CN208058455U - A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell - Google Patents
A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell Download PDFInfo
- Publication number
- CN208058455U CN208058455U CN201820692137.1U CN201820692137U CN208058455U CN 208058455 U CN208058455 U CN 208058455U CN 201820692137 U CN201820692137 U CN 201820692137U CN 208058455 U CN208058455 U CN 208058455U
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- Prior art keywords
- boron
- glass shell
- silicon glass
- light
- seal ring
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Abstract
The utility model discloses a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell, including high-boron-silicon glass shell, the side outer wall of the high-boron-silicon glass shell is provided with lamp cap, and the one end of lamp cap far from high-boron-silicon glass shell is provided with binding post, the binding post is socketed with plastic nut close to the outer surface of lamp cap, the one end of the binding post far from plastic nut is provided with power supply wiring, the power supply wiring is coated with rubber fastener close to the outer surface of binding post, the inside of the high-boron-silicon glass shell offers luminous inner cavity, and the inner cavity that shines is internally provided with the first fixed seal ring, second fixed seal ring and glass stem.In the utility model, the radiating efficiency of device is improved, and lamps and lanterns service life extends, and can carry out position adjustment to light source or move, and also can carry out mobile placement at any time to light-emitting LED device according to the needs of greenhouse, structure novel has good practicability.
Description
Technical field
The utility model is related to light-emitting LED technical fields, especially design a kind of 180 ° of hairs of direct insertion high-boron-silicon glass shell
Light LED matrix structure.
Background technology
Common light-emitting LED device form is various, chipset have single group, double groups and multigroup, shape have round, ellipse,
It is rectangular etc., belong to fixed suspension type or positioning formula, position adjustment cannot be carried out because of the change of environment or is moved.It is answering
It when for various different light sources, because of the fixation of position, cannot arbitrarily place, a position can only be fixed on and used, being not achieved can
With the mobile effect placed, inconvenience is brought to the use of light-emitting LED device.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and the direct insertion high boron of one kind proposed
180 ° of light-emitting LED devices of silica glass shell.
To achieve the goals above, the utility model uses following technical solution:
A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell, including high-boron-silicon glass shell, the high borosilicate
The side outer wall of glass shell is provided with lamp cap, and the one end of lamp cap far from high-boron-silicon glass shell is provided with binding post, described
Binding post is socketed with plastic nut close to the outer surface of lamp cap, and the one end of the binding post far from plastic nut is provided with power supply and connects
Line, the power supply wiring are coated with rubber fastener close to the outer surface of binding post, and the inside of the high-boron-silicon glass shell is opened
Equipped with luminous inner cavity, and the inner cavity that shines is internally provided with the first fixed seal ring, the second fixed seal ring and glass stem, institute
It states the first fixed seal ring and centre in the second fixed seal ring and glass stem is set, and the first fixed seal ring and second solid
Determine to be provided with semiconductor wafer between sealing ring, the glass stem is installed with close to one end of the first fixed seal ring and connects
Line plate.
Preferably, the specification of the high-boron-silicon glass shell is Φ 45-65mm.
Preferably, the one end of the power supply wiring far from binding post is installed with plug.
Preferably, power supply guide wire is provided between the terminal plate and semiconductor wafer.
Preferably, the quantity of the semiconductor wafer is six.
Preferably, six semiconductor wafers are fixed as by first fixed seal ring and the second fixed seal ring
180 ° of light-emitting LED devices.
Compared with prior art, the utility model has the beneficial effects that:
1, in the utility model, cross-ventilation is conducive to by space sufficient in the high-boron-silicon glass shell of setting and is dissipated
Heat reduces light decay, improves the radiating efficiency of device, extends lamps and lanterns service life;
2, in the utility model, by the first fixed seal ring of setting and the second fixed seal ring by multigroup semiconductor die
Piece is fixed as 180 ° of light-emitting LED devices, and formation can carry out position adjustment or carry out mobile light source, while also can be according to greenhouse
It needs, carries out mobile placement at any time;
To sum up, the radiating efficiency of device is improved, lamps and lanterns service life extend, to light source can carry out position adjustment or into
Row movement also can carry out light-emitting LED device at any time mobile placement according to the needs of greenhouse, and structure novel has real well
The property used.
Description of the drawings
Fig. 1 be the utility model proposes the structures of direct insertion 180 ° of light-emitting LED devices of high-boron-silicon glass shell a kind of show
It is intended to;
Fig. 2 be the utility model proposes a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell in high borosilicate
The anatomy view of glass shell.
In figure:1 high-boron-silicon glass shell, 2 lamp caps, 3 binding posts, 4 plastic nuts, 5 power supply wirings, 6 rubber are tight
Firmware, 7 plugs, 8 luminous inner cavities, 9 first fixed seal rings, 10 second fixed seal rings, 11 glass stems, 12 half are led
Body chip, 13 terminal plates, 14 power supply guide wires.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1-2, a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell, including high-boron-silicon glass shell
1, the side outer wall of high-boron-silicon glass shell 1 is provided with lamp cap 2, and the one end of lamp cap 2 far from high-boron-silicon glass shell 1 is provided with
Binding post 3, binding post 3 are socketed with plastic nut 4 close to the outer surface of lamp cap 2, and the one end of binding post 3 far from plastic nut 4 is set
It is equipped with power supply wiring 5, power supply wiring 5 is coated with rubber fastener 6 close to the outer surface of binding post 3, high-boron-silicon glass shell 1
Inside offers luminous inner cavity 8, and the inner cavity 8 that shines is internally provided with the first fixed seal ring 9,10 and of the second fixed seal ring
Glass stem 11, the first fixed seal ring 9 is arranged in the centre of the second fixed seal ring 10 and glass stem 11, and first fixes
Semiconductor wafer 12 is provided between sealing ring 9 and the second fixed seal ring 10, glass stem 11 is close to the first fixed seal ring 9
One end be installed with terminal plate 13.
The specification of high-boron-silicon glass shell 1 is Φ 45-65mm, and the one end of power supply wiring 5 far from binding post 3 is installed with
Plug 7 is provided with power supply guide wire 14 between terminal plate 13 and semiconductor wafer 12, the quantity of semiconductor wafer 12 is 6, the
Six semiconductor wafers 12 are fixed as 180 ° of light-emitting LED devices by one fixed seal ring 9 and the second fixed seal ring 10.
Operation principle:High-boron-silicon glass shell 1 and lamp cap 2 constitute the placement space of light source, meanwhile, high-boron-silicon glass shell
Sufficient space is conducive to cross-ventilation heat dissipation in 1, reduces light decay, improves the radiating efficiency of device, extends lamps and lanterns service life,
4 pairs of posts 3 of plastic nut is reinforced, and plug 7 is connected with power supply using power supply wiring 5, is carried for the work of light-emitting component
For electric power, rubber fastener 6 plays protection to the interface of power supply wiring 5, the first fixed seal ring being arranged in the inner cavity 8 that shines
9 and second fixed seal ring 10 multigroup semiconductor wafer 12 is fixed as 180 ° of light-emitting LED devices, formation can carry out position adjustment
Or mobile light source is carried out, while also mobile placement can be carried out at any time, glass stem 11 is conductive, wiring according to the needs of greenhouse
Power supply guide wire 14 on plate 13 light emission operation that maintains device in parallel with semiconductor wafer 12, in the utility model, device
Radiating efficiency is improved, and lamps and lanterns service life extends, and can carry out position adjustment to light source or move, also can be according to greenhouse
Needs, carry out mobile placement at any time to light-emitting LED device, structure novel has good practicability.
The preferable specific implementation mode of the above, only the utility model, but the scope of protection of the utility model is not
Be confined to this, any one skilled in the art within the technical scope disclosed by the utility model, according to this practicality
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell, including high-boron-silicon glass shell (1), feature exists
In the side outer wall of the high-boron-silicon glass shell (1) is provided with lamp cap (2), and lamp cap (2) is far from high-boron-silicon glass shell
(1) one end is provided with binding post (3), and the binding post (3) is socketed with plastic nut (4), institute close to the outer surface of lamp cap (2)
It states the one end of binding post (3) far from plastic nut (4) and is provided with power supply wiring (5), the power supply wiring (5) is close to binding post
(3) outer surface is coated with rubber fastener (6), and the inside of the high-boron-silicon glass shell (1) offers luminous inner cavity (8),
And shine inner cavity (8) be internally provided with the first fixed seal ring (9), the second fixed seal ring (10) and glass stem (11),
First fixed seal ring (9) setting is in the centre of the second fixed seal ring (10) and glass stem (11), and first fixes
It is provided with semiconductor wafer (12) between sealing ring (9) and the second fixed seal ring (10), the glass stem (11) is close to the
One end of one fixed seal ring (9) is installed with terminal plate (13).
2. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell according to claim 1, which is characterized in that
The specification of the high-boron-silicon glass shell (1) is Φ 45-65mm.
3. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell according to claim 1, which is characterized in that
The one end of the power supply wiring (5) far from binding post (3) is installed with plug (7).
4. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell according to claim 1, which is characterized in that
It is provided with power supply guide wire (14) between the terminal plate (13) and semiconductor wafer (12).
5. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell according to claim 1, which is characterized in that
The quantity of the semiconductor wafer (12) is six.
6. a kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell according to claim 5, which is characterized in that
Six semiconductor wafers (12) are fixed as 180 ° of hairs by first fixed seal ring (9) and the second fixed seal ring (10)
Light LED matrix.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820692137.1U CN208058455U (en) | 2018-05-10 | 2018-05-10 | A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820692137.1U CN208058455U (en) | 2018-05-10 | 2018-05-10 | A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell |
Publications (1)
Publication Number | Publication Date |
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CN208058455U true CN208058455U (en) | 2018-11-06 |
Family
ID=63982076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820692137.1U Expired - Fee Related CN208058455U (en) | 2018-05-10 | 2018-05-10 | A kind of 180 ° of light-emitting LED devices of direct insertion high-boron-silicon glass shell |
Country Status (1)
Country | Link |
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CN (1) | CN208058455U (en) |
-
2018
- 2018-05-10 CN CN201820692137.1U patent/CN208058455U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181106 Termination date: 20190510 |
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CF01 | Termination of patent right due to non-payment of annual fee |