CN102103928B - Capacitor packaging structure - Google Patents
Capacitor packaging structure Download PDFInfo
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- CN102103928B CN102103928B CN 200910259653 CN200910259653A CN102103928B CN 102103928 B CN102103928 B CN 102103928B CN 200910259653 CN200910259653 CN 200910259653 CN 200910259653 A CN200910259653 A CN 200910259653A CN 102103928 B CN102103928 B CN 102103928B
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- carbon paste
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Abstract
The invention discloses a capacitor packaging structure which comprises a substrate unit, a capacitor module and a packaging unit, wherein the substrate unit is provided with an insulating body, at least one first upper conductive layer and one second upper conductive layer which are formed on the upper surface of the insulating body, at least one first lower conductive layer and one second lower conductive layer which are formed on the lower surface of the insulating body, at least two via holes and at least two intermediate conductive layers; the capacitor module is provided with a plurality of capacitor units arranged on the substrate body, and the anode and cathode of each capacitor unit are respectively electrically contacted with the first upper conductive layer and the second upper conductive layer; and the packaging unit is arranged on the substrate body and covers the capacitor module. The anode foil of each capacitor unit is provided with an anode pin which is led outwards, and the anode pins are grouped into a group of anode pin unit so as to enable the anode pins to be electrically stacked together; and in addition, the anode pins are respectively led outwards from the same direction of the anode foil.
Description
Technical field
The present invention relates to a kind of capacitor packaging structure, particularly, relate to a kind of capacitor packaging structure.
Background technology
Capacitor is used in the primary element of consumer electrical home appliances, computer motherboard and periphery thereof, power supply unit, communication product and automobile etc. widely, and its main effect comprises: filtering, bypass, rectification, coupling, decoupling, phase inversion etc.It is one of indispensable element in the electronic product.Capacitor has different kenels according to different materials and purposes.Comprise aluminium matter electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc.
In the prior art, the aluminium foil that is used for aluminium electrolytic capacitor is divided into positive paper tinsel and negative paper tinsel usually, must just can be used for electrochemical capacitor through the step that burn into changes into.Corrosion refers to highly purified aluminium is immersed in and utilizes a series of manufacturing process such as galvanic corrosion, pickling, dechlorination, washing in the galvanic corrosion liquid, to increase the surface area of aluminium foil, is just improved widely and compares electric capacity.The raising of specific volume is the important technology that electrochemical capacitor is realized miniaturization.The again processing through changing into of aluminium foil after excessive erosion (positive paper tinsel) forms aluminium oxide at aluminium foil, as the dielectric of electrochemical capacitor.The withstand voltage linear relationship that is generally a direct ratio of dielectric thickness and aluminium foil, this also is the Main Basis of electrochemical capacitor operating voltage.As for negative paper tinsel, usually form the proof voltage layer of a 1-3V on the surface, also have and do not make the negative paper tinsel that changes into processing, if but the etched foil that will not do pressure-resistant treatments places air, also can the self-assembling formation aluminium oxide.The aluminium foil that changes into through burn into cuts into certain width according to the specification of design, again with the guide pin nail joint on aluminium foil, separate through nail joint, coiling manufacturing process with electrolytic paper again and form a cylindrical structure, be called as fuse or sub-prime.At this moment, fuse does not have the electrical characteristic of electrochemical capacitor, must via with the electrolyte complete wetting in fuse, by the water absorbing capacity of electrolytic paper with electrolyte absorption wherein and infiltrate through in the corrosion structure of aluminium foil.The fuse of this complete wetting bottom of packing into is had in the column shape container of Explosion-proof Design, at the seal of the openend device rubber of column shape container, by machinery sealing and envelope waist, form an airtight column structure, form via manufacturing process such as sleeve pipe, charging are aging again.
In fact, be to form an electronic loop by the movement of electrolyte intermediate ion at the negative pole of electrolytic capacitor, so the conductivity of electrolyte (conductivity) just directly affect the electrical characteristic of electrolytic capacitor.Therefore how improving the conductivity of electrolyte, so that electrolytic capacitor still can keep the chemical stability, particularly electrolyte of electrolyte and aluminium foil, electrolytic paper and the stability of aluminium foil in high temperature, is the trend of electrolyte development.The electrolyte that the aluminium electrolytic capacitor of mentioning in the general document uses particularly is used in below the operating voltage 100V, mainly is to be formed according to the different proportion allotment by water, organic solvent, organic acid, inorganic acid and some special additives.
Solid electrolytic capacitor gets most of the attention in electrolytic capacitor field medium frequency characteristic especially excellence.In solid electrolytic capacitor, mainly be to use chemical composition coating (chemical conversion coating) that the valve metal by aluminium, tantalum etc. consists of as anode.The representative construction of the solid electrolytic capacitor of using as electrode foil with aluminium is all if any a kind of structure, that is: the anode aluminium that will be formed with the dielectric oxide-film take barrier paper as intermediary transforms capacitor element that paper tinsel forms around volume immersed with monomer and oxidant with chemical conversion paper tinsel and phase target aluminum chemistry, is accommodated in aluminium matter box body or synthetic resin matter box body etc. and gives airtight structure.Above-mentioned solid electrolytic capacitor is small-sized and can obtain very large electric capacity, therefore can widely use.Moreover electrolyte uses such as polypyrrole, polythiophene, polyaniline etc., but in order to reduce the purpose of ESR (equivalent series resistance), therefore mainly uses the low poly-ethylene group dioxy thiophene of resistance coefficient.Above-mentioned solid electrolytic capacitor shape is little and have large electric capacity, except ESR is low, also has the characteristics such as the wafer of being easy to and applicable surface installations, so indispensable person when just becoming miniaturization, multifunction, the cost degradation of e-machine.
In recent years, follow the digitisation of outstanding e-machine, electrolytic capacitor also needs high capacity, miniaturization and in the high-frequency zone impedance is lowly changed, and gazes at and the characteristics of solid electrolytic capacitor tool excellent frequency characteristic enjoy it in electrolytic capacitor.Moreover, in the solid electrolytic capacitor, coiled solid electrolysis capacitor, stacked solid electrolytic capacitor etc. are arranged.Usually stacked solid electrolytic capacitor is provided with the aluminium foil with valve action known to, and is provided with the dielectric substrate that is formed and be made of polypyrrole by chemical polymerization, electrolysis polymerization method etc.But the dielectric substrate that is made of polypyrrole has and can't be formed uniformly on aluminium foil surface and hold flimsy shortcoming.So aforementioned stacked solid electrolytic capacitor has the problems such as leakage current increase, short circuit.
Summary of the invention
The object of the invention is to, for the problems referred to above, propose a kind of capacitor packaging structure, by the use of base board unit, to realize not needing to arrange in addition the advantage of lead frame.
For achieving the above object, the technical solution used in the present invention is: a kind of capacitor packaging structure, comprise: a base board unit, described base board unit has an insulating body, at least two form in the body upper surface first on conductive layer on the conductive layer and second, at least two the first lower conductiving layer and the second lower conductiving layers that form in the body upper surface, at least two perforation and at least two intermediate conductive layers that are formed separately in described at least two perforation that penetrate described insulating body, and wherein an intermediate conductive layer is electrically connected on described first between the conductive layer and described the first lower conductiving layer, and an other intermediate conductive layer is electrically connected on described second between the conductive layer and affiliated the second lower conductiving layer; One electric capacity module, it has a plurality of capacitor cells that are arranged on the described substrate body, and the positive pole of each capacitor cell and negative pole be electrical contact conductive layer on conductive layer on described first and described second respectively; And an encapsulation unit, it is arranged on the described substrate body and covers described electric capacity module.
Further, wherein the positive paper tinsel of each capacitor cell has an anodal pin of outwards drawing, and described anodal pin is distinguished into the anodal pin units of many groups, it is stacked together electrically that each organizes the described anodal pin of anodal pin units, and described anodal pin is outwards drawn from the equidirectional of described positive paper tinsel respectively in addition.
Further, wherein the positive paper tinsel of each capacitor cell has an anodal pin of outwards drawing, and described anodal pin is formed one group of anodal pin units, so that described anodal pin is stacked together electrically, described anodal pin is outwards drawn from the equidirectional of described positive paper tinsel respectively in addition.
Further, described each capacitor cell sequentially is laminated by a carbon paste, a conducting polymer, a valve metal paillon foil, a conducting polymer and a carbon paste, and described electric capacity module further comprises a plurality of conductive layers, and it is electrically connected at respectively between the described carbon paste of each capacitor cell.
Further, the positive terminal of the described valve metal paillon foil of described capacitor cell sees through a plurality of pads and is electrically connected, the described carbon paste of described capacitor cell sees through described conductive layer and is electrically connected, and described valve metal paillon foil and described carbon paste are insulated from each other; Described electric capacity module further comprises in addition: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil and surround into the insulating barrier of a circle, limiting the length of described carbon paste and described conducting polymer, and as the positive pole of each capacitor cell and the insulated wire of negative pole.
Further, described each capacitor cell sequentially is laminated by a carbon paste, a conducting polymer, a valve metal paillon foil, a conducting polymer and a carbon paste, and see through carbon paste between per two capacitor cells and electrically stacked together, described electric capacity module further comprises in addition: a plurality of conductive layers, it is electrically connected at respectively between the described carbon paste of each capacitor cell.
Further, the positive terminal of the described valve metal paillon foil of described capacitor cell sees through a plurality of pads and is electrically connected, the described carbon paste of described capacitor cell sees through described conductive layer and is electrically connected, and described valve metal paillon foil and described carbon paste are insulated from each other, described electric capacity module further comprises in addition: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil and surround into the insulating barrier of a circle, limiting the length of described carbon paste and described conducting polymer, and as the positive pole of each capacitor cell and the insulated wire of negative pole.
A kind of capacitor packaging structure, comprise: a base board unit, it has an insulating body, at least two separated from one another and form in described insulating body upper surface first on conductive layer on the conductive layer and second, at least two separated from one another and form in the first lower conductiving layer and second lower conductiving layer of described insulating body lower surface, at least two perforation and at least two intermediate conductive layers that are formed separately in described at least two perforation that penetrate described insulating body, and wherein an intermediate conductive layer is electrically connected on described first between the conductive layer and described the first lower conductiving layer, and an other intermediate conductive layer is electrically connected on described second between the conductive layer and described the second lower conductiving layer; One capacitor cell, the positive pole of wherein said capacitor cell and negative pole be electrical contact conductive layer on conductive layer on described first and described second respectively; And an encapsulation unit, it is arranged on the described substrate body and covers described electric capacity module.
Beneficial effect of the present invention:
1. capacitor packaging structure can prepare large tracts of land, large capacity, the low back of the bodyization (Low Profile), capacitor cheaply.
2, can significantly reduce condenser leakage current (Leakage Current, LC) and short circuit problem.
3, can reduce the capacitor welding degree of difficulty, and significantly reduce the equivalent series resistance (Equivalent Series Resistance, ESR) of capacity capacitor.
4, the present invention sees through the use of base board unit, and does not need to arrange in addition lead frame.
Description of drawings
Accompanying drawing is used to provide a further understanding of the present invention, and consists of the part of specification, is used for together with embodiments of the present invention explaining the present invention, is not construed as limiting the invention.In the accompanying drawings:
Figure 1A is the perspective exploded view of embodiments of the invention one;
Figure 1B is the solid combination schematic diagram of embodiments of the invention one;
Fig. 1 C is the generalized section of embodiments of the invention one;
Fig. 2 is the schematic side view of the first cascade type electric capacity module of the present invention;
Fig. 3 is the schematic side view of the second cascade type electric capacity module of the present invention;
Fig. 4 is the schematic diagram of the first pin fit system of the present invention;
Fig. 5 is the schematic diagram of the second pin fit system of the present invention;
Fig. 6 is the schematic diagram of the third pin fit system of the present invention.
By reference to the accompanying drawings, Reference numeral is as follows in the embodiment of the invention:
[the first cascade type electric capacity]
Capacitor cell 1n carbon paste 10n
Conducting polymer 11n
Conducting polymer 11n
Valve metal paillon foil 12n
Conductive layer Sn
Pad Pn
[the second cascade type electric capacity]
Capacitor cell 1p carbon paste 10p
Conducting polymer 11p
Conducting polymer 11p
Valve metal paillon foil 12p
Insulating barrier 4p
Pad Pp
[pin derivation embodiment]
Anodal pin 120
Anodal pin units 120 '
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the present invention, is not intended to limit the present invention.
Shown in Figure 1A to Fig. 1 C, the embodiment of the invention one provides the capacitor packaging structure of a kind of use surface mount technology (SMT), and it comprises: a base board unit 1a, an electric capacity module 2a and an encapsulation unit 3a.
Wherein, base board unit 1a has an insulating body 10a, at least two separated from one another and form in this insulating body 10a upper surface first on conductive layer 12a on the conductive layer 11a and second, at least two separated from one another and form in the first lower conductiving layer 13a and the second lower conductiving layer 14a of this insulating body 10a lower surface, at least two perforation 15a (for example chadless) and at least two intermediate conductive layer 16a that are formed separately in above-mentioned at least two perforation 15a that penetrate this insulating body 10a, and wherein an intermediate conductive layer 16a is electrically connected at this on first between conductive layer 11a and this first lower conductiving layer 13a, and an other intermediate conductive layer 16a is electrically connected at this on second between conductive layer 12a and this second lower conductiving layer 14a.Moreover according to different design requirements, above-mentioned at least two intermediate conductive layer 16a also can be filled in respectively in above-mentioned two perforation 15a at least.
In addition, electric capacity module 2a has a capacitor cell 20a who is arranged on this substrate body 10a, this capacitor cell 20a is a cascade type electric capacity, and the anodal 201a of this capacitor cell 20a and negative pole 202a difference electrical contact conductive layer 12a on conductive layer 11a and second on first.In addition, embodiment one further comprises: one is arranged at the watertight composition 4a (shown in Fig. 1 C) between this base board unit 1a and this electric capacity module 2a, see through base board unit 1a and be delivered to this electric capacity module 2a with the aqueous vapor of avoiding the external world, and have influence on the quality of this electric capacity module 2a.
Moreover encapsulation unit 3a is arranged at the upper and covering electric capacity module 2a of substrate body 10a.In addition, encapsulation unit 3a has the fixedly colloid 31a that a housing 30a and is positioned at this housing 30a, and the electric capacity module 2a colloid 31a that is fixed coats.According to different design requirements, housing 30a can be metal or plastic cement, and fixedly colloid 31a can be silicones (silicone) or epoxy resin (epoxy)
As shown in Figure 2, the first electric capacity module of the present invention comprises: a plurality of capacitor cell 1n, and be coated with conductive layer Sn between per two capacitor cell 1n, for example: elargol or silver paste.
Wherein, each capacitor cell 1n sequentially is laminated by a carbon paste 10n (negative pole), a conducting polymer 11n, a valve metal paillon foil 12n (positive pole), a conducting polymer 11n and a carbon paste 10n (negative pole), all there is oxide skin(coating) (not indicating among the figure) on the surface of each valve metal paillon foil 12n, to produce insulation effect as dielectric layer, wherein above-mentioned two conducting polymer 11n form on the oxide skin(coating) on surface of this valve metal paillon foil 12n.In addition, this electric capacity module further comprises: a plurality of conductive layer 5n, it is electrically connected at respectively between the described carbon paste 10n of each capacitor cell 1n.
Examine again, the positive terminal of the described valve metal paillon foil 12n of described capacitor cell 1n sees through a plurality of pad Pn and is electrically connected, the described carbon paste 10n of described capacitor cell 1n sees through described conductive layer 5n and is electrically connected, and described valve metal paillon foil 12n and described carbon paste 10n are insulated from each other.In addition, this electric capacity module further comprises: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil 12n and surround into the insulating barrier 4n (that is each insulating barrier 4n is formed in upper and lower surface and the two opposition side limits of the part outer surface of each corresponding valve metal paillon foil 12n in the mode that centers on) of a circle, limiting the length of described carbon paste 10n and described conducting polymer 11n, and as the positive pole of each capacitor cell 1n and the insulated wire of negative pole.
As shown in Figure 3, the second chip capacitor module of the present invention comprises: a plurality of capacitor cell 1p.Wherein, each capacitor cell 1p sequentially is laminated by a carbon paste 10p (negative pole), a conducting polymer 11p, a valve metal paillon foil 12p (positive pole), a conducting polymer 11p and a carbon paste 10p (negative pole), all there is oxide skin(coating) (not indicating among the figure) on the surface of each valve metal paillon foil 12e, to produce insulation effect as dielectric layer, wherein above-mentioned two conducting polymer 11p form on the oxide skin(coating) on surface of this valve metal paillon foil 12p, and see through carbon paste 10p between per two capacitor cell 1p and electrically stacked together.In addition, this electric capacity module further comprises: a plurality of conductive layer 5p are electrically connected at respectively between the described carbon paste 10p of each capacitor cell 1p.
Moreover, the positive terminal of the described valve metal paillon foil 12p of capacitor cell 1p sees through a plurality of pad Pp and is electrically connected, the described carbon paste 10p of described capacitor cell 1p sees through described conductive layer 5p and is electrically connected, and described valve metal paillon foil 12p and described carbon paste 10p are insulated from each other.In addition, this electric capacity module further comprises: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil 12p and surround into the insulating barrier 4p (that is each insulating barrier 4p is formed in upper and lower surface and the two opposition side limits of the part outer surface of each corresponding valve metal paillon foil 12p in the mode that centers on) of a circle, limiting the length of described carbon paste 10p and described conducting polymer 11p, and as the positive pole of each capacitor cell 1p and the insulated wire of negative pole.
In addition, above-mentioned two kinds of cascade type electric capacity can adopt following different enforcement aspect:
As shown in Figure 4 (positive pole is drawn with a negative pole and is drawn), the positive paper tinsel 12 of each capacitor cell 1 has an anodal pin 120 of outwards drawing, and described anodal pin 120 respectively electrically stacked together and become one group of anodal pin units 120 ', wherein said anodal pin 120 is outwards drawn from the same direction of described positive paper tinsel 12 respectively.In addition, described negative paper tinsel (not shown) sees through described conductive layer and directly electrically (as shown in Figure 2 to Figure 3) stacked together.
Shown in Fig. 5-6 (how anodal same side is drawn with a negative pole and drawn), the positive paper tinsel 12 of each capacitor cell 1 has an anodal pin 120 of outwards drawing, and anodal pin 120 be distinguished into multicomponent not electrically anodal pin units 120 stacked together ' (Fig. 5 disclose two groups of anodal pin units 120 '; Fig. 6 appear three groups of anodal pin units 120 '), wherein said anodal pin 120 is outwards drawn from the same direction of described positive paper tinsel 12 respectively.Fig. 5 shows can be stacked 8 layers, but can keep the height of 4 layers of welding, and Fig. 6 demonstration can be stacked 12 layers in addition, but can keep the height of 4 layers of welding.In addition, described negative paper tinsel (not shown) sees through described conductive layer and electrically (as shown in Figure 2 to Figure 3) stacked together.
In sum, the advantage of capacitor packaging structure of the present invention is: the present invention sees through the mode of surface mount technology (SMT), can directly the electric capacity module be arranged on this base board unit.In other words, the present invention sees through the use of base board unit, and does not need to arrange in addition lead frame.Therefore capacitor packaging structure of the present invention is simpler than existing structure, and the manufacture method of capacitor packaging structure of the present invention is easier and quick than existing manufacture method.
It should be noted that at last: the above only is the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment the present invention is had been described in detail, for a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. capacitor packaging structure, it is characterized in that, comprise: a base board unit, described base board unit has an insulating body, at least two form in the body upper surface first on conductive layer on the conductive layer and second, at least two the first lower conductiving layer and the second lower conductiving layers that form in the body upper surface, at least two perforation and at least two intermediate conductive layers that are formed separately in described at least two perforation that penetrate described insulating body, and wherein an intermediate conductive layer is electrically connected on described first between the conductive layer and described the first lower conductiving layer, and an other intermediate conductive layer is electrically connected on described second between the conductive layer and affiliated the second lower conductiving layer;
One electric capacity module has a plurality of capacitor cells that are arranged on the described substrate body, and the positive pole of each capacitor cell and negative pole be electrical contact conductive layer on conductive layer on described first and described second respectively; And an encapsulation unit, it is arranged on the described substrate body and covers described electric capacity module.
2. according to the described capacitor packaging structure of claim l, it is characterized in that, wherein the positive paper tinsel of each capacitor cell has an anodal pin of outwards drawing, and described anodal pin is distinguished into the anodal pin units of many groups, it is stacked together electrically that each organizes the described anodal pin of anodal pin units, and described anodal pin is outwards drawn from the equidirectional of described positive paper tinsel respectively in addition.
3. according to the described capacitor packaging structure of claim l, it is characterized in that, wherein the positive paper tinsel of each capacitor cell has an anodal pin of outwards drawing, and described anodal pin is formed one group of anodal pin units, so that described anodal pin is stacked together electrically, described anodal pin is outwards drawn from the equidirectional of described positive paper tinsel respectively in addition.
4. according to the described a kind of capacitor packaging structure of claim l, it is characterized in that, described each capacitor cell sequentially is laminated by a carbon paste, a conducting polymer, a valve metal paillon foil, a conducting polymer and a carbon paste, and described electric capacity module further comprises a plurality of conductive layers, and it is electrically connected at respectively between the described carbon paste of each capacitor cell.
5. a kind of capacitor packaging structure according to claim 4, it is characterized in that, the positive terminal of the described valve metal paillon foil of described capacitor cell sees through a plurality of pads and is electrically connected, the described carbon paste of described capacitor cell sees through described conductive layer and is electrically connected, and described valve metal paillon foil and described carbon paste are insulated from each other; Described electric capacity module further comprises in addition: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil and surround into the insulating barrier of a circle, limiting the length of described carbon paste and described conducting polymer, and as the positive pole of each capacitor cell and the insulated wire of negative pole.
6. according to the described a kind of capacitor packaging structure of claim l, it is characterized in that, described each capacitor cell sequentially is laminated by a carbon paste, a conducting polymer, a valve metal paillon foil, a conducting polymer and a carbon paste, and see through carbon paste between per two capacitor cells and electrically stacked together, described electric capacity module further comprises in addition: a plurality of conductive layers, it is electrically connected at respectively between the described carbon paste of each capacitor cell.
7. to be subordinate to 6 described a kind of capacitor packaging structures according to right, it is characterized in that, the positive terminal of the described valve metal paillon foil of described capacitor cell sees through a plurality of pads and is electrically connected, the described carbon paste of described capacitor cell sees through described conductive layer and is electrically connected, and described valve metal paillon foil and described carbon paste are insulated from each other, described electric capacity module further comprises in addition: on a plurality of part outer surfaces that are arranged at respectively described valve metal paillon foil and surround into the insulating barrier of a circle, limiting the length of described carbon paste and described conducting polymer, and as the positive pole of each capacitor cell and the insulated wire of negative pole.
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| CN 200910259653 CN102103928B (en) | 2009-12-21 | 2009-12-21 | Capacitor packaging structure |
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| CN 200910259653 CN102103928B (en) | 2009-12-21 | 2009-12-21 | Capacitor packaging structure |
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| CN102103933B (en) * | 2009-12-21 | 2013-05-29 | 钰邦电子（无锡）有限公司 | Capacitor packaging structure using surface mounting technology |
| CN102103932B (en) * | 2009-12-21 | 2013-04-17 | 钰邦电子（无锡）有限公司 | Capacitor encapsulation structure using surface mount technology |
| CN107221440A (en) * | 2017-06-15 | 2017-09-29 | 苏州圣咏电子科技有限公司 | A kind of solid capacitor |
| CN110895994B (en) * | 2018-09-12 | 2021-07-27 | 钰冠科技股份有限公司 | Stacked capacitor assembly structure |
| CN110718697A (en) * | 2019-09-24 | 2020-01-21 | 厦门翔澧工业设计有限公司 | Chemical battery/capacitor for inhibiting self-discharge |
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| CN102103933A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor packaging structure using surface mounting technology |
| CN102103932A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor encapsulation structure using surface mount technology |
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| CN102103933A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor packaging structure using surface mounting technology |
| CN102103932A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor encapsulation structure using surface mount technology |
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