CN112195502B - Recovery device and recovery method for efficient tin methanesulfonate electroplating solution - Google Patents
Recovery device and recovery method for efficient tin methanesulfonate electroplating solution Download PDFInfo
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- CN112195502B CN112195502B CN201910545970.2A CN201910545970A CN112195502B CN 112195502 B CN112195502 B CN 112195502B CN 201910545970 A CN201910545970 A CN 201910545970A CN 112195502 B CN112195502 B CN 112195502B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention relates to a high-efficiency recovery device of tin methane sulfonate electroplating solution, which comprises a plating solution rinsing system, a plating solution circulating tank, a plating solution storage tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein the waste water discharge pipeline is connected with the waste water pit, an MSA (multi-amino-acid) stock solution feeding device is arranged above the plating solution rinsing system, the plating solution circulating tank is connected with the plating solution storage tank through a solution taking pipeline, a solution taking valve and a solution taking pump, the plating solution circulating tank and the plating solution storage tank are connected with the evaporator through a first branch pipe of a first plating solution circulating pipeline, a second branch pipe of the first plating solution circulating tank pipeline and a first plating solution circulating pipeline main pipe, and the evaporator is connected with the plating solution circulating tank and the plating solution storage tank through a second plating solution circulating pipeline main pipe, a first branch pipe of a second plating solution circulating pipeline and a second branch pipe of the second plating solution circulating pipeline.
Description
Technical Field
The invention relates to a recovery device, in particular to a recovery device of high-efficiency tin methane sulfonate electroplating solution, and belongs to the technical field of continuous production strip steel electroplating.
Background
The tin electroplating process with methanesulfonic acid (MSA) is an environment-friendly tin electroplating technology appearing in recent years, and the technology is used by plum steel, first steel, sand steel and Zhongyue tin electroplating units at home. The chemical cost of the MSA plating solution is high, so the recovery efficiency of the MSA plating solution in production is important for saving the plating solution cost.
Generally, a plating solution circulating tank and an electroplating working tank of a continuous electroplating tin production line form circulation, strip steel enters an electroplating working tank to be electroplated and then enters a rinsing tank to remove MSA plating solution carried out on the surface, deionized water is continuously supplemented in the rinsing tank through a flow valve to form a rare plating solution, and according to different treatment modes of the rare plating solution, the conventional MSA plating solution recovery modes are two: one method is that overflow is recovered into plating solution storage tank, evaporator directly evaporates the dilute plating solution in plating solution storage tank, and a small amount of concentrated plating solution is pumped into plating solution circulating tank by pump every shift for useThe influence of the component concentration is small, and when the recovery system is in failure, the unit can normally produce; the other method is that overflow is directly recycled into a plating solution circulating tank, and plating solution in the plating solution circulating tank is evaporated by an evaporator to remove washing water and directly recycle, and the plating solution recycling method has high recycling efficiency and has the defect that once a plating solution recycling system fails, the liquid level of the plating solution working on line changes, so that the concentration of plating solution components changes, the machine is stopped to process the failure, and a certain degree of economic loss is brought to a continuous production unit. These two bath recovery methods also have a common disadvantage: when the pH of the rinsing water is less than 1, sn is recovered in a rinsing tank 2+ Is not oxidized into Sn by hydrolysis 4+ Changing into tin mud, when the unit is started, the PH of deionized water in a rinsing tank is between 6 and 7, and then Sn in a plating solution 2+ There is no meaning in the recovery of (B).
Chinese patent application publication No. CN104790023B, entitled "electroplating solution recovery method and apparatus", this method is lifted up and moved to above the recovery jar from the electroplating jar single breadboard, the breadboard above the recovery jar is inclined, make the bottom edge of the breadboard and horizontal plane present the included angle greater than 0 degrees and smaller than 90 degrees, preferred the included angle of 45 degrees; and residual electroplating solution on the circuit board is gathered at the lowest point of the circuit board and then dripped into the recovery tank, so that the electroplating solution is recovered. The method is not suitable for recovering MSA plating solution of a continuous electrotinning production line.
Chinese patent application publication No. CN206902279U, entitled "plating solution recovery device", mainly through being equipped with the timer, the user can regularly handle the plating solution recovery process through the adjustment button who adjusts the timer to the progress of reaction is retrieved in the control, has effectively improved the work efficiency of equipment. The method is used for recovering the wire electroplating solution, and is also not suitable for recovering the MSA solution of the continuous electrotinning production line.
Disclosure of Invention
The invention provides a high-efficiency recovery device of tin methane sulfonate electroplating solution aiming at the problems in the prior art, and the technical scheme is characterized in that an original electroplating solution circulating tank recovery system and an electroplating solution storage tank recovery system are connected and combined into a new electroplating solution recovery system through a pipeline, a valve and a pump, and the recovery device has two functions of electroplating solution recovery and is additionally provided with a rinsing tank MSA feeding device; a method for recovering high-efficiency tin methane sulfonate electroplating solution effectively solves the problem of Sn & lt 2+ & gt hydrolysis in a rinsing tank in a manner of adding MSA (methyl methacrylate-N-ethyl methacrylate) in the rinsing tank, can realize the conversion between an original electroplating solution circulating tank recovery system and an electroplating solution storage tank recovery system in a new electroplating solution recovery system by controlling a pipeline valve according to the production condition of an electroplating tin unit, solves the problems in the prior art, and improves the recovery efficiency of the electroplating solution.
In order to achieve the purpose, the technical scheme of the invention is that the device for recovering the high-efficiency tin methane sulfonate system plating solution is characterized by comprising a plating solution rinsing system, a plating solution circulating tank, a plating solution storage tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein the waste water discharge pipeline is connected with the waste water pit; the plating solution rinsing system comprises a third countercurrent rinsing tank, a second countercurrent rinsing tank and a first countercurrent rinsing tank which are sequentially arranged from left to right and gradually reduced in height, the first countercurrent rinsing tank, the second countercurrent rinsing tank and the third countercurrent rinsing tank are connected through overflow holes, a first liquid discharge pipeline is arranged at the lower end of the first countercurrent rinsing tank, a second liquid discharge pipeline is arranged at the lower end of the second countercurrent rinsing tank, and a third liquid discharge pipeline is arranged at the lower end of the third countercurrent rinsing tank; the first liquid discharging pipeline, the second liquid discharging pipeline and the third liquid discharging pipeline are connected with the wastewater discharge pipeline and the fourth liquid discharging pipeline; a first deionized water inlet pipeline is arranged above the third countercurrent rinsing tank, the right end of the first countercurrent rinsing tank passes through the plating solution reflux main pipe, and the first reflux branch pipe and the second reflux branch pipe are connected with the plating solution circulating tank and the plating solution storage tank; and the fourth liquid discharging pipeline is connected with the second reflux branch pipe and is positioned at the lower end of the first reflux branch pipe.
As an improvement of the invention, a deionized water flow regulating valve is arranged on the first deionized water inlet pipeline; a first countercurrent rinsing tank bottom tapping valve is arranged on the first tapping pipeline, a second countercurrent rinsing tank bottom tapping valve is arranged on the second tapping pipeline, and a third countercurrent rinsing tank bottom tapping valve is arranged on the third tapping pipeline; the first branch pipe of the first plating solution circulating pipeline is provided with a first plating solution circulating pipeline first branch pipe valve, the second branch pipe of the first plating solution circulating pipeline is provided with a first plating solution circulating pipeline second branch pipe valve, the first branch pipe of the second plating solution circulating pipeline is provided with a second plating solution circulating pipeline first branch pipe valve, the second branch pipe of the second plating solution circulating pipeline is provided with a second plating solution circulating pipeline second branch pipe valve, and the second plating solution circulating pipeline main pipe is provided with an evaporator liquid taking pump.
As an improvement of the invention, a second deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; a first water feeding pipeline, a second water feeding pipeline and a third water feeding pipeline are arranged at the lower end of the second deionized water inlet pipeline, the third water feeding pipeline is arranged above a third countercurrent rinsing groove, the second water feeding pipeline is arranged above the second countercurrent rinsing groove, and the first water feeding pipeline is arranged above the first countercurrent rinsing groove; and a first deionized water valve is arranged on the first water adding pipeline, a second deionized water valve is arranged on the second water adding pipeline, and a third deionized water valve is arranged on the third water adding pipeline.
As an improvement of the invention, the MSA stock solution feeding device comprises an MSA stock solution storage tank, a first MSA stock solution feeding pipeline and a second MSA stock solution feeding pipeline are arranged below the MSA stock solution storage tank, and the first MSA stock solution feeding pipeline is arranged above a first countercurrent rinsing tank; and the second MSA stock solution feeding pipeline is arranged above the second countercurrent rinsing tank.
As an improvement of the invention, a first MSA raw material adding flow regulating valve is arranged on a first MSA raw liquid feeding pipeline; a second MSA raw material adding flow regulating valve is arranged on the second MSA stock solution feeding pipeline;
and a first self-circulation spraying system is arranged above the first countercurrent rinsing tank, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline.
As an improvement of the invention, the first self-circulation spraying system comprises a first circulation pipeline and a spraying device, the lower end of the first circulation pipeline is connected with the first liquid discharging pipeline, the upper end of the first circulation pipeline is connected with the spraying device, and the first circulation pipeline is provided with a first self-circulation spraying device liquid inlet valve and a first self-circulation spraying device pressure pump.
As an improvement of the invention, a second self-circulation spraying system is arranged above the second countercurrent rinsing tank, and the lower end of the second self-circulation spraying system is connected with a second liquid discharge pipeline.
As an improvement of the invention, the second self-circulation spraying system comprises a second circulation pipeline and a spraying device, the lower end of the second circulation pipeline is connected with the second liquid discharging pipeline, the upper end of the second circulation pipeline is connected with the spraying device, and the second circulation pipeline is provided with a second self-circulation spraying device liquid inlet valve and a second self-circulation spraying device pressure pump.
A method for recovering tin methanesulfonate electroplating solution includes the following steps:
(1) Before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) The plating solution is prepared for recovery,
a. Opening a third deionized water valve, a second deionized water valve and a first deionized water valve, filling the third countercurrent rinsing tank, the second countercurrent rinsing tank and the first countercurrent rinsing tank with deionized water, and closing the third deionized water valve, the second deionized water valve and the first deionized water valve;
b. adding MSA stock solution into a first countercurrent rinsing tank and a second countercurrent rinsing tank respectively through a first MSA raw material adding flow regulating valve and a second MSA raw material adding flow regulating valve, so that the pH value of the first countercurrent rinsing tank and the second countercurrent rinsing tank is less than 1;
c. opening a liquid inlet valve of a first self-circulation spraying device, a pressure pump of the first self-circulation spraying device, a liquid inlet valve of a second self-circulation spraying device and a pressure pump of the second self-circulation spraying device, starting the self-circulation spraying devices in a second countercurrent rinsing tank and a first countercurrent rinsing tank, uniformly mixing MSA added above, and washing the electroplating solution taken out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) Opening a first plating solution circulating pipeline first branch pipe valve, a second plating solution circulating pipeline first branch pipe valve and an evaporator liquid taking pump on a circulating pipeline between an evaporator and a plating solution circulating tank, opening a deionized water flow regulating valve above a third countercurrent rinsing tank, setting the supply water quantity, and opening a plating solution reflux first reflux branch pipe valve at the right end of the first countercurrent rinsing tank; the unit is operated, and MSA plating solution is in a plating solution circulating tank recovery state;
(4) When the liquid level of the plating solution circulating tank is higher, the plating solution circulating tank gives a high liquid level alarm and judges that a plating solution recovery system has a fault, or the washing water quantity needs to be increased, a first backflow branch pipe valve of plating solution at the right end of the first countercurrent rinsing tank is closed, a second backflow branch pipe valve of plating solution at the right end of the first countercurrent rinsing tank is opened at the same time, a first branch pipe valve of a first plating solution circulating pipeline on a circulating pipeline between the evaporator and the plating solution circulating tank and a first branch pipe valve of a second plating solution circulating pipeline and a liquid taking pump of the evaporator are closed, a second branch pipe valve of the first plating solution circulating pipeline on the circulating pipeline between the evaporator and the plating solution storage tank and the liquid taking pump of the evaporator are opened, and the plating solution is recovered in a plating solution storage tank;
(5) In production, a liquid taking valve is opened, and a certain volume of concentrated electroplating liquid is intermittently taken from a plating liquid storage tank through a liquid taking pump to an electroplating circulating tank to supplement the liquid level reduction of the electroplating circulating tank caused by the carrying-over of the electroplating liquid;
(6) After the failure of the plating solution recovery system is eliminated or the washing water amount is recovered to be normal, closing a second reflux branch pipe valve for the plating solution to flow back from the right end of the first countercurrent rinsing tank, opening a first reflux branch pipe valve for the plating solution to flow back from the right end of the first countercurrent rinsing tank, closing a second branch pipe valve of a first plating solution circulating pipeline on a circulating pipeline between the evaporator and the plating solution storage tank, closing the second branch pipe valve of the second plating solution circulating pipeline and an evaporator liquid taking pump, opening the first branch pipe valve of the first plating solution circulating pipeline on the circulating pipeline between the evaporator and the plating solution circulating tank, opening the first branch pipe valve of the second plating solution circulating pipeline and the evaporator liquid taking pump, and converting the plating solution recovery system into a plating solution circulating tank recovery state;
(7) And after the production is finished, closing the deionized water flow regulating valve, opening a liquid discharging valve at the bottom of the second countercurrent rinsing tank and a liquid discharging valve at the bottom of the first countercurrent rinsing tank, putting the recovered plating solution in the second countercurrent rinsing tank and the first countercurrent rinsing tank into a plating solution storage tank, closing a liquid discharging valve at the bottom of the second countercurrent rinsing tank and a liquid discharging valve at the bottom of the first countercurrent rinsing tank, opening a liquid discharging valve at the bottom of the third countercurrent rinsing tank, putting water in the third countercurrent rinsing tank into a waste water pit, closing a liquid discharging valve at the bottom of the third countercurrent rinsing tank, closing an evaporator, an evaporator liquid taking pump, a first branch valve of a first plating solution circulating pipeline and a first branch valve of a second plating solution circulating pipeline, and finishing the operation of the plating solution recovery system.
Compared with the prior art, the invention has the advantages that the technical scheme can improve the recovery efficiency of the tin methanesulfonate system electroplating solution of the continuous tin electroplating unit, simultaneously can ensure the continuous production of the tin electroplating unit when the evaporation capacity of an evaporator is reduced or the flow of flushing water is increased, and improve the recovery efficiency of the electroplating solution.
Drawings
FIG. 1 is a schematic view showing the overall structure of a recovery apparatus for a high-efficiency tin methanesulfonate-based electroplating solution;
in the figure: 1. a first plating solution circulating pipeline first branch pipe valve, 2, a first plating solution circulating pipeline second branch pipe valve, 3, a second plating solution circulating pipeline second branch pipe valve, 4, a second plating solution circulating pipeline first branch pipe valve, 5, a liquid taking valve, 6, a plating solution backflow second branch pipe valve, 7, a plating solution backflow first branch pipe valve, 8, a third countercurrent rinsing groove bottom liquid discharging valve, 9, a second countercurrent rinsing groove bottom liquid discharging valve, 10, a first countercurrent rinsing groove bottom liquid discharging valve, 11, a second self-circulation spraying device liquid feeding valve, 12, a first self-circulation spraying device liquid feeding valve, 13, a deionized water flow regulating valve, 14, a third deionized water valve, 15, a second deionized water valve, 16, a first deionized water valve, 17, a second MSA raw material adding flow regulating valve, 18, a first MSA raw material adding flow regulating valve, 19, an evaporator liquid taking pump, 20, a liquid taking pump, 21, a second self-circulation spray device pressure pump, 22, a first self-circulation spray device pressure pump, 23, a plating solution circulating tank, 24, a plating solution storage tank, 25 evaporator, 26, a waste water pit, 27, a third counter-current rinsing tank, 28, a second counter-current rinsing tank, 29, a first counter-current rinsing tank, 30, an MSA stock solution storage tank, 31, a first plating solution circulating pipeline first branch pipe, 32, a first plating solution circulating pipeline second branch pipe, 33, a first plating solution circulating pipeline main pipe, 34, a second plating solution circulating pipeline first branch pipe, 35, a second plating solution circulating pipeline second branch pipe, 36, a second plating solution circulating pipeline main pipe, 37, a liquid taking pipeline, 38, a plating solution backflow first branch pipe, 39, a plating solution backflow second branch pipe, 40, a plating solution backflow main pipe, 41, a waste water discharge pipeline, 42, a fourth liquid discharge pipeline, 43, a third liquid discharge pipeline and a second self-circulation spray pipeline, 44. a second tapping pipeline 45, a first tapping pipeline 46 and a first self-circulation spraying pipeline; 47. the system comprises a second self-circulation spraying pipeline, a 48, a first deionized water inlet pipeline, a 49, a third water adding pipeline, a 50, a second water adding pipeline, a 51, a first water adding pipeline, a 52, a second deionized water inlet pipeline, a 53, a second MSA stock solution feeding pipeline, a 54, a first MSA stock solution feeding pipeline, a 55, an MSA stock solution feeding device, a 56, a first spraying device and a 57 second spraying device.
The specific implementation mode is as follows:
for the purpose of promoting an understanding of the present invention, reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings.
Example 1: referring to fig. 1, a high-efficiency recycling device for tin methane sulfonate electroplating solution comprises a plating solution rinsing system, a plating solution circulating tank 23, a plating solution storage tank 24, a waste water pit 26, a waste water discharge pipeline 41 and an evaporator 25, wherein the waste water discharge pipeline 41 is connected with the waste water pit 26, an MSA stock solution feeding device 55 is arranged above the plating solution rinsing system, the plating solution circulating tank 23 is connected with the plating solution storage tank 24 through a solution taking pipeline 37, a solution taking valve 5 and a solution taking pump 20, the plating solution circulating tank 23 and the plating solution storage tank 24 are connected with the evaporator 26 through a first plating solution circulating pipeline first branch pipe 31, a first plating solution circulating tank pipeline second branch pipe 32 and a first plating solution circulating pipeline main pipe 33, and the evaporator 25 is connected with the plating solution circulating tank 23 and the plating solution storage tank 24 through a second plating solution circulating pipeline main pipe 36, a second plating solution circulating pipeline first branch pipe 34 and a second plating solution circulating pipeline second branch pipe 35; the plating solution rinsing system comprises a third countercurrent rinsing tank 27, a second countercurrent rinsing tank 28 and a first countercurrent rinsing tank 29 which are sequentially arranged from left to right and gradually decrease in height, the first countercurrent rinsing tank 29, the second countercurrent rinsing tank 28 and the third countercurrent rinsing tank 27 are connected through overflow holes, a first liquid discharge pipeline 45 is arranged at the lower end of the first countercurrent rinsing tank 29, a second liquid discharge pipeline 44 is arranged at the lower end of the second countercurrent rinsing tank 28, and a third liquid discharge pipeline 43 is arranged at the lower end of the third countercurrent rinsing tank 27; the first liquid discharging pipeline 45, the second liquid discharging pipeline 44 and the third liquid discharging pipeline 43 are connected with the wastewater discharge pipeline 41 and the fourth liquid discharging pipeline 42; a first deionized water inlet pipeline 48 is arranged above the third countercurrent rinsing tank 27, the right end of the first countercurrent rinsing tank 29 passes through a plating solution reflux header pipe 40, and a first reflux branch pipe 38 and a second reflux branch pipe 39 are connected with the plating solution circulating tank 23 and the plating solution storage tank 24; a fourth tapping line 42 is connected to the second return branch 39 at the lower end of the first return branch 38.
The first deionized water inlet pipeline 48 is provided with a deionized water flow regulating valve 13; a first countercurrent rinsing tank bottom tapping valve 10 is arranged on the first tapping pipeline 45, a second countercurrent rinsing tank bottom tapping valve 9 is arranged on the second tapping pipeline 44, and a third countercurrent rinsing tank bottom tapping valve 43 is arranged on the third tapping pipeline 43; a first plating solution circulating pipeline first branch pipe 31 is provided with a first plating solution circulating pipeline first branch pipe valve 1, a first plating solution circulating pipeline second branch pipe valve 2 is arranged on a first plating solution circulating pipeline second branch pipe 32, a second plating solution circulating pipeline first branch pipe 34 is provided with a second plating solution circulating pipeline first branch pipe valve 4, a second plating solution circulating pipeline second branch pipe valve 3 is arranged on a second plating solution circulating pipeline second branch pipe, and an evaporator liquid taking pump 19 is arranged on a second plating solution circulating pipeline main pipe 36;
a second deionized water inlet pipeline 52 is arranged above the third countercurrent rinsing tank 27; a first water adding pipeline 51, a second water adding pipeline 50 and a third water adding pipeline 49 are arranged at the lower end of the second deionized water inlet pipeline 52, the third water adding pipeline 49 is arranged above the third counter-current rinsing tank 27, the second water adding pipeline 50 is arranged above the second counter-current rinsing tank 28, and the first water adding pipeline 51 is arranged above the first counter-current rinsing tank 29; the first water adding pipeline 51 is provided with a first deionized water valve 16, the second water adding pipeline 50 is provided with a second deionized water valve 15, and the third water adding pipeline 49 is provided with a third deionized water valve 14.
The MSA stock solution feeding device 55 comprises an MSA stock solution storage tank 30, a first MSA stock solution feeding pipeline 54 and a second MSA stock solution feeding pipeline 53 are arranged below the MSA stock solution storage tank, and the first MSA stock solution feeding pipeline 54 is arranged above the first countercurrent rinsing tank 29; the second MSA stock solution feed line 53 is disposed above the second counter-current rinse tank 27.
The first MSA raw liquid feeding pipeline 54 is provided with a first MSA raw material feeding flow regulating valve 18; and a second MSA raw material adding flow regulating valve 17 is arranged on the second MSA raw liquid feeding pipeline 53.
A first self-circulation spraying system is arranged above the first countercurrent rinsing tank 29, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline 45.
The first self-circulation spraying system comprises a first circulation pipeline 47 and a first spraying device 56, the lower end of the first circulation pipeline 47 is connected with the first liquid discharging pipeline 45, the upper end of the first circulation pipeline 47 is connected with the spraying device 56, and a first self-circulation spraying device liquid inlet valve 12 and a first self-circulation spraying device pressure pump 22 are arranged on the first circulation pipeline 47.
A second self-circulating spray system is arranged above the second countercurrent rinsing tank 28, and the lower end of the second self-circulating spray system is connected with a second liquid discharge pipeline 44.
The second self-circulation spraying system comprises a second circulation pipeline 46 and a second spraying device 57, the lower end of the second circulation pipeline 46 is connected with the second liquid discharging pipeline 44, the upper end of the second circulation pipeline 46 is connected with the second spraying device 57, and a second self-circulation spraying device liquid inlet valve 11 and a second self-circulation spraying device pressure pump 21 are arranged on the second circulation pipeline.
A heating temperature control device is arranged in the plating solution circulating tank 23, and the plating solution circulating tank has a high-low liquid level alarm function;
the evaporator 25 has a vacuum low-temperature evaporation function; the vacuum degree is less than-0.1 Mpa, and the temperature is less than 65 ℃;
application example 1: the normal evaporation capacity of the evaporator 22 of the MSA plating solution recovery system is 1.5h/m < 3 >, and the high-low liquid level alarm is more than 25m < 3 > and less than LL < 32m < 3 > when the plating solution circulating tank 20 works. The volumes of the third countercurrent rinsing tank 24, the second countercurrent rinsing tank 25 and the first countercurrent rinsing tank 26 are 2.5m3,3m3 and 3.5m3.
A method for recovering tin methanesulfonate electroplating solution includes the following steps:
(1) Before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) The plating solution is prepared for recovery,
a. Opening a third deionized water valve 14, a second deionized water valve 15 and a first deionized water valve 16, filling a third countercurrent rinsing tank 27, a second countercurrent rinsing tank 28 and a first countercurrent rinsing tank 29 with deionized water, and closing the third deionized water valve 14, the second deionized water valve 15 and the first deionized water valve 16;
b. a first countercurrent rinsing tank 29 and a second countercurrent rinsing tank 28 are respectively added with 10L and 12LMSA stock solutions through a first MSA raw material adding flow regulating valve 18 and a second MSA raw material adding flow regulating valve 17, so that the pH values of the stock solutions are less than 1;
c. opening a valve, namely a first self-circulation spraying device liquid inlet valve 12, a first self-circulation spraying device pressure pump 22, a second self-circulation spraying device liquid inlet valve 11 and a second self-circulation spraying device pressure pump 21, starting self-circulation spraying devices in a second countercurrent rinsing tank 28 and a first countercurrent rinsing tank 29, uniformly mixing MSA added on the top, and washing the electroplating solution carried out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) Opening a first plating solution circulating pipeline first branch pipe valve 1, a second plating solution circulating pipeline first branch pipe valve 4 and an evaporator liquid taking pump 19 on a circulating pipeline between an evaporator 25 and a plating solution circulating tank 23, opening a deionized water flow regulating valve 13 above a third countercurrent rinsing tank 27, and setting the water supply amount to be 1.5h/m 3 Opening a plating solution reflux first reflux branch pipe valve 7 at the right end of the first reflux rinsing tank 29, running the unit, and keeping the MSA plating solution in a plating solution circulating tank recovery state;
(4) The production is continuously carried out, and the liquid level of the plating solution circulating groove 23 is 32m 3 When the liquid circulation tank generates a high liquid level alarm, the evaporation capacity of the evaporator 25 is reduced, and the current evaporation capacity of the evaporator 25 is judged to be 1.0 m 3 Closing a first reflux branch pipe valve 7 for the plating solution at the right end of the first countercurrent rinsing groove 29 to flow back, simultaneously opening a second reflux branch pipe valve 6 for the plating solution from the right end of the first countercurrent rinsing groove 29 to flow back, closing the evaporator 25 and a first plating solution circulating pipeline first branch pipe valve 1, a second plating solution circulating pipeline first branch pipe valve 4 and an evaporator liquid taking pump 19 on a circulating pipeline between the evaporator and the plating solution circulating groove, opening a first plating solution circulating pipeline second branch pipe valve 2, a second plating solution circulating pipeline second branch pipe valve 3 and an evaporator liquid taking pump 19 on the circulating pipeline between the evaporator 25 and the plating solution storage groove, and recovering the plating solution in a storage groove recovering state;
(5) In production, the liquid taking valve 5 is opened, and the concentrated plating solution of 2m < 3 > is intermittently taken from the plating solution storage tank to the plating circulation tank through the liquid taking pump 20 to supplement the plating circulation tank with the lowering of the liquid level caused by the carrying-over of the plating solution.
(6) After the failure of the evaporator is eliminated, the second reflux branch pipe valve 6 for the plating solution from the right end of the first countercurrent rinsing tank 29 to flow back is closed, the first reflux branch pipe valve 7 for the plating solution from the right end of the first countercurrent rinsing tank 29 to flow back is opened, the second branch pipe valve 2 of the first plating solution circulating pipeline on the circulating pipeline between the evaporator 25 and the plating solution storage tank, the second branch pipe valve 3 of the second plating solution circulating pipeline and the evaporator liquid taking pump 19 are closed, the first branch pipe valve 1 of the first plating solution circulating pipeline on the circulating pipeline between the evaporator 25 and the plating solution circulating tank, the first branch pipe valve 4 of the second plating solution circulating pipeline and the evaporator liquid taking pump 19 are opened, and the plating solution recycling system is switched to the recycling state of the plating solution circulating tank.
(7) And after the production is finished, closing the deionized water flow regulating valve 13, opening the tapping valve 9 at the bottom of the second countercurrent rinsing tank and the tapping valve 10 at the bottom of the first countercurrent rinsing tank, putting the plating solution recovered from the second countercurrent rinsing tank 28 and the first countercurrent rinsing tank 29 into the plating solution storage tank, closing the tapping valve 9 at the bottom of the second countercurrent rinsing tank 28 and the tapping valve 10 at the bottom of the first countercurrent rinsing tank 29, opening the tapping valve 8 at the bottom of the third countercurrent rinsing tank 27, putting the water in the third countercurrent rinsing tank 27 into the waste water pit 26, closing the tapping valve 8 at the bottom of the third countercurrent rinsing tank, closing the evaporator 25, the evaporator liquid taking pump 19, the first plating solution circulating pipeline first branch valve 1 and the second plating solution circulating pipeline first branch valve 4, and finishing the operation of the plating solution recovery system.
Application example 2
The normal evaporation capacity of the evaporator 22 of the MSA plating solution recovery system is 1.5h/m < 3 >, and the high-low liquid level alarm is more than 25m < 3 > and less than LL < 32m < 3 > when the plating solution circulating tank 20 works. The volume of the third countercurrent rinsing tank 24, the volume of the second countercurrent rinsing tank 25 and the volume of the first countercurrent rinsing tank 26 are 2.5m3,3m3 and 3.5m3.
A method for recovering tin methanesulfonate electroplating solution includes the following steps:
(1) Before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) The plating solution is prepared for recovery,
a. Opening a third deionized water valve 14, a second deionized water valve 15 and a first deionized water valve 16, filling a third countercurrent rinsing tank 27, a second countercurrent rinsing tank 28 and a first countercurrent rinsing tank 29 with deionized water, and closing the third deionized water valve 14, the second deionized water valve 15 and the first deionized water valve 16;
b. the first countercurrent rinsing tank 29 and the second countercurrent rinsing tank 28 are respectively added with 10L and 12LMSA stock solution through a first MSA raw material adding flow regulating valve 18 and a second MSA raw material adding flow regulating valve 17, so that the pH value is less than 1;
c. opening a valve, namely a first self-circulation spraying device liquid inlet valve 12, a first self-circulation spraying device pressure pump 22, a second self-circulation spraying device liquid inlet valve 11 and a second self-circulation spraying device pressure pump 21, starting self-circulation spraying devices in a second countercurrent rinsing tank 28 and a first countercurrent rinsing tank 29, uniformly mixing MSA added on the top, and washing the electroplating solution carried out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) Opening a first plating solution circulating pipeline first branch pipe valve 1, a second plating solution circulating pipeline first branch pipe valve 4 and an evaporator liquid taking pump 19 on a circulating pipeline between an evaporator 25 and a plating solution circulating tank 23, opening a deionized water flow regulating valve 13 above a third countercurrent rinsing tank 27, and setting the water supply amount to be 1.5h/m 3 Opening a plating solution reflux first reflux branch pipe valve 7 at the right end of the first reflux rinsing tank 29, running the unit, and keeping the MSA plating solution in a plating solution circulating tank recovery state;
(4) The production is continuously carried out, the generator normally works, when turbid matters are generated in the rinsing tank, the water quality is dirty, and the flow rate of flushing water needs to be increased in order to ensure the cleanness of the electroplated strip steel; closing a first reflux branch pipe valve 7 for the plating solution at the right end of a first countercurrent rinsing tank 29 to flow back, simultaneously opening a second reflux branch pipe valve 6 for the plating solution at the right end of the first countercurrent rinsing tank 29 to flow back, closing a first branch pipe valve 1 of a first plating solution circulating pipeline, a first branch pipe valve 4 of a second plating solution circulating pipeline and a liquid taking pump 19 of the evaporator on an evaporator 25 and a circulating pipeline between the evaporator and a plating solution circulating tank, opening a second branch pipe valve 2 of the first plating solution circulating pipeline, a second branch pipe valve 3 of the second plating solution circulating pipeline and a liquid taking pump 19 of the evaporator on the circulating pipeline between the evaporator 25 and the plating solution storing tank, wherein the plating solution is recovered in a state of recovering the plating solution storing tank, and the desalination water amount of a flow valve 13 is set to be 2m 3 /h；
(5) In production, the liquid taking valve 5 is opened, and the concentrated plating solution of 2m < 3 > is intermittently taken from the plating solution storage tank to the plating circulation tank through the liquid taking pump 20 to supplement the plating circulation tank with the lowering of the liquid level caused by the carrying-over of the plating solution.
(6) The flow valve 13 is reset to 1.5m for desalination after the rinsing water quality is clean and expensive 3 Closing a second reflux branch pipe valve 6 for refluxing the plating solution from the right end of the first countercurrent rinsing tank 29, opening a first reflux branch pipe valve 7 for refluxing the plating solution from the right end of the first countercurrent rinsing tank 29, closing the evaporator 25, a second branch pipe valve 2 of a first plating solution circulating pipeline on a circulating pipeline between the evaporator and a plating solution storage tank, closing a second branch pipe valve 3 of a second plating solution circulating pipeline and a liquid taking pump 19 of the evaporator, and opening the evaporator 25 and the first plating solution circulating pipeline on the circulating pipeline between the evaporator and the plating solution circulating tankA first branch valve 1 of the circulating pipeline, a first branch valve 4 of the second plating solution circulating pipeline and an evaporator liquid taking pump 19, and the plating solution recycling system is switched to a plating solution recycling tank recycling state.
(7) And after the production is finished, closing the deionized water flow regulating valve 13, opening the tapping valve 9 at the bottom of the second countercurrent rinsing tank and the tapping valve 10 at the bottom of the first countercurrent rinsing tank, putting the plating solution recovered from the second countercurrent rinsing tank 28 and the first countercurrent rinsing tank 29 into the plating solution storage tank, closing the tapping valve 9 at the bottom of the second countercurrent rinsing tank 28 and the tapping valve 10 at the bottom of the first countercurrent rinsing tank 29, opening the tapping valve 8 at the bottom of the third countercurrent rinsing tank 27, putting the water in the third countercurrent rinsing tank 27 into the waste water pit 26, closing the tapping valve 8 at the bottom of the third countercurrent rinsing tank, closing the evaporator 25, the evaporator liquid taking pump 19, the first plating solution circulating pipeline first branch valve 1 and the second plating solution circulating pipeline first branch valve 4, and finishing the operation of the plating solution recovery system.
It should be noted that the above-mentioned embodiments are not intended to limit the scope of the present invention, and all equivalent modifications and substitutions based on the above-mentioned technical solutions are within the scope of the present invention as defined in the claims.
Claims (2)
1. The device is characterized by comprising a plating solution rinsing system, a plating solution circulating tank, a plating solution storage tank, a waste water pit, a waste water discharge pipeline and an evaporator, wherein the waste water discharge pipeline is connected with the waste water pit; the plating solution rinsing system comprises a third countercurrent rinsing tank, a second countercurrent rinsing tank and a first countercurrent rinsing tank which are sequentially arranged from left to right and gradually reduced in height, the first countercurrent rinsing tank, the second countercurrent rinsing tank and the third countercurrent rinsing tank are connected through overflow holes, a first liquid discharge pipeline is arranged at the lower end of the first countercurrent rinsing tank, a second liquid discharge pipeline is arranged at the lower end of the second countercurrent rinsing tank, and a third liquid discharge pipeline is arranged at the lower end of the third countercurrent rinsing tank; the first liquid discharge pipeline, the second liquid discharge pipeline and the third liquid discharge pipeline are connected with the wastewater discharge pipeline and the fourth liquid discharge pipeline; a first deionized water inlet pipeline is arranged above the third countercurrent rinsing tank, the right end of the first countercurrent rinsing tank passes through a plating solution reflux main pipe, and the first reflux branch pipe and the second reflux branch pipe are connected with a plating solution circulating tank and a plating solution storage tank; the fourth liquid discharging pipeline is connected with the second return branch pipe and is positioned at the lower end of the first return branch pipe;
a deionized water flow regulating valve is arranged on the first deionized water inlet pipeline; a first countercurrent rinsing groove bottom tapping valve is arranged on the first tapping pipeline, a second countercurrent rinsing groove bottom tapping valve is arranged on the second tapping pipeline, and a third countercurrent rinsing groove bottom tapping valve is arranged on the third tapping pipeline; a first plating solution circulating pipeline first branch pipe is provided with a first plating solution circulating pipeline first branch pipe valve, a first plating solution circulating pipeline second branch pipe is provided with a first plating solution circulating pipeline second branch pipe valve, a second plating solution circulating pipeline first branch pipe is provided with a second plating solution circulating pipeline first branch pipe valve, a second plating solution circulating pipeline second branch pipe valve is arranged on a second plating solution circulating pipeline second branch pipe, and an evaporator liquid taking pump is arranged on a second plating solution circulating pipeline main pipe;
a second deionized water inlet pipeline is arranged above the third countercurrent rinsing tank; a first water feeding pipeline, a second water feeding pipeline and a third water feeding pipeline are arranged at the lower end of the second deionized water inlet pipeline, the third water feeding pipeline is arranged above a third countercurrent rinsing groove, the second water feeding pipeline is arranged above the second countercurrent rinsing groove, and the first water feeding pipeline is arranged above the first countercurrent rinsing groove; a first deionized water valve is arranged on the first water adding pipeline, a second deionized water valve is arranged on the second water adding pipeline, and a third deionized water valve is arranged on the third water adding pipeline;
the MSA stock solution feeding device comprises an MSA stock solution storage tank, a first MSA stock solution feeding pipeline and a second MSA stock solution feeding pipeline are arranged below the MSA stock solution storage tank, and the first MSA stock solution feeding pipeline is arranged above the first countercurrent rinsing tank; the second MSA stock solution feeding pipeline is arranged above the second countercurrent rinsing tank;
a first MSA raw material adding flow regulating valve is arranged on the first MSA stock solution feeding pipeline; a second MSA raw material adding flow regulating valve is arranged on the second MSA stock solution feeding pipeline; a first self-circulation spraying system is arranged above the first countercurrent rinsing tank, and the lower end of the first self-circulation spraying system is connected with a first liquid discharge pipeline;
the first self-circulation spraying system comprises a first circulation pipeline and a spraying device, the lower end of the first circulation pipeline is connected with a first liquid discharging pipeline, the upper end of the first circulation pipeline is connected with the spraying device, and a first self-circulation spraying device liquid inlet valve and a first self-circulation spraying device pressure pump are arranged on the first circulation pipeline;
a second self-circulation spraying system is arranged above the second countercurrent rinsing tank, and the lower end of the second self-circulation spraying system is connected with a second liquid discharging pipeline;
the second self-circulation spraying system comprises a second circulation pipeline and a spraying device, the lower end of the second circulation pipeline is connected with the second liquid discharging pipeline, the upper end of the second circulation pipeline is connected with the spraying device, and a second self-circulation spraying device liquid inlet valve and a second self-circulation spraying device pressure pump are arranged on the second circulation pipeline.
2. A method for recovering a tin methanesulfonate-based plating solution, characterized by using the recovery apparatus according to claim 1, the method comprising the steps of:
(1) Before production, valves and pumps of all plating solution recovery systems are in a closed state;
(2) The plating solution is prepared for recovery,
a. opening a third deionized water valve, a second deionized water valve and a first deionized water valve, filling the third countercurrent rinsing tank, the second countercurrent rinsing tank and the first countercurrent rinsing tank with deionized water, and closing the third deionized water valve, the second deionized water valve and the first deionized water valve;
b. adding MSA stock solution into a first countercurrent rinsing tank and a second countercurrent rinsing tank respectively through a first MSA raw material adding flow regulating valve and a second MSA raw material adding flow regulating valve, so that the pH value of the first countercurrent rinsing tank and the second countercurrent rinsing tank is less than 1;
c. opening a liquid inlet valve of a first self-circulation spraying device, a pressure pump of the first self-circulation spraying device, a liquid inlet valve of a second self-circulation spraying device and a pressure pump of the second self-circulation spraying device, starting the self-circulation spraying devices in a second countercurrent rinsing tank and a first countercurrent rinsing tank, uniformly mixing MSA added above, and washing the electroplating solution taken out from the steel plate to the maximum extent through a self-circulation spraying and cleaning function;
(3) Opening a first plating solution circulating pipeline first branch pipe valve, a second plating solution circulating pipeline first branch pipe valve and an evaporator liquid taking pump on a circulating pipeline between an evaporator and a plating solution circulating tank, opening a deionized water flow regulating valve above a third countercurrent rinsing tank, setting the supply water quantity, and opening a plating solution reflux first reflux branch pipe valve at the right end of the first countercurrent rinsing tank; the unit is operated, and MSA plating solution is in a plating solution circulating tank recovery state;
(4) When the liquid level of the plating solution circulating tank is higher, the plating solution circulating tank gives a high liquid level alarm and judges that a plating solution recovery system has a fault or the washing water quantity needs to be increased, a first reflux branch valve of plating solution at the right end of the first countercurrent rinsing tank is closed, a second reflux branch valve of plating solution at the right end of the first countercurrent rinsing tank is opened at the same time, a first branch valve of a first plating solution circulating pipeline on a circulating pipeline between the evaporator and the plating solution circulating tank and a first branch valve of a second plating solution circulating pipeline and an evaporator liquid taking pump on the circulating pipeline between the evaporator and the plating solution storage tank are closed, a second branch valve of the first plating solution circulating pipeline on the circulating pipeline between the evaporator and the plating solution storage tank and the second branch valve of the second plating solution circulating pipeline and the evaporator liquid taking pump are opened, and the plating solution is recovered in a plating solution storage tank;
(5) In production, a liquid taking valve is opened, and a certain volume of concentrated electroplating liquid is intermittently taken from a plating liquid storage tank through a liquid taking pump to an electroplating circulating tank to supplement the liquid level reduction of the electroplating circulating tank caused by the carrying-over of the electroplating liquid;
(6) After the failure of the plating solution recovery system is eliminated or the washing water amount is recovered to be normal, closing a second reflux branch pipe valve for the plating solution to flow back from the right end of the first countercurrent rinsing tank, opening a first reflux branch pipe valve for the plating solution to flow back from the right end of the first countercurrent rinsing tank, closing a second branch pipe valve of a first plating solution circulating pipeline on a circulating pipeline between the evaporator and the plating solution storage tank, closing the second branch pipe valve of the second plating solution circulating pipeline and a liquid taking pump of the evaporator, opening the first branch pipe valve of the first plating solution circulating pipeline on the circulating pipeline between the evaporator and the plating solution circulating tank, opening the first branch valve of the second plating solution circulating pipeline and the liquid taking pump of the evaporator, and converting the plating solution recovery system into a plating solution circulating tank recovery state;
(7) And after the production is finished, closing the deionized water flow regulating valve, opening a tapping valve at the bottom of the second countercurrent rinsing tank and a tapping valve at the bottom of the first countercurrent rinsing tank, putting the plating solution recovered from the second countercurrent rinsing tank and the first countercurrent rinsing tank into a plating solution storage tank, closing the tapping valve at the bottom of the second countercurrent rinsing tank and the tapping valve at the bottom of the first countercurrent rinsing tank, opening a tapping valve at the bottom of the third countercurrent rinsing tank, putting water in the third countercurrent rinsing tank into a waste water pit, closing the tapping valve at the bottom of the third countercurrent rinsing tank, closing the evaporator, the evaporator liquid taking pump, the first branch valve of the first plating solution circulating pipeline and the first branch valve of the second plating solution circulating pipeline, and finishing the operation of the plating solution recovery system.
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