CN110923761B - Spraying electroplating system - Google Patents
Spraying electroplating system Download PDFInfo
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- CN110923761B CN110923761B CN201911369657.4A CN201911369657A CN110923761B CN 110923761 B CN110923761 B CN 110923761B CN 201911369657 A CN201911369657 A CN 201911369657A CN 110923761 B CN110923761 B CN 110923761B
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- electroplating
- spray
- plating solution
- spray gun
- nozzle
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Abstract
The invention discloses a spray electroplating system, which comprises an electroplating box, a plating solution box and an electroplating power supply device, wherein a spray gun array consisting of a plurality of spray guns is arranged in the electroplating box, the liquid inlet ends of the spray guns in the spray gun array are connected to the liquid outlet ends of the same or different plating solution boxes through plating solution conveying pipelines, a pumping device is arranged on the plating solution conveying pipelines, the flow, the temperature and the direction of plating solution sprayed out by each spray gun in the spray gun array are adjustable, an anode device and a material to be plated are respectively detachably fixed in the electroplating box, and the anode device and the material to be plated are respectively and electrically connected with the anode and the cathode of the electroplating power supply device. The remarkable effects are as follows: the flow, the temperature and the direction of the plating solution in the nozzle are controlled, so that the plating layer thickness is uniform, and the component proportion and the plating layer uniformity of the electroplating alloy material are accurately controlled.
Description
Technical Field
The invention relates to the technical field of electronic product electroplating equipment, in particular to a spraying electroplating system.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
However, the conventional electroplating techniques have drawbacks:
for alloy material electroplating, because the plating solution contains a plurality of metal cations which have high and low price points, and the movement speeds of ions with different price points in the plating solution, the supplement speeds of anodes, the deposition speeds on cathodes and the like are completely different, the components or the proportion of an alloy plating layer after electroplating are difficult to accurately control in the traditional electroplating mode, and the component proportion of the plating layer in the field of integrated circuits is particularly important;
after the electroplating solution is configured, along with the progress of an electroplating process, various components and concentrations in the electroplating solution are dynamically changed, the quality of an electroplating coating is changed along with the change of the electroplating solution, and the components and the concentrations of the electroplating solution cannot be timely adjusted midway, so that the electroplating solution needs to be replaced when the electroplating reaches a certain degree, the electroplating efficiency is influenced, and the electroplating quality cannot be guaranteed;
when the traditional electroplating process needs to increase the electroplating speed, the mode of increasing the voltage between electrodes to increase the current density is usually adopted, but if the current density is too high, the workpiece is easy to be blackened or burnt, the plating layer is easy to have the problems of pits, pinholes, looseness and the like, and if the current density is too low, the covering capacity of the electrolyte is influenced, the plating leakage or the non-plating condition occurs, and meanwhile, the magnitude of the current density is closely related to the concentration of the plating solution, so that the control on the current has high requirements.
Therefore, it is desirable to design an electroplating system to solve the above problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a spraying electroplating system, which enables the sprayed plating solution to form current through an applied electric field, metal ions in the plating solution are deposited on a material to be plated to form a surface coating, and the flow, the temperature and the direction of the plating solution in a nozzle are controlled, so that the purposes of uniform coating thickness and accurate control of the component proportion of an electroplating alloy material and the uniformity of the coating are achieved.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a spray electroplating system, includes electroplating box, plating solution case and electroplating power supply unit, its key lies in: the electroplating device comprises an electroplating box, wherein a spray gun array consisting of a plurality of spray guns is arranged in the electroplating box, the liquid inlet end of each spray gun in the spray gun array is connected to the liquid outlet end of the same or different electroplating boxes through a plating solution conveying pipeline, a pumping device is arranged on the plating solution conveying pipeline, the flow, temperature and direction of the plating solution sprayed out of each spray gun in the spray gun array are adjustable, an anode device and a material to be plated are detachably fixed in the electroplating box respectively, and the anode device and the material to be plated are electrically connected with the anode and the cathode of an electroplating power supply device respectively.
Furthermore, the spray gun comprises a liquid conveying pipe and a nozzle, one end of the liquid conveying pipe is communicated with the liquid inlet end of the spray gun, the other end of the liquid conveying pipe is connected with the nozzle, a flow control device is arranged on the liquid conveying pipe, and a temperature control device and a direction adjusting device are arranged on the nozzle.
Furthermore, flow control device is including setting firmly in two piece at least piezoceramics pieces on the transfer line lateral wall, just piezoceramics piece is in evenly distributed on the transfer line lateral wall, piezoceramics piece can take place deformation and extrusion according to the outside signal of telecommunication the transfer line takes place deformation.
Further, the direction adjusting device is arranged closer to the liquid outlet end of the nozzle than the temperature control device.
Furthermore, the temperature control device comprises at least one electric heater attached to the outer side wall of the nozzle, and a temperature sensor matched with the electric heater is arranged at the liquid outlet end of the nozzle.
Further, the electric heater adopts an automatic constant temperature type PTC heater, and the temperature sensor adopts a Pt1000 temperature sensor.
Furthermore, the direction adjusting device comprises a plurality of first electrode plates and a plurality of second electrode plates, the first electrode plates and the second electrode plates are respectively arranged on two opposite sides of the nozzle, and the first electrode plates and the second electrode plates are respectively and correspondingly connected to the positive electrode and the negative electrode of the external power supply.
Further, the nozzle is made of heat conducting materials.
Further, a liquid outlet is formed in the bottom of the electroplating box, a liquid outlet pipe is connected to the liquid outlet, and the other end of the liquid outlet pipe is connected with a plating solution recycling box.
Furthermore, a pressurizing device is also arranged on the plating solution conveying pipeline and is positioned between the pumping device and the spray gun array.
When the system is used for electroplating production, the nozzles are arranged in an array mode, each nozzle can be independently controlled through an external signal, and different numbers of nozzles can be selectively controlled according to the area or the area of a plated plate for spray electroplating, so that the proportion of various components can be very accurately controlled in the electroplating of alloy materials, and the waste of plating solution materials is effectively avoided; meanwhile, the piezoelectric ceramic piece in the flow control device can be controlled through an external electric signal to deform and extrude the pipeline, so that the regulation of the flow of the plating solution sprayed by the nozzle can be realized, and the spraying amount and the spraying speed of the plating solution can be controlled very accurately by the piezoelectric ceramic control mode, so that great help is provided for the uniformity of the plating layer and the control of various components and proportions in the electroplating of alloy materials; in addition, the direction adjusting device and the temperature control device additionally arranged on the spray gun can further accurately control the trend of the plating solution, the temperature of the plating solution and the like, and the final effect and quality of electroplating are ensured.
The invention has the following remarkable effects:
1. the spray gun array consisting of a plurality of spray guns is adopted to carry out spray combination, each metal ion can be separately and independently sprayed with the plating solution, and the flow of the spray gun spraying the plating solution is accurately controlled, so that the electroplating process is strictly carried out according to the alloy proportion, the defect that the cost or proportion of the electroplated alloy plating layer is difficult to accurately control due to metal cations with different prices is overcome, the accuracy of the plating layer components and the alloy proportion is greatly improved, the electroplating quality of different batches is very stable, and the phenomenon of unstable electroplating quality due to the cations with different prices is avoided;
2. the system adopts the external plating solution tank, has high flexibility when plating solution needs to be replaced, namely, the plating solution tank filled with corresponding plating solution can be directly replaced, and the corresponding plating solution tank can be selected and used in a switching valve mode to realize the replacement of the plating solution, so that the long-term continuous stability of various components and concentrations in the plating solution can be maintained, the waste is not easy to form, and the system has better help for the uniformity of an alloy plating layer after the alloy material is electroplated and the plating layer components and the alloy proportion;
3. through the temperature control device arranged on the spray gun, when the plating solution flows through the spray gun, the plating solution can be heated, and the temperature can be accurately controlled, so that the system saves the complexity of an external heating device when the special electroplating production needing heating is carried out, and the quality of the plating layer is ensured through the accurate control of the temperature;
4. the system can accurately control the current density only by controlling the flow of the plating solution in the spray gun through the flow control device, thereby ensuring the quality of an electroplating coating and effectively avoiding the uncontrollable phenomenon of the electroplating speed in the traditional electroplating process;
5. the anode device of the system adopts insoluble anode materials, an anode activator is not needed to be used in the plating solution, the plating layer deposited at the cathode is completely formed by the crystallization of metal ions in the plating solution, and the configuration and control mode of the plating solution are simplified;
6. the system adopts a continuous liquid spraying mode, plating solution quickly and instantly finishes metal ion movement under the action of an electric field and then flows to the electroplating box body along the electrode, the plating solution flows back to the plating solution recovery box through a pipeline in the electroplating box body, the recovered plating solution can be used as new plating solution after being simply added, the concentration of the plating solution can be continuously and stably kept, stirring is not needed, the use is more convenient, and the defect that a stirring device is required to be arranged in the traditional electroplating process for ensuring the uniform distribution of the plating solution state is overcome.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of the lance;
FIG. 3 is a schematic structural view of embodiment 2 of the present invention;
fig. 4 is a block diagram of the control system of the present invention.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
Example 1:
as shown in fig. 1, a spray electroplating system comprises an electroplating tank 1, a plating tank 2 and an electroplating power supply device 3, wherein a spray gun array composed of a plurality of spray guns 4 is arranged in the electroplating tank 1, the liquid inlet ends of the spray guns 4 in the spray gun array are connected to the liquid outlet end of the plating tank 2 through a plating solution conveying pipeline 5, a pumping device 6 is arranged on the plating solution conveying pipeline 5, a pressurizing device 7 is also arranged on the plating solution conveying pipeline 5, the pressurizing device 7 is positioned between the pumping device 6 and the spray gun array, the flow, temperature and direction of the plating solution sprayed by each spray gun 4 in the spray gun array are adjustable, an anode device 8 and a material 9 to be plated are respectively detachably fixed in the electroplating tank 1, and the anode device 8 and the material 9 to be plated are respectively electrically connected with the anode and the cathode of the electroplating power supply device 3; a liquid outlet is further formed in the bottom of the electroplating box 1, a liquid outlet pipe 10 is connected to the liquid outlet, the other end of the liquid outlet pipe 10 is connected with a plating solution recycling box 11, and a liquid discharge pump 12 is configured on the liquid outlet pipe 10.
The spray guns 4 are arranged in an array mode, each spray gun 4 can be independently controlled through an external signal, the spray guns 4 with different quantities can be selectively controlled according to the area or the area size of a plated plate to carry out spray electroplating, so that the uniformity of a plated layer can be ensured, the proportion of various components can be controlled very accurately in the electroplating of alloy materials, and the waste of plating solution materials is effectively avoided.
Referring to fig. 2, the spray gun 4 includes a liquid pipe 41 and a nozzle 42, one end of the liquid pipe 41 is connected to the liquid inlet end of the spray gun 4, the other end of the liquid pipe 41 is connected to the nozzle 42, a flow control device 43 is disposed on the liquid pipe 41, a temperature control device 44 and a direction adjustment device 45 are disposed on the nozzle 42, and the direction adjustment device 45 is disposed closer to the liquid outlet end of the nozzle 42 than the temperature control device 44 for better controlling the direction of the sprayed plating solution.
Specifically, flow control device 43 is including setting firmly in a plurality of piezoceramics pieces on the transfer line 41 lateral wall, just piezoceramics piece is in evenly distributed on the transfer line 41 lateral wall, piezoceramics piece can take place deformation and extrusion according to the external signal of telecommunication transfer line 41 takes place deformation.
When voltage acts on the piezoelectric ceramic, mechanical deformation is generated along with the change of the voltage and the frequency, so that the piezoelectric ceramic piece in the flow control device 43 can respond according to an external electric signal, and the piezoelectric ceramic piece can deform and extrude the infusion tube 41 according to the external electric signal, so that the sectional area of the infusion tube 41 is changed, and the spraying amount and the spraying speed of the plating solution in the nozzle 42 can be controlled very accurately.
Preferably, the temperature control device 44 includes a plurality of electric heaters 44a attached to the outer side wall of the nozzle 42, and a temperature sensor 44b matched with the electric heaters 44a is disposed at the liquid outlet end of the nozzle 42 (the temperature sensors 44b with different control accuracy can be configured according to the requirement of the control accuracy of the plating solution temperature).
In this embodiment, the electric heater 44a is preferably an automatic constant temperature type PTC heater, which is called a PTC heater, and is composed of a PTC ceramic heating element and an aluminum tube. The PTC heating element has the advantages of small thermal resistance and high heat exchange efficiency, is an automatic constant-temperature and power-saving electric heater, and is characterized in that the surface of the electric heating tube heater does not turn red under any application condition on the safety performance, so that potential safety hazards such as scalding and fire disasters are caused.
When the plating solution is heated, the nozzle 42 is made of an aluminum material or a copper material having a good thermal conductivity, and is bonded with the PTC heater 44a by high-temperature glue, so that the flowing plating solution can be heated by the heat conduction of the pipe after the PTC heater is heated when the power is turned on.
In this embodiment, the temperature sensor 44b is preferably a Pt1000 temperature sensor. The Pt1000 temperature sensor can show different resistance values according to different environmental temperatures, the reaction precision can reach +/-0.05 ℃, and a simple single chip microcomputer control system is externally connected to carry out power on and power off control on the PTC heating sheet, so that accurate temperature control from the environmental temperature to the temperature of 100 ℃ can be realized on the part of the nozzle 42.
In this embodiment, the direction adjusting device 45 includes a plurality of first electrode plates and a plurality of second electrode plates, the first electrode plates and the second electrode plates are respectively disposed on two opposite sides of the nozzle 42, and the first electrode plates and the second electrode plates are respectively and correspondingly connected to the positive electrode and the negative electrode of the external power source.
A certain electric field is applied between the first electrode plate and the second electrode plate, so that the plating solution with charges is influenced by the electric field to deflect to different degrees, and the deflection direction of the plating solution can be accurately controlled by adjusting the electric field intensity (refer to the principle of an ink-jet printer). Meanwhile, the anode and the cathode of the power supply can be alternately changed to deflect the plating solution in different directions, so that the double-sided plating of the planar plate can be conveniently realized, and the double-sided plating can be realized without adopting a rotating device to drive the plate to be plated to rotate or turn over the plate like the traditional technology.
Example 2:
as shown in fig. 3, the difference between this embodiment and embodiment 1 is that the liquid inlet end of each spray gun 4 in the spray gun array is connected to the liquid outlet end of a different plating solution tank 2 through a plating solution delivery pipe 5, that is, the liquid inlet end of a part of spray guns 4 is connected to a plating solution tank i, the liquid inlet end of a part of spray guns 4 is connected to a plating solution tank ii, and the liquid inlet end of a part of spray guns 4 is connected to a plating solution tank iii, plating solutions of different types of metal cations are respectively contained in the plating solution tanks i, ii, and iii, and the different spray guns 4 are selectively controlled to perform spray electroplating by individually controlling each spray gun 4, that is, each type of metal ions is separately sprayed with the plating solution individually by a spray combination method, and the flow control is assisted by the spray gun 4, so that the precision of plating layer components and alloy proportion is realized.
It should be noted that the system can perform electroplating processing on a planar plate (such as a ceramic wafer, a silicon wafer, etc. commonly used for integrated circuits), and can also perform electroplating on a wire after a rotating device is additionally arranged on a material to be plated 9.
In the implementation process of the system, in order to facilitate the unified control of each part and realize the automatic management of electroplating production, a control circuit shown in fig. 4 may be adopted, specifically, the control circuit includes a controller, a signal input end of the controller is connected to the temperature sensor 44b, a signal output end group of the controller is respectively connected to the pumping device 6, the pressurizing device 7, the flow control device 43, the temperature control device 44, the direction adjusting device 45 and the liquid discharge pump 12, and meanwhile, a control signal of the controller may also control the on-off of the electroplating power supply device 3, so that the whole electroplating process is automatically controlled and managed.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. The utility model provides a spray electroplating system, includes electroplating box, plating solution case and electroplating power supply unit, its characterized in that: a spray gun array consisting of a plurality of spray guns is arranged in the electroplating box, the liquid inlet end of each spray gun in the spray gun array is connected to the liquid outlet end of the same or different electroplating boxes through a plating solution conveying pipeline, a pumping device is arranged on the plating solution conveying pipeline, the flow, the temperature and the direction of the plating solution sprayed out by each spray gun in the spray gun array are adjustable, an anode device and a material to be plated are detachably fixed in the electroplating box respectively, and the anode device and the material to be plated are electrically connected with the anode and the cathode of an electroplating power supply device respectively;
the spray gun comprises a liquid conveying pipe and a spray nozzle, one end of the liquid conveying pipe is communicated with the liquid inlet end of the spray gun, the other end of the liquid conveying pipe is connected with the spray nozzle, the liquid conveying pipe is provided with a flow control device, and the spray nozzle is provided with a temperature control device and a direction adjusting device;
the direction adjusting device comprises a plurality of first electrode plates and a plurality of second electrode plates, the first electrode plates and the second electrode plates are respectively arranged on two opposite sides of the nozzle, and the first electrode plates and the second electrode plates are respectively and correspondingly connected to the positive electrode and the negative electrode of the external power supply.
2. The spray plating system of claim 1, wherein: flow control device is including setting firmly in two piece at least piezoceramics pieces on the transfer line lateral wall, just piezoceramics piece is in evenly distributed on the transfer line lateral wall, piezoceramics piece can take place deformation and extrusion according to the outside signal of telecommunication the transfer line takes place deformation.
3. The spray plating system of claim 1, wherein: the direction adjusting device is arranged closer to the liquid outlet end of the nozzle than the temperature control device.
4. The spray plating system of claim 1, wherein: the temperature control device comprises at least one electric heater attached to the outer side wall of the nozzle, and a temperature sensor matched with the electric heater is arranged at the liquid outlet end of the nozzle.
5. The spray plating system of claim 4, wherein: the electric heater adopts an automatic constant temperature type PTC heater, and the temperature sensor adopts a Pt1000 temperature sensor.
6. The spray plating system of any of claims 2 to 5, wherein: the nozzle is made of heat conducting materials.
7. The spray plating system of claim 1, wherein: a liquid outlet is also formed in the bottom of the electroplating box, a liquid outlet pipe is connected to the liquid outlet, and the other end of the liquid outlet pipe is connected with a plating solution recycling box.
8. The spray plating system of claim 1, wherein: and a pressurizing device is also arranged on the plating solution conveying pipeline and is positioned between the pumping device and the spray gun array.
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| CN201911369657.4A CN110923761B (en) | 2019-12-26 | 2019-12-26 | Spraying electroplating system |
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| CN201911369657.4A CN110923761B (en) | 2019-12-26 | 2019-12-26 | Spraying electroplating system |
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| CN110923761A CN110923761A (en) | 2020-03-27 |
| CN110923761B true CN110923761B (en) | 2022-01-11 |
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| CN113026080A (en) * | 2021-04-25 | 2021-06-25 | 山王电子(无锡)有限公司 | Special nickel plating solution nozzle for electroplating production line |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS56158891A (en) * | 1980-05-10 | 1981-12-07 | Nippon Steel Corp | Electrolytic treatment of strip metallic plate |
| US4364801A (en) * | 1981-06-29 | 1982-12-21 | Northern Telecom Limited | Method of an apparatus for selectively surface-treating preselected areas on a body |
| CN1174249A (en) * | 1996-08-16 | 1998-02-25 | 柯建信 | Jet electroplating method |
| EP1055020A2 (en) * | 1998-02-12 | 2000-11-29 | ACM Research, Inc. | Plating apparatus and method |
| JP3501747B2 (en) * | 2000-10-26 | 2004-03-02 | 秀行 小林 | Plating solution jet nozzle system with adjustable flow rate of plating equipment |
| CN101255594B (en) * | 2007-12-07 | 2010-06-23 | 东莞洲亮通讯科技有限公司 | Electroplating production technique and equipment |
| CN201141053Y (en) * | 2007-12-07 | 2008-10-29 | 东莞洲亮通讯科技有限公司 | Sealing fountain type environment-protection electroplating apparatus |
| DE102009029551B4 (en) * | 2009-09-17 | 2013-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for galvanic coating of substrates |
| CN102330126B (en) * | 2011-09-13 | 2013-10-16 | 南京航空航天大学 | Method and device for machining multilayer film by using multiple jet-electrodeposition |
| CN103255452B (en) * | 2013-05-03 | 2016-02-24 | 中国人民解放军装甲兵工程学院 | A kind of selective metal electric deposition device and application thereof |
| KR20190108033A (en) * | 2018-11-01 | 2019-09-23 | 주식회사 지씨이 | Vertical continuous plating apparatus |
| CN110552053A (en) * | 2019-10-18 | 2019-12-10 | 广东坤川实业有限公司 | Automatic water-plating device of inner loop and flow control |
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