CN1070211A - Metal adhesive - Google Patents

Metal adhesive Download PDF

Info

Publication number
CN1070211A
CN1070211A CN 92110102 CN92110102A CN1070211A CN 1070211 A CN1070211 A CN 1070211A CN 92110102 CN92110102 CN 92110102 CN 92110102 A CN92110102 A CN 92110102A CN 1070211 A CN1070211 A CN 1070211A
Authority
CN
China
Prior art keywords
solidifying agent
epoxy
resins
agent
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 92110102
Other languages
Chinese (zh)
Other versions
CN1033862C (en
Inventor
张国福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 92110102 priority Critical patent/CN1033862C/en
Publication of CN1070211A publication Critical patent/CN1070211A/en
Application granted granted Critical
Publication of CN1033862C publication Critical patent/CN1033862C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention is a kind of tackiness agent based on Resins, epoxy, and raw material comprises E-44 and E-51 Resins, epoxy, liquid polysulphide rubber, KH-560, tributyl phosphate, dinoctyl phthalate, JC-3 solidifying agent, T-31 solidifying agent, polyamide 6 50 #, benzoic sulfimide, DMP-30, activated magnesia and reduced iron powder, wherein the JC-3 solidifying agent is from a kind of amine-phenolic condensation compound made from phenol, hexanediamine and three kinds of compositions of industrial formol.This adhesive solidifying agent, softening agent and prescription thereof have all been broken through traditional pattern, have the characteristic of bonding strength height, quick solidifying.

Description

Metal adhesive
The present invention relates to a kind of tackiness agent, specifically be based on the tackiness agent of Resins, epoxy.
Existing is that base material doses that other solidifying agent, coupling agent etc. are auxilliary to be added tackiness agent that agent constitutes and have multiplely with Resins, epoxy, but when being used for bonded metal, defectives such as the low and tackiness agent of bonding fastness time of coagulation is long then generally being arranged, thereby influenced construction quality and progress.Crack, perforation etc. in use appear in many equipment, support, oil tank etc., and welding is inapplicable, is a kind of very easy, economic and feasible maintaining method with sticking benefit of tackiness agent then.
Purpose of the present invention just provides a kind of new tackiness agent, makes it have the characteristic that cohesive force is strong, setting time is short.
The present invention is achieved in that proportioning raw materials (weight percent) is:
E-44 Resins, epoxy 29-32%, E-51 Resins, epoxy 5-9%, liquid polysulphide rubber 3-5%, KH-560 coupling agent 1-2%, tbp 1-3%, o-phthalic acid dibutyl ester 1-3%, JC-3 solidifying agent 4-6%, T-31 solidifying agent 2-4%, Versamid 650#2-3%, benzoic sulfimide 1-2%, DMP-30 promotor 1-3%, activated magnesia 2-4%, reduced iron powder 34-38%.Wherein except that the JC-3 solidifying agent, other raw materials are the commercially available prod.The preparation of JC-3 solidifying agent is to be 1: 1 in molar ratio with phenol, hexanediamine and industrial formol three: 0.5-1 gets material, earlier phenol and quadrol are mixed stirring, and by warming-in-water, temperature is controlled at 60-75 ℃, drips industrial formol, is warmed up to 95-105 ℃ after adding, stirred 3-4 hour, cool to 85-95 ℃ again, and then be warming up to 105-110 ℃, and under 60 mmhg decompression dehydration 2 hours.
This adhesive is first and second liang of components under the normality, and the first component has E-44 Resins, epoxy, E-51 Resins, epoxy, liquid polysulphide rubber, KH-560 coupling agent and tbp, component B has o-phthalic acid dibutyl ester, the JC-3 solidifying agent, the T-31 solidifying agent, Versamid, benzoic sulfimide, DMP-30 promotor and activated magnesia, reduced iron powder is added in two components as counterweight, and making first and second liang of component weight ratios is 3: 1.
This metal adhesive is based on Resins, epoxy, and reason is that E-44 Resins, epoxy is good adhesive substrate, but its low temperature process performance is not really desirable, therefore uses E-51, Resins, epoxy and it compound again.Because the molecular weight of E-51 is slightly little, viscosity is also less, and low-temperature fluidity is better, can improve the blending process and the application property of adhesive like this, simultaneously owing to adjusted molecular weight distribution, thereby has also improved the wetting property on adherend surface.Experimental results show that composite epoxy base-material effective than general single epoxy base material.
Though Resins, epoxy intensity height, cementability is good, but still has shortcomings such as easily aging, that curing back property is crisp.Use the liquid polysulphide rubber modification, can improve its toughness and ageing resistance greatly.Because the thiorubber good springiness, ageing resistance is good, participate in to solidify and sulfuration after thiorubber, improved the interior poly-state of the solidification internal stress of glue-line.So improved cementitious resistivity against fire and reliability.The general molecular weight that adopts gets final product at 3000-4000 (as JZY-124).
The KH-560 organo-silicon coupling agent is to glue material with transfer method coupling glue and quilt in tackiness agent, and can soak into and improve interfacial state, increases adhesive effect, also can improve the glue-applying technique performance of preparation simultaneously.
The liquid polymeric amide of low molecule is good ambient cure agent, simultaneously because itself has snappiness preferably, after participating in solidifying, the plasticity of glue is increased, because this plasticity is created in the structure after the curing, therefore plays a kind of self-plasticizing action again.This internal plasticization attribute that this glue has is not moved it, so can improve cementitious resistance to deterioration.
Benzoic sulfimide is nontoxic solidifying agent, and it and polymeric amide KH-560 and softening agent cooperatively interact effective, can improve adhering speed and adhesive effect.
Tbp and o-phthalic acid dibutyl ester all are softening agent, add in this glue with the further plasticity of improving glue.The former increases the induced dipole of molecule because the existence of phosphate radical is arranged, and can strengthen and intermetallic interaction force, thereby can improve adhesive effect, accelerates curing speed.The latter further improves the glue-applying technique performance of preparation because molecular chain length is flexible good.Its neighbour phthalic acid dibutylester has more persistent plastification, and is difficult for being moved.
The adding of activated magnesia can improve the heat-resistant stability of glue, and it can vulcanize thiorubber again simultaneously, improves cementitious over-all properties.
Add reduced iron powder, at first can reduce the electropotential of adhesively bonded joint, prevent the development of electrochemical process, also can increase intermetallic molecular force simultaneously, and reduce cure shrinkage, increase the hardness and the cohesive strength of glue-line, also can reduce the cost of glue.
The JC-3 solidifying agent that is added in this adhesive is a kind of homemade amine-phenolic condensation compound, modification at normal temperatures and cured epoxy resin, improve the intensity and the hardness of epoxy glue, dexterously phenolic structure is introduced in the amine curing agent, can also use simultaneously with multiple properties-correcting agent again, improve glue to the stability of chemical mediator and thermotolerance etc., improved the over-all properties of this glue significantly, and make usually the glue of can only many components and depositing become two components, guarantee storage period, helped the use and the commercialization of this glue.
The optimum combination of solidifying agent, softening agent and Recipe that this adhesive is used has all broken through traditional pattern, has adopted the composite curing principle, and the allotment scope is big, and is easy to use, and bonding force is strong.At ambient temperature, solidified the tensile strength 〉=23.5Mpa of bonding 45# steel, shearing resistance 〉=15MPa in this glue 2-3 hour; Shearing resistance 〉=the 12.3MPa of bonding aluminium alloy.In that " the sticking aluminium shearing resistance of " YY-921 " the two component glue on the 830th page of the adhesive applications handbook is 8-9MPa only.This glue is compared with the poly-sulphur two-component adhesive product of similar both at home and abroad epoxy, all has remarkable advantages at aspects such as condition of cure, curing speed, mechanical strength, costs.
Provide three embodiment (unit is weight percentage) of this adhesive proportioning raw materials below with tabular form:
Figure 921101023_IMG1
Wherein the preceding method preparation is then pressed in the preparation of JC-3 solidifying agent, and the equal powder of the solid matter in the proportioning raw materials carefully reaches the 250-300 order.Under the normality the first five is planted raw material and be uniformly mixed into the first component, the 6th to 12 kind of raw material is uniformly mixed into component B, reduced iron powder adds respectively in first and second liang of components, and making first and second liang of component weight ratios is 3: 1.With embodiment 2, be example explanation, promptly the first five first component of planting raw material is 45 parts, the component B of the 6th to 12 kind of raw material is 45 parts, 35 parts reduced iron powders are divided into 30 parts add the first component, 5 parts add component B, and then first is 72 parts, 25 parts of second, the two weight ratio was 3: 1.

Claims (3)

1, a kind of metal adhesive is characterized in that:
The feed proportioning of a, this adhesive than (weight percent) is:
E-44 Resins, epoxy 29-32%, E-51 Resins, epoxy 5-9%, liquid polysulphide rubber 3-5%, KH-560 coupling agent 1-2%, tbp 1-3%, o-phthalic acid dibutyl ester 1-3%, JC-3 solidifying agent 4-6%, T-31 solidifying agent 2-4%, Versamid 650 #2-3%, benzoic sulfimide 1-2%, DMP-30 promotor 1-3%, activated magnesia 2-4%, reduced iron powder 34-38%,
The preparation of b, above-mentioned JC-3 solidifying agent is to be 1: 1 with phenol, quadrol and industrial formol three mol ratio: 0.5-1 gets material, earlier with phenol and diamines mixing stirring, and by warming-in-water, temperature is controlled at 60-75 ℃, drips industrial formol, is warmed up to 95-105 ℃ after adding, stirred 3-4 hour, cool to 85-95 ℃ again, and then be warming up to 105-110 ℃, and under 60 mmhg decompression dehydration 2 hours.
2, metal adhesive according to claim 1 is characterized in that this adhesive is first and second liang of components under the normality, and the first component has E-44 Resins, epoxy, E-51 Resins, epoxy, liquid polysulphide rubber, KH-560 coupling agent and tbp, component B has o-phthalic acid dibutyl ester, the JC-3 solidifying agent, T-31 solidifying agent, Versamid, benzoic sulfimide, DMP-30 promotor and activated magnesia, reduced iron powder is added in two components as counterweight, and making first and second liang of component weight ratios is 3: 1.
3, metal adhesive according to claim 1 is characterized in that the equal powder of solid matter in the proportioning raw materials carefully reaches the 250-300 order.
CN 92110102 1992-08-20 1992-08-20 Metal adhesive Expired - Fee Related CN1033862C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 92110102 CN1033862C (en) 1992-08-20 1992-08-20 Metal adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 92110102 CN1033862C (en) 1992-08-20 1992-08-20 Metal adhesive

Publications (2)

Publication Number Publication Date
CN1070211A true CN1070211A (en) 1993-03-24
CN1033862C CN1033862C (en) 1997-01-22

Family

ID=4944612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 92110102 Expired - Fee Related CN1033862C (en) 1992-08-20 1992-08-20 Metal adhesive

Country Status (1)

Country Link
CN (1) CN1033862C (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305990C (en) * 2005-01-12 2007-03-21 李宇峙 Interfacial adhesive for steel bridge surface paving
CN1308409C (en) * 2004-05-31 2007-04-04 宝山钢铁股份有限公司 Antiwear epoxy resin adhesive
CN100387669C (en) * 2005-04-18 2008-05-14 李怀新 Antiwear ceramic-metal adhesive
CN100422281C (en) * 2007-03-16 2008-10-01 中交第四航务工程局有限公司 Epoxy resin adhesive for use in water
CN100439467C (en) * 2007-06-29 2008-12-03 上海天洋热熔胶有限公司 Polyamide thermosol for clothing and preparation method thereof
CN102153978A (en) * 2011-03-11 2011-08-17 中南林业科技大学 Room-temperature solidification heat-resistant epoxy adhesive
CN103122230A (en) * 2013-03-06 2013-05-29 中国人民解放军63605部队 Cold welding adhesive for leakage sealing of liquid propellant and application method
CN105086907A (en) * 2015-09-30 2015-11-25 佛山市日丰企业有限公司 Mildew-proof sealant and preparation method thereof
CN107236508A (en) * 2016-12-29 2017-10-10 北京奥宇可鑫表面工程技术有限公司 The method of bimetallic joint sealant and repairing metal device
US20180132479A1 (en) * 2011-02-15 2018-05-17 Toyo Seikan Group Holdings, Ltd. Antibacterial resin composition
CN111315839A (en) * 2017-08-15 2020-06-19 Ddp特种电子材料美国公司 Room temperature curable two-part toughened epoxy adhesive

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1308409C (en) * 2004-05-31 2007-04-04 宝山钢铁股份有限公司 Antiwear epoxy resin adhesive
CN1305990C (en) * 2005-01-12 2007-03-21 李宇峙 Interfacial adhesive for steel bridge surface paving
CN100387669C (en) * 2005-04-18 2008-05-14 李怀新 Antiwear ceramic-metal adhesive
CN100422281C (en) * 2007-03-16 2008-10-01 中交第四航务工程局有限公司 Epoxy resin adhesive for use in water
CN100439467C (en) * 2007-06-29 2008-12-03 上海天洋热熔胶有限公司 Polyamide thermosol for clothing and preparation method thereof
US20180132479A1 (en) * 2011-02-15 2018-05-17 Toyo Seikan Group Holdings, Ltd. Antibacterial resin composition
US11172676B2 (en) * 2011-02-15 2021-11-16 Toyo Seikan Group Holdings, Ltd. Antibacterial resin composition
CN102153978A (en) * 2011-03-11 2011-08-17 中南林业科技大学 Room-temperature solidification heat-resistant epoxy adhesive
CN102153978B (en) * 2011-03-11 2013-07-17 中南林业科技大学 Room-temperature solidification heat-resistant epoxy adhesive
CN103122230A (en) * 2013-03-06 2013-05-29 中国人民解放军63605部队 Cold welding adhesive for leakage sealing of liquid propellant and application method
CN103122230B (en) * 2013-03-06 2014-02-12 中国人民解放军63605部队 Cold welding adhesive for leakage sealing of liquid propellant and application method
CN105086907B (en) * 2015-09-30 2017-07-18 日丰企业集团有限公司 A kind of mildewproof sealant and preparation method thereof
CN105086907A (en) * 2015-09-30 2015-11-25 佛山市日丰企业有限公司 Mildew-proof sealant and preparation method thereof
CN107236508A (en) * 2016-12-29 2017-10-10 北京奥宇可鑫表面工程技术有限公司 The method of bimetallic joint sealant and repairing metal device
CN111315839A (en) * 2017-08-15 2020-06-19 Ddp特种电子材料美国公司 Room temperature curable two-part toughened epoxy adhesive

Also Published As

Publication number Publication date
CN1033862C (en) 1997-01-22

Similar Documents

Publication Publication Date Title
JP3249983B2 (en) Two-component curable hot melt resin composition
JP2689992B2 (en) Reactive hot melt adhesive
CN100569888C (en) Hot-melt asphalt adhesive and preparation method thereof
CN1070211A (en) Metal adhesive
CN111019575B (en) High-temperature-resistant high-peeling-resistance hot-melt pressure-sensitive adhesive and preparation method thereof
CN106085309B (en) Automobile floor leather melt pressure sensitive glue composition and preparation method thereof
CN101307214B (en) Hot-fusible adhesive and method for preparing same
CN105733494B (en) A kind of hot melt adhesive and preparation method thereof
KR100792524B1 (en) Metal adhesive moulding method and the product made by the method
CN101407708A (en) High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof
US4359556A (en) Thermoplastic polyamide hot melt adhesive composition
CN105219271B (en) Uncured phosphorus solid waste modified waterproof asphalt material and its preparation technology
CN107151419B (en) A kind of high tenacity cold mixing bituminous epoxy binder and preparation method thereof
WO2011032822A1 (en) Hydrolytically stable polyamide
EP0441545A1 (en) Two-component curable hot-melt resin compositions
JP4044349B2 (en) Thin film adhesive
US5424371A (en) Adhesive of amine-terminated, piperazine-containing polyamide and epoxy resin
US6214158B1 (en) High temperature carbonaceous cement
CN112390935B (en) Amido amine epoxy resin curing agent and preparation method thereof
CN109280531B (en) Low-noise adhesive tape
JP3134769B2 (en) Polyamide resin composition for coating
CN1048741C (en) Phenol aldehyde modified firming agent and its preparation method
CN117363259B (en) High-adhesive-strength tackifier and preparation method and application thereof
JPH029072B2 (en)
JP3134770B2 (en) Polyamide resin composition for coating

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee