CN111029150A - Monomer electric capacity integrated configuration - Google Patents
Monomer electric capacity integrated configuration Download PDFInfo
- Publication number
- CN111029150A CN111029150A CN201911286315.6A CN201911286315A CN111029150A CN 111029150 A CN111029150 A CN 111029150A CN 201911286315 A CN201911286315 A CN 201911286315A CN 111029150 A CN111029150 A CN 111029150A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- capacitor
- integrated structure
- single capacitor
- copper bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Abstract
The invention provides a single capacitor integrated structure, which relates to the technical field of high-voltage electricity and power electronics, and comprises a circuit board and at least one single capacitor welded on the circuit board, wherein the circuit board is used as a current carrier of the single capacitor; the whole circuit board is exposed, and the circuit board is further provided with a heat dissipation through hole for achieving external cooling of the single capacitor. The invention adopts the printed circuit board as the current carrier, has mature process, low cost and short manufacturing period, saves the die cost and is convenient for integrating various functional circuits. The single capacitor and the printed circuit board are welded by adopting a selective welding process, and the process is mature and easy to realize; the temperature of the printed circuit board is lower after the printed circuit board is effectively cooled, so that the service life of each single capacitor is ensured; the capacitor can be compatible with monomer capacitors with different specifications, and research and development and monomer cost are effectively reduced; the printed circuit board can be laminated by more than six layers, the layer gap is small, and the parasitic inductance is effectively reduced by the arrangement of the absorption capacitor.
Description
Technical Field
The invention relates to the technical field of high-voltage electricity and power electronics, in particular to a single capacitor integrated structure.
Background
With the rapid development of the electronic industry, the requirements of high-level and low-price electronic products are more and more urgent, electronic equipment required by people for material and cultural life also tends to medium-high grade, and a capacitor, which is one of electronic elements widely used in the electronic equipment, is widely applied to aspects such as blocking, coupling, bypass, filtering, tuning loops, energy conversion, control circuits and the like as an electronic basic product.
In the prior art, in the manufacturing process of the capacitor, generally, a copper bar is firstly punched, bent, hot-pressed, punched and the like to form a laminated copper bar, then a capacitor core and the laminated copper bar are connected in parallel by adopting a resistance welding or brazing mode to form an assembly, the assembly is filled and sealed by resin to form a module capacitor, and finally a shell of the capacitor is formed by an injection mold.
Various dies such as stamping, bending and hot pressing need to be designed in the laminated copper bar manufacturing process, an injection mold adopted by the shell also needs to be opened and customized, the manufacturing process is complex, the manufacturing cost is high, and the manufacturing period is long. And the copper bar is a two-layer laminating structure, the thickness of the middle insulating paper is large, the output pins are long, and the parasitic inductance of the capacitor is high easily. In addition, the positive and negative electrodes of the capacitor are generally led out by electrodes or laminated copper bars in the manufacturing process, and the laminated copper bars are generally led out for the capacitor with large capacity, so that the laminated copper bars and the capacitor core are required to be welded together. Because the connection process requirement of the laminated copper bar and the capacitor core is higher, the vibration requirement of a welding spot is higher, the failure rate is high, and the production cost is higher due to the adoption of resistance welding equipment or brazing equipment and the like, most domestic manufacturers adopt a manual welding mode, the production efficiency is low, and the large scale is difficult to realize. Meanwhile, except for the lead-out pins, most of the laminated copper bars are located inside the shell, cooling cannot be effectively implemented, the temperature resistance of the capacitor core is usually 105 ℃, and the service life of the capacitor is shortened due to the overhigh temperature of the copper bars. In addition, due to the limitation of the manufacturing process and the structure, additional functions such as a discharge circuit, a voltage acquisition circuit and the like cannot be integrated.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a single capacitor integrated structure, which comprises a circuit board and at least one single capacitor welded on the circuit board, wherein the circuit board is used as a current carrier of the single capacitor;
the whole circuit board is exposed, and the circuit board is further provided with a heat dissipation through hole for achieving external cooling of the single capacitor.
Preferably, the circuit board is a printed circuit board.
Preferably, the single capacitor is soldered on the circuit board by a selective soldering process.
Preferably, the single capacitor comprises a single bus capacitor and/or a Y capacitor.
Preferably, an absorption capacitor is further welded on the circuit board at a position close to the output pin, and is used for reducing the parasitic inductance of the single capacitor.
Preferably, the absorption capacitor is a ceramic capacitor.
Preferably, the circuit board is further integrated with a functional circuit;
the functional circuit comprises a discharge circuit and/or a voltage acquisition circuit.
Preferably, the functional circuit is integrated on the circuit board by using surface mount technology.
Preferably, the circuit board is provided with a copper bar, the copper bar is welded on the circuit board, and the circuit board is electrically connected with the single capacitor.
Preferably, the copper bar comprises an anode copper bar and a cathode copper bar, and the anode copper bar and the cathode copper bar are laminated on the circuit board.
The technical scheme has the following advantages or beneficial effects:
1) the printed circuit board is used as a current carrier, so that the process is mature, the cost is low, the manufacturing period is short, the die cost is saved, and a plurality of functional circuits are conveniently integrated.
2) The single capacitor and the printed circuit board are welded by adopting a selective welding process, and the process is mature and easy to realize;
3) the temperature of the printed circuit board is lower after the printed circuit board is effectively cooled, so that the service life of each single capacitor is ensured;
4) the capacitor can be compatible with standard single capacitors and Y capacitors of different specifications, customized development is avoided, and development and die cost is effectively reduced;
5) the printed circuit board can be laminated by more than six layers, the layer gap is small, and the parasitic inductance is effectively reduced by the arrangement of the absorption capacitor.
Drawings
FIG. 1 is a side view of a monolithic capacitor integrated structure in accordance with a preferred embodiment of the present invention;
fig. 2 is a bottom view of a single capacitor integrated structure according to a preferred embodiment of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present invention is not limited to the embodiment, and other embodiments may be included in the scope of the present invention as long as the gist of the present invention is satisfied.
In the preferred embodiment of the present invention, based on the above problems in the prior art, there is provided a single capacitor integrated structure, as shown in fig. 1 and 2, including a circuit board 2 and at least one single capacitor 1 soldered on the circuit board 2, wherein the circuit board 2 is used as a current carrier of the single capacitor 1;
the circuit board 2 is wholly exposed, and the circuit board 2 is further provided with a heat dissipation through hole 3 for realizing external cooling of the single capacitor 1.
Specifically, in the embodiment, the circuit board 2 is used as a current carrier, and since the technology of the printed circuit board is mature, and a customized mold is not required in the manufacturing process, the cost is effectively saved, and the manufacturing period is short. And according to project requirements, the selective welding process with mature process and low welding technology threshold is adopted to select the monomer capacitors 1 with different specifications to be welded on the circuit board 1 so as to meet different requirements, so that the manufacturing period is greatly shortened, the cost is not shared, and both the research and development cost and the monomer cost are lower.
Further, the circuit board 2 may be provided with more than six layers of lamination to meet higher performance requirements, and the layer gap is small, which is beneficial to control of impedance, interlayer coupling and shielding. Meanwhile, current routing, the number of layers of the circuit board 2, the thickness of each layer of copper, output pins and the like can be reasonably set according to the current capability and the requirement on parasitic inductance.
In this embodiment, the overall exposed layout of the circuit board 2 is adopted, so that the single capacitors can be better cooled, and the performance of each single capacitor is effectively improved. Meanwhile, due to the overall exposed layout of the circuit board 2, the circuit board 2 can be further provided with the heat dissipation through hole 3, so that the external cooling of the single capacitor 1 is further realized, and the service life of the single capacitor 1 is prolonged. It should be noted that fig. 2 only shows a schematic distribution diagram of the heat dissipation through holes 3, and the actual distribution positions and the number of the heat dissipation through holes 3 are not limited thereby.
In a preferred embodiment of the present invention, the circuit board 2 is a printed circuit board.
In the preferred embodiment of the present invention, the single capacitor 1 is soldered on the circuit board 2 by a selective soldering process.
In a preferred embodiment of the present invention, the single capacitor 1 includes a single bus capacitor and/or a Y capacitor.
In the preferred embodiment of the present invention, an absorption capacitor 5 is further soldered on the circuit board 2 near the output pin 4 for reducing the parasitic inductance of the single capacitor 1.
Specifically, in this embodiment, the output pin 4 includes a positive electrode pin and a negative electrode pin, and is used for leading out an electrode of each single capacitor 1, and in addition, the circuit board 2 is further provided with a ground pin 6.
In a preferred embodiment of the present invention, the absorption capacitor 5 is a ceramic capacitor.
In the preferred embodiment of the present invention, the circuit board 2 is further integrated with a functional circuit;
the functional circuit comprises a discharge circuit and/or a voltage acquisition circuit.
In the preferred embodiment of the present invention, the functional circuit is integrated on the circuit board 2 by using surface mount technology.
In the preferred embodiment of the present invention, the circuit board 2 is provided with the copper bar 7, and the copper bar 7 is welded on the circuit board 2, and the circuit board 2 and the single capacitor 1 are electrically connected.
Specifically, in this embodiment, the copper bar 7 is preferably disposed on the circuit board 2 in a stacked manner, and by disposing the copper bar 7, the current carrier of the circuit board 2 is increased, and the current capability of the circuit board 2 is enhanced. The copper bars 7 are provided with corresponding copper bar pins, and the copper bar pins and the pins of the single capacitors 1 can be welded on the circuit board 2 at one time without adding extra working procedures. The positive and negative electrodes of the copper bar 7 are electrically connected with the positive and negative electrodes of the single capacitor 1 through the circuit board 2.
In the preferred embodiment of the present invention, the copper bar 7 includes a positive copper bar 71 and a negative copper bar 72, and the positive copper bar 71 and the negative copper bar 72 are stacked on the circuit board 2.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A single capacitor integrated structure is characterized by comprising a circuit board and at least one single capacitor welded on the circuit board, wherein the circuit board is used as a current carrier of the single capacitor;
the whole circuit board is exposed, and the circuit board is further provided with a heat dissipation through hole for achieving external cooling of the single capacitor.
2. The monolithic capacitive integrated structure of claim 1, wherein the circuit board is a printed circuit board.
3. The monolithic capacitor integrated structure of claim 1, wherein the monolithic capacitor is soldered to the circuit board using a selective soldering process.
4. The cell capacitor integrated structure of claim 3, wherein the cell capacitor comprises a cell bus capacitor and/or a Y capacitor.
5. The monolithic capacitor integrated structure as recited in claim 1, wherein an absorption capacitor is further soldered on the circuit board near the output pin for reducing the parasitic inductance of the monolithic capacitor.
6. The monolithic capacitive integrated structure of claim 5, wherein the absorption capacitor is a ceramic capacitor.
7. The monolithic capacitor integrated structure of claim 1, wherein a functional circuit is further integrated on the circuit board;
the functional circuit comprises a discharge circuit and/or a voltage acquisition circuit.
8. The monolithic capacitor integrated structure of claim 7, wherein said functional circuitry is integrated on said circuit board using surface mount technology.
9. The integrated structure of single capacitor as claimed in claim 1, wherein a copper bar is disposed on the circuit board, and the copper bar is soldered on the circuit board and electrically connected to the single capacitor through the circuit board.
10. The capacitor-on-board integrated structure of claim 9, wherein the copper bar comprises a positive copper bar and a negative copper bar, and the positive copper bar and the negative copper bar are stacked on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911286315.6A CN111029150A (en) | 2019-12-13 | 2019-12-13 | Monomer electric capacity integrated configuration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911286315.6A CN111029150A (en) | 2019-12-13 | 2019-12-13 | Monomer electric capacity integrated configuration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111029150A true CN111029150A (en) | 2020-04-17 |
Family
ID=70210809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911286315.6A Pending CN111029150A (en) | 2019-12-13 | 2019-12-13 | Monomer electric capacity integrated configuration |
Country Status (1)
| Country | Link |
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| CN (1) | CN111029150A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206657736U (en) * | 2017-03-07 | 2017-11-21 | 珠海英搏尔电气股份有限公司 | One kind stacking power busbar filter capacitor component |
| CN108735509A (en) * | 2018-05-14 | 2018-11-02 | 无锡宸瑞新能源科技有限公司 | A kind of high heat dissipation thin film capacitor for electric vehicle |
| CN110234201A (en) * | 2018-03-05 | 2019-09-13 | 施韦策电子公司 | Printed circuit board component, power inverter and the method for manufacturing printed circuit board component of integrated electronic switch element |
| CN110323058A (en) * | 2019-08-02 | 2019-10-11 | 北斗航天汽车（北京）有限公司 | A kind of novel modularized electric machine controller |
-
2019
- 2019-12-13 CN CN201911286315.6A patent/CN111029150A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206657736U (en) * | 2017-03-07 | 2017-11-21 | 珠海英搏尔电气股份有限公司 | One kind stacking power busbar filter capacitor component |
| CN110234201A (en) * | 2018-03-05 | 2019-09-13 | 施韦策电子公司 | Printed circuit board component, power inverter and the method for manufacturing printed circuit board component of integrated electronic switch element |
| CN108735509A (en) * | 2018-05-14 | 2018-11-02 | 无锡宸瑞新能源科技有限公司 | A kind of high heat dissipation thin film capacitor for electric vehicle |
| CN110323058A (en) * | 2019-08-02 | 2019-10-11 | 北斗航天汽车（北京）有限公司 | A kind of novel modularized electric machine controller |
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Application publication date: 20200417 |