CN107221440A - A kind of solid capacitor - Google Patents
A kind of solid capacitor Download PDFInfo
- Publication number
- CN107221440A CN107221440A CN201710442103.7A CN201710442103A CN107221440A CN 107221440 A CN107221440 A CN 107221440A CN 201710442103 A CN201710442103 A CN 201710442103A CN 107221440 A CN107221440 A CN 107221440A
- Authority
- CN
- China
- Prior art keywords
- layer
- lead frame
- solid capacitor
- electric capacity
- conductive polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 24
- 239000007787 solid Substances 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 84
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000000903 blocking effect Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011241 protective layer Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 125000005375 organosiloxane group Chemical group 0.000 claims 1
- 238000007743 anodising Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000002322 conducting polymer Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Include anode end portions and cathode end the invention discloses lead frame；Capacitance body is arranged on lead frame, and capacitance body includes anode tap and cathode terminal, and anode tap is electrically connected to the anode end portions of lead frame, and cathode terminal is electrically connected to the cathode end of lead frame；Capacitance body includes electric capacity substrate, dielectric layer, conductive polymer layer, conductive adhesion layer, water blocking layer；Dielectric layer coats electric capacity substrate completely；Conductive polymer layer is arranged on above electric capacity substrate；Conductive adhesion layer is arranged on above conductive polymer layer, and water blocking layer is arranged between conductive polymer layer and conductive adhesion layer and above conductive adhesion layer；Encapsulated layer coated wire frame, capacitance body and protective layer, lead frame two ends are exposed outside encapsulated layer.By the above-mentioned means, the present invention can strengthen and stablize the intermembranous chemical bonded refractory power of conducting polymer, it is to avoid anodizing, the anti-aqueous vapor effect of solid capacitor is improved, the stability and durability of part characteristic is improved, increases service life.
Description
Technical field
The present invention relates to capacitance technology field, more particularly to a kind of solid capacitor.
Background technology
Solid capacitor is to employ different dielectric materials, liquid aluminium capacitive dielectric material from conventional capacitive maximum differential
For electrolyte, and the dielectric material of solid capacitor is then conductive polymer material.Traditional aluminium electrolutic capacitor, the electricity used
Solution liquid is liquid, therefore there are that temperature characterisitic is poor, and leakage current and the big situation of dielectric loss, when being flowed between anode and negative electrode
The electric current crossed, or temperature between the two poles of the earth, when exceeding specification, its security feature will be destroyed, make the reduction of its capacity, impedance
Increase and cause the damage of electrolytic capacitor, there is the possibility for involving electronic circuit.
Solid capacitor is possessed using method of the electroconductive polymer as solid electrolyte for being easier to be formed solid electrolyte
A plurality of anodes with anode portion are stopped, and in the anode body surface have sequentially form dielectric substance oxide scale film and cathode layer
Negative pole part capacitor assembly.But existing solid capacitor density is not good, it is impossible to which the aqueous vapor in environment is blocked outside completely,
Anodizing and polymeric membrane destruction are easily caused, so as to cause component failure.
The content of the invention
The present invention solves the technical problem of a kind of solid capacitor is provided, anodizing can be avoided, first device is improved
The stability and durability of part characteristic.
To reach above-mentioned purpose, the technical solution adopted for the present invention to solve the technical problems is：
A kind of solid capacitor, including：Lead frame, capacitance body and encapsulated layer；
The lead frame includes anode end portions and cathode end；The capacitance body is arranged on the lead frame, the electricity
Volume includes anode tap and cathode terminal, and the anode tap is electrically connected to the anode end portions of the lead frame, the cathode terminal electricity
Property is connected to the cathode end of the lead frame；
The capacitance body includes electric capacity substrate, dielectric layer, conductive polymer layer, conductive adhesion layer, water blocking layer；The dielectric
Layer coats the electric capacity substrate completely；The conductive polymer layer is arranged on above the electric capacity substrate；The conductive bond
Layer is arranged on above conductive polymer layer, the water blocking layer be arranged between conductive polymer layer and conductive adhesion layer with
And above conductive adhesion layer；
The encapsulated layer coats the lead frame, capacitance body and protective layer, and the lead frame two ends are exposed in the encapsulation
Layer is outer.
It is preferred that, the material of the water blocking layer is organosilicone compounds and the mixture of organic solvent.
It is preferred that, the accounting of organosilicone compounds is 10~50% in the mixture.
It is preferred that, the material of the conductive adhesion layer is one kind in carbon paste and elargol or its combination.
It is preferred that, the material of the encapsulated layer is epoxy resin, silicones, silicon rubber, polyimides, polytetrafluoroethylene (PTFE),
One or more in polyurethane, liquid crystal plastic cement.
It is preferred that, the electric capacity substrate is aluminium foil structure.
It is preferred that, the material of the dielectric layer is aluminum oxide.
Due to the utilization of above-mentioned technical proposal, the present invention has following beneficial effect compared with prior art：
There is provided a kind of solid capacitor, water blocking layer is introduced, strengthens the anti-aqueous vapor ability of encapsulated layer, the anti-of solid capacitor is improved
Aqueous vapor effect；Water blocking layer directly covers conductive polymer layer, strengthens and stablize the intermembranous chemical bonded refractory power of conducting polymer, it is to avoid
Anodizing, improves the stability and durability of part characteristic, increases service life.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the preferred embodiment of solid capacitor one of the invention.
Fig. 2 is that capacitance changes with time rate when not increasing water blocking layer.
Fig. 3 is the equivalent series resistance amount of changing with time when not increasing water blocking layer.
Fig. 4 is that capacitance changes with time rate after present invention increase water blocking layer.
Fig. 5 is the equivalent series resistance amount of changing with time after present invention increase water blocking layer.
Embodiment
Presently preferred embodiments of the present invention is described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
Refering to Fig. 1, a kind of solid capacitor, including：Lead frame, capacitance body and encapsulated layer；
Lead frame includes anode end portions 11 and cathode end 12；Capacitance body is arranged on lead frame, and capacitance body includes anode
End and cathode terminal, anode tap are electrically connected to the anode end portions of lead frame, and cathode terminal is electrically connected to the cathode end of lead frame；
Capacitance body includes electric capacity substrate 21, dielectric layer 22, conductive polymer layer 23, conductive adhesion layer 24, water blocking layer；Electric capacity substrate is aluminium
Foil construction, the material of dielectric layer is aluminum oxide.Dielectric layer coats electric capacity substrate completely；Conductive polymer layer is arranged on electric capacity substrate
Above；Conductive adhesion layer is arranged on above conductive polymer layer, and water blocking layer is arranged on conductive polymer layer and conductive bond
Between layer and above conductive adhesion layer；Encapsulated layer coated wire frame, capacitance body and protective layer, lead frame two ends are exposed to be exposed at
Outside encapsulated layer.
The material of water blocking layer is organic siloxane in the mixture of organosilicone compounds and organic solvent, mixture
The accounting of compound is 10~50%.Wherein, organosilicone compounds can be dimethyl silicone polymer, triethoxysilane,
Tetraethyl siloxanes, tetraalkoxysilane or trialkoxy silane etc..Organic solvent can be alcohols, toluene or tetrahydrofuran
Deng.
The material of conductive adhesion layer is one kind in carbon paste and elargol or its combination.The side such as impregnation, wire mark, bat printing can be passed through
Formula, conductive adhesion layer is covered on conductive polymer layer, to be drawn as cathode capacities.
The material of encapsulated layer is epoxy resin, silicones, silicon rubber, polyimides, polytetrafluoroethylene (PTFE), polyurethane
One or more in fat, liquid crystal plastic cement.
Component is positioned under hot and humid environment, can be measured at any time by LCR meter (also known as digital electric bridge)
Between the rate of change of capacitance (△ Cp) and equivalent series resistance variable quantity (ESR) that change.In the present embodiment, element is placed on temperature
Degree is 60 DEG C, humidity is that in the environment of 90%, assessing component with rate of change of capacitance and equivalent series resistance variable quantity can
By degree, the analysis of capacitance and amount of resistance is carried out within 250 hours with every layout.By taking 500 hours this moment as an example, do not increasing resistance
During water layer, capacitance has failed more than 20%, and waits school series resistance to rise violently 5 times of original value；After increase water blocking layer, hold
Amount decline is less than 10%, waits the change of school series resistance to be less than 1.5 times.Therefore, can by Fig. 4, Fig. 5 and Fig. 2, Fig. 3 comparison
To draw, after increase water blocking layer, it can effectively suppress the school series electrical resistives such as the capacitance decline caused by aqueous vapor invasion, and reduction
Change amount.
Embodiments of the invention are these are only, are not intended to limit the scope of the invention, it is every to be said using the present invention
Equivalent structure or equivalent flow conversion that bright book and accompanying drawing content are made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (7)
1. a kind of solid capacitor, it is characterised in that including：Lead frame, capacitance body and encapsulated layer；
The lead frame includes anode end portions and cathode end；The capacitance body is arranged on the lead frame, the capacitance body
Including anode tap and cathode terminal, the anode tap is electrically connected to the anode end portions of the lead frame, and the cathode terminal electrically connects
It is connected to the cathode end of the lead frame；
The capacitance body includes electric capacity substrate, dielectric layer, conductive polymer layer, conductive adhesion layer, water blocking layer；The dielectric layer is complete
The electric capacity substrate is coated entirely；The conductive polymer layer is arranged on above the electric capacity substrate；The conductive adhesion layer is set
Put above conductive polymer layer, the water blocking layer is arranged between conductive polymer layer and conductive adhesion layer and led
Above electric tack coat；
The encapsulated layer coats the lead frame, capacitance body and protective layer, and the lead frame two ends are exposed to be exposed at the encapsulated layer
Outside.
2. a kind of solid capacitor according to claim 1, it is characterised in that：The material of the water blocking layer is organosiloxane
The mixture of compound and organic solvent.
3. a kind of solid capacitor according to claim 2, it is characterised in that：Organosilicone compounds in the mixture
Accounting be 10~50%.
4. a kind of solid capacitor according to claim 1, it is characterised in that：The material of the conductive adhesion layer be carbon paste and
One kind or its combination in elargol.
5. a kind of solid capacitor according to claim 1, it is characterised in that：The material of the encapsulated layer be epoxy resin,
One or more in silicones, silicon rubber, polyimides, polytetrafluoroethylene (PTFE), polyurethane, liquid crystal plastic cement.
6. a kind of solid capacitor according to claim 1, it is characterised in that：The electric capacity substrate is aluminium foil structure.
7. a kind of solid capacitor according to claim 1, it is characterised in that：The material of the dielectric layer is aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442103.7A CN107221440A (en) | 2017-06-15 | 2017-06-15 | A kind of solid capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442103.7A CN107221440A (en) | 2017-06-15 | 2017-06-15 | A kind of solid capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107221440A true CN107221440A (en) | 2017-09-29 |
Family
ID=59947592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710442103.7A Pending CN107221440A (en) | 2017-06-15 | 2017-06-15 | A kind of solid capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107221440A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036434A (en) * | 1988-12-15 | 1991-07-30 | Nec Corporation | Chip-type solid electrolytic capacitor and method of manufacturing the same |
| JPH08153650A (en) * | 1994-11-29 | 1996-06-11 | Nec Toyama Ltd | Manufacture of solid-state electrolytic capacitor |
| WO2006118144A1 (en) * | 2005-04-27 | 2006-11-09 | Showa Denko K.K. | Solid state electrolytic capacitor and method for producing the same |
| JP2008004583A (en) * | 2006-06-20 | 2008-01-10 | Nec Tokin Corp | Solid electrolytic capacitor |
| CN101329953A (en) * | 2008-07-14 | 2008-12-24 | 钰邦电子（无锡）有限公司 | Method of preparing multilayer solid electrolytic capacitor |
| JP2010141180A (en) * | 2008-12-12 | 2010-06-24 | Nichicon Corp | Solid-state electrolytic capacitor, and method of manufacturing the same |
| CN102103928A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor packaging structure |
| JP2011243898A (en) * | 2010-05-21 | 2011-12-01 | Nec Tokin Corp | Solid electrolytic capacitor |
| CN103456502A (en) * | 2012-11-05 | 2013-12-18 | 钰邦电子（无锡）有限公司 | Improved manufacturing method of solid electrolytic capacitor |
-
2017
- 2017-06-15 CN CN201710442103.7A patent/CN107221440A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036434A (en) * | 1988-12-15 | 1991-07-30 | Nec Corporation | Chip-type solid electrolytic capacitor and method of manufacturing the same |
| JPH08153650A (en) * | 1994-11-29 | 1996-06-11 | Nec Toyama Ltd | Manufacture of solid-state electrolytic capacitor |
| WO2006118144A1 (en) * | 2005-04-27 | 2006-11-09 | Showa Denko K.K. | Solid state electrolytic capacitor and method for producing the same |
| JP2008004583A (en) * | 2006-06-20 | 2008-01-10 | Nec Tokin Corp | Solid electrolytic capacitor |
| CN101329953A (en) * | 2008-07-14 | 2008-12-24 | 钰邦电子（无锡）有限公司 | Method of preparing multilayer solid electrolytic capacitor |
| JP2010141180A (en) * | 2008-12-12 | 2010-06-24 | Nichicon Corp | Solid-state electrolytic capacitor, and method of manufacturing the same |
| CN102103928A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor packaging structure |
| JP2011243898A (en) * | 2010-05-21 | 2011-12-01 | Nec Tokin Corp | Solid electrolytic capacitor |
| CN103456502A (en) * | 2012-11-05 | 2013-12-18 | 钰邦电子（无锡）有限公司 | Improved manufacturing method of solid electrolytic capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104919555B (en) | Electrolytic capacitor and its manufacture method | |
| US8116069B2 (en) | Electrolytic capacitor | |
| CN101740236B (en) | Method of manufacturing solid electrolytic capacitor | |
| CN1773640B (en) | Solid electrolytic capacitor and producing method thereof | |
| CN103680987B (en) | Solid electrolytic capacitor And Manufacturing approach | |
| CN104428856B (en) | Solid electrolytic capacitor | |
| KR20070077437A (en) | Laminated solid electrolytic condenser | |
| TW201117244A (en) | Solid electrolytic capacitor and method of manufacturing thereof | |
| US20110019341A1 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| CN106663542A (en) | Capacitor with charge time reducing additives and work function modifiers | |
| CN104752061B (en) | Composite electrode and electrolytic capacitor | |
| CN101714464A (en) | Solid electrolytic capacitor and fabrication method thereof | |
| CN104078243B (en) | A kind of solid electrolytic capacitor based on Graphene composite polyphenylene amine | |
| CN109686568A (en) | Capacitor and preparation method thereof | |
| CN102576606A (en) | Solid electrolytic capacitors with improved esr stability | |
| CN107293407A (en) | A kind of capacitor arrangement and production method | |
| US10658122B2 (en) | Capacitor package structure with functional coating and method for manufacturing the same | |
| US8873221B2 (en) | Solid electrolytic capacitor | |
| CN106409515A (en) | Preparation method for polymer chip laminated solid aluminum electrolytic capacitor | |
| CN100399481C (en) | Solid electrolytic capacitor and method of mfg. capacitor | |
| CN102103928B (en) | Capacitor packaging structure | |
| CN107221440A (en) | A kind of solid capacitor | |
| CN107785170B (en) | Solid electrolytic capacitor element and its manufacturing method, Solid electrolytic capacitor And Manufacturing approach | |
| CN110444396B (en) | Wound capacitor assembly for improving structural strength and method for manufacturing same | |
| JP4707538B2 (en) | Electrolytic solution for driving electrolytic capacitor and electrolytic capacitor using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170929 |