CN110996500A - Mini LED circuit board and preparation process thereof - Google Patents
Mini LED circuit board and preparation process thereof Download PDFInfo
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- CN110996500A CN110996500A CN201911393980.5A CN201911393980A CN110996500A CN 110996500 A CN110996500 A CN 110996500A CN 201911393980 A CN201911393980 A CN 201911393980A CN 110996500 A CN110996500 A CN 110996500A
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- circuit board
- led circuit
- aluminum
- mini led
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
Abstract
The invention relates to the technical field of printed circuit board preparation, in particular to a mini LED circuit board and a preparation process thereof. The mini LED circuit board sequentially comprises a substrate layer, a heat conducting insulating layer and a circuit layer, wherein the substrate layer is made of an aluminum plate, and the heat conducting insulating layer comprises, by mass, 50-65 parts of sodium silicate, 8-10 parts of sodium hydroxide, 90-100 parts of polydimethylsiloxane, 15-25 parts of zinc oxide, 95-105 parts of monofunctional epoxy glycidyl ether, 15-18 parts of toluene, 10-15 parts of a silane coupling agent and 50-70 parts of an alkali-soluble wall material. According to the invention, the zinc oxide and the aluminosilicate jointly construct the heat conducting network, and the two kinds of heat conducting particles complement each other, so that the gaps among the heat conducting molecules can be better reduced, and the heat conducting performance of the LED circuit board can be effectively improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board preparation, in particular to a mini LED circuit board and a preparation process thereof.
Background
A PCB (Printed Circuit Board) has at least one conductive pattern attached thereon and is provided with holes to interconnect electronic components, which is the basis of almost all electronic products. Generally, if electronic components are present in a device, they are also integrated on PCBs of various sizes. In addition to holding various components, the PCB board mainly functions to provide a connection circuit between various components.
In the circuit board industry, with the rise of the LED industry, research on heat conduction is rapidly increased, and statistical data show that the reliability of an electronic component is reduced by 10% when the temperature of the electronic component is increased by 2 ℃, and the service life of the electronic component when the temperature is increased by 50 ℃ is only 1/6 when the temperature is increased by 25 ℃. This requires designers to consider using advanced heat dissipation processes and select superior heat dissipation materials to ensure that the device will operate properly at the highest temperatures that it can withstand. The substrate of the traditional PCB is generally made of FR-4 material, wherein FR-4 refers to an epoxy glass cloth laminated board, the heat conduction capability is low, the performance of the PCB is seriously affected by a large amount of accumulated heat for a long time, and even circuits and electronic elements can be burnt out, so that the PCB is scrapped. Therefore, a circuit board with good thermal conductivity is needed.
Disclosure of Invention
The invention aims to solve the problems and provides a mini LED circuit board and a preparation process thereof.
The technical scheme for solving the problems is that the mini LED circuit board sequentially comprises a substrate layer, a heat conduction insulating layer and a circuit layer, wherein the substrate layer is made of an aluminum plate, and the heat conduction insulating layer comprises, by mass, 50-65 parts of sodium silicate, 8-10 parts of sodium hydroxide, 90-100 parts of polydimethylsiloxane, 15-25 parts of zinc oxide, 95-105 parts of monofunctional epoxy glycidyl ether, 15-18 parts of toluene, 10-15 parts of a silane coupling agent and 50-70 parts of an alkali-soluble wall material.
Preferably, the monofunctional epoxy glycidyl ether comprises one or more of cardanol glycidyl ether, glycidyl methacrylate ether, allyl glycidyl ether and n-butyl glycidyl ether.
Preferably, the silane coupling agent comprises one or more of A151, A171, A172, KH-550, KH-560 and KH-570.
Preferably, the alkali-soluble wall material is polyacrylic resin.
The invention also aims to provide a preparation process of the mini LED circuit board, which comprises the following steps:
(1) preparing a heat conduction insulating layer: coating sodium silicate with alkali-soluble wall material to obtain a material a; mixing polydimethylsiloxane, monofunctional epoxy glycidyl ether and toluene, and then carrying out grafting reaction for 4-5h at the temperature of 80-100 ℃ to obtain a material b; mixing zinc oxide and a silane coupling agent, stirring at the rotating speed of 1200-1500r/min for 45-60min, filtering, and drying a filter cake at the temperature of 100-110 ℃ to obtain a material c; mixing the material a, the material b and the material c, and then mixing at the rotating speed of 400-;
(2) preparing an aluminum plate, coating a sodium hydroxide solution on the surface of the aluminum plate, standing for 30-60s, coating a heat-conducting insulating sizing material, standing for 1-2min, and covering a copper foil to obtain a composite;
(3) carrying out vacuum hot pressing on the complex to obtain an aluminum-based copper-clad plate;
(4) and processing the aluminum-based copper-clad plate according to the PCB manufacturing process to obtain the LED circuit board.
Preferably, the step a includes the steps of: dissolving polyacrylic resin in absolute ethyl alcohol, adding sodium silicate, mixing at the rotating speed of 300-400r/min for 1-2h, filtering, and drying a filter cake at the temperature of more than 85 ℃ to obtain a material a.
Preferably, in the step (3), the complex is hot pressed for 30-50min at 200 ℃ and 0.9-1.1MPa under the vacuum degree of 70-80 kpa.
Preferably, the step (4) comprises the steps of: a. designing a PCB (printed Circuit Board) according to the functional requirements of the circuit; b. printing and outputting the designed PCB picture by using special carbon paper, and then pressing the surface printed with the PCB picture and the copper plate relatively, and carrying out hot stamping; c. putting the aluminum-based copper-clad plate containing the ink marks into etching solution, taking out and cleaning after the aluminum-based copper-clad plate except the ink marks is completely corroded; d. punching the position needing to be punched on the aluminum-based copper-clad plate, and then welding the component to the copper plate through the through hole.
The invention has the beneficial effects that:
1. after the aluminum substrate is subjected to sodium hydroxide treatment, sodium metaaluminate generated on the surface of the aluminum substrate is decomposed to release sodium silicate when being coated with a sizing material containing sodium silicate coated by an alkali-soluble wall material, and the sodium silicate and the sodium metaaluminate generate aluminosilicate to become a heat-conducting filler in the sizing material so as to ensure the heat-conducting property of the sizing material.
2. The sizing material also comprises zinc oxide, the zinc oxide and aluminosilicate can jointly construct a heat conduction network, and the two heat conduction particles complement each other, so that gaps among heat conduction molecules can be better reduced, and the heat conduction performance is further improved.
3. The silane coupling agent is used for organically treating the surface of the zinc oxide, so that the polarity of the surface of the zinc oxide is reduced, the interaction is reduced, and the agglomeration is not easy to generate, thereby the zinc oxide is uniformly dispersed in the rubber material to construct a uniform heat conduction network with aluminosilicate.
4, after the monofunctional epoxy glycidyl ether epoxy and the polydimethylsiloxane are copolymerized, the polyacrylic resin is grafted and copolymerized under the action of the silane coupling agent to form a sizing material matrix, so that on one hand, the mechanical property of the sizing material can be improved, on the other hand, the zinc oxide coated by the silane coupling agent is filled into pores of the sizing material, and the uniformity of the construction of the heat conducting network is further improved.
Detailed Description
The following are specific embodiments of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
Example 1
The mini LED circuit board sequentially comprises a substrate layer, a heat conduction insulating layer and a circuit layer, and is prepared through the following steps:
(1) preparing a heat conduction insulating layer:
according to parts by mass, 50 parts of sodium silicate, 9 parts of sodium hydroxide, 95 parts of polydimethylsiloxane, 20 parts of zinc oxide, 100 parts of monofunctional epoxy glycidyl ether, 16 parts of toluene, 12 parts of a silane coupling agent and 60 parts of an alkali-soluble wall material are prepared. Wherein, the monofunctional epoxy glycidyl ether is methacrylic acid glycidyl ether. The silane coupling agent is KH-550. The alkali soluble wall material is polyacrylic resin.
Firstly, dissolving polyacrylic resin in absolute ethyl alcohol, adding sodium silicate, mixing for 1.5h at the rotating speed of 350r/min, filtering, and drying a filter cake at the temperature of 90 ℃ to obtain a material a. Then, after mixing polydimethylsiloxane, monofunctional epoxy glycidyl ether and toluene, carrying out grafting reaction for 4.5 hours at 90 ℃ to obtain a material b. And mixing zinc oxide and a silane coupling agent, stirring at the rotating speed of 1300r/min for 50min, filtering, and drying a filter cake at 105 ℃ to obtain a material c. Finally, mixing the material a, the material b and the material c, and mixing at the rotating speed of 450r/min for 50min to obtain a heat-conducting insulating rubber material;
(2) preparing an aluminum plate, coating a sodium hydroxide solution on the surface of the aluminum plate, standing for 45s, coating a heat-conducting insulating sizing material, standing for 90s, and covering with a copper foil to obtain a composite.
(3) And (3) placing the aluminum-based copper clad laminate at 190 ℃ and under 1.0Mpa and vacuum degree of 75kpa for hot pressing for 40min to obtain the aluminum-based copper clad laminate, and cutting the aluminum-based copper clad laminate to the required size.
(4) The PCB diagram is designed according to the circuit function requirement. And printing and outputting the designed PCB picture by using special carbon paper, and then pressing the surface printed with the PCB picture and the copper plate relatively and thermally printing. And (3) putting the aluminum-based copper-clad plate containing the ink marks into etching solution, taking out and cleaning after the aluminum-based copper-clad plate except the ink marks is completely corroded. Punching the position needing to be punched on the aluminum-based copper-clad plate, and then welding the components to the copper plate through the through holes to obtain the mini LED circuit board.
Example 2
The mini LED circuit board sequentially comprises a substrate layer, a heat conduction insulating layer and a circuit layer, and is prepared through the following steps:
(2) preparing a heat conduction insulating layer:
according to parts by mass, 50 parts of sodium silicate, 8 parts of sodium hydroxide, 90 parts of polydimethylsiloxane, 15 parts of zinc oxide, 95 parts of monofunctional epoxy glycidyl ether, 15 parts of toluene, 10 parts of a silane coupling agent and 50 parts of an alkali-soluble wall material are prepared. Wherein, the monofunctional epoxy glycidyl ether is allyl glycidyl ether. The silane coupling agent is A151. The alkali soluble wall material is polyacrylic resin.
Firstly, dissolving polyacrylic resin in absolute ethyl alcohol, adding sodium silicate, mixing for 1h at the rotating speed of 300r/min, filtering, and filtering a filter cake at 86 ℃ to obtain a material a. Then, polydimethylsiloxane, monofunctional epoxy glycidyl ether and toluene are mixed and subjected to grafting reaction for 4 hours at the temperature of 80 ℃ to obtain a material b. And mixing zinc oxide and a silane coupling agent, stirring at the rotating speed of 1200r/min for 45min, filtering, and drying a filter cake at 100 ℃ to obtain a material c. Finally, mixing the material a, the material b and the material c, and mixing at the rotating speed of 400r/min for 40min to obtain a heat-conducting insulating rubber material;
(2) preparing an aluminum plate, coating a sodium hydroxide solution on the surface of the aluminum plate, standing for 30s, coating a heat-conducting insulating sizing material, standing for 1min, and covering with a copper foil to obtain a composite.
(3) And (3) placing the aluminum-based copper clad laminate at 180 ℃, 0.9Mpa and 70kpa of vacuum degree for hot pressing for 30min to obtain the aluminum-based copper clad laminate, and cutting the aluminum-based copper clad laminate to the required size.
(4) The PCB diagram is designed according to the circuit function requirement. And printing and outputting the designed PCB picture by using special carbon paper, and then pressing the surface printed with the PCB picture and the copper plate relatively and thermally printing. And (3) putting the aluminum-based copper-clad plate containing the ink marks into etching solution, taking out and cleaning after the aluminum-based copper-clad plate except the ink marks is completely corroded. Punching the position needing to be punched on the aluminum-based copper-clad plate, and then welding the components to the copper plate through the through holes to obtain the mini LED circuit board.
Example 3
The mini LED circuit board sequentially comprises a substrate layer, a heat conduction insulating layer and a circuit layer, and is prepared through the following steps:
(3) preparing a heat conduction insulating layer:
according to parts by mass, 65 parts of sodium silicate, 10 parts of sodium hydroxide, 100 parts of polydimethylsiloxane, 25 parts of zinc oxide, 105 parts of monofunctional epoxy glycidyl ether, 18 parts of toluene, 15 parts of a silane coupling agent and 70 parts of an alkali-soluble wall material are prepared. Wherein, the monofunctional epoxy glycidyl ether is n-butyl glycidyl ether. The silane coupling agent is KH-560. The alkali soluble wall material is polyacrylic resin.
Firstly, dissolving polyacrylic resin in absolute ethyl alcohol, adding sodium silicate, mixing for 2 hours at the rotating speed of 400r/min, filtering, and putting a filter cake at 100 ℃ to obtain a material a. Then, after mixing polydimethylsiloxane, monofunctional epoxy glycidyl ether and toluene, carrying out grafting reaction for 5 hours at 100 ℃ to obtain a material b. And mixing zinc oxide and a silane coupling agent, stirring at the rotating speed of 1500r/min for 60min, filtering, and drying a filter cake at 110 ℃ to obtain a material c. Finally, mixing the material a, the material b and the material c, and mixing at the rotating speed of 500r/min for 60min to obtain a heat-conducting insulating rubber material;
(2) preparing an aluminum plate, coating a sodium hydroxide solution on the surface of the aluminum plate, standing for 60s, coating a heat-conducting insulating sizing material, standing for 2min, and covering with a copper foil to obtain a composite.
(3) And (3) placing the aluminum-based copper clad laminate at 200 ℃, 1.1Mpa and 80kpa of vacuum degree for hot pressing for 50min to obtain the aluminum-based copper clad laminate, and cutting the aluminum-based copper clad laminate to the required size.
(4) The PCB diagram is designed according to the circuit function requirement. And printing and outputting the designed PCB picture by using special carbon paper, and then pressing the surface printed with the PCB picture and the copper plate relatively and thermally printing. And (3) putting the aluminum-based copper-clad plate containing the ink marks into etching solution, taking out and cleaning after the aluminum-based copper-clad plate except the ink marks is completely corroded. Punching the position needing to be punched on the aluminum-based copper-clad plate, and then welding the components to the copper plate through the through holes to obtain the mini LED circuit board.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. The utility model provides a mini LED circuit board, includes base plate layer, heat conduction insulating layer and circuit layer in proper order, its characterized in that: the substrate layer is made of an aluminum plate, and the heat-conducting insulating layer comprises, by mass, 50-65 parts of sodium silicate, 8-10 parts of sodium hydroxide, 90-100 parts of polydimethylsiloxane, 15-25 parts of zinc oxide, 95-105 parts of monofunctional epoxy glycidyl ether, 15-18 parts of toluene, 10-15 parts of a silane coupling agent and 50-70 parts of an alkali-soluble wall material.
2. The mini LED circuit board of claim 1, wherein: the monofunctional epoxy glycidyl ether comprises one or more of cardanol glycidyl ether, methacrylic acid glycidyl ether, allyl glycidyl ether and n-butyl glycidyl ether.
3. The mini LED circuit board of claim 1, wherein: the silane coupling agent comprises one or more of A151, A171, A172, KH-550, KH-560 and KH-570.
4. The mini LED circuit board of claim 1, wherein: the alkali-soluble wall material is polyacrylic resin.
5. A process for preparing a mini LED circuit board according to any one of claims 1 to 4, wherein: the method comprises the following steps:
preparing a heat conduction insulating layer: coating sodium silicate with alkali-soluble wall material to obtain a material a; mixing polydimethylsiloxane, monofunctional epoxy glycidyl ether and toluene, and then carrying out grafting reaction for 4-5h at the temperature of 80-100 ℃ to obtain a material b; mixing zinc oxide and a silane coupling agent, stirring at the rotating speed of 1200-1500r/min for 45-60min, filtering, and drying a filter cake at the temperature of 100-110 ℃ to obtain a material c; mixing the material a, the material b and the material c, and then mixing at the rotating speed of 400-;
preparing an aluminum plate, coating a sodium hydroxide solution on the surface of the aluminum plate, standing for 30-60s, coating a heat-conducting insulating sizing material, standing for 1-2min, and covering a copper foil to obtain a composite;
carrying out vacuum hot pressing on the complex to obtain an aluminum-based copper-clad plate;
and processing the aluminum-based copper-clad plate according to the PCB manufacturing process to obtain the LED circuit board.
6. The process for preparing a mini LED circuit board according to claim 5, wherein the process comprises the following steps: the step a comprises the following steps: dissolving polyacrylic resin in absolute ethyl alcohol, adding sodium silicate, mixing at the rotating speed of 300-400r/min for 1-2h, filtering, and drying a filter cake at the temperature of more than 85 ℃ to obtain a material a.
7. The process for preparing a mini LED circuit board according to claim 5, wherein the process comprises the following steps: in the step (3), the complex is placed at the temperature of 180 ℃ and 200 ℃, the pressure of 0.9-1.1MPa and the vacuum degree of 70-80kpa for hot pressing for 30-50 min.
8. The process for preparing a mini LED circuit board according to claim 5, wherein the process comprises the following steps: the step (4) comprises the following steps: a. designing a PCB (printed Circuit Board) according to the functional requirements of the circuit; b. printing and outputting the designed PCB picture by using special carbon paper, and then pressing the surface printed with the PCB picture and the copper plate relatively, and carrying out hot stamping; c. putting the aluminum-based copper-clad plate containing the ink marks into etching solution, taking out and cleaning after the aluminum-based copper-clad plate except the ink marks is completely corroded; d. punching the position needing to be punched on the aluminum-based copper-clad plate, and then welding the component to the copper plate through the through hole.
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| CN201911393980.5A CN110996500B (en) | 2019-12-30 | 2019-12-30 | Mini LED circuit board and preparation process thereof |
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| CN201911393980.5A CN110996500B (en) | 2019-12-30 | 2019-12-30 | Mini LED circuit board and preparation process thereof |
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| CN101434748A (en) * | 2008-12-04 | 2009-05-20 | 上海大学 | Preparation of nano zinc oxide modified organosilicon encapsulation adhesive |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN105131493A (en) * | 2012-08-07 | 2015-12-09 | 朱海燕 | Heat-conductive and electric-insulating material being excellent in heat conductivity for high-power LED substrate |
| CN106380708A (en) * | 2016-08-29 | 2017-02-08 | 芜湖众力部件有限公司 | Thermally conductive and insulating corrosion-resisting modified plastic and manufacturing method thereof |
| CN109735108A (en) * | 2019-01-04 | 2019-05-10 | 东莞市汉华热能科技有限公司 | A kind of thermally conductive gel and preparation method thereof of the low fuel-displaced one pack system of high thermal conductivity |
-
2019
- 2019-12-30 CN CN201911393980.5A patent/CN110996500B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101434748A (en) * | 2008-12-04 | 2009-05-20 | 上海大学 | Preparation of nano zinc oxide modified organosilicon encapsulation adhesive |
| CN105131493A (en) * | 2012-08-07 | 2015-12-09 | 朱海燕 | Heat-conductive and electric-insulating material being excellent in heat conductivity for high-power LED substrate |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN106380708A (en) * | 2016-08-29 | 2017-02-08 | 芜湖众力部件有限公司 | Thermally conductive and insulating corrosion-resisting modified plastic and manufacturing method thereof |
| CN109735108A (en) * | 2019-01-04 | 2019-05-10 | 东莞市汉华热能科技有限公司 | A kind of thermally conductive gel and preparation method thereof of the low fuel-displaced one pack system of high thermal conductivity |
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