CN111020521A - Preparation method of metal-plated film for battery - Google Patents
Preparation method of metal-plated film for battery Download PDFInfo
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- CN111020521A CN111020521A CN201911170562.XA CN201911170562A CN111020521A CN 111020521 A CN111020521 A CN 111020521A CN 201911170562 A CN201911170562 A CN 201911170562A CN 111020521 A CN111020521 A CN 111020521A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Secondary Cells (AREA)
Abstract
The invention relates to a preparation method of a metal-plated film for a battery, which comprises the following steps: (1) taking a base film, carrying out surface treatment on the surface of the base film, and then carrying out vapor deposition on the surface of the base film by passing through a vacuum vapor deposition chamber filled with metal vapor; (2) then, after the base film with the metal layer evaporated is processed, the base film continues to pass through a vacuum evaporation chamber to carry out evaporation of the next metal layer; (3) and (3) circularly evaporating a plurality of metal layers on the base film according to the step (2) to ensure that the thicknesses of all the metal layers meet the set requirement, thus finishing the process. Compared with the prior art, the invention realizes high-performance coating of thicker metal on the base film by adopting a mode of evaporating the metal layer for multiple times, and has the advantages of good overall performance of the film, long service life and the like.
Description
Technical Field
The invention belongs to the technical field of metal-plated battery membrane materials, and relates to a preparation method of a metal-plated membrane for a battery.
Background
Currently, the anode fluid of the lithium ion battery usually adopts an aluminum foil as a carrier, but the structure using the aluminum foil as the carrier is deficient in energy density and safety. Therefore, in order to solve the above problems, a new alternative is to replace the aluminum foil with a plated metal film for a battery, in which the plated metal film for a battery is plated with aluminum on both sides of a polymer film, so that the weight and volume can be reduced to increase the energy density. Meanwhile, in the aspect of safety, the polymer plastic film is used as an intermediate, and when a high-temperature short circuit occurs, the metal film can be fused to form a broken circuit, so that the use safety of the battery is greatly improved.
Therefore, the performance of the aluminum-plated thin film for a battery directly affects the interface structure, internal resistance, and the like of the battery, and further directly affects the characteristics of the battery, such as capacity, cycle, and safety performance. The metal film with excellent performance plays an important role in improving the comprehensive performance of the battery.
There are many factors that affect the excellent performance of the film, and among them, the magnitude of the bonding strength between the metal layer and the base film is a very important factor. In addition, in order to meet the performance requirements of the film, it is generally required to be about 800nm by depositing an aluminum plating layer or the like with a certain thickness on the surface of the polyolefin base film, for example. If the aluminum plating layer with the thickness of the specification is finished by one-time evaporation, the base film is required to stay in a high-temperature vacuum evaporation chamber for a long time during the evaporation, so that the base film is easy to wrinkle and deform due to high temperature, and the quality of the film is seriously influenced. The present invention has been made in view of the above problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for preparing a metal-plated film for a battery.
The purpose of the invention can be realized by the following technical scheme:
a method for preparing a metal-plated film for a battery comprises the following steps:
(1) taking a base film, carrying out surface treatment on the surface of the base film, and then carrying out vapor deposition on the surface of the base film by passing through a vacuum vapor deposition chamber filled with metal vapor;
(2) then, after the base film with the metal layer evaporated is processed, the base film continues to pass through a vacuum evaporation chamber to carry out evaporation of the next metal layer;
(3) and (3) circularly evaporating a plurality of metal layers on the base film according to the step (2) to ensure that the thicknesses of all the metal layers meet the set requirement, thus finishing the process.
Further, in the step (1), the surface treatment of the base film is performed by corona treatment, electric spark treatment, plasma treatment, Ni plating, Al plating2O3One or more of treatment, chemical treatment coating or NaOH soaking treatment.
Further, in the step (1), the method for filling metal vapor into the vacuum evaporation chamber comprises: the vacuum evaporation chamber is internally provided with an evaporation mechanism capable of placing metal materials, and after the vacuum degree in the vacuum evaporation chamber meets the set requirement, the metal materials in the evaporation mechanism are heated, so that the metal materials are melted and evaporated to form metal steam and are filled in the vacuum evaporation chamber.
Further, the residence time of the base film passing through the vacuum evaporation chamber each time is 0.04-0.1s, so that the thickness of the metal layer evaporated each time is 40-80 nm.
Furthermore, when the base film enters the vacuum evaporation chamber and the metal layer is evaporated, oxygen flow is sprayed to the lower surface of the base film. By means of oxygen flow spraying, enough oxygen molecules are attached to the surface of the base film before the base film enters the vacuum evaporation chamber, so that in the evaporation process of high-temperature metal steam, the oxygen molecules permeating into the surfaces of the two adjacent metal layers react with metal atoms such as aluminum on the surfaces of the metal layers to generate materials such as aluminum oxide and the like, and the bonding strength between the metal layers is greatly enhanced. The spraying amount of the oxygen flow is preferably 1-2L/min, the spraying amount of the oxygen flow is too large, the vacuum degree and the like in a vacuum evaporation chamber are easily influenced, the evaporation of metal steam on the film is influenced, and if the spraying amount is too small, enough oxygen molecules cannot be attached to the surface of the film, so that the connection intermediate structure of aluminum oxide and the like generated among metal layers is insufficient, and the strength of the metal layers cannot meet the requirements.
Further, the surface of the base film is firstly subjected to plasma treatment before the base film is introduced into a vacuum evaporation chamber and a metal layer is evaporated. Specifically, the base film is subjected to plasma treatment by using mixed gas of oxygen and argon, so that polar groups with oxygen are attached to the surface to be evaporated of the base film, and the polar groups with oxygen respectively permeate between two metal layers and react with metal atoms on the surface to generate intermediate materials such as aluminum oxide and the like under the action of metal steam such as high-temperature aluminum and the like during subsequent evaporation of metal steam such as aluminum and the like, and the bonding strength between the two metal layers is further improved.
Further, in the step (2), the temperature of the base film is kept between 40 and 80 ℃ before the base film is processed and is introduced into the vacuum evaporation chamber. When the temperature is too low, the surface molecular activity of the evaporated metal layer is insufficient, which affects the connection between the metal layers, and when the temperature is too high, the base film is easily deformed.
Furthermore, when the metal layer is evaporated, the vacuum degree in the vacuum evaporation chamber is less than or equal to 9 multiplied by 10-2Pa。
Furthermore, in the whole preparation process, the ambient temperature is not higher than 30 ℃, and the relative humidity is not higher than 50%.
Further, the metal steam is aluminum steam, and the metal material for correspondingly providing the steam is aluminum material.
Further, the used base film is a PET film, a PI film or a PP film.
Furthermore, a cooling roller for introducing circulating cooling liquid is arranged above the vacuum evaporation chamber, the base film passes through the vacuum evaporation chamber in a manner of being attached to the surface of the cooling roller, and the temperature of the circulating cooling liquid introduced into the cooling roller is less than or equal to-15 ℃.
Compared with the prior art, the invention has the following advantages:
(1) the metal layer of once plating is accomplished through layering plating many times originally, like this, the time that the control base film that can be fine passes through the vacuum evaporation chamber effectively avoids the base film to lead to the cooling to follow up with the film that produces and crimple and warp scheduling problem because of exposing under high temperature environment for a long time.
(2) In the method, when the metal layers are plated for multiple times, oxygen molecules are attached to the surfaces of the metal layers plated firstly in an oxygen jet mode or oxygen and argon mixed gas is adopted for plasma treatment to form oxygen-carrying polar groups, so that when the next metal layer is evaporated again, the oxygen molecules or the oxygen-carrying polar groups can permeate into the surfaces of the two adjacent metal layers and react to generate intermediate connecting materials such as aluminum oxide and the like, and the bonding strength between the metal layers is improved.
(3) By optimizing the conditions such as oxygen flow, temperature before evaporation of the base film, environmental humidity and the like, the combination effect among all the metal layers is improved, and the evaporation quality of the metal layers is ensured.
Detailed Description
The present invention will be described in detail with reference to specific examples. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
In the following examples, the procedure for testing the bond strength is as follows: 1) firstly, laying an EAA film on the prepared aluminized film product; 2) hot pressing at 120 deg.C for 0.5s with a heat-sealing instrument to bond the EAA film and the aluminum-plated film; 3) and cutting the aluminum plated film into strips, pulling one side of the EAA film on a tensile testing machine, testing the tensile value for pulling the EAA film and the aluminum plated film product apart, sampling three strips each time, and averaging the obtained tensile values to obtain the bonding strength of the aluminum plated layer on the aluminum plated film product to be characterized.
The remainder, unless specifically stated, of the materials, functional elements, or processing techniques are those conventionally available in the art, or are conventional processing techniques, or are conventional functional structures in the art for performing the corresponding functions.
Example 1:
a method for preparing a metal-plated film for a battery comprises the following steps:
(1) taking a base film, carrying out surface treatment on the surface of the base film, and then carrying out vapor deposition on the surface of the base film by passing through a vacuum vapor deposition chamber filled with metal vapor;
(2) then, after the base film with the metal layer evaporated is processed, the base film continues to pass through a vacuum evaporation chamber to carry out evaporation of the next metal layer;
(3) and (3) circularly evaporating a plurality of metal layers on the base film according to the step (2) to ensure that the thicknesses of all the metal layers meet the set requirement, thus finishing the process.
In the step (1), the surface treatment of the base film is performed by corona treatment, electric spark treatment, plasma treatment, Ni plating treatment and Al plating2O3One or more of treatment, chemical treatment coating or NaOH soaking treatment (corona treatment is used in this embodiment).
In the step (1), the method for filling metal vapor in the vacuum evaporation chamber comprises the following steps: an evaporation mechanism (an evaporation boat and the like) capable of placing metal materials is installed in the vacuum evaporation chamber, and when the vacuum degree in the vacuum evaporation chamber meets a set requirement, the metal materials in the evaporation mechanism are heated, so that the metal materials are melted and evaporated to form metal steam and are filled in the vacuum evaporation chamber.
In the vapor deposition process, the residence time of the base film in each passage through the vacuum vapor deposition chamber is 0.04 to 0.1s (preferably about 0.05s in this embodiment), so that the thickness of the metal layer in each vapor deposition is about 50nm, and 16 metal layers are co-deposited.
In this example, when the base film was introduced into the vacuum deposition chamber and the metal layer was deposited, an oxygen gas flow was also jetted to the lower surface of the base film. The oxygen flow is preferably sprayed in an amount of 1 to 2L/min.
In step (2), the base film is kept at 40-80 deg.C (preferably about 55 deg.C in this embodiment) before being processed into the vacuum evaporation chamber.
In this embodiment, when the metal layer is evaporated, the vacuum degree in the vacuum evaporation chamber is less than or equal to 9 × 10-2Pa。
In the whole preparation process, the ambient temperature is not higher than 30 ℃ (the embodiment is preferably about 25 ℃), and the relative humidity is not higher than 60% (the embodiment is preferably 30%).
In this embodiment, the metal vapor is aluminum vapor, and the metal material for providing the vapor is aluminum material.
In the embodiment, a cooling roller for circulating cooling liquid is arranged above the vacuum evaporation chamber, the base film passes through the vacuum evaporation chamber in a manner of being attached to the surface of the cooling roller, and the temperature of the circulating cooling liquid communicated in the cooling roller is less than or equal to-15 ℃.
In this example, the base film is a PET, PP, or PI film.
Comparative example 1
Most of the results are the same as in example 1, except that in step (2), the temperature of the treated substrate film is reduced to room temperature before entering the vacuum deposition chamber.
Comparative example 2
Compared with the embodiment 1, most of the method is the same, except that in the embodiment, the temperature of the treated base film is controlled to be about 90 ℃ before the base film enters the vacuum evaporation chamber in the step (2).
Comparative example 3
Most of the results were the same as in example 1, except that in this example, the oxygen jet treatment was not performed before the base film was introduced into the vacuum deposition chamber.
Comparative example 4
Compared with the embodiment 1, the method is mostly the same, except that in the embodiment, the residence time of the base film passing through the vacuum evaporation chamber each time is controlled to be about 0.6s, so that the thickness of the metal layer evaporated each time is about 300nm, and the co-evaporation is carried out for 2-3 times.
Comparative example 5
Most of the same is true compared to example 1, except that in this example the relative humidity is controlled to 70%.
Example 2
Most of them are the same as in example 1, except that in this example, the relative humidity is controlled to 60%.
Example 3
Most of them were the same as in example 1 except that the plasma treatment was carried out by using a mixed gas of oxygen and argon (volume ratio of both 1:4) instead of injecting the oxygen flow onto the lower surface of the base film in this example.
The aluminum-plated films prepared in the above examples 1 to 3, comparative examples 1 to 5 were also subjected to a bonding strength test, and the performance results are shown in the following table 1.
TABLE 1 Properties of each aluminum-plated film
Note: downstream manufacturers require that the bonding strength of the metal layer of the aluminum-plated film product is more than or equal to 2N, and generally 2N is delivered as a qualified product, and more than 3N is delivered as an excellent product.
As can be seen from the data measured in table 1 above, the bonding strength between the metal layers is greatly enhanced by spraying oxygen flow or plasma treatment on the lower surface of the base film. Meanwhile, the optimization of technological condition parameters such as the temperature of the base film before entering the vacuum evaporation chamber, the relative humidity of the environment and the like also obviously improves the plating strength of the metal layer.
Meanwhile, the hardness and the like of the aluminum-plated thin film products of the embodiment 1 and the comparative example 1 are detected, and the hardness of the plated film product is obviously improved after an aluminum oxide connecting part is introduced between the metal layers, the apparent smoothness is improved, wrinkles, plated hollow lines and the like are not generated, and the yield of evaporation and subsequent coating is greatly improved.
Examples 4 to 9
Unlike example 1, in this example, the surface treatment of the base film in step (1) was carried out by electric discharge treatment, plasma treatment, Ni plating, and Al plating, respectively2O3Treatment, chemical treatment coating or NaOH soaking treatment.
Example 10
Unlike example 1, in this example, the base film was kept at 40 ℃ in step (2) before being processed into the vacuum deposition chamber.
Example 11
Unlike example 1, in this example, the base film was kept at 80 ℃ in step (2) before being processed into the vacuum deposition chamber.
Example 12
Unlike example 1, in this example, the residence time of the base film per pass through the vacuum evaporation chamber was about 0.04 s.
Example 13
Unlike example 1, in this example, the residence time of the base film per pass through the vacuum evaporation chamber was about 0.1 s.
In each of the above embodiments, the base film used may be replaced with a PET film or a PI film.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.
Claims (10)
1. A preparation method of a metal-plated film for a battery is characterized by comprising the following steps:
(1) taking a base film, carrying out surface treatment on the surface of the base film, and then carrying out vapor deposition on the surface of the base film by passing through a vacuum vapor deposition chamber filled with metal vapor;
(2) then, after the base film with the metal layer evaporated is processed, the base film continues to pass through a vacuum evaporation chamber to carry out evaporation of the next metal layer;
(3) and (3) circularly evaporating a plurality of metal layers on the base film according to the step (2) to ensure that the thicknesses of all the metal layers meet the set requirement, thus finishing the process.
2. The method of claim 1, wherein the surface treatment of the base film in step (1) is selected from corona treatment, spark treatment, plasma treatment, Ni plating, and Al plating2O3One or more of treatment, chemical treatment coating or NaOH soaking treatment.
3. The method for preparing a metal-plated film for a battery according to claim 1, wherein in the step (1), the method for filling the vacuum evaporation chamber with the metal vapor is as follows: the vacuum evaporation chamber is internally provided with an evaporation mechanism capable of placing metal materials, and after the vacuum degree in the vacuum evaporation chamber meets the set requirement, the metal materials in the evaporation mechanism are heated, so that the metal materials are melted and evaporated to form metal steam and are filled in the vacuum evaporation chamber.
4. The method of claim 1, wherein the residence time of the base film in each pass through the vacuum evaporation chamber is 0.04-0.1s, so that the thickness of the metal layer in each evaporation is 40-80 nm.
5. The method according to claim 1, wherein in the step (2), the temperature of the base film is maintained at 40-80 ℃ before the base film is processed into the vacuum evaporation chamber.
6. The method of claim 1, wherein an oxygen stream is further sprayed onto the lower surface of the base film while the base film is introduced into the vacuum deposition chamber and the metal layer is deposited;
or the surface of the base film is firstly treated by plasma before the base film is introduced into the vacuum evaporation chamber and the metal layer is evaporated.
7. The method of claim 1, wherein the degree of vacuum in the vacuum deposition chamber is less than or equal to 9 x 10 when the metal layer is deposited-2Pa。
8. The method of claim 1, wherein the temperature is not higher than 30 ℃ and the relative humidity is not higher than 60% throughout the process.
9. The method of claim 1, wherein the metal vapor is aluminum vapor and the metal material to which the vapor is applied is aluminum.
10. The method of claim 1, wherein a cooling roller is further disposed above the vacuum evaporation chamber, the base film passes through the vacuum evaporation chamber in such a manner as to adhere to the surface of the cooling roller, and the temperature of the cooling liquid circulating through the cooling roller is not more than-15 ℃.
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Cited By (5)
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|---|---|---|---|---|
| CN111883777A (en) * | 2020-07-28 | 2020-11-03 | 合肥国轩高科动力能源有限公司 | Composite current collector, preparation method thereof and lithium battery pole piece |
| CN112030101A (en) * | 2020-09-05 | 2020-12-04 | 昆山鑫美源电子科技有限公司 | Preparation method of aluminum-based conductive film with multilayer composite structure |
| CN112048700A (en) * | 2020-09-05 | 2020-12-08 | 昆山鑫美源电子科技有限公司 | Film coating process |
| CN112144018A (en) * | 2020-08-14 | 2020-12-29 | 浙江长宇新材料有限公司 | Preparation system and method of composite material with oxide intermediate layer |
| CN114351092A (en) * | 2021-12-01 | 2022-04-15 | 湖北润烨新能源有限公司 | Preparation method and system of metal composite aluminum film |
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| CN112144018A (en) * | 2020-08-14 | 2020-12-29 | 浙江长宇新材料有限公司 | Preparation system and method of composite material with oxide intermediate layer |
| CN112030101A (en) * | 2020-09-05 | 2020-12-04 | 昆山鑫美源电子科技有限公司 | Preparation method of aluminum-based conductive film with multilayer composite structure |
| CN112048700A (en) * | 2020-09-05 | 2020-12-08 | 昆山鑫美源电子科技有限公司 | Film coating process |
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