CN110948071B - Brazing method of splicing-free rotary target - Google Patents
Brazing method of splicing-free rotary target Download PDFInfo
- Publication number
- CN110948071B CN110948071B CN201911155343.4A CN201911155343A CN110948071B CN 110948071 B CN110948071 B CN 110948071B CN 201911155343 A CN201911155343 A CN 201911155343A CN 110948071 B CN110948071 B CN 110948071B
- Authority
- CN
- China
- Prior art keywords
- brazing
- target
- tube
- temperature
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a brazing method of a splicing-free rotary target, which comprises the following steps: utilizing an ultrasonic welding head to perform high-frequency oscillation on brazing materials to enter the inner surface of the target tube and the outer surface of the back tube; mounting the target tube and the back tube on a positioning base, and connecting a brazing filler metal disc to the upper end part of the target tube; placing the assembled soldering device in an electric heating constant temperature blast drying oven, setting a temperature control heating curve through a temperature controller, and naturally cooling to room temperature after the heat preservation time is up; and after the whole set of device is cooled to room temperature, removing the residual brazing material on the brazing material disc by using a scraper, and dismantling the brazing material disc and the positioning base to obtain the rotary target material after brazing. The brazing method can solve the problem of large temperature difference between the target tube and the back tube in the heating process in the target brazing process; the brazing method is easy to control the heating rate, and can avoid the problem that the target material is cracked due to too fast heating.
Description
Technical Field
The invention relates to the technical field of target preparation, in particular to a brazing method of a splicing-free rotary target.
Background
The rotating target is a key material used in the sputter coating process. The rotary target needs to be arranged on a film plating machine for use, so a structure connected with the film plating machine needs to be processed for installation, the target material needs to be brazed on a stainless steel back tube or a titanium back tube because some materials are difficult to process complex structures, and the connecting structure is processed on the back tube to enable the back tube to be normally installed.
The prior art disclosed at present is a method for heating and brazing a target material and a back tube by using different heating modes; for example, CN109352109A, entitled apparatus and method for rotary target bonding, describes a method for target bonding by heating a backing tube with an oil bath. The method can solve the problem of heating uniformity, but only heats the back tube, and the temperature difference between the target tube and the back tube is too large.
In addition, for example, the publication number is CN110218983A, the patent name is a binding method of a magnetron sputtering rotating target, which describes that heating of a target and a back tube is performed by heating with a heating wire or induction heating, the target is easily cracked due to too fast heating rate, and the method can only bind materials which are spliced in multiple sections and have short length of a single section.
Brazing is generally expressed as binding by target manufacturing enterprises, and thus target brazing and target binding are synonymous in the technical field.
Disclosure of Invention
Technical problem to be solved
In order to solve the problems in the prior art, the invention provides a soldering method of a splicing-free rotary target, wherein the heating and soldering processes of the target, a back tube and a brazing solder are carried out in an electric heating constant-temperature air blowing drying box by using air blowing heating, so that the problems of heating rate and heating uniformity are solved, the target, the back tube and the brazing solder have no temperature difference, the heating rate is controllable, the size of an inner cavity can be selected according to the specification of the target, and the rotary target within 3m of a single section can be bound to the longest extent.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
a brazing method of a splicing-free rotary target comprises the following specific steps:
the method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: utilizing an ultrasonic welding head to enable brazing filler metal to enter the inner surface of the target tube and the outer surface of the back tube in a high-frequency oscillation mode, and enabling the inner surface of the target tube and the outer surface of the back tube to form a brazing filler metal layer;
step two: assembling the rotary target brazing device: mounting a target pipe and a back pipe on a positioning base, sleeving the target pipe on the back pipe, connecting a brazing filler metal disc to the upper end part of the target pipe, wherein a brazing filler metal discharge hole is formed in the brazing filler metal disc and is communicated with a brazing gap formed between the target pipe and the back pipe;
step three: adding brazing solder: calculating the theoretical weight of pi (ID) required for brazing according to the brazing gap formed between the target tube and the backing tube 1 2 -OD 2 2 )·L 1 ·ρ Solder /4000, wherein, ID 1 Is the inner diameter dimension, OD, of the target tube (10) 2 Is the outer diameter dimension, L, of the back tube (12) 1 Is the length dimension of the target tube (10),ρ solder Taking the brazing solder with the weight equal to the theoretical weight of 1.1 as the density of the brazing solder, and placing the brazing solder into the brazing solder tray in the second step;
step four: brazing: arranging the assembled soldering device in an electric heating constant-temperature air blowing drying box, and setting a temperature control heating curve through a temperature controller: the heating rate is controlled to be 5-10 ℃/min, the target temperature is as follows: 165-;
step five: cleaning residual brazing solder: and after the whole device is cooled to room temperature, removing the residual brazing material on the brazing material disc by using a scraper, and dismantling the brazing material disc and the positioning base to obtain the brazed rotary target material.
(III) advantageous effects
The invention has the beneficial effects that: 1. the brazing method can solve the problem of large temperature difference between the target tube and the back tube in the heating process in the target brazing (binding) process.
2. The brazing method is easy to control the heating rate, and can avoid the problem that the target material is cracked due to too fast heating.
3. Compared with the spliced target material, the target material prepared by the brazing method can reduce the discharge phenomenon of the target material in the using process, and the discharge phenomenon is easy to occur in the sputtering process of the target material due to the spliced gap of the spliced target material.
Drawings
FIG. 1 is a schematic view of a brazing apparatus according to the present invention;
fig. 2 is an exploded view of the positioning base and the solder plate in the mounted state.
Detailed Description
For a better understanding of the present invention, reference will now be made in detail to the present embodiments of the invention, which are illustrated in the accompanying drawings.
A brazing method of a splicing-free rotary target material is used for preparing the rotary target material with the specification of OD-ID Lmm, wherein the specification of a target tube 10 is OD 1 -ID 1 *L 1 mm, 12-gauge back tube OD 2 -ID 2 *L 2 mm, comprising the following specific steps:
the method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: utilizing an ultrasonic welding head to enable brazing materials to enter the inner surface of the target tube 10 and the outer surface of the back tube 12 in a high-frequency oscillation mode, enabling the inner surface of the target tube 10 and the outer surface of the back tube 12 to form a brazing material layer, only covering the surfaces with the brazing material layers on the inner surface of the target tube 10 and the outer surface of the back tube 12, and enabling a metallization treatment process which is well known to a person skilled in the art to be free of special limitation to be adopted;
step two: assembling the rotary target brazing device: mounting a target tube 10 and a back tube 12 on a positioning base 9, sleeving the target tube 10 on the back tube 12, connecting a brazing filler metal plate 11 to the upper end part of the target tube 10, wherein a brazing filler metal discharge hole is formed in the brazing filler metal plate 11 and is communicated with a brazing gap formed between the target tube 10 and the back tube 12;
step three: adding brazing solder: the theoretical weight required for brazing was calculated as the brazing gap formed between the target tube 10 and the backing tube 12, and the theoretical weight was pi (ID) 1 2 -OD 2 2 )·L 1 ·ρ Solder /4000, wherein, ID 1 Is the inner diameter dimension, OD, of the target tube (10) 2 Is the outer diameter dimension, L, of the back tube (12) 1 Is the length dimension of the target tube (10) (. rho) Solder Taking an integer as the density of the brazing material; placing brazing materials with the weight equal to 1.1 of the theoretical weight in the brazing material tray 11 in the second step, wherein the brazing materials are preferably indium metal, and indium is generally selected as a target brazing material in the industry;
step four: brazing: arranging the assembled brazing device in an electric heating constant-temperature air blowing drying box, and setting a temperature control heating curve: the heating rate is controlled to be 5-10 ℃/min, the target temperature is as follows: 165-; when the heating rate is more than 10 ℃/min, the oxide target material has poor self heat conduction, the surface of the target material and the interior of the target material generate large temperature difference, and the cracking phenomenon easily occurs, and when the heating rate is less than 5 ℃/min, the operation efficiency is too low. The target temperature is that the melting point of the brazing solder (indium) is 156 ℃, so the target temperature needs to be higher than 156 ℃, the fluidity of the brazing solder is improved along with the temperature rise, the fluidity of the brazing solder is poor after the brazing solder is melted at the temperature lower than 165 ℃, the brazing gap is difficult to fill, the surface of the brazing solder starts to be oxidized at the temperature higher than 175 ℃, the fluidity of the brazing solder is influenced, and the loss of the brazing solder is increased. The heat preservation time is fixed for 10min, and the brazing gap is ensured to be filled with brazing solder.
Step five: cleaning residual brazing solder: and after the whole set of device is cooled to room temperature, removing the residual brazing material on the brazing material disk 11 by using a scraper, and dismantling the brazing material disk 11 and the positioning base 9 to obtain the rotary target material after brazing.
As shown in fig. 1 and 2, the brazing device of the embodiment includes an electric heating constant temperature blast drying box 1, the electric heating constant temperature blast drying box 1 is of a door type structure, a hot air channel 6 and a heating chamber 14 are formed in the electric heating constant temperature blast drying box 1 through a partition plate, a temperature controller 2, a heating switch 3 and a blast switch 4 are arranged on the electric heating constant temperature blast drying box 1, the temperature controller 2 is used for setting a heating temperature rise curve, an air blower 7 is arranged on the electric heating constant temperature blast drying box 1, an air supply outlet of the air blower 7 is communicated with the hot air channel 6 of the electric heating constant temperature blast drying box 1, an air inlet 61 and an air return 62 are arranged on the partition plate at intervals, and a circulating hot air channel is formed among the air inlet 61, the heating chamber 14, the air return 62 and the hot air channel 6; the blower 7 is electrically connected with the blower switch 4; a positioning base 9 for fixing a target tube 10 and a back tube 12 and a solder disc 11 for adding solder are arranged in the electric heating constant temperature blast drying box 1, and the positioning base 9 is positioned in a heating chamber 14; when the target tube 10 and the back tube 12 are connected on the positioning base 9, the brazing filler metal plate 11 is connected with the upper end part of the target tube 10, and a brazing filler metal discharge hole on the brazing filler metal plate 11 is communicated with a brazing gap formed between the target tube 10 and the back tube 12 and used for supplying brazing filler metal; and a heating resistor 8 is arranged in the electric heating constant-temperature air blowing drying box 1, and the heating resistor 8 is electrically connected with the heating switch 3.
Furthermore, in order to know the temperature in the heating chamber 14 in real time, a thermocouple 13 is arranged on the heating chamber 14, and the thermocouple 13 is electrically connected with the temperature controller 2.
Further, in order to ensure the heat preservation effect of the electric heating constant temperature air blowing drying box 1, a heat preservation layer 5 is arranged on the inner wall of the electric heating constant temperature air blowing drying box 1.
Specifically, the positioning base 9 is provided with fixing grooves for fixing the target tube 10 and the back tube 12, and the size of the fixing grooves is matched and fixed with the outer diameter of the target tube 10 and the outer diameter of the back tube 12 at intervals.
Specifically, the brazing disc 11 is provided with a middle hole matched with the target tube 10 and the back tube 12, and the size of the middle hole is matched and fixed with the outer diameter of the target tube 10 and the outer diameter of the back tube 12 at intervals.
The temperature controller 2, the thermocouple 13, the blower 7, the blast switch 4, the heating switch 3 and the heating resistor 8 are purchased in the market, so that the design cost is low, and the cost is saved.
Example 1
Preparing a rotary ITO target material with the specification of OD149-ID125 × L850mm, wherein the specification of the target tube is OD 1 149-ID 1 135*L 1 800mm, back tube specification OD 2 133-ID 2 125*L 2 850mm。
The method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: and (3) utilizing an ultrasonic welding head to perform high-frequency oscillation on the brazing material to enter the surfaces of the target tube and the back tube to form a thin brazing material layer. The metallization process is not particularly limited, and metallization processes known to those skilled in the art may be used.
Step two: assembling the rotary target brazing device: and mounting the back tube and the target on a positioning base, and mounting the brazing filler metal disc on the upper end part of the target.
Step three: adding brazing solder: and (3) selecting metal indium as the brazing material, calculating the theoretical weight 2457g required by brazing according to the brazing gap, and placing the 2457 × 1.1 2703g of the brazing material into the brazing disc in the second step.
Step four: brazing: arranging the assembled soldering device in an electric heating constant temperature air blast drying box, and setting a temperature control heating curve: the heating rate is controlled at 5 ℃/min, the target temperature: keeping the temperature at 170 ℃ for 10min, closing the heating after the heat preservation time is up, and naturally cooling to room temperature along with the atmosphere of the box body.
Step five: cleaning residual brazing solder: and after the whole device is cooled to room temperature, removing the residual brazing material on the brazing material disc by using a scraper, and dismantling the brazing material disc and the positioning base to obtain the brazed rotary target material.
Example 2
Preparing a rotary niobium target material with the specification of OD145-ID 125L 1940mm, wherein the target tube has the specification of OD 1 145-ID 1 134.5*L 1 1900mm, back tube specification OD 2 133-ID 2 125*L 2 1940mm。
The method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: and (3) utilizing an ultrasonic welding head to perform high-frequency oscillation on the brazing material to enter the surfaces of the target tube and the back tube to form a thin brazing material layer. The metallization process is not particularly limited, and a metallization process known to those skilled in the art may be used.
Step two: assembling the rotary target brazing device: and mounting the back tube and the target on a positioning base, and mounting the brazing filler metal disc on the upper end part of the target.
Step three: adding brazing solder: and selecting metal indium as brazing flux, calculating the theoretical weight of the brazing flux required by brazing according to the brazing gap, namely 4369g, and putting the brazing flux with the weight of 4369 x 1.1-4806 g into the brazing disc in the second step.
Step four: brazing: arranging the assembled soldering device in an electric heating constant temperature air blast drying box, and setting a temperature control heating curve: the heating rate is controlled at 8 ℃/min, the target temperature: keeping the temperature at 175 ℃ for 10min, turning off the heating after the heat preservation time is up, and naturally cooling to room temperature along with the atmosphere of the box body.
Step five: and (4) cleaning residual brazing solder. And after the whole device is cooled to room temperature, removing the residual brazing material on the brazing material disc by using a scraper, and dismantling the brazing material disc and the positioning base to obtain the brazed rotary target material.
Example 3
Preparing a rotary silicon target material with the specification of OD146-ID125 × L1194mm, wherein the specification of the target tube is OD 1 146-ID 1 134.5*L 1 1150mm, back tube specification OD 2 133-ID 2 125*L 2 1194mm。
The method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: and (3) utilizing an ultrasonic welding head to perform high-frequency oscillation on the brazing material to enter the surfaces of the target tube and the back tube to form a thin brazing material layer. The metallization process is not particularly limited, and a metallization process known to those skilled in the art may be used.
Step two: assembling the rotary target brazing device: and mounting the back tube and the target on a positioning base, and mounting the brazing filler metal disc on the upper end part of the target.
Step three: adding brazing solder: and (3) selecting metal indium as brazing flux, calculating the theoretical weight required by brazing according to the brazing gap, namely 3532g, 1.1 g and 3885g of the brazing flux, and placing the brazing flux into the brazing disc in the second step.
Step four: brazing: arranging the assembled soldering device in an electric heating constant temperature air blast drying box, and setting a temperature control heating curve: the heating rate is controlled at 6 ℃/min, the target temperature: keeping the temperature at 170 ℃ for 10min, closing the heating after the heat preservation time is up, and naturally cooling to room temperature along with the atmosphere of the box body.
Step five: cleaning residual brazing solder: and after the whole device is cooled to room temperature, removing the residual brazing material on the brazing material disc by using a scraper, and dismantling the brazing material disc and the positioning base to obtain the brazed rotary target material.
The above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made according to the claims of the present invention should be covered by the present invention.
Claims (2)
1. The brazing method of the splicing-free rotary target is characterized by comprising the following specific steps of:
the method comprises the following steps: and (3) carrying out metallization treatment on the inner surface of the target tube and the outer surface of the back tube: utilizing an ultrasonic welding head to enable brazing solder to enter the inner surface of the target tube (10) and the outer surface of the back tube (12) in a high-frequency oscillation mode, and enabling the inner surface of the target tube (10) and the outer surface of the back tube (12) to form a brazing solder layer;
step two: assembling the rotary target brazing device: mounting a target pipe (10) and a back pipe (12) on a positioning base (9), sleeving the target pipe (10) on the back pipe (12), connecting a brazing filler metal plate (11) to the upper end part of the target pipe (10), wherein a brazing filler metal discharge hole is formed in the brazing filler metal plate (11) and is communicated with a brazing gap formed between the target pipe (10) and the back pipe (12);
step three: adding brazing solder: calculating the theoretical weight required by brazing according to the brazing clearance formed between the target tube (10) and the back tube (12), and placing brazing material with the weight equal to 1.1 of the theoretical weight into the brazing material tray (11) in the second step;
step four: brazing: placing the assembled soldering device in an electrothermal constant-temperature air-blowing drying oven, setting a temperature control heating curve through a temperature controller, preserving heat for 10min, closing heating after the heat preservation time is up, and naturally cooling to room temperature along with the atmosphere of the electrothermal constant-temperature air-blowing drying oven;
step five: cleaning residual brazing solder: when the whole set of device is cooled to room temperature, removing residual brazing material on the brazing material disc (11) by using a scraper, and dismantling the brazing material disc (11) and the positioning base (9) to obtain a brazed rotary target material;
the back tube (12) is higher than the target tube (10); the brazing material is metal indium, and the temperature control heating curve specifically comprises the following steps: the heating rate is controlled to be 5-10 ℃/min, and the target temperature is as follows: 165-175 ℃.
2. The brazing method of the splicing-free rotary target material according to claim 1, wherein the theoretical weight is calculated by: theoretical weight ═ pi (ID) 1 2 -OD 2 2 )·L 1 ·ρ Solder /4000, wherein, ID 1 Is the inner diameter dimension, OD, of the target tube (10) 2 Is the outer diameter dimension, L, of the back tube (12) 1 Is the length dimension of the target tube (10) (. rho) Solder Is the density of the braze.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911155343.4A CN110948071B (en) | 2019-11-22 | 2019-11-22 | Brazing method of splicing-free rotary target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911155343.4A CN110948071B (en) | 2019-11-22 | 2019-11-22 | Brazing method of splicing-free rotary target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110948071A CN110948071A (en) | 2020-04-03 |
| CN110948071B true CN110948071B (en) | 2022-07-26 |
Family
ID=69978167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911155343.4A Active CN110948071B (en) | 2019-11-22 | 2019-11-22 | Brazing method of splicing-free rotary target |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110948071B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118342057B (en) * | 2024-06-17 | 2024-09-17 | 江苏东玖光电科技有限公司 | Soldering device for splicing-free rotary target |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722902B (en) * | 2015-03-31 | 2016-08-03 | 常州特尔玛枪嘴有限公司 | A kind of novel soldering formula plasma electrode and manufacture method thereof |
| CN105779957B (en) * | 2016-03-22 | 2018-12-28 | 广西晶联光电材料有限责任公司 | A kind of back metal method of ITO target |
| CN106141494B (en) * | 2016-07-26 | 2018-02-23 | 江苏科技大学 | Solder and preparation method and soldering processes for soldering Mo Re alloys foil |
| CN106270866B (en) * | 2016-08-30 | 2018-08-21 | 常州苏晶电子材料有限公司 | A kind of welding method of rotation molybdenum target material |
| CN109518147A (en) * | 2018-12-08 | 2019-03-26 | 东曹(上海)电子材料有限公司 | A kind of production method of rotary target |
| CN110218983A (en) * | 2019-06-25 | 2019-09-10 | 杨晔 | The binding method of magnetron sputtering rotary target material |
| CN110408897B (en) * | 2019-08-13 | 2023-05-05 | 北京航大微纳科技有限公司 | Vertical binding device and binding method for rotary target |
| CN110373643B (en) * | 2019-08-21 | 2020-07-03 | 东莞市欧莱溅射靶材有限公司 | ITO (indium tin oxide) rotary target binding method |
| CN110408901B (en) * | 2019-08-21 | 2020-06-26 | 东莞市欧莱溅射靶材有限公司 | Method for pretreating inner wall of whole target tube bound by long tube rotating target by brush plating |
| CN110373647B (en) * | 2019-08-21 | 2020-06-19 | 东莞市欧莱溅射靶材有限公司 | Long tube rotating target binding method |
| CN110408899A (en) * | 2019-08-21 | 2019-11-05 | 东莞市欧莱溅射靶材有限公司 | A kind of binding method of plane ITO target |
-
2019
- 2019-11-22 CN CN201911155343.4A patent/CN110948071B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110948071A (en) | 2020-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110948071B (en) | Brazing method of splicing-free rotary target | |
| WO2020155540A1 (en) | Additive manufacturing device using combined resistance-induction heating of metal wire material | |
| EP2618086B1 (en) | Cold crucible induction melter integrating induction coil and melting furnace | |
| KR20080059281A (en) | Very long cylindrical sputtering target and method for manufacturing | |
| US20090272728A1 (en) | Cooking appliances using heater coatings | |
| WO2020233346A1 (en) | Process chamber and semiconductor processing device | |
| KR101513605B1 (en) | Shaft-equipped heater unit, and method for producing shaft-equipped heater unit | |
| CN110408897A (en) | A kind of vertical binding device and binding method of rotary target material | |
| CN110218983A (en) | The binding method of magnetron sputtering rotary target material | |
| US20240042687A1 (en) | Apparatus, system and method of operating an additive manufacturing nozzle | |
| JPH10251854A (en) | Heating element having diamond sealing material | |
| GB2558897B (en) | Wire dispenser | |
| US4609035A (en) | Temperature gradient furnace for materials processing | |
| EP2572013B1 (en) | Non-continuous bonding of sputtering target to backing material | |
| CN114507848A (en) | Method for improving sputtering rate of aluminum-tin-copper alloy coating | |
| CN211102021U (en) | Soldering device of splicing-free rotary target | |
| JP2001110885A (en) | Method and device for processing semiconductor | |
| JP3847920B2 (en) | Electrostatic adsorption hot plate, vacuum processing apparatus, and vacuum processing method | |
| CN104529180B (en) | The production method of a kind of electric heating lamina membranacea and the equipment of production | |
| CN113385766B (en) | High-temperature induction brazing device for ceramic matrix composite and carbon/carbon composite | |
| CN207704965U (en) | Electron tubes type microwave heating is by carbon stove | |
| CN207071495U (en) | A kind of glue rifle heater | |
| CN111390321B (en) | Bottom surface brazing device and method for stainless steel electric heating appliance | |
| CN111519185B (en) | Supersonic laser deposition device and method | |
| CN105728876B (en) | A kind of method realized heat conductive filament and connect with metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |