a tackifying resin to lower the melting temperature of the adhesive and to provide a functional group in some cases, thereby improving the initial wetting and adhesion strength and controlling the solidification time. do. If the petroleum resin is less than 10wt%, the above-mentioned effect does not appear, and if it exceeds 20wt%, the result is that only the relative content of polyamide is reduced without further improving the effect, so that the composition ratio is 10 to 20wt%. Here, wettability refers to a property in which an adhesive is entangled while being spread on a surface of a plastic injection molded product.
또한, 석유수지란 석유의 정제과정이나 석유화학공정의 부산물로 생성되는 유분으로서, 올레핀이나 디올레핀을 함유하는 것을 원료로 하여 여러 가지 방법으로 중합시킨 플라스틱을 총칭한다.The petroleum resin is an oil produced as a by-product of petroleum refining or petrochemical processes, and generically refers to plastics polymerized by various methods, containing olefins or diolefins as raw materials.
다음, 미네랄 오일은 가소제로서, 혼합된 수지의 윤활역할을 수행하여 혼합물의 유동성과 분포를 고르게 하고 혼합물이 제품의 일부분에 치우치는 것을 방지하는 역할을 수행한다. 만일, 그 함유량이 2wt% 미만이면 수지의 흐름을 방해하여 최종 제품이 뒤틀리는 등 문제가 발생하고, 7wt%를 초과하면 유동성이 과도해져 사출과정에서 금형으로부터 수지가 흘러 넘치는 문제점이 발생한다.Next, the mineral oil is a plasticizer, which performs a lubrication role of the mixed resin to even out the flowability and distribution of the mixture and prevent the mixture from biasing a part of the product. If the content is less than 2wt%, there is a problem such as disturbing the flow of the resin and twisting the final product, if the content exceeds 7wt%, the fluidity is excessive and the resin overflows from the mold during the injection process.
또한, 아미노 실란은 접착 프로모터(adhesive promoter 또는 경화제)로서, 금속의 모재와 수지 사이의 부착력을 향상시키고, 수지와 무기물 사이의 젖음 성(wetting)을 증진시키는 역할을 수행한다. 아미노 실란은 사용량의 다소(多少)에 따라 부착력, 경화시간 및 기계적 강도를 크게 변화시킬 수 있으므로 사용량에 신중을 기할 필요가 있는데, 이러한 성질을 적당하게 만족시킬 수 있는 조성비로서 3~7wt%가 바람직하다.In addition, the amino silane is an adhesive promoter (hardener) or the like, and serves to improve adhesion between the base metal of the metal and the resin and to improve the wetting between the resin and the inorganic material. Since amino silane can change the adhesion, curing time and mechanical strength greatly depending on the amount of usage, it is necessary to pay attention to the usage. 3 to 7 wt% is preferable as a composition ratio that can satisfactorily satisfy these properties. Do.
상기 접착제는 도포한 후 상온에서 20분 이상 건조하고 100~120℃의 온도에서 20~40분 동안 유지한 상태에서 사출하는 것이 접착력을 최대로 발휘할 수 있다. 이는, 접착제 경화온도가 지나치게 낮거나 경화시간이 짧으면 접착제가 탈락하거나 넘치는 경우가 발생하고, 경화온도가 지나치게 높거나 경화시간이 길면 조기 경화 현상 또는 사출전 일부 경화 현상이 발생하여 접착력이 약해지기 때문이다. 또한, 상온건조시간이 짧으면 접착제에 기포가 발생하여 접착력이 떨어진다.After applying the adhesive is dried at room temperature for 20 minutes or more and maintained for 20 to 40 minutes at a temperature of 100 ~ 120 ℃ it can exhibit the maximum adhesive strength. This is because if the adhesive curing temperature is too low or the curing time is too short, the adhesive may drop out or overflow. If the curing temperature is too high or the curing time is too long, premature curing or some curing before injection may occur, resulting in weak adhesive strength. to be. In addition, when the room temperature drying time is short, bubbles are generated in the adhesive, resulting in poor adhesion.
또한, 상기 접착제의 도포 두께는 40~80㎛의 범위에 있는 것이 바람직하다. 이는 도포두께가 지나치게 작으면 고온의 사출과정에서 부분적으로 수지와 접촉하지 않는 부분이 발생하여 접착력이 떨어지고, 도포두께가 지나치게 두꺼우면 접착제가 탈락하여 금형으로부터 넘쳐서 접착력이 떨어지거나 접착되는 합성수지에 포함되어 악영향을 미칠 수 있기 때문이다.Moreover, it is preferable that the application | coating thickness of the said adhesive exists in the range of 40-80 micrometers. If the coating thickness is too small, the part that does not come into contact with the resin partially occurs during the injection process at high temperature, the adhesive strength is lowered. If the coating thickness is too thick, the adhesive falls off and overflows from the mold, the adhesive strength falls or is included in the synthetic resin This can be adversely affected.
접착제는 통상적인 혼합방식에 의해 제조된다. 즉, 전술한 4가지 성분을 모두 용기에 넣은 후 일반적인 교반기로 저어서 혼합 제작하게 된다. 그리고, 상기 접착제는 상온에서 밀폐용기에 보관할 수 있다.The adhesive is prepared by conventional mixing. That is, all four components described above are put into a container and then mixed and manufactured by stirring with a general stirrer. In addition, the adhesive may be stored in a sealed container at room temperature.
본 발명에 사용되는 접착제는 열경화성 수지로서, 도포된 접착제에 100℃ 이상의 온도를 가하면 접착제가 경화되면서 금속과 강한 접착력을 유지하게 된다.The adhesive used in the present invention is a thermosetting resin, and when a temperature of 100 ° C. or more is applied to the applied adhesive, the adhesive is cured to maintain strong adhesion with the metal.
또한, 본 발명에서의 접착제는 금속에 도포한 후에는 대략 10일 동안 경화가 유지된다. 즉, 도포한 후 10일 이내에 사출하면 소정의 접착력을 지닌 사출물을 얻을 수 있다.In addition, the adhesive in the present invention remains cured for approximately 10 days after application to the metal. That is, if the injection within 10 days after coating can be obtained an injection molding having a predetermined adhesive strength.
따라서, 금속 모재에 접착제를 도포하고 건조한 후 포장하여 10일 이내에 사출하면 소정의 접착력을 발휘할 수 있다.Therefore, when the adhesive is applied to the metal base material, dried and then packaged and injected within 10 days, a predetermined adhesive force can be exhibited.
상기 접착제의 접착력 측정은 사출이 완료된 합성수지와 금속 모재를 진공노즐을 이용하여 분리할 때 필요한 힘(또는 압력)을 측정하는 것에 의해 이루어진다.The adhesive force of the adhesive is measured by measuring the force (or pressure) required to separate the synthetic resin and the metal base material which have been injected by using a vacuum nozzle.
한편, 사출시 수지가 적절한 유동성을 가지도록 실린더의 온도는 280~300℃의 범위에 있는 것이 바람직하다. 즉, 지나치게 온도가 낮으면 빨리 굳어져서 성형되기 전에 굳어지는 경우가 발생하고, 지나치게 온도가 높으면 접착제가 녹아서 모재로부터 탈락하여 사출된 제품의 품질에 악영향을 미치게 된다.On the other hand, it is preferable that the temperature of a cylinder exists in the range of 280-300 degreeC so that resin may have appropriate fluidity at the time of injection. That is, if the temperature is too low, it hardens quickly and hardens before molding. If the temperature is too high, the adhesive melts and falls off from the base material, thereby adversely affecting the quality of the injected product.
또한, 사출 실린더의 압력은 58~65kgf/cm2의 범위에 있는 것이 좋다. 상기 사출 실린더의 압력이 너무 작으면 사출물의 모양이 완전히 성형되지 않고 접착력이 약하게 되며, 너무 크면 접착제가 넘치는 현상이 발생한다.In addition, the pressure of the injection cylinder is preferably in the range of 58 ~ 65kgf / cm 2 . If the pressure of the injection cylinder is too small, the shape of the injection molded product is not completely molded and the adhesive strength is weak, if too large, the adhesive overflow occurs.
그리고, 상기 금속접합몰딩방법은, 금형 온도 65~95℃ 및 냉각유지시간 8~20초인 것이 좋다. 이는, 금형온도가 너무 낮으면 성형이 완료되기 전에 굳어지는 사출 미성형의 문제가 발생되고, 너무 높으면 접착재가 탈락되거나 넘쳐서 모재와 수지의 접착력이 약해지기 때문이다. 또한, 냉각유지시간을 너무 짧게 하면 합성수지가 굳기 전에 변형되는 문제가 있고, 너무 길게 하면 생산성이 떨어지게 된다. 즉, 생산성과 상관이 없다면 8초 이상으로 냉각유지시간을 설정하여도 좋다.The metal bonding molding method may be a mold temperature of 65 to 95 ° C. and a cooling holding time of 8 to 20 seconds. This is because, if the mold temperature is too low, the problem of injection unmolding that hardens before the molding is completed occurs. If the mold temperature is too high, the adhesion between the base material and the resin is weakened because the adhesive material is dropped or overflowed. In addition, if the cooling holding time is too short, there is a problem of deforming before the synthetic resin hardens, and if it is too long, the productivity decreases. In other words, the cooling holding time may be set to 8 seconds or more, regardless of the productivity.
합성수지의 사출액은 대략 1.5~3초의 범위에서 금형 내에 채우면 된다.The injection liquid of the synthetic resin may be filled in the mold in the range of approximately 1.5 to 3 seconds.
실시예Example 1 One
아래 [표 1]은 스테인레스 스틸(SUS) 모재에 폴리카보네이트(PC) 수지를 결합하되 접착제를 구성하는 각 성분을 다르게 하여 접착력을 시험한 결과를 나타낸다. 시험에서 접착제의 조성을 제외한 조건은 모두 동일하게 유지하였다.[Table 1] below shows the results of testing the adhesive strength by combining polycarbonate (PC) resin to the stainless steel (SUS) base material but different components constituting the adhesive. All conditions except the composition of the adhesive in the test were kept the same.
표에서, #1과 #2는 본 발명예를 나타내고, #3~#10는 비교예를 나타낸다.In the table, # 1 and # 2 represent examples of the present invention, and # 3 to # 10 represent comparative examples.
본 발명예인 #1과 #2의 경우에는 접착력이 우수했으며 다른 단점이 나타나지 않았다.In the case of the
그러나, 기본수지가 부족하거나 과도한 #3와 #4의 경우에는 접착제가 SUS와 PC에 균일하게 접착력을 발휘하지 못하고, 탈착시 접착제가 PC에 불순물로서 남게 되었다.However, in the case of basic resins lacking or
또한, 석유수지가 부족하거나 과도한 #5와 #6의 경우에는 SUS에 대한 접착제의 젖음성이 부족하여 SUS와 PC에 균일하게 접착력을 구현하지 못하고, 탈착시 접착제가 PC에 불순물로서 잔여하게 되었다.In addition, in the case of the petroleum resin is insufficient or excessive # 5 and # 6, the adhesiveness to the SUS is not enough due to the lack of adhesion to SUS and PC, the adhesive is left as impurities in the PC when desorption.
또한, 미네랄 오일이 부족한 #7의 경우에는 접착제를 확산시켜주는 가소제가 부족하여 도포의 유동성이 좋지 않으므로 균일하게 도포하는 것이 곤란했고, 이에 따라 작업성이 좋지 않았다.In addition, in case of # 7 lacking mineral oil, it was difficult to apply uniformly because the fluidity of the coating was not good due to the lack of the plasticizer for diffusing the adhesive, and thus the workability was not good.
또한, 미네랄 오일이 과도한 #8의 경우에는 접착제를 확산시켜주는 가소제가 많아서 도포의 유동성이 과도하므로 접착제가 넘쳐서 사출시 접착제가 누출되는 경우가 발생하였으며, 이에 따라 작업성이 좋지 않았다.In addition, in the case of # 8 excessive mineral oil, there are many plasticizers to diffuse the adhesive, so the fluidity of the coating is excessive, the adhesive overflows, the adhesive leaks during injection, resulting in poor workability.
또한, 경화제인 아미노실란이 부족한 #9의 경우, 경화되지 않고 액체 상태를 유지하므로 2차 사출 작업이 불가능하였다.In addition, in case of # 9 lacking an aminosilane as a curing agent, the secondary injection operation was not possible because it was not cured and remained in a liquid state.
또한, 경화제인 아미노실란이 과도한 #10의 경우, 사출하면 접착제가 이미 어느 정도 딱딱하게 굳음으로써 PC와 SUS를 잡는 힘이 상대적으로 떨어졌다. 이에 따라, 탈착시 접착제가 탁탁 끊어지면서 떨어지는 현상이 발생하였다.In addition, in the case of # 10 with an excessive amount of aminosilane, which is a curing agent, the adhesive had already hardened to some extent when injected, so that the holding force of the PC and SUS was relatively decreased. Accordingly, a phenomenon in which the adhesive fell off while detaching occurred.
실시예Example 2 2
아래 표 2는, 스테인레스 스틸에 폴리카보네이트를 사출하되, 폴리아미드 75wt%, 석유수지 15wt%, 미네랄 오일 5wt%, 아미노 실란 5wt%의 조성을 가지는 접착제를 8개의 사용조건에 따라 사출 시험한 결과를 나타낸다.Table 2 below shows the results of injection testing of adhesives having a composition of 75 wt% polyamide, 15 wt% petroleum resin, 5 wt% mineral oil, and 5 wt% amino silane according to the eight conditions of use. .
여기서, #1을 제외하고 나머지는 비교예에 해당한다.Here, except for # 1, the rest corresponds to a comparative example.
표 2에 나타낸 바와 같이, 본 발명의 조건에 따른 접착제를 적용하면 접착력이 유지되나, 그 조건을 벗어나는 경우 대부분 다양한 단점들이 나타났다. 시험예를 통해서 단점은 나타나나 소정의 접착력을 유지한 경우(#6 조건)도 있었다.As shown in Table 2, when the adhesive according to the conditions of the present invention is applied, the adhesive force is maintained, but most of the disadvantages appear when the conditions are out of the condition. Disadvantage was shown through the test example, but there was also the case where the predetermined adhesive force was maintained (# 6 condition).
실시예Example 3 3
아래 표 3은, 스테인레스 스틸에 폴리카보네이트를 사출하되, 폴리아미드 75wt%, 석유수지 15wt%, 미네랄 오일 5wt%, 아미노 실란 5wt%의 조성을 가지는 접착제를 7개의 사출성형조건에 따라 사출 시험한 결과를 나타낸다.Table 3 below shows the results of injection testing of adhesives having a composition of 75 wt% polyamide, 15 wt% petroleum resin, 5 wt% mineral oil, and 5 wt% amino silane according to the injection molding conditions. Indicates.
여기서, #1 시험을 제외하고 나머지는 비교예에 해당한다.Here, except the # 1 test, the rest is a comparative example.
표 3에 나타낸 바와 같이, 본 발명의 사출조건에 따른 접착제를 적용하면 접착력이 유지되고 단점이 나타나지 않으나, 그 조건을 벗어나는 경우 대부분 다양한 단점들이 나타났다. 시험예를 통해서 단점은 나타나나 소정의 접착력을 유지한 경우(#3, #5 조건)도 있었다. 그러나, #3의 경우에는 접착제가 넘치는 현상이 발생하였고, #5의 경우에는 냉각시간이 길어져서 생산성이 떨어지는 문제가 있다.As shown in Table 3, when the adhesive according to the injection conditions of the present invention is applied, the adhesive strength is maintained and does not appear, but most of the disadvantages appear when out of the conditions. Disadvantages were shown through the test examples, but there were also cases where the predetermined adhesive strength was maintained (# 3, # 5 conditions). However, in the case of # 3, the adhesive overflowed, and in the case of # 5, the cooling time is long, and thus there is a problem in that productivity decreases.
전술한 실시예는 SUS와 PC의 결합에 관한 것이나, 금속이 Al, Ti, Mg, Zn, Ni 중 어느 하나인 경우와 수지가 아크릴 또는 ABS인 경우에도 유사한 결과가 얻어졌다.The above embodiment relates to the bonding of SUS and PC, but similar results were obtained when the metal is any one of Al, Ti, Mg, Zn, and Ni, and the resin is acrylic or ABS.
전술한 바와 같은 구성의 본 발명에 따르면, 접착제에 의해 소정 형상의 금속에 수지 사출물을 견고하게 결합시킬 수 있어 견고한 금속접합몰딩물을 얻을 수 있다는 이점이 있다.According to the present invention having the configuration described above, there is an advantage that the resin injection molded product can be firmly bonded to the metal having a predetermined shape by the adhesive, thereby obtaining a rigid metal bonded molding.
또한, 본 발명에 따르면, 공정이 종래에 비해 간단하여 공정수와 인력 및 이에 따른 비용이 절감되는 이점이 있다.In addition, according to the present invention, the process is simple compared to the conventional has the advantage of reducing the number of processes and manpower and the cost accordingly.
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US8409678B2 (en) | 2010-04-06 | 2013-04-02 | Pao Yi Technology Co., Ltd. | Thin metal casing with plastic part and manufacturing method thereof |
CN102310566A (en) * | 2010-07-05 | 2012-01-11 | 和硕联合科技股份有限公司 | Forming method for combining metal with plastic |
CN102501376B (en) * | 2011-11-02 | 2015-04-29 | 深圳创维-Rgb电子有限公司 | Manufacturing method for large-size, ultra-thin and ultra-narrow shell |
CN102490310A (en) * | 2011-12-14 | 2012-06-13 | 昆山易昌泰电子有限公司 | Soft rubber molding process for metal shell surface |
JP2015066846A (en) * | 2013-09-30 | 2015-04-13 | Dic株式会社 | Method for producing structure and method for producing battery lid |
EP2886287A1 (en) * | 2013-12-20 | 2015-06-24 | nolax AG | Method for producing hybrid components |
JP6555640B2 (en) * | 2015-12-02 | 2019-08-07 | 住友電気工業株式会社 | Composite material |
CN109465454B (en) * | 2019-01-11 | 2020-10-16 | 合肥工业大学 | Injection molding feed based on stainless steel powder with epoxy functional groups on surface |
CN109926590B (en) * | 2019-05-06 | 2020-06-30 | 合肥工业大学 | Preparation method of injection molding feed |
BR112022010156A2 (en) | 2019-11-26 | 2022-08-09 | Dupont Polymers Inc | METAL AND POLYAMIDE LAMINATE, METALLIC PART, COMPOSITION, POLYAMIDE LAMINATION METHOD AND ARTICLE |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030074138A (en) * | 2002-12-26 | 2003-09-19 | 서영재 | High-resolution color heat transfer method and printed matter prepared thereby |
JP2004188698A (en) | 2002-12-10 | 2004-07-08 | Shin Etsu Polymer Co Ltd | Metal surface decorative material and insert molded product using the same |
KR20060008468A (en) * | 2004-07-20 | 2006-01-27 | 주식회사 엘엔씨테크 | Keypad making method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS626101Y2 (en) * | 1980-06-06 | 1987-02-12 | ||
US4419494A (en) * | 1982-03-16 | 1983-12-06 | National Starch And Chemical Corporation | Heat resistant hot melt adhesives |
JP2504828B2 (en) * | 1989-05-10 | 1996-06-05 | 有限会社コーキ・エンジニアリング | Method for producing composite of plastic and metal |
JP2572174B2 (en) * | 1991-10-16 | 1997-01-16 | カネボウ・エヌエスシー株式会社 | Manufacturing method of substrate-resin composite |
JPH06182808A (en) * | 1992-12-22 | 1994-07-05 | Fujitsu Ltd | In-mold molding method |
JP3417422B2 (en) * | 1994-03-02 | 2003-06-16 | 三菱瓦斯化学株式会社 | Method of manufacturing polycarbonate molded article having heat ray reflection function |
JP3436983B2 (en) * | 1994-09-02 | 2003-08-18 | 富士通株式会社 | Method for separating molded products |
JP4040991B2 (en) * | 2003-02-27 | 2008-01-30 | 三ツ星ベルト株式会社 | Polyamide resin molded body with core material and method for producing the same |
DE10335716A1 (en) * | 2003-08-05 | 2005-02-24 | Eichenauer Heizelemente Gmbh & Co. Kg | Connection between a component and a surrounding cladding layer, device with such a connection and method for producing such a connection |
DE10346097A1 (en) * | 2003-10-04 | 2005-05-04 | Rehau Ag & Co | Process for producing a composite component and composite component produced therewith |
DE10361096A1 (en) * | 2003-12-22 | 2005-07-21 | Robert Bosch Gmbh | Component and method for manufacturing a component |
KR100522048B1 (en) * | 2003-12-27 | 2005-10-17 | 주식회사 세진 | Metal decoration molding formed integrally with clip and metal decoration member by injection and mamufacturing method thereof |
WO2005109984A2 (en) * | 2004-05-18 | 2005-11-24 | Bang & Olufsen A/S | A process for the manufacture of a hybrid element comprising a metal skin |
-
2007
- 2007-05-09 KR KR1020070044976A patent/KR100792524B1/en active IP Right Grant
- 2007-06-05 JP JP2010500807A patent/JP2010522654A/en active Pending
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- 2007-06-05 CN CNA2007800445728A patent/CN101547778A/en active Pending
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004188698A (en) | 2002-12-10 | 2004-07-08 | Shin Etsu Polymer Co Ltd | Metal surface decorative material and insert molded product using the same |
KR20030074138A (en) * | 2002-12-26 | 2003-09-19 | 서영재 | High-resolution color heat transfer method and printed matter prepared thereby |
KR20060008468A (en) * | 2004-07-20 | 2006-01-27 | 주식회사 엘엔씨테크 | Keypad making method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100999490B1 (en) * | 2008-07-31 | 2010-12-09 | 박민혜 | Injection molding method of metal and resin and the injection molding form |
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WO2008140143A1 (en) | 2008-11-20 |
EP2142350A1 (en) | 2010-01-13 |
JP2010522654A (en) | 2010-07-08 |
CN101547778A (en) | 2009-09-30 |
EP2142350A4 (en) | 2013-01-02 |
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