CN212404283U

CN212404283U - Copper plating film for battery

Info

Publication number: CN212404283U
Application number: CN201922058896.XU
Authority: CN
Inventors: 吴明忠; 曾祥平; 吴林海; 张孝中
Original assignee: Zhejiang Changyu New Materials Co ltd
Current assignee: Zhejiang Changyu New Material Co., Ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2021-01-26
Anticipated expiration: 2029-11-26

Abstract

The utility model relates to a copper-plated film for battery, including the base film, compound at the surface treatment layer on base film both sides surface, and the coating by vaporization is in proper order a plurality of layers of copper plating on the surface treatment layer, between the adjacent two-layer copper plating, the surface that is located inboard copper plating still is equipped with the nickel coating. Compared with the prior art, the utility model discloses a change conventional one shot forming copper plate into multilayer structure, can solve the copper facing product and corrugate the deformation scheduling problem.

Description

Copper plating film for battery

Technical Field

The utility model belongs to the technical field of the battery membrane material, a battery is with plating metal membrane is related to.

Background

Currently, copper foil is generally adopted as a carrier for a negative electrode fluid of a lithium ion battery, but the structure using the copper foil as the carrier is deficient in energy density and safety. Therefore, in order to solve the above problems, a new alternative is to replace the copper foil with a plated film for a battery, in which the plated film for a battery is plated with copper on both sides of a polymer film, thereby reducing the weight and volume and increasing the energy density. Meanwhile, in the aspect of safety, the polymer plastic film is used as an intermediate, and when a high-temperature short circuit occurs, the metal film can be fused to form a broken circuit, so that the use safety of the battery is greatly improved.

Therefore, the performance of the plated metal film for a battery directly affects the interface structure, internal resistance, etc. of the battery, and further directly affects the characteristics of the battery, such as capacity, cycle, and safety performance. The metal film with excellent performance plays an important role in improving the comprehensive performance of the battery.

In order to meet the performance requirements of the film, a copper plating layer with a certain thickness is required to be evaporated on the surface of a polyolefin base film, and the like, and the thickness is generally required to be about 800 nm. If the copper plating layer with the thickness of the specification is finished by one-time evaporation, the base film is required to stay in a high-temperature vacuum evaporation chamber for a long time during the evaporation, so that the base film is easy to wrinkle and deform due to high temperature, and the quality of the film is seriously influenced. The present invention has been made in view of the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a copper plating film for a battery, which aims to overcome the defects of the prior art.

The purpose of the utility model can be realized through the following technical scheme:

a copper plating film for a battery comprises a base film, surface treatment layers compounded on the surfaces of two sides of the base film, and a plurality of copper plating layers plated on the surface treatment layers in sequence.

Further, the base film is a PET film or a PP film.

Further, the thickness of the base film is 3-12 μm.

Further, the surface treatment layer is a metal plating layer.

Furthermore, the metal plating layer is a nickel layer, a chromium layer or a stainless steel layer.

Furthermore, the copper plating layer is an evaporation copper plating layer or a combination of the evaporation copper plating layer and an electroplating copper plating layer, and when the copper plating layer is the combination of the evaporation copper plating layer and the electroplating copper plating layer, the evaporation copper plating layer is positioned on one side close to the base film, and the electroplating copper plating layer is positioned on the outer side.

Furthermore, two adjacent copper plating layers are provided with a nickel plating layer on the surface of the copper plating layer positioned on the inner side.

Furthermore, the thickness of the nickel plating layer is 5-10 nm.

Compared with the prior art, the utility model has the advantages of it is following:

(1) the original single-layer copper plating layer is changed into the compounding of the multi-layer copper plating layer, so that the original one-time evaporation forming can be changed into repeated evaporation processing, the residence time in a vacuum evaporation chamber at each time is greatly reduced, and the base film can not be curled and shrunk due to high temperature.

(2) In the plating process many times, inevitable can have impurity such as precipitate between the copper plating layer, this can influence the combination between the double-phase adjacent copper plating layer, the utility model discloses a set up the nickel coating layer on the copper plating layer surface that is located the inboard for at the coating by vaporization in-process on follow-up copper plating layer, under the effect of high temperature metal steam, the nickel on nickel coating layer surface can partially dissolve into the copper plating layer surface, and then has improved the bonding strength between the adjacent metal level greatly.

Drawings

FIG. 1 is a schematic diagram of an exploded structure of a copper-plated film according to the present invention;

the notation in the figure is:

1-basal membrane, 2-surface treatment layer, 3-copper plating layer and 4-nickel plating layer.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.

In the following examples, the procedure for testing the bond strength is as follows: 1) firstly, spreading an EAA film on the prepared copper-plated film product; 2) hot-pressing at 120 deg.C for 0.5s with a heat-sealing instrument to bond the EAA film and the copper-plated film; 3) and cutting into strips, pulling one side of the EAA film on a tensile testing machine, testing the tensile force value for pulling the EAA film and the copper-plated film product, sampling three strips at each time, and averaging the obtained tensile force values to obtain the bonding strength of the copper-plated layer on the copper-plated film product to be characterized.

If the rest materials, functional components or processing techniques are not specifically described, the materials, the functional components or the processing techniques are conventional commercial materials in the field, or conventional processing techniques, or conventional functional structures in the field for realizing corresponding functions, such as nickel plating layers, and the like, can be plated by conventional methods such as magnetron sputtering and the like.

Example 1:

a copper plating film for a battery is structurally shown in figure 1 and comprises a base film 1, surface treatment layers 2 compounded on the surfaces of two sides of the base film 1, and a plurality of copper plating layers 3 sequentially evaporated on the surface treatment layers 2, wherein a nickel plating layer 4 is further arranged on the surface of the copper plating layer 3 positioned on the inner side between every two adjacent copper plating layers 3.

The base film 1 is a PET film, and the thickness of the base film 1 is 3 to 12 μm (about 8 μm is preferable in the present embodiment).

In this embodiment, the surface treatment layer 2 is an uneven rough layer, and the rough layer is a sand blasting layer.

In this embodiment, the thickness of the nickel plating layer 4 is about 5 to 10 nm.

In this embodiment, the thickness of each copper plating layer 3 is about 40nm, and the total thickness of the copper plating layer is about 800 nm.

Example 2

Compared to example 1, most of them are the same except that in this example: the copper plating layer 3 is a combination of an evaporated copper plating layer and an electroplated copper plating layer, and the two layers are totally two layers, and the nickel plating layer 4 is not arranged between the two layers. The thickness of the evaporated copper plating layer is about 100nm, and the thickness of the electroplated copper plating layer is about 500-600 nm.

Comparative example 1

Compared with example 1, the nickel plating layer 4 is not introduced between two adjacent copper plating layers 3 in the present comparative example.

Comparative example 2

Most of them are the same as in example 1 except that the thickness of each copper plating layer 3 of this comparative example is about 400nm, and two copper plating layers 3 are co-evaporated.

Meanwhile, the copper plating films prepared in the above example 1, comparative example 1 and comparative example 2 were subjected to a bonding strength characterization test, and the obtained performance results are shown in the following table 1.

TABLE 1 Properties of each copper plating film

Note: downstream manufacturers require that the bonding strength of the metal layer of the copper-plated film product is more than or equal to 2N, the copper-plated film product is generally delivered by taking 2N as a qualified product, and the copper-plated film product with the bonding strength more than 3N is taken as an excellent product.

As can be seen from the data measured in table 1 above, the bonding strength between the copper plating layers is greatly enhanced by performing the nickel plating treatment on the surface of the metal layer located on the inner side.

Examples 2 to 4

Compared to example 1, most of them are the same except that in this example:

the surface treatment layer 2 is a nickel plating treatment layer, a chromium plating treatment layer or a stainless steel plating treatment layer.

Example 5

Compared to example 1, most of them are the same except that in this example: the thickness of each copper plating layer 3 is about 20 nm.

Example 6

Compared to example 1, most of them are the same except that in this example: the thickness of each copper plating layer 3 is about 50 nm.

In the above embodiments, the base film 1 may be replaced with other types of films such as a PET film.

The embodiments described above are intended to facilitate the understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention according to the disclosure of the present invention.

Claims

1. The copper plating film for the battery is characterized by comprising a base film, surface treatment layers compounded on the surfaces of two sides of the base film, and a plurality of copper plating layers plated on the surface treatment layers in sequence, wherein a nickel plating layer is further arranged on the surface of the copper plating layer positioned on the inner side in two adjacent copper plating layers.

2. The copper-plated film for batteries according to claim 1, wherein the base film is a PET film or a PP film.

3. The copper plating film for a battery according to claim 1 or 2, wherein the thickness of the base film is 3 to 12 μm.

4. The copper plating film for a battery according to claim 1, wherein the surface treatment layer is a metal plating layer.

5. The copper-plated film for a battery according to claim 4, wherein the metal plating layer is a nickel layer, a chromium layer or a stainless steel layer.

6. The copper plating film for a battery according to claim 1, wherein the thickness of the nickel plating layer is 5 to 10 nm.