CN218215010U

CN218215010U - Miniaturized novel thin-film capacitor structure

Info

Publication number: CN218215010U
Application number: CN202221711246.6U
Authority: CN
Inventors: 戴静; 俞广铨; 陈栋
Original assignee: Wuxi Chenrui New Energy Technology Co ltd
Current assignee: Wuxi Chenrui New Energy Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2023-01-03
Anticipated expiration: 2032-07-05

Abstract

The utility model relates to a film capacitor technical field specifically is a miniaturized novel film capacitor structure, it can improve the overcurrent ability under the condition of guaranteeing small volume, it includes the shell, be provided with the condenser core in the shell, the stromatolite is female to be arranged, the potting material, be provided with extraction electrode on the shell, a serial communication port, the stromatolite is female to be arranged including outer female arranging and the female row of inlayer, outer female arranging and the female arranging between being provided with the insulating layer of inlayer, outer female arranging, the inlayer is female to be arranged, set up corresponding logical groove on the insulating layer respectively, an electrode end of condenser core links to each other through the inboard of first connection copper and the female row of inlayer, another electrode end of condenser core links to each other through the outside of connecting copper and outer female arranging through the second that runs through the groove, the electrode through-hole has been seted up on outer female arranging and the insulating layer, extraction electrode is direct to be connected with outer arranging or to pass the electrode through-hole and the female row of inlayer and be connected, extraction electrode tip runs through the shell.

Description

Miniaturized novel thin-film capacitor structure

Technical Field

The utility model relates to a film capacitor technical field specifically is a miniaturized novel film capacitor structure.

Background

The advantages of the thin film capacitor, such as strong self-repairing capability, high voltage endurance, high overcurrent capability, long service life, etc., make it increasingly popular in the power electronics industry. At present, dry-type metallized film capacitors are widely selected in the fields of power electronic industry such as rail transit, flexible and straight engineering, new energy and the like.

When the existing film capacitor is applied as a direct current support capacitor, a high-temperature polypropylene film is generally adopted as a medium, among a plurality of organic media, the breakdown voltage of polypropylene is highest, the loss angle of the polypropylene is extremely low, the manufactured product has extremely low self-inductance and ESR, and the cost performance of polypropylene is high, so that the polypropylene becomes the most widely used medium in the film capacitor, but the melting point of polypropylene is low, the long-term operation temperature of the polypropylene cannot exceed 105 ℃, if the operation temperature rise of the capacitor is too high, the internal film is deformed or melted, and if the operation temperature rise of the capacitor is too high, the internal film is melted, the working life of the capacitor is influenced, and the internal film is melted, so that the capacitor is overheated and fails.

The current level in the thin film capacitor is one of its main design parameters and is also the source of the heat generation of the capacitor. In general, in order to ensure that the capacitor does not exceed the working temperature range of the capacitor due to temperature in application, a large margin is generally reserved as much as possible in model selection, so that the volume of a thin film capacitor is large, the cost is high, and in addition, a laminated busbar with a large cross section is required to be designed to be matched with the laminated busbar for use when the capacitor is connected. This greatly affects the improvement of the device in the direction of high power, high density and miniaturization, and there is a strong demand for improvement of the design.

Disclosure of Invention

In order to solve the problem that current film capacitor volume and overcurrent ability can't be compatible, the utility model provides a miniaturized novel film capacitor structure, it can improve overcurrent ability under the condition of guaranteeing little volume.

The technical scheme is as follows: the utility model provides a miniaturized novel thin film capacitor structure, its includes the shell, be provided with condenser core, the female row of stromatolite, the encapsulation material in the shell, be provided with extraction electrode on the shell, its characterized in that, the female row of stromatolite includes that outer female arranges and inlayer is female, outer female arrange with be provided with the insulating layer between the female row of inlayer, set up corresponding logical groove on outer female arranging, inlayer are female, the insulating layer respectively, an electrode tip of condenser core through first connecting copper with the inboard of the female row of inlayer links to each other, another electrode tip of condenser core is through running through the second connecting copper that leads to the groove with the outside of outer female row links to each other, outer female arranging with the electrode through-hole has been seted up on the insulating layer, extraction electrode direct with outer female row is connected or passes the electrode through-hole with the female row of inlayer is connected, extraction electrode tip runs through the shell.

The bus bar is further characterized in that the outer layer bus bar, the inner layer bus bar and the insulating layer are arranged in an inverted U shape, and the leading-out electrodes are arranged on two sides of the outer layer bus bar and the inner layer bus bar;

the shell is a stainless steel shell, and the outer wall of the shell is provided with a handle;

the insulating layer is made of polyimide paper, and the potting material is polyurethane.

Adopt the utility model discloses afterwards, the female design of arranging of stromatolite of inside adoption integral type, electric capacity have extremely low equivalent series inductance, can effectively reduce the condenser and generate heat, satisfy heavy current design demand, draw electrode direct mount on the female row of stromatolite and the tip runs through the shell, and the connecting distance between the female row of capacitor core and stromatolite shortens greatly, and overall structure is compact, has reduced the volume.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the internal structure of the housing;

fig. 3 is a schematic diagram of the connection between the laminated busbar and the capacitor core.

Detailed Description

Referring to fig. 1, fig. 2 and fig. 3, a miniaturized novel thin film capacitor structure comprises a shell 1, a capacitor core 4, a laminated busbar 3 and a potting material (not shown) are arranged in the shell 1, an extraction electrode 2 is arranged on the shell 1, the laminated busbar 3 comprises an outer busbar 3-1 and an inner busbar 3-2, a polyimide insulating layer is arranged between the outer busbar 3-1 and the inner busbar 3-2 to prevent short circuit of the inner layer and the outer layer, the outer busbar 3-1, the inner busbar 3-2 and the insulating layer are respectively provided with a corresponding through groove 6, one electrode end of the capacitor core 4 is connected with the inner side of the inner busbar 3-2 through a first connecting copper plate 7, the other electrode end of the capacitor core 4 is connected with the outer side of the outer busbar 3-1 through a second connecting copper plate 8 penetrating through the through groove 6, the outer busbar 3-1 and the insulating layer are provided with electrode through holes 9, the extraction electrode 2 is directly connected with the outer busbar 3-1 or connected with the inner busbar 3-2 through the electrode through holes 9, the end of the extraction electrode 2 penetrates through the shell, the stainless steel shell is 1, a handle is installed on the outer wall, the handle is installed, the heat dissipation performance of the heat conduction busbar is improved, and the heat conduction efficiency of the polyurethane sealing material is improved, and the heat conduction efficiency is improved.

The outer bus bar 3-1, the inner bus bar 3-2 and the insulating layer are all arranged in an inverted U shape, leading-out electrodes 2 are arranged on two sides of the outer bus bar 3-1 and the inner bus bar 3-2, two ends of the leading-out electrodes are led out, a customer input and output end is directly connected into the capacitor, external bus bar switching is not needed, the external bus bar switching is directly welded on the laminated bus bar 3 in the capacitor, the connection distance is greatly shortened, and the capacitor is guaranteed to have extremely low self-inductance ESL and extremely small equivalent series resistance ESR.

Claims

1. The utility model provides a miniaturized novel thin film capacitor structure, its includes the shell, be provided with condenser core, the female row of stromatolite, the encapsulation material in the shell, be provided with extraction electrode on the shell, its characterized in that, the female row of stromatolite includes that outer female arranges and inlayer is female, outer female arrange with be provided with the insulating layer between the female row of inlayer, set up corresponding logical groove on outer female arranging, inlayer are female, the insulating layer respectively, an electrode tip of condenser core through first connecting copper with the inboard of the female row of inlayer links to each other, another electrode tip of condenser core is through running through the second connecting copper that leads to the groove with the outside of outer female row links to each other, outer female arranging with the electrode through-hole has been seted up on the insulating layer, extraction electrode direct with outer female row is connected or passes the electrode through-hole with the female row of inlayer is connected, extraction electrode tip runs through the shell.

2. The miniaturized novel thin film capacitor structure as claimed in claim 1, wherein the outer layer busbar, the inner layer busbar and the insulating layer are arranged in an inverted U shape, and the leading-out electrodes are arranged on two sides of the outer layer busbar and the inner layer busbar.

3. The miniaturized novel thin film capacitor structure as claimed in claim 1, wherein the housing is a stainless steel housing and a handle is mounted on an outer wall of the housing.

4. The miniaturized novel thin film capacitor structure as claimed in claim 1, wherein the insulating layer is polyimide paper, and the potting compound is polyurethane.