CN209626051U - A kind of one chip series connection ceramic capacitor - Google Patents
A kind of one chip series connection ceramic capacitor Download PDFInfo
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- CN209626051U CN209626051U CN201920446348.1U CN201920446348U CN209626051U CN 209626051 U CN209626051 U CN 209626051U CN 201920446348 U CN201920446348 U CN 201920446348U CN 209626051 U CN209626051 U CN 209626051U
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Abstract
A kind of one chip series connection ceramic capacitor, including ceramic chip, encapsulated layer, the first pin and second pin, it is characterized by: the leading flank of the ceramic chip is equipped with before first electrode before electrode and second, there is gap between electrode before electrode and second before first；The trailing flank of ceramic chip is equipped with after first electrode after electrode and second, has gap after first after electrode and second between electrode, after first after electrode and second between electrode by being conductively connected item connection；Electrode is corresponding with electrode position before first after first, and electrode is corresponding with electrode position before second after second；First pin upper end is together with electrode welding before first, and second pin upper end is together with electrode welding before second.The one chip series connection ceramic capacitor of the utility model is equivalent to concatenated two capacitors, voltage endurance capability with higher and reliability, and compact-sized, secured, takes up space smaller, is suitble to the circuit to the restricted requirement of the size of component.
Description
Technical field
The utility model relates to capacitors, and in particular to a kind of one chip series connection ceramic capacitor.
Background technique
Ceramic capacitor is using ceramics as dielectric capacitor.Existing ceramic capacitor generally comprises ceramic chip
(usually disk), two lead electrodes (such as silver electrode), two pins and encapsulated layer (such as epoxy resin enclosed layer, asphalt mixtures modified by epoxy resin
Shell is formed after the solidification of rouge encapsulated layer), two lead electrodes are respectively arranged on the two sides of ceramic chip, and two pins are respectively with two
A lead electrode welds together, and encapsulated layer is by ceramic chip, lead electrode and a part of pin (i.e. pin and lead electrode
The part of connection) be sealed, the part that two pins are in outside encapsulated layer for when assembling circuit with route or other elements
Connection.Above-mentioned pin generallys use metal wire and is made.
In some circuits, lead to line short because of capacitor failure in order to prevent, improves safety, generally use and connect
The mode for entering concatenated two capacitors substitutes an original capacitor, in this way, wherein a capacitor failure and it is another
In the case that a capacitor remains to normal work, short-circuit state can avoid.However, being needed for two capacitors of installation
Two capacitor installation sites are reserved on route (such as circuit board), installation is more inconvenient, and occupies biggish installation space.
Authorization Notice No. is that the Chinese utility model patent specification of CN208189401U discloses a kind of series connection ceramic electrical
Container, the series connection ceramic capacitor include encapsulated layer, two pins, the first ceramic chip, the second ceramic chip and connecting line；The
One ceramic chip and the second ceramic chip or so side by side, are respectively equipped with one first on the leading flank of the first ceramic chip and trailing flank
Electrode is respectively equipped with a second electrode on the leading flank of the second ceramic chip and trailing flank；Connecting line one end and a first electrode
Weld together, the connecting line other end welds together with a second electrode, and a pin upper end is welded on another first electrode
Together, another pin upper end welds together with another second electrode；Encapsulated layer makes pottery the first ceramic chip, connecting line, second
Porcelain core piece, two first electrodes, two second electrodes and two pins upper end are sealed.The series connection ceramic capacitor is equivalent to concatenated
Two capacitors, voltage endurance capability with higher and reliability, and there is lesser thickness, it is easily installed, however a left side need to be used
Right two side-by-side ceramic chip, the size of width direction is larger, and the spacing between two pins is also larger, and when installation occupies
Biggish space, and the connection and fixation between two ceramic chips are realized by connecting line, it is easy in actual use because of connection
Line bends and causes the deformation or damage of series connection ceramic capacitor.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of one chip series connection ceramic capacitor, this one chips
Series connection ceramic capacitor is equivalent to concatenated two capacitors, voltage endurance capability with higher and reliability, and compact-sized, firm
Gu it is smaller to take up space.The technical solution adopted is as follows:
A kind of one chip series connection ceramic capacitor, including ceramic chip, encapsulated layer, the first pin and second pin, it is special
Sign is: electrode before electrode and second before the leading flank of the ceramic chip is equipped with first, electricity before electrode and second before first
There is gap between pole；The trailing flank of ceramic chip is equipped with after first electrode after electrode and second, electrode and second after first
There is between electrode gap afterwards, connected between electrode by being conductively connected item after electrode and second after first；After first electrode with
Electrode position is corresponding before first, and electrode is corresponding with electrode position before second after second；It is electric before first pin upper end and first
Pole welds together, and second pin upper end is together with electrode welding before second；Encapsulated layer by electrode after ceramic chip, first,
Electrode, the first pin upper end and second pin upper end are sealed before electrode, second before electrode, conductive connection item, first after second.
Gap before above-mentioned first before electrode and second between electrode refers to electric before being in first on ceramic chip leading flank
There is no the part of electrode material before pole and second between electrode；Gap after first after electrode and second between electrode refers to pottery
There is no the part of electrode material between electrode after electrode and second after being in first on porcelain core piece trailing flank.
Above-mentioned one chip series connection ceramic capacitor is equivalent to concatenated two capacitors, in which: before first after electrode, first
Part between them constitutes a capacitor at electrode and ceramic chip, electrode and ceramic core after electrode, second before second
Part at piece between them constitutes another capacitor, the two capacitors are automatic to distribute by being conductively connected item series connection
Pressure resistance can be improved the voltage endurance capability of one chip series connection ceramic capacitor, and in the case where a capacitor damages, another
A capacitor remains to retention property, improves reliability.The part that two pins are in outside encapsulated layer for when assembling circuit with
Route or the connection of other elements, only need a capacitor installation site, easy for installation.Moreover, two capacitors be formed in it is same
On a ceramic chip, so that its structure is more compact, secured, take up space smaller.
In a kind of preferred embodiment, before electrode is looped around second before above-mentioned first on the outside of electrode, electrode is looped around the after first
After two on the outside of electrode.In a kind of concrete scheme, above-mentioned ceramic chip is disk, and electrode is rounded before second, and electrode is before first
Have annular shape jaggy, before first the notch of electrode with second pin position is corresponding (contact second pin will not
Electrode before to first)；Electrode is rounded after second, and electrode is in circular ring shape after first.In another concrete scheme, above-mentioned ceramic core
Piece is rectangular sheet, and electrode is in rectangle before second, before first electrode be have it is jaggy rectangular box-like, before first the notch of electrode with
Second pin position is corresponding (electrode before making second pin not touch first in this way)；After second electrode be in rectangle, first
Electrode rectangular frame-shaped afterwards.
In another preferred embodiment, electrode is arranged side by side (side by side or up and down such as left and right before electrode and second before above-mentioned first
Side by side etc.), electrode is arranged side by side and (such as controls side by side or side by side up and down) after electrode and second after first.A kind of concrete scheme
In, above-mentioned ceramic chip is rectangular sheet, and electrode is in rectangle after electrode and second after electrode, first before electrode, second before first.
In addition, above-mentioned ceramic chip can also be other shapes, as it is round (at this time before first before electrode, second after electrode, first electrode and
Electrode substantially semicircular in shape after second) or ellipse (electrode and second after electrode, first before electrode, second before first at this time
Electrode is substantially in half elliptic afterwards).
Electrode can be by electrode layer (such as silver electrode on the leading flank of ceramic chip before electrode and second before above-mentioned first
Layer, copper electrode layer or nickel electrode layer) it constitutes；Electrode and conductive connection item can be by being set to ceramic chip after electrode, second after first
Electrode layer (such as silver electrode layer, copper electrode layer or nickel electrode layer) on trailing flank is constituted, and electrode and is led after electrode, second after first
The narrow bars that are electrically connected are connected, and are easier to produce in this way.
Above-mentioned encapsulated layer is usually epoxy resin enclosed layer.
In general, above-mentioned first pin, second pin are made of metal wire.
The one chip series connection ceramic capacitor of the utility model is equivalent to concatenated two capacitors, the two capacitors are logical
Connecting line series connection is crossed, automatic distribution pressure resistance can be improved the voltage endurance capability of one chip series connection ceramic capacitor, and use process
In, in the case where a capacitor damages, another capacitor remains to retention property, and integral capacitor device can also continue to make
With raising reliability.The part that two pins are in outside encapsulated layer is used to connect when assembling circuit with route or other elements,
A capacitor installation site is only needed, easy for installation, occupied space is smaller.Moreover, two capacitors are formed in the same ceramics
On chip, so that its structure is more compact, secured, take up space smaller.In brief, the one chip of the utility model, which is connected, makes pottery
Porcelain condenser voltage endurance capability with higher and reliability, and it is compact-sized, secured, it takes up space smaller, is suitble to component
The restricted requirement of size circuit.
Detailed description of the invention
Fig. 1 is the structural schematic diagram (being not drawn into encapsulated layer) of the preferred embodiment in the utility model 1；
Fig. 2 is the rearview of the series connection ceramic capacitor of one chip shown in Fig. 1；
Fig. 3 is the structural schematic diagram (being not drawn into encapsulated layer) of the preferred embodiment in the utility model 2；
Fig. 4 is the rearview of the series connection ceramic capacitor of one chip shown in Fig. 3；
Fig. 5 is the structural schematic diagram (being not drawn into encapsulated layer) of the preferred embodiment in the utility model 3；
Fig. 6 is the rearview of the series connection ceramic capacitor of one chip shown in Fig. 5.
Specific embodiment
Embodiment 1
As depicted in figs. 1 and 2, this one chip series connection ceramic capacitor includes ceramic chip 1, encapsulated layer, the first pin 2
With second pin 3；The leading flank of ceramic chip 1 is equipped with before first electrode 5 before electrode 4 and second, electrode 4 and second before first
There is gap 6 between preceding electrode 5；The trailing flank of ceramic chip 1 is equipped with after first electrode 8 after electrode 7 and second, electricity after first
There is between electrode 8 gap 9 behind pole 7 and second, connected between electrode 8 by being conductively connected item 10 after electrode 7 and second after first
It connects；Electrode 7 is corresponding with 4 position of electrode before first after first, and electrode 8 is corresponding with 5 position of electrode before second after second；First
Electrode 4 welds together before 2 upper end of pin and first, and electrode 5 welds together before 3 upper end of second pin and second；Encapsulated layer
By electrode 5, first before electrode 4, second before electrode 8, conductive connection item 10, first after electrode 7, second after ceramic chip 1, first
2 upper end of pin and 3 upper end of second pin are sealed.
In the present embodiment, before first before electrode 4 and second electrode 5 or so side by side, electrode 8 after electrode 7 and second after first
Left and right is side by side；Ceramic chip 1 is rectangular sheet, and electrode 8 is equal after electrode 7 and second after electrode 5, first before electrode 4, second before first
In rectangle.In addition, above-mentioned ceramic chip can also be other shapes, such as round (electrode, first before electrode, second before first at this time
Electrode substantially semicircular in shape after electrode and second afterwards) or ellipse (electricity after electrode, first before electrode, second before first at this time
Electrode is substantially in half elliptic behind pole and second).
Silver electrode layer before first before electrode 4 and second on leading flank of the electrode 5 by being set to ceramic chip 1 (can also be it
Its metal layer, such as copper electrode layer or nickel electrode layer) it constitutes；After first after electrode 7, second electrode 8 and be conductively connected item 10 can be by
Silver electrode layer (can also be other metal electrode layers, such as copper electrode layer or nickel electrode layer) structure on 1 trailing flank of ceramic chip
At electrode 8 and conductive connection item 10 are connected after electrode 7, second after first.
Above-mentioned encapsulated layer is epoxy resin enclosed layer.
First pin 2, second pin 3 are made of metal wire.
This series connection ceramic capacitor can manufacture in the steps below: (1) making silver electrode on the two sides of ceramic chip 1
(electrode 5 before electrode 4 and second, makes layer on the trailing flank of ceramic chip 1 before making first on the leading flank of ceramic chip 1
After making first after electrode 7, second electrode 8 and be conductively connected item 10)；(2) two pins 2,3 are placed, two pins are then made
2,3 upper ends weld together with electrode 5 before electrode 4, second before first on 1 leading flank of ceramic chip respectively；(3) epoxy is encapsulated
Resin simultaneously toasts, and makes epoxy resin cure, forms epoxy resin enclosed layer.
Above-mentioned one chip series connection ceramic capacitor is equivalent to concatenated two capacitors, in which: electrode 4, first before first
The part at electrode 7 and ceramic chip 1 between them constitutes a capacitor afterwards, 8 and of electrode after electrode 5, second before second
Part at ceramic chip 1 between them constitutes another capacitor, the two capacitors are connected by being conductively connected item 10.
The part that two pins 2,3 are in outside encapsulated layer when assembling circuit with route or other elements for connecting.
Embodiment 2
As shown in Figure 3 and Figure 4, in the present embodiment, before electrode 4 is looped around second before first on the outside of electrode 5, electrode after first
7 be looped around second after the outside of electrode 8；Ceramic chip 1 is disk, and electrode 5 is rounded before second, and electrode 4 is with scarce before first
Mouthfuls 11 annular shape, before first the notch 11 of electrode 4 with 3 position of second pin is corresponding (contact second pin 3 will not
Electrode 4 before to first)；Electrode 8 is rounded after second, and electrode 7 is in circular ring shape after first.
Remaining structure of the present embodiment is same as Example 1.
Embodiment 3
As shown in Figure 5 and Figure 6, in the present embodiment, before electrode 4 is looped around second before first on the outside of electrode 5, electrode after first
4 be looped around second after the outside of electrode 5；Ceramic chip 1 is rectangular sheet, and electrode 5 is in rectangle before second, before first electrode 4 be with
Notch 11 it is rectangular box-like, the notch 11 of electrode 4 is corresponding with 3 position of second pin before first (makes second pin 3 will not in this way
Electrode 4 before touching first)；Electrode 8 is in rectangle, 7 rectangular frame-shaped of electrode after first after second.
Remaining structure of the present embodiment is same as Example 1.
Claims (8)
- The ceramic capacitor 1. a kind of one chip is connected, including ceramic chip, encapsulated layer, the first pin and second pin, feature Be: the leading flank of the ceramic chip is equipped with before first electrode before electrode and second, electrode before electrode and second before first Between have gap；The trailing flank of ceramic chip is equipped with after first electrode after electrode and second, after first after electrode and second There is gap between electrode, connected between electrode by being conductively connected item after electrode and second after first；Electrode and after first Electrode position is corresponding before one, and electrode is corresponding with electrode position before second after second；Electrode before first pin upper end and first Weld together, second pin upper end is together with electrode welding before second；Encapsulated layer is by electrode, after ceramic chip, first Electrode, the first pin upper end and second pin upper end are sealed before electrode, second before electrode, conductive connection item, first after two.
- The ceramic capacitor 2. one chip according to claim 1 is connected, it is characterized in that: electrode is looped around the before described first Before two on the outside of electrode, after electrode is looped around second after first on the outside of electrode.
- The ceramic capacitor 3. one chip according to claim 2 is connected, it is characterized in that: the ceramic chip is disk, the Electrode is rounded before two, and electrode is to have annular shape jaggy before first, the notch and second pin position phase of electrode before first It is corresponding；Electrode is rounded after second, and electrode is in circular ring shape after first.
- The ceramic capacitor 4. one chip according to claim 2 is connected, it is characterized in that: the ceramic chip is rectangular sheet, Electrode is in rectangle before second, and electrode is to have jaggy rectangular box-like, the notch of electrode and second pin position before first before first It sets corresponding；Electrode is in rectangle, electrode rectangular frame-shaped after first after second.
- The ceramic capacitor 5. one chip according to claim 1 is connected, it is characterized in that: before described first before electrode and second Electrode is arranged side by side, and electrode is arranged side by side after electrode and second after first.
- The ceramic capacitor 6. one chip according to claim 5 is connected, it is characterized in that: the ceramic chip is rectangular sheet, Electrode is in rectangle after electrode and second after electrode, first before electrode, second before first.
- The ceramic capacitor 7. one chip according to claim 1-6 is connected, it is characterized in that: electrode before described first Electrode layer before with second on leading flank of the electrode by being set to ceramic chip is constituted；Electrode and conduction after electrode, second after first Connection strap is made of the electrode layer being set on ceramic chip trailing flank, and electrode and conductive connection item connect after electrode, second after first Integrally.
- The ceramic capacitor 8. one chip according to claim 1-6 is connected, it is characterized in that: the encapsulated layer is ring Oxygen Resin Wrappage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920446348.1U CN209626051U (en) | 2019-04-03 | 2019-04-03 | A kind of one chip series connection ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920446348.1U CN209626051U (en) | 2019-04-03 | 2019-04-03 | A kind of one chip series connection ceramic capacitor |
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| CN209626051U true CN209626051U (en) | 2019-11-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524702A (en) * | 2020-03-16 | 2020-08-11 | 广东风华高新科技股份有限公司 | Manufacturing method of series capacitor and mountable series capacitor |
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2019
- 2019-04-03 CN CN201920446348.1U patent/CN209626051U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524702A (en) * | 2020-03-16 | 2020-08-11 | 广东风华高新科技股份有限公司 | Manufacturing method of series capacitor and mountable series capacitor |
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