CN110931655A - Novel active organic light-emitting diode packaging structure capable of preventing extrusion - Google Patents
Novel active organic light-emitting diode packaging structure capable of preventing extrusion Download PDFInfo
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- CN110931655A CN110931655A CN201911192066.4A CN201911192066A CN110931655A CN 110931655 A CN110931655 A CN 110931655A CN 201911192066 A CN201911192066 A CN 201911192066A CN 110931655 A CN110931655 A CN 110931655A
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- groove
- diode
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- active organic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Abstract
The invention discloses a novel active organic light-emitting diode packaging structure capable of preventing extrusion, which comprises a packaging box, a box cover, a first sealing sleeve, a ball groove, a fixing block and a clamping groove, wherein a diode placing cavity is formed in the packaging box, an anode lead groove is formed in the diode placing cavity, the anode lead groove is fixedly connected with a lead bent pipe, a heat dissipation device is fixedly connected below the diode placing cavity, a groove is formed in the packaging box, a spring is fixedly connected in the groove, the other end of the spring is fixedly connected with the clamping block, the first sealing sleeve is fixedly connected on the left side surface of the box cover, the fixing block is fixedly connected on the box cover, and the clamping groove is formed in the fixing block. The novel active organic light-emitting diode packaging structure capable of preventing extrusion is provided with a box cover, a first sealing sleeve, a second sealing sleeve, a connecting rod, a ball and a ball groove, and can effectively prevent a light-emitting diode in a diode placing cavity from being extruded.
Description
Technical Field
The invention relates to the technical field of light emitting diode packaging structures, in particular to a novel active organic light emitting diode packaging structure capable of preventing extrusion.
Background
A diode is a semiconductor device that converts ac power to dc power. Typically it comprises a PN junction having two terminals, a positive and a negative terminal. The most important characteristic of a diode is one-way conductivity. In the circuit, current can only flow in from the anode and flow out from the cathode of the diode. The performance generally required by the rectification light-emitting diode is higher, precious metal is added in the rectification light-emitting diode to serve as a conductor, so the price is higher, the existing rectification light-emitting diode is basically the same as the package of the common diode and is packaged by a common plastic bag, but the sensitivity requirement of the rectification light-emitting diode is very high, the sensitivity of the rectification light-emitting diode can be influenced by collision, bending, impurity pollution and the like, and the rectification light-emitting diode is placed in a common hard box and is inconvenient to take out and use singly.
Diode packaging structure on the market causes the diode to collide each other at present, and sealing performance is poor, reduces life, and inconvenient carrying is not convenient for the inspection, is not convenient for the heat dissipation scheduling problem.
Disclosure of Invention
The invention aims to provide a novel active organic light-emitting diode packaging structure capable of preventing extrusion, and aims to solve the problems that diodes in the current diode packaging structure in the market provided by the background technology collide with each other, the sealing performance is poor, the service life is shortened, the carrying is inconvenient, the inspection is inconvenient, and the heat dissipation is inconvenient.
In order to achieve the purpose, the invention provides the following technical scheme: a novel active organic light-emitting diode packaging structure capable of preventing extrusion comprises a packaging box, a box cover, a first sealing sleeve, a ball groove, a fixing block and a clamping groove, wherein a diode placing cavity is formed in the packaging box, an anode lead groove is formed in the diode placing cavity, a lead bent pipe is fixedly connected with the anode lead groove, a cathode lead groove is formed in the diode placing cavity, an external anode lead groove is formed in the packaging box, an external cathode lead groove is formed in the side edge of the external anode lead groove, a flexible plate is fixedly connected with the side edge of the diode placing cavity, a heat dissipation device is fixedly connected below the diode placing cavity, and the heat dissipation device is arranged on the side edge of the diode placing cavity,
a groove is formed in the packaging box, a spring is fixedly connected in the groove, and the other end of the spring is fixedly connected with a clamping block;
the improved paint spraying box is characterized in that a first seal sleeve is fixedly connected to the left side face of the box cover, a second seal sleeve is fixedly connected to the right side face of the box cover, a ball groove is formed in the second seal sleeve, balls are distributed in the ball groove, the balls are connected with the connecting rod in a laminating mode, a pigment pattern glass plate is embedded in the box cover, a fixed block is fixedly connected to the box cover, and a clamping groove is formed in the fixed block.
Preferably, three groups of the diode placing cavity, the anode lead groove, the cathode lead groove, the outer anode lead groove, the outer cathode lead groove, the flexible plate and the heat dissipation device are arranged in the packaging box at equal intervals.
Preferably, the positive lead groove is connected with an external positive lead groove through a lead bent pipe, the negative lead groove is connected with an external negative lead groove through a lead bent pipe, and the lead bent pipe, the first sealing sleeve and the second sealing sleeve are made of insulating materials.
Preferably, heat abstractor includes the air-out net, places chamber, pivot, first bearing, second bearing, flabellum, air inlet net, the chamber is placed to the below fixedly connected with of air-out net, place intracavity fixedly connected with pivot, the first bearing of top fixedly connected with of pivot, the below fixedly connected with second bearing of pivot, fixedly connected with flabellum in the pivot, the below fixed connection of second bearing is on the air inlet net.
Preferably, the rotating shaft, the first bearing and the second bearing constitute a rotating structure.
Preferably, the number of the pigment coating glass plates embedded in the box cover is the same as that of the diode placing cavities, and the pigment coating glass plates are opposite to the central positions of the diode placing cavities.
Preferably, the position of the groove formed in the packaging box and the position of the fixed block fixedly connected to the box cover are both arranged at the center.
Preferably, the depth of the groove is the same as the length of the fixed block, the length of the clamping block is the same as the depth of the clamping groove, and the length of the clamping groove from the lower end face of the fixed block is the same as the height of the clamping block from the groove.
Preferably, the connecting rod, the ball and the ball groove constitute a rotating structure.
Compared with the prior art, the invention has the beneficial effects that: this prevent extruded novel active organic electroluminescent diode packaging structure:
1. the LED packaging box is provided with a diode placing cavity, an anode lead groove, a cathode lead groove, an external anode lead groove, an external cathode lead groove, a flexible plate and a heat dissipation device, wherein three groups of the diode placing cavity, the anode lead groove, the cathode lead groove, the external anode lead groove, the external cathode lead groove, the flexible plate and the heat dissipation device are arranged in the packaging box at equal intervals, and a plurality of groups of LEDs can be placed at the same time, so that the LED packaging box is convenient to store and manage;
2. the LED packaging structure is provided with an anode lead groove, a cathode lead groove, an external anode lead groove and an external cathode lead groove, wherein the anode lead groove is connected with the external anode lead groove through a lead bent pipe;
3. be provided with first seal cover and second seal cover and seal the sealed save of the inside emitting diode of encapsulation box, increase of service life reduces cost of maintenance.
4. Be provided with heat abstractor including going out the air net, placing chamber, pivot, first bearing, second bearing, flabellum, take a breath in the effect through first bearing, second bearing and flabellum to dispel the heat.
5. The light-emitting diode placing cavity is provided with the box cover, the first sealing sleeve, the second sealing sleeve, the connecting rod, the balls and the ball grooves, so that the light-emitting diode in the diode placing cavity can be effectively prevented from being extruded.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic view of the connection structure of the positive lead groove and the external positive lead groove of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation device according to the present invention.
FIG. 4 is an enlarged view of the part A structure of the present invention
In the figure: 1. packaging the box; 2. a diode placement cavity; 3. a positive lead groove; 4. a lead bending pipe; 5. a negative lead groove; 6. an external positive lead groove; 7. an external negative lead groove; 8. a flexible board; 9. a heat sink; 10. a groove; 11. a spring; 12. a buckling block; 13. a box cover; 14. a first seal cartridge; 15. a second seal cartridge; 16. a connecting rod; 17. a ball bearing; 18. a ball groove; 19. a pigment coated glass plate; 20. a fixed block; 21. a snap groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a novel active organic light-emitting diode packaging structure capable of preventing extrusion comprises a packaging box 1, a diode placing cavity 2, an anode lead groove 3, a lead bent pipe 4, a cathode lead groove 5, an external anode lead groove 6, an external cathode lead groove 7, a flexible plate 8, a heat dissipation device 9, a groove 10, a spring 11, a buckling block 12, a box cover 13, a first sealing sleeve 14, a second sealing sleeve 15, a connecting rod 16, a ball 17, a ball groove 18, a pigment pattern glass plate 19, a fixing block 20 and a buckling groove 21, wherein the packaging box 1 is internally provided with the diode placing cavity 2, the diode placing cavity 2 is provided with the anode lead groove 3, the anode lead groove 3 is fixedly connected with the lead bent pipe 4, the diode placing cavity 2 is provided with the cathode lead groove 5, the packaging box 1 is provided with the external anode lead groove 6, the side edge of the external anode lead groove 6 is provided with the external cathode lead groove 7, the side fixedly connected with flexbile plate 8 of cavity 2 is placed to the diode, the below fixedly connected with heat abstractor 9 of cavity 2 is placed to the diode, heat abstractor 9 includes air-out net 801, places chamber 802, pivot 803, first bearing 804, second bearing 805, flabellum 806, air inlet net 807, the below fixedly connected with of air-out net 801 places chamber 802, place fixedly connected with pivot 803 in the chamber 802, the top fixedly connected with first bearing 804 of pivot 803, the below fixedly connected with second bearing 805 of pivot 803, the below fixedly connected with of second bearing 805 is on air inlet net 807, fixedly connected with flabellum 806 on the pivot 803, first bearing 804 and second bearing 805 constitute revolution mechanic, and air inlet net 807 blows in the outside air, reaches air-out net 801 fast through flabellum 806, exchanges with the gas in cavity 2 is placed to the diode, thereby dissipating heat, three groups of the diode placing cavity 2, the anode lead groove 3, the cathode lead groove 5, the external anode lead groove 6, the external cathode lead groove 7, the flexible plate 8 and the heat dissipating device 9 are arranged in the packaging box 1 at equal intervals, a plurality of groups of light emitting diodes can be placed at the same time, thereby facilitating the storage and management, wherein,
a groove 10 is formed in the packaging box 1, a spring 11 is fixedly connected in the groove 10, and a clamping block 12 is fixedly connected to the other end of the spring 11;
the left side surface of the box cover 13 is fixedly connected with a first sealing sleeve 14, the right side surface of the box cover 13 is fixedly connected with a second sealing sleeve 15, the anode lead groove 3 is connected with an external anode lead groove 6 through a lead bent pipe 4, the cathode lead groove 5 is connected with an external cathode lead groove 7 through a lead bent pipe 4, the first sealing sleeve 14 and the second sealing sleeve 15 are made of insulating materials, the anode and the cathode of the light-emitting diode can be respectively placed, the distinguishing is convenient and the damage is not easy to occur, the second sealing sleeve 15 is provided with a ball groove 18, balls 17 are distributed in the ball groove 18, the balls 17 are jointed and linked with a connecting rod 16, a pigment layer glass plate 19 is embedded on the box cover 13, the number of the pigment layer glass plates 19 embedded on the box cover 13 is the same as that of the diode placing cavities 2, and the pigment layer glass plate 19 is right opposite to the central position of the diode placing cavities 2, the light-emitting diode packaging box is convenient to observe the working condition of the light-emitting diode, the box cover 13 is fixedly connected with a fixing block 20, a clamping groove 21 is formed in the fixing block 20, the depth of the groove 10 is equal to that of the fixing block 20, the length of the clamping block 12 is equal to that of the clamping groove 21, the clamping groove 21 is free from being equal to the height of the clamping block 12 from the groove 10 from the lower end of the fixing block 20, the clamping block 12 can be tightly connected with the clamping groove 21, the packaging box 1 and the box cover 13 are tightly fixed, and the light-emitting diode in the diode placing cavity 2 is prevented from being extruded.
The working principle is as follows: when the novel active organic light-emitting diode packaging structure for preventing extrusion is used, firstly, the device is simply known, the light-emitting diode is placed into a diode placing cavity 2, then the anode and the cathode of the light-emitting diode are respectively placed into an anode lead groove 3 and a cathode lead groove 5, the anode lead groove 3 is connected with an external anode lead groove 6 through a lead bent pipe 4, the cathode lead groove 5 is connected with an external cathode lead groove 7 through a lead bent pipe 4, a lead can be connected to the outside, the two leads are prevented from being collided and rubbed in the transportation process to cause damage, the cost is reduced, external air is blown in by an air inlet net 807, the external air rapidly reaches an air outlet net 801 through a fan blade 806 and is exchanged with air in the diode placing cavity 2, the heat dissipation is carried out in the diode placing cavity 2, the damage of the light-emitting diode due to overhigh temperature is prevented, and a buckling block 12 is tightly connected with a buckling groove, the packaging box 1 and the box cover 13 are tightly fixed to prevent the light emitting diode in the diode placing cavity 2 from being extruded, and the flexible plate 8 can prevent the light emitting diode from being damaged due to violent shaking in the diode placing cavity 2.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a prevent extruded novel active organic electroluminescent diode packaging structure, includes encapsulation box (1), lid (13), first seal cover (14), ball groove (18), fixed block (20) and buckle groove (21), its characterized in that: the LED packaging box is characterized in that a diode placing cavity (2) is arranged in the packaging box (1), an anode lead groove (3) is formed in the diode placing cavity (2), a lead bent pipe (4) is fixedly connected with the anode lead groove (3), a cathode lead groove (5) is formed in the diode placing cavity (2), an outer anode lead groove (6) is formed in the packaging box (1), an outer cathode lead groove (7) is formed in the side edge of the outer anode lead groove (6), a flexible plate (8) is fixedly connected with the side edge of the diode placing cavity (2), and a heat dissipation device (9) is fixedly connected below the diode placing cavity (2),
a groove (10) is formed in the packaging box (1), a spring (11) is fixedly connected in the groove (10), and a clamping block (12) is fixedly connected to the other end of the spring (11);
the utility model discloses a paint spraying device, including lid (13), fixedly connected with first seal cover (14) on the left surface of lid (13), fixedly connected with second seal cover (15) on the right flank of lid (13), ball groove (18) have been seted up on second seal cover (15), ball (17) have been laid in ball groove (18), ball (17) and connecting rod (16) laminating are linked, it is equipped with pigment picture layer glass board (19) to inlay on lid (13), fixedly connected with fixed block (20) on lid (13), buckle groove (21) have been seted up on fixed block (20).
2. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: three groups of diode placing cavities (2), anode lead grooves (3), cathode lead grooves (5), external anode lead grooves (6), external cathode lead grooves (7), flexible plates (8) and heat dissipation devices (9) are arranged in the packaging box (1) at equal intervals.
3. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: the positive lead groove (3) is connected with an external positive lead groove (6) through a lead bent pipe (4), the negative lead groove (5) is connected with an external negative lead groove (7) through the lead bent pipe (4), and the lead bent pipe (4), the first sealing sleeve (14) and the second sealing sleeve (15) are made of insulating materials.
4. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: heat abstractor (9) are including air-out net (801), place chamber (802), pivot (803), first bearing (804), second bearing (805), flabellum (806), air inlet net (807), the below fixedly connected with of air-out net (801) places chamber (802), place fixedly connected with pivot (803) in chamber (802), the first bearing of top fixedly connected with (804) of pivot (803), below fixedly connected with second bearing (805) of pivot (803), fixedly connected with flabellum (806) on pivot (803), the below fixed connection of second bearing (805) is on air inlet net (807).
5. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 4, wherein: the rotating shaft (803), the first bearing (804) and the second bearing (805) form a rotating structure.
6. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: the number that the lid (13) is inlayed and is equipped with pigment coating glass board (19) is the same with the quantity that the chamber (2) was placed to the diode, just pigment coating glass board (19) are just right the central point that the chamber (2) was placed to the diode puts.
7. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: the position of a groove (10) formed in the packaging box (1) and the position of a fixing block (20) fixedly connected to the box cover (13) are both arranged at the center.
8. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: the depth of the groove (10) is the same as that of the fixed block (20), the length of the buckling block (12) is the same as that of the buckling groove (21), and the length of the buckling groove (21) from the lower end face of the fixed block (20) is the same as that of the buckling block (12) from the groove (10).
9. The novel active organic electroluminescent diode encapsulation structure for preventing extrusion as claimed in claim 1, wherein: the connecting rod (16), the balls (17) and the ball grooves (18) form a rotating structure.
10. The use of the novel active organic electroluminescent diode packaging structure for preventing squeezing as claimed in claim 1, wherein: when the novel active organic light-emitting diode packaging structure for preventing extrusion is used, firstly, the device is simply known, the light-emitting diode is placed into a diode placing cavity 2, then the anode and the cathode of the light-emitting diode are respectively placed into an anode lead groove 3 and a cathode lead groove 5, the anode lead groove 3 is connected with an external anode lead groove 6 through a lead bent pipe 4, the cathode lead groove 5 is connected with an external cathode lead groove 7 through a lead bent pipe 4, a lead can be connected to the outside, the two leads are prevented from being collided and rubbed in the transportation process to cause damage, the cost is reduced, external air is blown in by an air inlet net 807, the external air rapidly reaches an air outlet net 801 through a fan blade 806 and is exchanged with air in the diode placing cavity 2, the heat dissipation is carried out in the diode placing cavity 2, the damage of the light-emitting diode due to overhigh temperature is prevented, and a buckling block 12 is tightly connected with a buckling groove, make encapsulation box 1 and lid 13 closely fixed, prevent that the emitting diode that the diode placed the intracavity 2 from receiving the extrusion, simultaneously flexbile plate 8 can prevent that emitting diode from placing the intracavity 2 acutely rocking and damaging at the diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911192066.4A CN110931655A (en) | 2019-11-28 | 2019-11-28 | Novel active organic light-emitting diode packaging structure capable of preventing extrusion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911192066.4A CN110931655A (en) | 2019-11-28 | 2019-11-28 | Novel active organic light-emitting diode packaging structure capable of preventing extrusion |
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| Publication Number | Publication Date |
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| CN110931655A true CN110931655A (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911192066.4A Withdrawn CN110931655A (en) | 2019-11-28 | 2019-11-28 | Novel active organic light-emitting diode packaging structure capable of preventing extrusion |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111668702A (en) * | 2020-07-06 | 2020-09-15 | 曹小妮 | New energy power generation device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207985557U (en) * | 2017-12-14 | 2018-10-19 | 深圳市晶鑫晨光电科技有限公司 | A kind of light-emitting diode encapsulation structure |
| CN209127337U (en) * | 2018-11-09 | 2019-07-19 | 南通升辉机械有限公司 | A kind of logistics transportation case of light emitting diode |
-
2019
- 2019-11-28 CN CN201911192066.4A patent/CN110931655A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207985557U (en) * | 2017-12-14 | 2018-10-19 | 深圳市晶鑫晨光电科技有限公司 | A kind of light-emitting diode encapsulation structure |
| CN209127337U (en) * | 2018-11-09 | 2019-07-19 | 南通升辉机械有限公司 | A kind of logistics transportation case of light emitting diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111668702A (en) * | 2020-07-06 | 2020-09-15 | 曹小妮 | New energy power generation device |
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Application publication date: 20200327 |