CN1110070C - Cleaner for large crystal wafer - Google Patents
Cleaner for large crystal wafer Download PDFInfo
- Publication number
- CN1110070C CN1110070C CN98120780.4A CN98120780A CN1110070C CN 1110070 C CN1110070 C CN 1110070C CN 98120780 A CN98120780 A CN 98120780A CN 1110070 C CN1110070 C CN 1110070C
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- China
- Prior art keywords
- wafer
- crawler belt
- belt
- crawler
- order
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000013078 crystal Substances 0.000 title claims description 25
- 238000004140 cleaning Methods 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims description 14
- 239000003153 chemical reaction reagent Substances 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000010926 purge Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 230000035699 permeability Effects 0.000 claims 2
- 239000013043 chemical agent Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a device for cleaning a large wafer, which comprises a track, rolling wheels and a support device, wherein the track is surrounded to form a sealed belt region, the rolling wheels are positioned on both sides of the sealed belt region formed by the track, and are coupled with the track to support the track, and then the track has a flat support surface. The support device is positioned in the sealed belt region formed by the track, and is used for supporting the large wafer. A set of rotating device for the large wafer can be configured around the large wafer. When the large wafer is cleaned, the large wafer can rotate along a specific direction.
Description
The present invention relates to a kind of cleaner for large crystal wafer, particularly relate to a kind of wafer surface cleaning apparatus that is applicable on the work-table of chemicomechanical grinding mill (CMP).
In the process of semiconductor fabrication process, often need with handling in addition planarization of wafer later, after manufacture crafts such as sputter, deposition.In the present semiconductor technology, chemical mechanical milling method (chemical mechanical po1ishing, CMP) be a kind of can be with a kind of technology of wafer surface global planarization.Wafer can produce some chips or particle (particle) in through the process of CMP grinding-flatening, so wafer also will be again after grinding through CMP cleaned the surface or the edge of wafer through one to cleaning procedure, this is the manufacture craft (post CMP cleaning) of CMP cleaning afterwards.
It is to adopt roller type (brush roller) or brush formula (penbrush) cleaner for large crystal wafer to come that wafer is carried out back CMP to clean that existing back CMP cleans manufacture craft.Please refer to Figure 1A and Figure 1B, it illustrates the top view and the end view of existing roller type cleaner for large crystal wafer respectively.The surface of wafer 10 is cleaned by roller brush 12.Wafer 10 rotates with direction A on the one hand, and 12 of roller brush are with direction B roll (shown in Figure 1B).By this, the whole surface of wafer 10 is cleaned totally.Refer again to Fig. 2 A and Fig. 2 B, it illustrates the top view and the end view of existing brush formula cleaner for large crystal wafer respectively.The surface of wafer 10 is cleaned by brush 14.Wafer 10 rotates with direction A on the one hand, and brush then moves (shown in Fig. 2 B) with direction B, in order to clean wafer 10 everywhere on wafer, so that the whole surface of wafer 10 is cleaned totally.
Wafer 10 lip-deep chips or particle also need by fluid or chemical reagent chip or particle to be taken away after being swept by roller brush 12 or brush.No matter in the existing skill be roller type or brush formula, it all can not make the wafer surface reach a uniform pH-value (pH value), and it is more rambunctious reaching surperficial uniformly acid's base number.This is because existing skill once only can be carried out local cleaning procedure to the wafer surface.
In addition, chip that is struck off or particle still drop on the wafer surface, so easily the wafer surface is caused twice injury such as wearing and tearing or scratch.
From the above, can only carry out the part to the processing on wafer surface and strike off chip or particle no matter prior art is roller type or brush formula.For example, be once in the mode of band shape at roller type, come chip or particle are removed in a certain zone of wafer; The brush formula also can only one this carry out zone with the brush area approximation.Therefore, existing dual mode all can only reach the effect that wafer is cleaned comprehensively indirectly in the mode that the part is cleaned.
In addition, because existing technology is to utilize local mode of cleaning wafer,, have time-consuming shortcoming so will reach the purpose that wafer is cleaned in this way comprehensively.
In sum, existing CMP cleaner for large crystal wafer afterwards once can only clean the part of wafer, is difficult to reach comprehensive inhomogeneity effect.Moreover, be difficult to also guarantee that the wafer surface has very average pH value.In addition, shortcoming consuming time is more arranged.
The object of the present invention is to provide a kind of cleaner for large crystal wafer, it can carry out comprehensive cleaning to the wafer surface, and non local cleaning.
Another object of the present invention is to provide a kind of cleaner for large crystal wafer, it can make the wafer surface keep a well-proportioned chemical characteristic, does not have surface p H value uneven phenomenon.
Another object of the present invention is to provide a kind of cleaner for large crystal wafer, it can reach the function that the wafer surface is cleaned up comprehensively more quickly.
The object of the present invention is achieved like this, and a kind of cleaner for large crystal wafer promptly is provided, and it is characterized in that, comprises at least: a crawler belt surrounds a sealing belt-like zone; One group of roller is positioned among formed this sealing belt-like zone of this crawler belt, and couples and prop up this crawler belt with this crawler belt, makes this crawler belt that the flat surface of one support can be arranged; And a bracing or strutting arrangement, be positioned among formed this sealing belt-like zone of this crawler belt, in order to support this wafer.In addition, more can use two groups of cleaner for large crystal wafer simultaneously, wherein one group is used for cleaning the wafer surface; Another group then is used for cleaning the wafer side.So, can obtain better cleaning performance.
The present invention also provides a kind of wafer purging system, in order to surface and the side that cleans a wafer, this wafer purging system comprises at least: a crawler type cleaning device, be coupled to the surface of this wafer, in order to clean the surface of this wafer, wherein, this crawler type cleaning device comprises at least, a crawler belt, surround a sealing belt-like zone, one roller is positioned among formed this sealing belt-like zone of this crawler belt, and couples and prop up this crawler belt with this crawler belt, make this crawler belt that the flat surface of one support can be arranged, and a bracing or strutting arrangement, be positioned among formed this sealing belt-like zone of this crawler belt, in order to support this wafer; And a cleaning device, be coupled to the side of this wafer, in order to clean the side of this wafer.
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Figure 1A is the top view of existing a kind of roller type cleaner for large crystal wafer;
Figure 1B is the end view of existing a kind of roller type cleaner for large crystal wafer;
Fig. 2 A is the top view of existing another kind of brush formula cleaner for large crystal wafer;
Fig. 2 B is the end view of existing another kind of brush formula cleaner for large crystal wafer;
Fig. 3 is the top view of cleaner for large crystal wafer of the present invention;
Fig. 4 is the end view of cleaner for large crystal wafer of the present invention.
The present invention proposes a kind of cleaning device of wafer, is particularly suitable for after wafer is through the cmp planarization manufacture craft, to the follow-up cleaning of wafer.Can carry out cleaning comprehensive and apace to the surface and the side of wafer by this kind device.Yet this device not only is applicable to the operation that back CMP (post CMP) wafer cleans, and after any semiconductor fabrication process, as long as need carry out comprehensive cleaning to the wafer surface, can utilize this device to come wafer is carried out cleaning.
Then, cooperate Fig. 3 and shown in Figure 4, in order to operation, function and its advantage of cleaner for large crystal wafer of the present invention to be described in detail in detail.
Fig. 3 and Fig. 4 are the top view and following view of cleaner for large crystal wafer of the present invention.
Cleaner for large crystal wafer 20 of the present invention comprises a crawler belt 22 and one group of roller 24a/24b at least.Preferable, crawler belt 22 is for becoming a closed area; Roller 24a/24b then is positioned among crawler belt 22 formed these sealing belt-like zones, and couples and prop up this crawler belt 22 with crawler belt 22, so that crawler belt 22 can have the flat surface of a support.Crawler belt 22 can use to have permeable material and makes.The material of crawler belt 22 can be polyvinyl acetate (PVA), polyurethane (PU), or other have the material of identical or similarity.The surface of crawler belt 22 can be processed into modes such as the ridge of special pattern or irrigation canals and ditches shape pattern, and chip or particle on the wafer 10 can be swept.Above-mentioned crawler belt 22 width are slightly larger than the diameter of wafer at least, and when using this device, wafer 10 surperficial back-offs are in the surface of crawler belt 22.
Roller 24a/24b can couple a transmission device 28, roller 24a/24b is rotated along certain specific direction, and then drive the rotation of crawler belt 22, as the direction of arrow among the figure.
Crawler belt 22 is formed should sealing belt-like zones in, can assemble a bracing or strutting arrangement (support) in order to support wafer 10, be unlikely to make wafer 10 compressing crawler belts 22 and subside.Can dispose wafer tumbler 30 around the wafer 10, use so that wafer 10 rotates along a specific direction.
When wafer 10 began to carry out cleaning procedure, wafer 10 back-offs made wafer 10 surfaces contact with each other with crawler belt 22 surfaces in the surface of crawler belt 22.Wafer 10 has 3/4ths surface and crawler belt 22 surperficial contacts at least.After roller 24a/24b rolls, just drive moving of crawler belt 22.At this moment, some particles of surface, groove or the pattern etc. on the crawler belt 22 just can scrape wafer 10 surfaces because of chip or the particle that CMP produced.Because crawler belt 22 is very wide with the contact range on wafer 10 surfaces,, therefore can obtain cleaning performance uniformly so can once remove very big area.In addition, because wafer 10 surperficial back-offs are on crawler belt 22 surfaces,, and can still not drop on the surface of wafer 10 so chip that strikes off or particle can drop on crawler belt 22.Be subjected to twice injury so can exempt the surface of wafer 10, so there is not the shortcoming of prior art.Moreover, because crawler belt 22 is very wide with the contact range on wafer 10 surfaces, thus the wafer cleaning can be finished at faster speed, to save the time and the cost of manufacture craft.
In the process of cleaning, more can inject chemical reagent between crawler belt 22 surfaces and wafer 10 surfaces.The injection of chemical reagent can be finished by the injection device 32 of a chemical reagent.This injection device 32 can be assemblied on the bracing or strutting arrangement 26, conveniently to utilize the Penetration Signature of crawler belt 22, makes chemical reagent be injected into crawler belt 22 surfaces.As previously mentioned, crawler belt 22 is very wide with the contact range on wafer 10 surfaces, so can make the chemical-pH value distribution uniform on wafer 10 surfaces and controlled easily, makes wafer 10 be suitable for follow-up manufacture craft.
In addition, device of the present invention more can comprise a wafer tumbler 30 (as shown in the figure), and the edge of itself and wafer 10 couples.Therefore, when wafer tumbler 30 when a direction is rotated, just can drive wafer 10 rotations.Motion and wafer tumbler 30 by crawler belt 22 allow wafer 10 rotate, and make cleaner for large crystal wafer 30 of the present invention carry out comprehensive and cleaning apace to wafer 10.
The above is used to clean wafer 10 surfaces with cleaning device 20.When if the side of wafer 10 also needs to clean, can utilize another identical cleaning device 40, the side of its crawler belt and wafer 10 is coupled, and the transmission by crawler belt, the side that makes particle on the crawler belt or groove strike off wafer.And water filling port 42 more can penetrate chip or particle that deionized water is used for washing away wafer 10 sides that swept in striking off process, in order to follow-up manufacture craft.
In sum, utilize device of the present invention comprehensive cleaning can be carried out in the wafer surface.Moreover, because the contact-making surface on crawler belt and wafer surface is extremely wide, so the uniformity of wafer surface pH value can be easy to Be Controlled, so there is not the shortcoming of prior art.In addition, wider because of contact-making surface, so can save the scavenging period of wafer, so can save production cost, and the chip that is swept in its process or particle can't drop on the wafer surface, so can not injure once more wafer.
Though among preferred embodiment, be to be illustrated with the cleaning of wafer after the cmp planarization manufacture craft, but be not in order to limit the range of application of cleaner for large crystal wafer of the present invention, in any semiconductor fabrication process, if in the time of need cleaning wafer surface or side, can use device of the present invention.
Therefore, characteristics of the present invention are that wafer is carried out comprehensive cleaning, and non local cleaning, and can make the wafer surface keep a well-proportioned chemical characteristic, do not have the uneven phenomenon of surface p H value.
Another characteristics of the present invention are because wafer surface back-off on track surface, so chip or particle that cleaning process produces can not drop on the wafer surface, and causes wearing and tearing to the wafer surface.
Characteristics more of the present invention are the faster comprehensive functions that wafer surface and side are cleaned up that reach apace, to save the time cost of producing.
In sum; though abovely disclosed the present invention in conjunction with a preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention should be considered as appended being as the criterion that claim defined.
Claims (18)
1. a cleaner for large crystal wafer is characterized in that, comprises at least:
One crawler belt surrounds a sealing belt-like zone;
One group of roller is positioned among formed this sealing belt-like zone of this crawler belt, and couples and prop up this crawler belt with this crawler belt, makes this crawler belt that the flat surface of one support can be arranged; And
One bracing or strutting arrangement is positioned among formed this sealing belt-like zone of this crawler belt, in order to support this wafer.
2. cleaner for large crystal wafer as claimed in claim 1 is characterized in that, also comprises:
One wafer tumbler is disposed at around this wafer, uses so that this wafer rotates along a specific direction.
3. device as claimed in claim 1 is characterized in that, the width of this crawler belt is at least the diameter of this wafer.
4. device as claimed in claim 1 is characterized in that, the surface of this crawler belt has the groove of patterning.
5. device as claimed in claim 1 is characterized in that this crawler belt has permeability.
6. device as claimed in claim 5 is characterized in that, the material of this crawler belt is polyvinyl acetate (PVA).
7. device as claimed in claim 5 is characterized in that, the material of this crawler belt is polyurethane (PU).
8. device as claimed in claim 1 is characterized in that, also comprises a chemical reagent injection device, in order to a chemical reagent is injected on this crawler belt.
9. device as claimed in claim 8 is characterized in that, this chemical reagent injection device is positioned at this bracing or strutting arrangement surface, by osmosis this chemical agent is penetrated on this crawler belt.
10. device as claimed in claim 1 is characterized in that, comprises that also a power transmission is coupled to this roller, and this roller is rotated.
11. device as claimed in claim 1 is characterized in that, comprises that also a power transmission is coupled to this wafer tumbler, and this wafer tumbler is rotated.
12. a wafer purging system, surface and side in order to clean a wafer is characterized in that, this wafer purging system comprises at least:
One crawler type cleaning device is coupled to the surface of this wafer, and in order to clean the surface of this wafer, wherein, this crawler type cleaning device comprises at least,
One crawler belt surrounds a sealing belt-like zone,
One group of roller is positioned among formed this sealing belt-like zone of this crawler belt, and couples and prop up this crawler belt with this crawler belt, makes this crawler belt that the flat surface of one support can be arranged, and
One bracing or strutting arrangement is positioned among formed this sealing belt-like zone of this crawler belt, in order to support this wafer; And
One cleaning device is coupled to the side of this wafer, in order to clean the side of this wafer.
13. system as claimed in claim 12 is characterized in that, the structure of this cleaning device is equal to this crawler type cleaning device.
14. system as claimed in claim 12 is characterized in that, this crawler belt has permeability.
15. system as claimed in claim 12 is characterized in that, also comprises a chemical reagent injection device, in order to a chemical reagent is injected on this crawler belt.
16. system as claimed in claim 12 is characterized in that, this chemical reagent injection device is positioned at this bracing or strutting arrangement surface, by osmosis this chemical reagent is penetrated on this crawler belt.
17. system as claimed in claim 12 is characterized in that, also comprises a water filling device, in order to deionized water is incident upon on this wafer side.
18. system as claimed in claim 12 is characterized in that, also comprises a wafer tumbler, is disposed at around this wafer, uses so that this wafer rotates along a specific direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98120780.4A CN1110070C (en) | 1998-09-29 | 1998-09-29 | Cleaner for large crystal wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98120780.4A CN1110070C (en) | 1998-09-29 | 1998-09-29 | Cleaner for large crystal wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1249532A CN1249532A (en) | 2000-04-05 |
| CN1110070C true CN1110070C (en) | 2003-05-28 |
Family
ID=5226878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98120780.4A Expired - Lifetime CN1110070C (en) | 1998-09-29 | 1998-09-29 | Cleaner for large crystal wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1110070C (en) |
-
1998
- 1998-09-29 CN CN98120780.4A patent/CN1110070C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1249532A (en) | 2000-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Applicant after: Taiwan Semiconductor Manufacturing Co., Ltd. Applicant before: Shida Integrated Circuit Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHIDA INTEGRATED CIRCUIT CO., LTD. TO: TAIWAN SEMICONDUCTOR MFG |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20030528 |
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| CX01 | Expiry of patent term |