CN110965114B - Recovery device and method for tin methane sulfonate electroplating solution - Google Patents
Recovery device and method for tin methane sulfonate electroplating solution Download PDFInfo
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- CN110965114B CN110965114B CN201811152598.0A CN201811152598A CN110965114B CN 110965114 B CN110965114 B CN 110965114B CN 201811152598 A CN201811152598 A CN 201811152598A CN 110965114 B CN110965114 B CN 110965114B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Abstract
The invention relates to a recovery unit and a method of tin methane sulfonate electroplating solution, which comprises a plating solution rinsing system, a plating solution circulating tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein an MSA stock solution feeding device is arranged above the plating solution rinsing system, the plating solution circulating tank is connected with the evaporator through a first plating solution circulating pipeline, and the evaporator is connected with the plating solution circulating tank through a second plating solution circulating pipeline; the plating solution rinsing system comprises a third countercurrent rinsing tank, a second countercurrent rinsing tank and a first countercurrent rinsing tank which are sequentially arranged from left to right and gradually reduce in height, wherein a first liquid discharge pipeline is arranged at the lower end of the first countercurrent rinsing tank, a second liquid discharge pipeline is arranged at the lower end of the second countercurrent rinsing tank, and a third liquid discharge pipeline and a fourth liquid discharge pipeline are arranged at the lower end of the third countercurrent rinsing tank; the invention can improve the recovery efficiency of the tin methane sulfonate system electroplating solution of the continuous tin electroplating unit, and can ensure the continuous production of the tin electroplating unit when the evaporation capacity of the evaporator is reduced or the flow of flushing water is increased.
Description
Technical Field
The invention belongs to the technical field of electroplating of continuously produced strip steel, and particularly relates to a recovery device and a recovery method of tin methane sulfonate electroplating solution.
Background
The tin electroplating process with methanesulfonic acid (MSA) is an environment-friendly tin electroplating technology appearing in recent years, and the technology is used by plum steel, first steel, sand steel and Zhongyue tin electroplating units at home. The chemical cost of the MSA plating solution is higher, so the recovery efficiency of the MSA plating solution in production is important for saving the plating solution cost.
The MSA plating solution consists of Sn2+MSA, additives, antioxidants, etc. The current mode of the continuous electrotinning unit with higher plating solution recovery efficiency is a plating solution circulating tank recovery mode, namely, the plating solution circulating tank and an electroplating working tank form circulation, strip steel enters the electroplating working tank to be electroplated and then enters a rinsing tank to remove MSA plating solution carried out on the surface, deionized water is continuously supplemented in the rinsing tank through a flow valve to form a dilute plating solution, the overflow is directly recovered into the plating solution circulating tank, and an evaporator evaporates the plating solution to circulateThe washing water in the bath is removed and directly recycled. This recovery mode has the following disadvantages: (1) when the pH of the rinsing water is<1 hour, Sn is recovered in a rinsing tank2+Is not oxidized into Sn by hydrolysis4+And become tin sludge. When the machine set is just started, the pH value of deionized water in the rinsing tank is between 6-7, at this time the Sn in the plating solution2 +There is no point in the recovery of (1); (2) after the electroplated strip steel passes through a rinsing tank, Sn can be detected in the subsequent processing procedures2+The presence of (a), indicates that the ability to recover the plating solution in the rinsing section needs to be enhanced; (3) once the evaporation capacity of the evaporator is reduced, the liquid level of the electroplating liquid working on line is changed, so that the concentration of the components of the electroplating liquid is changed, the machine is stopped to process faults, and a certain degree of economic loss is brought to a continuous production unit.
Chinese patent application publication No. CN104790023B entitled "electroplating solution recovery method and apparatus", the method lifts a single circuit board from an electroplating tank to a position above the recovery tank, and inclines the circuit board above the recovery tank to make the bottom edge of the circuit board and the horizontal plane form an included angle of more than 0 degree and less than 90 degrees, preferably an included angle of 45 degrees; and residual electroplating solution on the circuit board is gathered at the lowest point of the circuit board and then dripped into the recovery tank, so that the electroplating solution is recovered. The method is not suitable for recycling MSA plating solution of a continuous electrotinning production line.
Chinese patent application publication No. CN206902279U, entitled "plating solution recovery device", mainly through being equipped with the timer, the user can carry out the timing processing to the plating solution recovery process through the adjustment button who adjusts the timer to the progress of reaction is retrieved in the control, has effectively improved the work efficiency of equipment. The method is used for recovering the wire electroplating solution, and is also not suitable for recovering the MSA solution of the continuous electrotinning production line.
Disclosure of Invention
The invention provides a recovery device and a recovery method of tin methanesulfonate electroplating solution, aiming at the defects in the prior art and solving the problems in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a recovery device for tin methane sulfonate electroplating solution comprises a plating solution rinsing system, a plating solution circulating tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein the waste water discharge pipeline is connected with the waste water pit; the plating solution rinsing system comprises a third countercurrent rinsing tank, a second countercurrent rinsing tank and a first countercurrent rinsing tank which are sequentially arranged from left to right and gradually reduced in height, the first countercurrent rinsing tank, the second countercurrent rinsing tank and the third countercurrent rinsing tank are connected through overflow holes, a first liquid discharge pipeline is arranged at the lower end of the first countercurrent rinsing tank, a second liquid discharge pipeline is arranged at the lower end of the second countercurrent rinsing tank, and a third liquid discharge pipeline and a fourth liquid discharge pipeline are arranged at the lower end of the third countercurrent rinsing tank; the first liquid discharge pipeline, the second liquid discharge pipeline, the third liquid discharge pipeline and the fourth liquid discharge pipeline are all connected with a wastewater discharge pipeline; a first deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; the right end of the first countercurrent rinsing groove is connected with the plating solution circulating groove.
As an improvement of the invention, a deionized water flow regulating valve is arranged on the first deionized water inlet pipeline; a first countercurrent rinsing tank bottom tapping valve is arranged on the first tapping pipeline, a second countercurrent rinsing tank bottom tapping valve is arranged on the second tapping pipeline, a third countercurrent rinsing tank bottom tapping valve is arranged on the third tapping pipeline, and a tapping pipeline flow regulating valve is arranged on the fourth tapping pipeline; and a first plating solution circulating pipeline valve is arranged on the first plating solution circulating pipeline, and a second plating solution circulating pipeline valve and an evaporator liquid taking pump are arranged on the second plating solution circulating pipeline.
As an improvement of the invention, a second deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; a first water feeding pipeline, a second water feeding pipeline and a third water feeding pipeline are arranged at the lower end of the second deionized water inlet pipeline, the third water feeding pipeline is arranged above a third countercurrent rinsing groove, the second water feeding pipeline is arranged above the second countercurrent rinsing groove, and the first water feeding pipeline is arranged above the first countercurrent rinsing groove; the first deionized water valve is arranged on the first water adding pipeline, the second deionized water valve is arranged on the second water adding pipeline, and the third deionized water valve is arranged on the third water adding pipeline.
As an improvement of the invention, the MSA stock solution feeding device comprises an MSA stock solution storage tank, a first MSA stock solution feeding pipeline and a second MSA stock solution feeding pipeline are arranged below the MSA stock solution storage tank, and the first MSA stock solution feeding pipeline is arranged above a first countercurrent rinsing tank; and the second MSA stock solution feeding pipeline is arranged above the second countercurrent rinsing tank.
As an improvement of the invention, a first MSA raw material adding flow regulating valve is arranged on the first MSA stock solution feeding pipeline; and a second MSA raw material adding flow regulating valve is arranged on the second MSA stock solution feeding pipeline.
As an improvement of the invention, a first self-circulation spraying system is arranged above the first countercurrent rinsing tank, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline.
As an improvement of the invention, the first self-circulation spraying system comprises a first circulation pipeline and a spraying device, the lower end of the first circulation pipeline is connected with a first liquid discharge pipeline, the upper end of the first circulation pipeline is connected with the spraying device, and a first self-circulation spraying device pressurizing pump and a first self-circulation spraying device liquid inlet valve are arranged on the first circulation pipeline.
As an improvement of the invention, a second self-circulation spraying system is arranged above the second countercurrent rinsing tank, and the lower end of the second self-circulation spraying system is connected with a second liquid discharge pipeline.
As an improvement of the invention, the second self-circulation spraying system comprises a second circulation pipeline and a spraying device, the lower end of the second circulation pipeline is connected with the second liquid discharge pipeline, the upper end of the second circulation pipeline is connected with the spraying device, and the second circulation pipeline is provided with a second self-circulation spraying device pressure pump and a second self-circulation spraying device liquid inlet valve.
As an improvement of the present invention, the method for recovering a tin methanesulfonate-based plating solution includes the steps of:
(1) before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) the plating solution is prepared for recovery,
a. Opening a third deionized water valve, a second deionized water valve and a first deionized water valve, filling the third countercurrent rinsing tank, the second countercurrent rinsing tank and the first countercurrent rinsing tank with deionized water, and closing the third deionized water valve, the second deionized water valve and the first deionized water valve;
b. adding MSA stock solution into a first countercurrent rinsing tank and a second countercurrent rinsing tank respectively through a first MSA raw material adding flow regulating valve and a second MSA raw material adding flow regulating valve, so that the pH value of the first countercurrent rinsing tank and the second countercurrent rinsing tank is less than 1;
c. opening a valve of a first self-circulation spraying device pressure pump, a liquid inlet valve of the first self-circulation spraying device, a second self-circulation spraying device pressure pump and a liquid inlet valve of the second self-circulation spraying device, opening self-circulation spraying devices in a second countercurrent rinsing tank and a first countercurrent rinsing tank, uniformly mixing MSA added above, and washing the electroplating solution taken out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) opening a first plating solution circulating pipeline valve, a second plating solution circulating pipeline valve and an evaporator liquid taking pump on a circulating pipeline between an evaporator and a plating solution circulating tank, opening a deionized water flow regulating valve above a third countercurrent rinsing tank, setting the make-up water quantity, operating the unit, and taking the MSA plating solution out and recovering;
(4) the production is continuously carried out, when the liquid level of the plating solution circulating tank is higher, a high liquid level alarm is carried out on the liquid circulating tank, the situation that the evaporation capacity of the evaporator is reduced is shown, the current evaporation capacity of the evaporator is judged, a liquid discharging pipeline flow regulating valve leading to a waste water pit at the bottom of a third countercurrent rinsing tank is opened, the effluent flow of the third countercurrent rinsing tank is set, and the recovery device continues to operate;
when turbid matters are generated in the rinsing tank and the water quality is dirty, the rinsing water flow is increased and set; opening a flow regulating valve of a liquid discharge pipeline leading to a waste water pit at the bottom of the third countercurrent rinsing tank, and setting the effluent flow according to the current evaporation capacity of the evaporator;
(5) after production is finished, closing the deionized water flow regulating valve, opening a drain valve at the bottom of the second countercurrent rinsing tank and a drain valve at the bottom of the first countercurrent rinsing tank, putting the recovered plating solution in the second countercurrent rinsing tank and the first countercurrent rinsing tank into a plating solution circulating tank, and closing the drain valve at the bottom of the second countercurrent rinsing tank and the drain valve at the bottom of the first countercurrent rinsing tank; and opening a liquid discharging valve at the bottom of the third countercurrent rinsing tank, putting water in the third countercurrent rinsing tank into the waste water pit, closing the liquid discharging valve at the bottom of the third countercurrent rinsing tank, evaporating the plating solution circulating tank to the liquid level before the rinsing water is discharged by the evaporator, closing the evaporator, the evaporator liquid taking pump, the first plating solution circulating pipeline valve, the second plating solution circulating pipeline valve and the evaporator liquid taking pump, closing the evaporator and the plating solution recovery system, and ending the operation.
Compared with the prior art, the invention has the following beneficial effects because the technology is adopted:
the invention discloses a recovery device and a recovery method of tin methanesulfonate electroplating solution, which can solve the problem that the continuous production of a tin methanesulfonate electroplating unit can be ensured when the evaporation capacity of an evaporator is reduced or the flow of flushing water is increased while the recovery efficiency of the tin methanesulfonate electroplating solution of the continuous tin electroplating unit is improved.
Drawings
FIG. 1 is a schematic view showing a constitution of a recovering apparatus for a tin methanesulfonate-based plating solution;
in the figure: 1. a first plating solution circulating pipeline valve, 2, a second plating solution circulating pipeline valve, 3, a third countercurrent rinsing tank bottom tapping valve, 4, a second countercurrent rinsing tank bottom tapping valve, 5, a first countercurrent rinsing tank bottom tapping valve, 6, a second self-circulating spray device pressure pump, 7, a first self-circulating spray device pressure pump, 8, a deionized water flow regulating valve, 9, a tapping pipeline flow regulating valve, 10, a first MSA raw material adding flow regulating valve, 11, a second MSA raw material adding flow regulating valve, 12, a third deionized water valve, 13, a second deionized water valve, 14, a first deionized water valve, 15, a first self-circulating spray device liquid inlet valve, 16, a second self-circulating spray device liquid inlet valve, 17, an evaporator liquid taking pump, 18, a wastewater discharge pipeline, 19, a wastewater pit, 20, a plating solution circulating tank, 21, a second circulating pipeline, 22. the device comprises an evaporator, 23, an MSA stock solution feeding device, 24, a third countercurrent rinsing tank, 25, a second countercurrent rinsing tank, 26, a first countercurrent rinsing tank, 27, a spraying device, 28, a first liquid discharge pipeline, 29, a second liquid discharge pipeline, 30, a third liquid discharge pipeline, 31, a fourth liquid discharge pipeline, 32, a first deionized water inlet pipeline, 33, a first plating solution circulating pipeline, 34, a second plating solution circulating pipeline, 35, a second deionized water inlet pipeline, 36, a first water feeding pipeline, 37, a second water feeding pipeline, 38, a third water feeding pipeline, 39, an MSA stock solution storage tank, 40, a first MSA stock solution feeding pipeline, 41, a second MSA stock solution feeding pipeline, 42 and a first circulating pipeline.
Detailed Description
The invention is further elucidated with reference to the drawings and the detailed description.
Example 1:
a recovery unit of tin methane sulfonate system electroplating solution comprises a plating solution rinsing system, a plating solution circulating tank 20, a waste water pit 19, a waste water discharge pipeline 18 and an evaporator 22, wherein the waste water discharge pipeline 18 is connected with the waste water pit 19, an MSA raw solution feeding device 23 is arranged above the plating solution rinsing system, the plating solution circulating tank 20 is connected with the evaporator 22 through a first plating solution circulating pipeline 33, and the evaporator 22 is connected with the plating solution circulating tank 20 through a second plating solution circulating pipeline 34; the plating solution rinsing system comprises a third countercurrent rinsing tank 24, a second countercurrent rinsing tank 25 and a first countercurrent rinsing tank 26 which are sequentially arranged from left to right and gradually reduced in height, wherein the first countercurrent rinsing tank 26, the second countercurrent rinsing tank 25 and the third countercurrent rinsing tank 24 are connected through overflow holes, a first liquid discharge pipeline 28 is arranged at the lower end of the first countercurrent rinsing tank 26, a second liquid discharge pipeline 29 is arranged at the lower end of the second countercurrent rinsing tank 25, and a third liquid discharge pipeline 30 and a fourth liquid discharge pipeline 31 are arranged at the lower end of the third countercurrent rinsing tank 24; the first liquid discharging pipeline 28, the second liquid discharging pipeline 29, the third liquid discharging pipeline 30 and the fourth liquid discharging pipeline 31 are all connected with the wastewater discharge pipeline 18; a first deionized water inlet pipeline 32 is arranged above the third countercurrent rinsing tank 24; the right end of the first countercurrent rinsing tank 26 is connected with the plating solution circulating tank 20. In order to realize the overflow of the recovered liquid, the positions of the evaporator and the plating solution rinsing tank system are higher than the position of the plating solution circulating tank. When the first countercurrent rinsing bath 26 is connected to the bath circulation tank 20, the upper end of the connecting pipe is disposed below the liquid level line of the first countercurrent rinsing bath 26.
The first deionized water inlet pipeline 32 is provided with a deionized water flow regulating valve 8; a first countercurrent rinsing tank bottom tapping valve 5 is arranged on the first tapping pipeline 28, a second countercurrent rinsing tank bottom tapping valve 4 is arranged on the second tapping pipeline 29, a third countercurrent rinsing tank bottom tapping valve 3 is arranged on the third tapping pipeline 30, and a tapping pipeline flow regulating valve 9 is arranged on the fourth tapping pipeline 31; the first plating solution circulating pipeline 33 is provided with a first plating solution circulating pipeline valve 1, and the second plating solution circulating pipeline 34 is provided with a second plating solution circulating pipeline valve 2 and an evaporator liquid taking pump 17.
A second deionized water inlet pipeline 35 is arranged above the third countercurrent rinsing tank 24; a first water adding pipeline 36, a second water adding pipeline 37 and a third water adding pipeline 38 are arranged at the lower end of the second deionized water inlet pipeline 35, the third water adding pipeline 38 is arranged above the third countercurrent rinsing groove 24, the second water adding pipeline 37 is arranged above the second countercurrent rinsing groove 25, and the first water adding pipeline 36 is arranged above the first countercurrent rinsing groove 26; the first water adding pipeline 36 is provided with a first deionized water valve 14, the second water adding pipeline 37 is provided with a second deionized water valve 13, and the third water adding pipeline 38 is provided with a third deionized water valve 12.
The MSA stock solution feeding device 23 comprises an MSA stock solution storage tank 39, a first MSA stock solution feeding pipeline 40 and a second MSA stock solution feeding pipeline 41 are arranged below the MSA stock solution storage tank 39, and the first MSA stock solution feeding pipeline 40 is arranged above the first countercurrent rinsing tank 26; the second MSA stock feed line 41 is positioned above the second counter current rinse tank 25.
The first MSA raw material adding flow regulating valve 10 is arranged on the first MSA raw liquid feeding pipeline 40; and a second MSA raw material adding flow regulating valve 11 is arranged on the second MSA raw liquid feeding pipeline 41.
The MSA stock solution storage tank 39 is positioned higher than the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26; the function of replenishing MSA when the second countercurrent rinsing groove 25 and the first countercurrent rinsing groove 26 are taken out and recovered and the groove is started is realized.
A first self-circulation spraying system is arranged above the first countercurrent rinsing tank 26, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline 28.
The first self-circulation spraying system comprises a first circulation pipeline 42 and a spraying device 27, the lower end of the first circulation pipeline 42 is connected with the first liquid discharging pipeline 28, the upper end of the first circulation pipeline 42 is connected with the spraying device 27, and a first self-circulation spraying device pressure pump 7 and a first self-circulation spraying device liquid inlet valve 15 are arranged on the first circulation pipeline 42.
A second self-circulation spraying system is arranged above the second countercurrent rinsing tank 25, and the lower end of the second self-circulation spraying system is connected with a second liquid discharge pipeline 29.
The second self-circulation spraying system comprises a second circulation pipeline 21 and a spraying device 27, the lower end of the second circulation pipeline 21 is connected with a second liquid discharging pipeline 29, the upper end of the second circulation pipeline 21 is connected with the spraying device 27, and a second self-circulation spraying device pressure pump 6 and a second self-circulation spraying device liquid inlet valve 16 are arranged on the second circulation pipeline 21.
A heating temperature control device is arranged in the plating solution circulating tank 20, and the plating solution circulating tank has a high-low liquid level alarm function;
the evaporator 22 has a vacuum low-temperature evaporation function; the vacuum degree is less than-0.1 Mpa, and the temperature is less than 65 ℃;
example 2:
the normal evaporation capacity of the evaporator 22 of the MSA plating solution recovery system is 1.5h/m3And the high-low liquid level alarm is 25m when the plating solution circulating tank 20 works3＜LL＜32m3. The volume of the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 is 2.5m3,3m3，3.5m3。
A method for recovering tin methanesulfonate electroplating solution includes the following steps:
(1) before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) the plating solution is prepared for recovery,
a. Opening a third deionized water valve 12, a second deionized water valve 13 and a first deionized water valve 14, filling the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 with deionized water, and closing the third deionized water valve 12, the second deionized water valve 13 and the first deionized water valve 14;
b. the first countercurrent rinsing tank 26 and the second countercurrent rinsing tank 25 are respectively added with 10L of stock solution 12LMSA through a first MSA raw material adding flow regulating valve 10 and a second MSA raw material adding flow regulating valve 11, so that the pH value is less than 1;
c. opening a valve of a first self-circulation spraying device booster pump 7, opening a liquid inlet valve 15 of the first self-circulation spraying device, a second self-circulation spraying device booster pump 6 and a liquid inlet valve 16 of the second self-circulation spraying device, opening self-circulation spraying devices in a second countercurrent rinsing tank 25 and a first countercurrent rinsing tank 26, uniformly mixing MSA added on the top, and washing the electroplating solution carried out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) opening a first plating solution circulating pipeline valve 1, a second plating solution circulating pipeline valve 2 and an evaporator liquid taking pump 17 on a circulating pipeline between an evaporator 22 and a plating solution circulating groove 20, opening a deionized water flow regulating valve 8 above a third countercurrent rinsing groove 24, and setting the water supply amount to be 1.5h/m3When the unit is operated, the MSA plating solution is in a take-out recovery state;
(4) the production is continuously carried out, and the liquid level of the plating solution circulating groove 20 is 32m3When the liquid circulation tank generates a high liquid level alarm, the evaporation capacity of the evaporator 22 is reduced, and the current evaporation capacity of the evaporator 22 is judged to be 1.0 m3Opening a liquid discharge pipeline flow regulating valve 9 at the bottom of the third countercurrent rinsing tank 24 leading to the waste water pit 19, and setting the water outlet flow of the third countercurrent rinsing tank to be 0.5m3H; the recovery device continues to operate;
(5) after the production is finished, closing the deionized water flow regulating valve 8, opening the drain valve 4 at the bottom of the second countercurrent rinsing tank and the drain valve 5 at the bottom of the first countercurrent rinsing tank, putting the recovered plating solution in the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 into the plating solution circulating tank 20, and then closing the drain valve 4 at the bottom of the second countercurrent rinsing tank and the drain valve 5 at the bottom of the first countercurrent rinsing tank; and opening a liquid discharging valve 3 at the bottom of the third countercurrent rinsing tank, putting water in a third countercurrent rinsing tank 24 into a waste water pit 19, closing the liquid discharging valve 3 at the bottom of the third countercurrent rinsing tank, evaporating a plating solution circulating tank 20 to the liquid level before discharging the rinsing water by an evaporator 22, closing the evaporator 22, an evaporator liquid taking pump 17, a first plating solution circulating pipeline valve 1 and a second plating solution circulating pipeline valve 2, stopping the operation of the evaporation system, and finishing the operation of the plating solution recovery system.
Example 3:
the normal evaporation capacity of the evaporator 22 of the MSA plating solution recovery system is 1.5h/m3And the high-low liquid level alarm is 25m when the plating solution circulating tank 20 works3＜LL＜32m3. The volume of the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 is 2.5m3,3m3，3.5m3。
(1) Before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) the plating solution is prepared for recovery,
a. Opening a third deionized water valve 12, a second deionized water valve 13 and a first deionized water valve 14, filling the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 with deionized water, and closing the third deionized water valve 12, the second deionized water valve 13 and the first deionized water valve 14;
b. the first countercurrent rinsing tank 26 and the second countercurrent rinsing tank 25 are respectively added with 10L of stock solution 12LMSA through a first MSA raw material adding flow regulating valve 10 and a second MSA raw material adding flow regulating valve 11, so that the pH value is less than 1;
c. opening a valve of a first self-circulation spraying device pressure pump 7, a liquid inlet valve 15 of the first self-circulation spraying device, a second self-circulation spraying device pressure pump 6 and a liquid inlet valve 16 of the second self-circulation spraying device, opening self-circulation spraying devices in a second countercurrent rinsing tank 25 and a first countercurrent rinsing tank 26, uniformly mixing MSA added on the MSA, and washing the electroplating solution carried out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) opening a first plating solution circulating pipeline valve 1, a second plating solution circulating pipeline valve 2 and an evaporator liquid taking pump 17 on a circulating pipeline between an evaporator 22 and a plating solution circulating groove 20, opening a deionized water flow regulating valve 8 above a third countercurrent rinsing groove 24, and setting the water supply amount to be 1.5h/m3When the unit is operated, the MSA plating solution is in a take-out recovery state;
(4) the production is continuously carried out, the evaporator 22 is normally operated, when turbid substances are generated in the rinsing tank, the water quality is dirty, and in order to keep the cleanness of the strip steel after the positive electroplating, the flow rate of the rinsing water is increased and is set to be 2m3H; the flow regulating valve 9 of the liquid discharge pipeline leading to the waste water pit 19 at the bottom of the third countercurrent rinsing tank 24 is opened, and the water outlet flow is set to be 0.5 (m) according to the evaporation capacity of the evaporator 22 at that time3/h）；
(5) After the production is finished, closing the deionized water flow regulating valve 8, opening the drain valve 4 at the bottom of the second countercurrent rinsing tank and the drain valve 5 at the bottom of the first countercurrent rinsing tank, putting the recovered plating solution in the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 into the plating solution circulating tank 20, and then closing the drain valve 4 at the bottom of the second countercurrent rinsing tank and the drain valve 5 at the bottom of the first countercurrent rinsing tank; opening a liquid discharging valve 3 at the bottom of the third countercurrent rinsing tank, putting water in a wastewater pit 19 of a third countercurrent rinsing tank 24, closing the liquid discharging valve 3 at the bottom of the third countercurrent rinsing tank, evaporating a plating solution circulating tank 20 to the liquid level before the rinsing water is discharged by an evaporator 22, closing the evaporator 22, taking a liquid pump 17 by the evaporator, a first plating solution circulating pipeline valve 1 and a second plating solution circulating pipeline valve 2, stopping the operation of the evaporation system, and finishing the operation of the plating solution recovery system.
The above-mentioned embodiments are merely preferred embodiments of the present invention, and should not be construed as limiting the present invention, and the scope of the present invention should be defined by the claims, and equivalents including technical features of the claims, i.e., equivalent modifications within the scope of the present invention.
Claims (10)
1. A recovery unit of tin methane sulfonate electroplating solution, characterized in that: the device comprises a plating solution rinsing system, a plating solution circulating tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein the waste water discharge pipeline is connected with the waste water pit; the plating solution rinsing system comprises a third countercurrent rinsing tank, a second countercurrent rinsing tank and a first countercurrent rinsing tank which are sequentially arranged from left to right and gradually reduced in height, the first countercurrent rinsing tank, the second countercurrent rinsing tank and the third countercurrent rinsing tank are connected through overflow holes, a first liquid discharge pipeline is arranged at the lower end of the first countercurrent rinsing tank, a second liquid discharge pipeline is arranged at the lower end of the second countercurrent rinsing tank, and a third liquid discharge pipeline and a fourth liquid discharge pipeline are arranged at the lower end of the third countercurrent rinsing tank; the first liquid discharge pipeline, the second liquid discharge pipeline, the third liquid discharge pipeline and the fourth liquid discharge pipeline are all connected with a wastewater discharge pipeline; a first deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; the right end of the first countercurrent rinsing groove is connected with the plating solution circulating groove.
2. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 1, characterized in that: a deionized water flow regulating valve is arranged on the first deionized water inlet pipeline; a first countercurrent rinsing tank bottom tapping valve is arranged on the first tapping pipeline, a second countercurrent rinsing tank bottom tapping valve is arranged on the second tapping pipeline, a third countercurrent rinsing tank bottom tapping valve is arranged on the third tapping pipeline, and a tapping pipeline flow regulating valve is arranged on the fourth tapping pipeline; and a first plating solution circulating pipeline valve is arranged on the first plating solution circulating pipeline, and a second plating solution circulating pipeline valve and an evaporator liquid taking pump are arranged on the second plating solution circulating pipeline.
3. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 1, characterized in that: a second deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; a first water feeding pipeline, a second water feeding pipeline and a third water feeding pipeline are arranged at the lower end of the second deionized water inlet pipeline, the third water feeding pipeline is arranged above a third countercurrent rinsing groove, the second water feeding pipeline is arranged above the second countercurrent rinsing groove, and the first water feeding pipeline is arranged above the first countercurrent rinsing groove; the first deionized water valve is arranged on the first water adding pipeline, the second deionized water valve is arranged on the second water adding pipeline, and the third deionized water valve is arranged on the third water adding pipeline.
4. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 1, characterized in that: the MSA stock solution feeding device comprises an MSA stock solution storage tank, a first MSA stock solution feeding pipeline and a second MSA stock solution feeding pipeline are arranged below the MSA stock solution storage tank, and the first MSA stock solution feeding pipeline is arranged above the first countercurrent rinsing tank; and the second MSA stock solution feeding pipeline is arranged above the second countercurrent rinsing tank.
5. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 4, characterized in that: the first MSA raw material adding flow regulating valve is arranged on the first MSA raw liquid feeding pipeline; and a second MSA raw material adding flow regulating valve is arranged on the second MSA stock solution feeding pipeline.
6. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 1, characterized in that: and a first self-circulation spraying system is arranged above the first countercurrent rinsing tank, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline.
7. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 6, characterized in that: the first self-circulation spraying system comprises a first circulation pipeline and a spraying device, the lower end of the first circulation pipeline is connected with a first liquid discharging pipeline, the upper end of the first circulation pipeline is connected with the spraying device, and a first self-circulation spraying device pressure pump and a first self-circulation spraying device liquid inlet valve are arranged on the first circulation pipeline.
8. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 1, characterized in that: and a second self-circulation spraying system is arranged above the second countercurrent rinsing tank, and the lower end of the second self-circulation spraying system is connected with a second liquid discharge pipeline.
9. The apparatus for recovering a tin methanesulfonate-based plating solution according to claim 8, characterized in that: the second self-circulation spraying system comprises a second circulation pipeline and a spraying device, the lower end of the second circulation pipeline is connected with the second liquid discharging pipeline, the upper end of the second circulation pipeline is connected with the spraying device, and a second self-circulation spraying device pressure pump and a second self-circulation spraying device liquid inlet valve are arranged on the second circulation pipeline.
10. The method for recovering a tin methanesulfonate-based plating solution according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
(1) before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) the plating solution is prepared for recovery,
a. Opening a third deionized water valve, a second deionized water valve and a first deionized water valve, filling the third countercurrent rinsing tank, the second countercurrent rinsing tank and the first countercurrent rinsing tank with deionized water, and closing the third deionized water valve, the second deionized water valve and the first deionized water valve;
b. adding MSA stock solution into a first countercurrent rinsing tank and a second countercurrent rinsing tank respectively through a first MSA raw material adding flow regulating valve and a second MSA raw material adding flow regulating valve, so that the pH value of the first countercurrent rinsing tank and the second countercurrent rinsing tank is less than 1;
c. opening a valve of a first self-circulation spraying device pressure pump, a liquid inlet valve of the first self-circulation spraying device, a second self-circulation spraying device pressure pump and a liquid inlet valve of the second self-circulation spraying device, opening self-circulation spraying devices in a second countercurrent rinsing tank and a first countercurrent rinsing tank, uniformly mixing MSA added above, and washing the electroplating solution taken out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) opening a first plating solution circulating pipeline valve, a second plating solution circulating pipeline valve and an evaporator liquid taking pump on a circulating pipeline between an evaporator and a plating solution circulating tank, opening a deionized water flow regulating valve above a third countercurrent rinsing tank, setting the make-up water quantity, operating the unit, and taking the MSA plating solution out and recovering;
(4) the production is continuously carried out, when the liquid level of the plating solution circulating tank is higher, a high liquid level alarm is carried out on the liquid circulating tank, the situation that the evaporation capacity of the evaporator is reduced is shown, the current evaporation capacity of the evaporator is judged, a liquid discharging pipeline flow regulating valve leading to a waste water pit at the bottom of a third countercurrent rinsing tank is opened, the effluent flow of the third countercurrent rinsing tank is set, and the recovery device continues to operate;
when turbid matters are generated in the rinsing tank and the water quality is dirty, the rinsing water flow is increased and set; opening a flow regulating valve of a liquid discharge pipeline leading to a waste water pit at the bottom of the third countercurrent rinsing tank, and setting the effluent flow according to the current evaporation capacity of the evaporator;
(5) after production is finished, closing the deionized water flow regulating valve, opening a drain valve at the bottom of the second countercurrent rinsing tank and a drain valve at the bottom of the first countercurrent rinsing tank, putting the recovered plating solution in the second countercurrent rinsing tank and the first countercurrent rinsing tank into a plating solution circulating tank, and closing the drain valve at the bottom of the second countercurrent rinsing tank and the drain valve at the bottom of the first countercurrent rinsing tank; and opening a liquid discharging valve at the bottom of the third countercurrent rinsing tank, putting water in the third countercurrent rinsing tank into the waste water pit, closing the liquid discharging valve at the bottom of the third countercurrent rinsing tank, evaporating the plating solution circulating tank to the liquid level before the rinsing water is discharged by the evaporator, closing the evaporator, the evaporator liquid taking pump, the first plating solution circulating pipeline valve and the second plating solution circulating pipeline valve, closing the evaporator and the plating solution recovery system, and ending the operation.
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| CN201811152598.0A CN110965114B (en) | 2018-09-29 | 2018-09-29 | Recovery device and method for tin methane sulfonate electroplating solution |
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