200806815 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電鑄設備，特別是關於一種將待電 鑄之電鑄基材施以電鑄程序之不溶解性陽極之斜置式旋轉 陰極電禱設備。 【先前技術】 隨著微製作技術的進步，微電鑄技術有越來越廣泛的 應用，如微小金屬元件和微型模具上的製作等。這些微型 結構廣泛應用於光學元件、精密機械和塑膠微流道元件上 的製作上。不同於以往的精密電鑄技術，微電鑄技術通常 有小電流、小的電流密度和高深寬比的結構等特性。微電 鑄技術除了電鑄液的配方外，最重要的即是應用不同機構 單元設計之電鑄設備所使用的電鑄方法。微電鑄通常牽扯 到在許多高伸寬比的微盲孔中電鑄出均勻的金屬結構，這 些物理現象包括了電鑄液的濃度質量傳遞、整流器的電場 控制、電每液的流場分佈、電结液的潤濕性、接觸角和電 鑄液的成分等參數，若想要得到一份優良的電鑄產品，除 了電鑄液的特性與成分外，良好的電鑄設備亦是不可或缺 的重要因素。 而一般電鑄設備之結構，請參閱第一圖所示，係顯示 習知掛鍍式電鑄設備將電鑄基材電鑄之示意圖。如圖中所 示，習知掛鍍式電鑄設備1係具備一容置有預定比例電鑄 液L之電鑄槽10，該電鑄槽10包括有一溶解性陽極11、 200806815 斜置式旋轉陰極導電板 — 極導電板！2之待雷心币〃、一尨合在該斜置式旋轉陰 鑄時，該溶解性陽極U則㊃…料基材2欲電 子沿-傳導方則會使電子與料液中的金屬離 合吸引1口 ，，该斜置式旋轉陰極導電板12則200806815 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to an electroforming apparatus, and more particularly to an inclined rotating cathode of an insoluble anode in which an electroforming substrate to be electroformed is subjected to an electroforming process. Electric prayer equipment. [Prior Art] With the advancement of micro-fabrication technology, micro-electro-casting technology has become more and more widely used, such as the production of tiny metal components and micro-die. These miniature structures are widely used in the fabrication of optical components, precision machinery and plastic microchannel components. Unlike conventional precision electroforming technology, microelectroforming technology usually has characteristics such as small current, small current density, and high aspect ratio structure. In addition to the formulation of electroforming fluids, the micro-electroforming technology is the electroforming method used in electroforming equipment using different institutional unit designs. Micro-electroforming is usually involved in the electroforming of uniform metal structures in many high-blind, micro-blind holes. These physical phenomena include the mass transfer of the electroforming solution, the electric field control of the rectifier, and the flow field distribution of the liquid. If the wettability of the electrocalyx, the contact angle and the composition of the electroforming liquid are required, if you want to obtain an excellent electroforming product, in addition to the characteristics and composition of the electroforming liquid, good electroforming equipment is not available. An important factor that may be lacking. The structure of the general electroforming equipment, as shown in the first figure, shows a schematic diagram of electroforming of an electroformed substrate by a conventional electroplating electroforming device. As shown in the figure, the conventional electroplating electroforming apparatus 1 is provided with an electroforming tank 10 containing a predetermined ratio of electroforming liquid L, the electroforming tank 10 including a soluble anode 11, 200806815 oblique rotating cathode Conductive plate - very conductive plate! 2 Waiting for the 心 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 斜 斜 斜 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解 溶解1 port, the inclined rotating cathode conductive plate 12 is
曰及引该電子與該金屬 MJ 附著在該祕Ai^ 使_子_金屬離子均 亥电“基材2，以完成電鑄的動作。曰 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引 引
【發明内容】 本發明所欲解決之技術問題： 陽極在值、#自 綠備亦有許多缺失，例如該溶解性 和在傳¥該電子與該金屬離子時，因為沒有辅助 ^動的喷m使電鑄液料不均或電場分佈不均，进 ^斜置式旋轉陰極導電板無法則丨到全部的電子與金屬 離子’使得電禱在電鑄基材之電鑄金屬不均句。再者二 了電鑄該電鑄基材，該溶解性陽極亦會逐漸的消解掉^ 必須經常補充該轉性陽極，增加制置成本及使 更換次數。 而為了改善上述缺失，已有許多業者設計出了許多辦 加其電鑄效能之電鑄設備，例如在中華 : 明公告編號第―中即揭露出一種電二報= 法是將矽晶圓置於陰極，電鑄槽中之電鑄液由管路吸入 後，經幫浦加壓在送至噴流孔喷入電鑄内槽中，電鑄液流 到陰極附近，透過溢流孔位置流至外槽。電源供應器連= 到陽極和陰極提供電流。此種電鑄設備對於一般淺結構可 200806815 有效完成金屬沉積，改善 物之缺失，但對於高二二:，均勻咖 易排除，料產生中空孔祠的問題。、、。構，部有氫氣泡不 5932076 m ^ ^ ^樘光碟杈仁電鑄設備， 加埶器、丨W声#、f σ V、日出该儲存槽中放置 ~狀、、、工過幫浦加壓後，經 陽極網間，補充因雷U麻圓盤式的陰極和 極由弓二= 降低之離子濃度。圓盤式陰 柽由馬達讀旋轉，藉以增加電鑄 是陰極利用旋轉，而來增加金屬沉積=此種方法 令、L 却几傾々的均句性，但對於 同冰見比之結構仍有氫氣泡不易去除之問題。 國專:第外62=f ΓΓ出另一 圓電_f，如美 糾部於 遽中’石夕晶圓以錢鑛機、蒸鑛機、無電 =賴反應等方法覆設上一層金屬電轉種子層後，以夹 /、固疋於支#層，並以f線接地作為陰極。訊 據電鑄種子層和陽極間的電阻值輸入訊號至處理哭，^理 器計算出陰陽間適當的距離後，輸人訊號難 制升降機構至適當的高度。此電鑄系統之所以採 離的設計方式是因為電鑄種子層很薄，電阻大，因而電屢 的屋降很大’使得陰極和陽極的電場不均勻，此為該結構 之缺點。 以上的習知技術之實施例，均是將欲電鑄之電鑄基材 置於陰極，若石夕晶圓表面無高深寬比的孔洞結構，此種電 鑄槽之設計是很適當的。其陰極所產生的氫氣可以旋轉^ 200806815 用種離:力^法趕走氫氣，但在高深μ之微盲孔 易帶離，造成:=:朝下’氫氣較電鑄液輕，非常不 了包鑄的針孔問題。 門題亦有業者針對高深寬比之結構產生氫氣泡之SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is that the anode has many defects in the value, #自绿备, for example, the solubility and when the electron and the metal ion are transferred, because there is no auxiliary spray In order to make the electroforming liquid material uneven or the electric field distribution uneven, the tilting type rotating cathode conductive plate can not reach all the electrons and metal ions', so that the electric cast metal in the electroformed substrate is not uniform. Furthermore, the electroformed substrate is electroformed, and the dissolved anode is gradually eliminated. ^ The rotating anode must be frequently replenished to increase the manufacturing cost and the number of replacements. In order to improve the above-mentioned shortcomings, many manufacturers have designed many electroforming equipments that can be used for their electroforming performance. For example, in China: The announcement number of the announcement reveals an electric second report. At the cathode, the electroforming liquid in the electroforming tank is sucked by the pipeline, and is pressurized by the pump and sent to the jet orifice to be injected into the electroforming inner tank. The electroforming liquid flows to the vicinity of the cathode and flows out through the overflow hole position. groove. The power supply is connected to the anode and cathode to supply current. Such an electroforming device can effectively complete metal deposition for the general shallow structure 200806815, and the improvement is lacking, but for the high two: two, the uniform coffee is easily excluded, and the material has a problem of hollow pores. ,,. Structure, there are hydrogen bubbles not 5932076 m ^ ^ ^ 樘 杈 杈 电 电 electroforming equipment, twisting device, 丨 W sound #, f σ V, sunrise in the storage tank placed ~ shape,, work over the pump plus After pressing, through the anode mesh, the ion concentration of the cathode and the pole of the Ray U-disc type is reduced. The disc-type haze is read and rotated by the motor, so that the electroforming is to increase the metal deposition by the cathode, and the metal deposition is the same as that of the method, but the structure is still similar to the ice. Hydrogen bubbles are not easy to remove. National specialties: the outer 62=f ΓΓ another round _f, such as the United States in the 遽中' Shixi wafer with a gold mining machine, steaming machine, no electricity = Lai reaction, etc. After the layer, it is clamped/fixed to the support layer and grounded with f line as the cathode. According to the resistance value between the electroforming seed layer and the anode, the signal is input to the processing cry, and after the appropriate distance between the yin and the yang is calculated, the input signal is difficult to raise the lifting mechanism to an appropriate height. The design of the electroforming system is based on the fact that the electroforming seed layer is very thin and the electric resistance is large, so that the electric house is greatly reduced, which makes the electric field of the cathode and the anode uneven, which is a disadvantage of the structure. In the above embodiments of the prior art, the electroformed substrate to be electroformed is placed on the cathode. If the surface of the stone wafer has no high aspect ratio pore structure, the design of the electroforming groove is suitable. The hydrogen produced by the cathode can be rotated ^200806815. The hydrogen is removed by the seed: force method, but the micro-blind hole in the high-depth μ is easy to be separated, causing: =: downwards, the hydrogen is lighter than the electroforming solution, and it is not very good. Cast pinhole problem. There are also manufacturers who generate hydrogen bubbles for high aspect ratio structures.
與-調整槽，：電::構電沉積設備，至少包含-電鑄槽 實施電叙f it 能财晶圓及其料導體基板 陰極上方馬達’由馬達帶動陰極旋轉； 孔洞中喷向陰極，電轉亦由陽極的微细 和控制電鑄液的加敎Γ。 附雜質的弱電解裝置 喷入高深寬比微亡2。雖然此種結構能使電禱液輕易的 效率，伸且^、=中’輕易的去除氯氣泡和增加電鑄的 ―、'、、α構硬雜，若陽極欲更 間及有拆卸的困難度’造成使用者的困擾 :::=二式，ΐ端之陽極將電鑄液喷向陰極':並 關俜，、還::二‘動，猎以將氫氣泡帶離，但因為結構的 關係通疋會有部分的氫氣泡無法排除。 電鍵治具包括一底座 線路單元、一密封環與 中即新輯應卿號 ……：固電鑛治具，用以承載-晶圓，該晶圓 該底座具有一承载環用 山、丁衣人一上盍， 底座内… 1載L ’該線路單元位於該 …n 早70適於與該晶圓電性連接，該密封環配 置在晶圓與該承载環夕网iV _ _ ' ^日 鈿该線路單元與該晶圓接觸 200806815 之部分密封於該密封環、該晶圓及底座之間，以及該上蓋 配置於該承載環上方，以將該晶圓固定於該承載環上方。 因此，本發明之主要目的即是提供一種具備斜置式 結構之電鑄設備，並輔以一馬達帶動斜置式旋轉陰極導 電板旋轉，以使斜置式旋轉陰極導電板所產生的氫氣可 有效的排除並結合一種作為不溶解性陽極之陽極多孔網 板之電鑄設備，以藉由一電鑄液喷射機構所產生的電鑄 液流，以廣流方式穿透過該陽極多孔網板。 本發明解決問題之技術手段： 本發明為解決習知技術之問題所採用之技術手段係在 於一種不溶解性陽極之斜置式旋轉陰極電鑄設備，包括一 容置有電鑄液之電鑄槽、一設置於該電鑄槽内之斜置式旋 轉陰極導電板、一具備一電鑄液流入口與一電鑄液流出口 之電鑄液傳輸管路、一具備有多個電鑄液喷射元件之電鑄 液喷射機構、一裝設在該電鑄液喷射元件與該斜置式旋轉 陰極導電板間之陽極多孔網板與一分別電性連接於該陽極 多孔網板與該斜置式旋轉陰極導電板之電流傳導回路。該 斜置式旋轉陰極導電板結合一待電鑄之電鑄基材。該電鑄 液流入口係連通該電鑄槽之選定位置。該電鑄液流出口係 連通該電鑄液喷射元件。當待電鑄之電鑄基材欲電鑄時， 該電每槽之電每液自該電轉液輸入口流至連通该電每液輸 出口之各電鑄液喷射元件，該電鑄液噴射元件產生一電鑄 液流往該陽極多孔網板喷射，該電鑄液流藉由該陽極多孔 200806815 ^反解離錢子與金屬料，該電子藉由前流傳導回路 *至及斜置式旋轉陰極導電板，使該斜置式旋轉陰極導電 板吸引該金屬離子至該輯歸，以在該電鑄基材表面形 成一電鑄金屬層。 更甚至，该不，谷解性陽極之斜置式旋轉陰極電鑄設備 更可具備一設置在預加熱電鑄液之選定位置之加熱裝置， 違加熱裝置係、設置—加熱棒與—熱電偶，以利用該加熱棒 與該熱電偶之加熱，控制該電鑄液L·之溫度。 、更甚至’该電鑄設備更可具備—組自動電鑄液添加系 統以維持電鑄液有固定的濃度。 本發明對照先前技術之功效： 相車乂於現有技術，本發明利用非溶解性陽極來取代習 矣的冷解性陽極’以節省使用者的更換次數及購置成本， 並酉 =一種具備斜置式結構之_設備，有效克服了習知 電铸没備在電鑄時所具有的（例如氣氣無法排除而造成針 =、電鑄厚度不均勻、電鑄液質傳效果不佳）等問題，除了 :、’。使用者更大的便利性之外，亦可充分的達到最佳的電 鑄效果，以提昇電鑄後電鑄成品之良率。 本毛明所採用的具體實施例，將藉由以下之實施例 及附呈圖式作進一步之說明。 【實施方式】 請苓閱第二圖，係顯示本發明不溶解性陽極之斜置式 -11- 200806815 Z陰極電鑷設備之各構件配置示意圖。如圖所示 明之不溶解性陽極之钭晉 ^ 電鑄槽％ 極電料備3係具有一 一斜m 枝構3卜一塑膠聯結器定位機構32、 ::广疋轉陰極導電板33、-電鑄液傳輸管路34、一 構35、一陽極多孔網板36與一電流傳導回 U，觸槽3〇内容置-依預定比例調製而成之電鱗And-adjustment trough,: electric:: electroforming equipment, at least including - electroforming tank to implement electro-discharging, it can be used for the wafer and its material, the conductor above the cathode, the motor is driven by the motor to rotate the cathode; the hole is sprayed toward the cathode, The electrical rotation is also controlled by the fineness of the anode and the control of the electroforming solution. Weak electrolyzer with impurities sprayed into the high aspect ratio and died 2 times. Although this structure can make the electric prayer liquid easy to be efficient, it can easily remove chlorine bubbles and increase the electroforming ", ', and α structure, and if the anode is more difficult to disassemble. Degree 'causes the user's troubles:::=2, the anode of the end of the anode sprays the electroforming solution to the cathode': and closes, and also:: two 'moving, hunting to take hydrogen bubbles away, but because of the structure The relationship between the overnight and the hydrogen bubbles can not be ruled out. The electric button fixture includes a base circuit unit, a sealing ring and a medium-sized new Ying Yingqing...: a solid-state ore fixture for carrying a wafer, the base has a bearing ring for the mountain and the dressing The person is on the raft, in the base... 1 L' the line unit is located at the ...n early 70 is suitable for electrical connection with the wafer, the sealing ring is arranged on the wafer and the carrying ring network iV _ _ ' ^ day The portion of the line unit that is in contact with the wafer 200806815 is sealed between the sealing ring, the wafer and the base, and the upper cover is disposed above the carrier ring to fix the wafer above the carrier ring. Therefore, the main object of the present invention is to provide an electroforming device having an inclined structure, and supplemented by a motor to rotate the inclined rotating cathode conductive plate, so that the hydrogen generated by the inclined rotating cathode conductive plate can be effectively eliminated. In combination with an electroforming device as an anode porous mesh plate of an insoluble anode, the electroporation flow generated by an electroforming liquid spraying mechanism is passed through the anode porous mesh plate in a wide flow manner. Technical Solution for Solving the Problems of the Invention: The technical means adopted by the present invention to solve the problems of the prior art is an oblique-type rotary cathode electroforming device for an insoluble anode, comprising an electroforming tank containing an electroforming liquid. An oblique rotating cathode conductive plate disposed in the electroforming tank, an electroforming liquid transmission line having an electroforming liquid inlet and an electroforming liquid outlet, and a plurality of electroforming liquid ejecting elements An electroforming liquid ejecting mechanism, an anode porous mesh plate disposed between the electroforming liquid ejecting member and the oblique rotating cathode conductive plate, and electrically connected to the anode porous mesh plate and the oblique rotating cathode, respectively The current conduction loop of the board. The obliquely-rotating cathode conductive plate is combined with an electroformed substrate to be electroformed. The electroforming fluid inlet is connected to a selected location of the electroforming cell. The electroforming liquid outlet is connected to the electroforming liquid ejecting member. When the electroformed substrate to be electroformed is to be electroformed, the electricity per tank per liquid flows from the electrospinning liquid inlet to the electroforming liquid ejecting elements that communicate with the electrolysis liquid outlet, and the electroforming liquid is ejected. The component generates an electroforming liquid to be ejected to the anode porous mesh plate, and the electroforming liquid flow is reversed by the anode porous 200806815 ^, and the electron is passed through the forward flow conduction loop* to the oblique rotating cathode The conductive plate causes the obliquely-rotating cathode conductive plate to attract the metal ions to the set to form an electroformed metal layer on the surface of the electroformed substrate. Moreover, even if the grain-resolving anode is inclined, the rotary cathode electroforming device can further comprise a heating device disposed at a selected position of the preheated electroforming liquid, in violation of the heating device, the heating rod and the thermocouple, The temperature of the electroforming solution L· is controlled by heating with the heating rod and the thermocouple. And even more, the electroforming apparatus can be provided with a set of automatic electroforming liquid addition systems to maintain a fixed concentration of the electroforming solution. The present invention compares the effects of the prior art: the present invention utilizes an insoluble anode to replace the cold-resolvable anode of the prior art to save the number of replacements and the cost of the user, and 酉 = an inclined type The structure of the equipment effectively overcomes the problems that conventional electroforming does not have when it is electroformed (for example, the gas cannot be removed, the needle is not uniform, the electroforming thickness is not uniform, and the electroforming liquid is not good). apart from:,'. In addition to greater user convenience, the best electroforming effect can be achieved to improve the yield of electroformed products after electroforming. The specific embodiments of the present invention will be further illustrated by the following examples and accompanying drawings. [Embodiment] Please refer to the second drawing, which is a schematic view showing the arrangement of the components of the oblique electric discharge device of the insoluble anode of the present invention -11-200806815 Z. As shown in the figure, the insoluble anode is the same as that of the electroforming tank. The electro-mechanical casting tank has a one-to-one oblique m-branch structure, a plastic coupling positioner mechanism 32, and a wide-turn cathode conductive plate 33. - electroforming liquid transfer line 34, a structure 35, an anode porous screen 36 and a current conducted back to U, the contact groove 3 〇 content - according to a predetermined ratio of the scale
動機構31係设置在該電鑄槽3()之選定位置，包 馬達311與一轉軸312,並自該驅動馬達311依 序紅該轉軸312、該塑膠聯結器定位機構32與該斜置式 ^陰極導電板33。該驅動機構31係可使驅動馬達州 2㈣置式旋轉陰極導電板33轉動，並藉由該塑膠聯 σ定位機構32定位而使該斜置式旋轉陰極導電板％停 ^轉動。該斜置式旋轉陰極導電33係結合—待電鑄之 <鑄土材2以使忒不溶解性陽極之斜置式旋轉陰極電鑄 :備3對錢鑄基材2電鑄。此外，該斜置式旋轉陰極導 T板33與該塑膠聯結器定位機構32之間更可增設一導電 4構331 (如&電片、導電板、導電刷）。該塑膠聯結器定 位機構32係可為具有絕緣效果之滑動元件。 ^孩電鑄液傳輸管路34具備一電鑄液流入口 34a與一 私鑄液流出口 34b，該電鑄液流入口 34a係連通該電鑄槽 3〇之坻疋位置，並依序連通一幫浦341、一循環過濾裝置 342、節流閥343至該電鑄液流出口 34b。以將該電鑄槽 3〇之％鑄液L自電鑄液流入口 3如送入，利用幫浦341將 -12- 200806815 電鑄液L加壓後輸送至該循環過濾裝置342，再由該循環 過濾裝置342過濾後往該電鑄液流出口 34b送出。此外， 使用者可利用節流閥343，來調整電鑄液L送出該電鑄液 流出口 34b之流量。 該電鑄液喷射機構35具備有多個電鑄液噴射元件 351，各電鑄液喷射元件351分別連通該電鑄液流出口 34b， 且各電鑄液喷射元件351係面向該斜置式旋轉陰極導電板 33，使其將該電鑄液傳輸管路34之電鑄液L喷射出去。 該陽極多孔網板3 6設置在該電鑄液喷射機構3 5之 電鑄液喷射元件351與該斜置式旋轉陰極導電板33之 間，並於表面開設有多個貫孔361。該電流傳導回路37 分別電性連接於該陽極多孔網板36、與該斜置式旋轉陰 極導電板33形成電性連接之導電機構331。此外，該電 流傳導回路37係可為整流器。 此外，該陽極多孔網板36係利用非溶解性陽極來取 代習知的溶解性陽極，以節省使用者的更換次數及購置成 本0 更甚者，該不溶解性陽極之斜置式旋轉陰極電鑄設備 3更可包括一加熱裝置38，該加熱裝置38係設置在預加 熱電鑄液L之選定位置，並設置一加熱棒381與一熱電偶 382，以利用該加熱棒381與該熱電偶382之加熱，控制 該電鑄液L之溫度，即可使電鑄液L維持在最佳的電鑄狀 態。 當使用者欲利用不溶解性陽極之斜置式旋轉陰極電鑄 -13 - 200806815 設備3電鑄待電鑄之電轉基材2時， 第三圖，第二圖係顯示太^ τ參閱第二圖與 承發明不溶解性陽極> ^ 陰極電鑄設備之各構件配菩-立 之斜置式旋轉 -置不意圖。第二〇 不溶解性陽極之斜置式y你顯示本發明 之實施例。如圖所示，G陰極電鑄設備電鱗該電铸基材 田邊電鑄槽30之電镁、产 ‘夜輸入n34a流至連通該電鱗 自該電 射元件351時，該電缉液噴射元件351產生之電鑄液噴 住該陽極多孔網板36〇>射，該 電禱液流L1 孔網板30解離成電子盥八 错由該陽極多 回路37與該導電機構 电卞错由該電流傳導 板33，使該斜置式 =主3亥斜置式旋轉陰極導電 兮+择# 陰極導電板33吸引兮人p 忒电鑄基材2,以在該 ' “亥金屬離子至 4。 材2表面形成1鱗金屬層 凡熟悉此技藝者所能輕易得知，當节 :生-電鑄液流L1往該陽極 板，液嘴射元件 =轉陰極導電板33可藉由該驅動：噴射時，該 电％的均勻性。更甚者 1轉動’藉 之二3的轉動，而將該斜置式旋轉踭極導t式旋轉陰極導 孔的產生。再者力將氧氣帶離，即可有、：生 用數個電鱗、夜嗔射於本發明之電鑄液噴射機構方止針 电~液賀射元件351往 拽構35是利 鑄液流Ll，ra++ 知極多孔網；fe k 網板36，而、t i笔轉液流L1 “層流方式f喷射電 ^而達到良好的質傳效果。 飞牙過陽極多孔 错由上述之本發明實施例 -14^°’本㈣確具產業上之 200806815 利用價值。惟以上之實施例說明，僅為本發明之較佳實施 例說明，凡習於此項技術者當可依據本發明之上述實施例 說明而作其它種種之改良及變化。然而這些依據本發明實 施例所作的種種改良及變化，當仍屬於本發明之發明精神 及界定之專利範圍内。 【圖式簡單說明】 第一圖係顯示習知掛鍍式電鑄設備將電鑄基材電鑄之示意 圖， 第二圖係顯示本發明不溶解性陽極之斜置式旋轉陰極電鑄 設備之各構件配置示意圖； 第三圖係顯示本發明不溶解性陽極之斜置式旋轉陰極電鑄 設備電鑄該電鑄基材之實施例。 【主要元件符號說明】The moving mechanism 31 is disposed at a selected position of the electroforming groove 3 (), and includes a motor 311 and a rotating shaft 312, and sequentially rotates the rotating shaft 312, the plastic coupling positioning mechanism 32 and the inclined type from the driving motor 311. Cathode conductive plate 33. The driving mechanism 31 is configured to rotate the driving motor state 2 (four)-mounted rotating cathode conductive plate 33, and the tilting type rotating cathode conductive plate is stopped by the positioning of the plastic coupling σ positioning mechanism 32. The obliquely-rotating cathode conductive 33 is combined with the electroformed material to be electroformed. The cast-in-situ material 2 is used for the obliquely-rotating cathode electroforming of the insoluble anode. In addition, a conductive structure 331 (such as & electric sheet, conductive plate, conductive brush) may be further added between the oblique rotating cathode guiding plate 33 and the plastic coupling positioning mechanism 32. The plastic coupling positioning mechanism 32 can be a sliding element having an insulating effect. The electroforming fluid transfer line 34 is provided with an electroforming liquid inlet 34a and a private casting liquid outlet 34b. The electroforming liquid inlet 34a communicates with the electroforming tank 3〇 and is sequentially connected. A pump 341, a circulation filter unit 342, and a throttle valve 343 to the electroforming liquid outlet 34b. The casting solution L of the electroforming tank 3 is fed from the electroforming liquid inlet 3, and the electroforming liquid -12-200806815 is pressurized by the pump 341 and sent to the circulating filtering device 342, and then The circulating filtration device 342 filters and sends it to the electroforming liquid outlet 34b. Further, the user can use the throttle valve 343 to adjust the flow rate of the electroforming liquid L to the electroforming liquid discharge port 34b. The electroforming liquid ejecting mechanism 35 includes a plurality of electroforming liquid ejecting elements 351, each of which alternates with the electroforming liquid outflow port 34b, and each electroforming liquid ejecting element 351 faces the inclined rotating cathode The conductive plate 33 is caused to eject the electroforming liquid L of the electroforming liquid transfer line 34. The anode porous mesh plate 36 is disposed between the electroforming liquid ejecting member 351 of the electroforming liquid ejecting mechanism 35 and the oblique rotating cathode conductive plate 33, and has a plurality of through holes 361 formed in the surface. The current conducting circuit 37 is electrically connected to the anode porous mesh plate 36 and the conductive mechanism 331 electrically connected to the inclined rotating cathode conductive plate 33. Additionally, the current conducting circuit 37 can be a rectifier. In addition, the anode porous mesh plate 36 utilizes an insoluble anode instead of a conventional dissolved anode to save the number of replacements and the cost of the purchase by the user. Moreover, the oblique anode rotary electroforming of the insoluble anode The apparatus 3 further includes a heating device 38 disposed at a selected position of the preheated electroforming liquid L, and a heating rod 381 and a thermocouple 382 are disposed to utilize the heating rod 381 and the thermocouple 382. By heating and controlling the temperature of the electroforming solution L, the electroforming solution L can be maintained in an optimum electroforming state. When the user wants to use the insoluble anode to rotate the cathode electroforming -13 - 200806815 equipment 3 electroformed electroforming substrate 2 to be electroformed, the third picture, the second picture shows too ^ τ see the second figure It is not intended to be used with the insoluble anode of the invention. The second 〇 oblique view of the insoluble anode y shows an embodiment of the invention. As shown in the figure, the G cathode electroforming device scales the electromagnetism of the electroformed substrate field casting slot 30, and the production of the night input n34a flows to connect the scale to the electro-radiation element 351. The electroforming liquid generated by the element 351 is sprayed on the anode porous mesh plate 36〇, and the electric prayer liquid flow L1 is separated from the mesh plate 30 into an electronic circuit. The anode multi-circuit 37 is electrically disconnected from the conductive mechanism. The current conducting plate 33 causes the oblique type = main 3 slanted rotating cathode conductive 兮 + select # cathode conductive plate 33 to attract the p human p 忒 electroformed substrate 2, in the 'Hei metal ion to 4. 2 The surface forms a scale metal layer. Those skilled in the art can easily know that when the section: the raw-electroforming liquid stream L1 goes to the anode plate, the liquid nozzle element = the cathode cathode plate 33 can be driven by the jet: At the time, the uniformity of the electricity %. Even more than 1 rotation 'by the rotation of the two 3, and the oblique rotation of the rotating pole guide t-type rotating cathode guide hole. In addition, the force to carry away oxygen, then you can Yes, there are several electric scales and night sputum shots in the electroforming liquid spraying mechanism of the present invention. 5 is a good casting flow L1, ra++ knows the porous mesh; fe k stencil 36, and t i pen transfer liquid flow L1 "Laminar flow mode f injection electric ^ and achieve good quality transmission effect. The flying teeth over the anode is erroneous. The above-mentioned embodiment of the present invention -14^°' (4) is indeed of industrial use 200806815. However, the above embodiments are merely illustrative of the preferred embodiments of the present invention, and those skilled in the art can make various other modifications and changes in accordance with the embodiments of the present invention. However, various modifications and changes made in accordance with the embodiments of the present invention are still within the scope of the invention and the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure shows a schematic diagram of electroforming of an electroformed substrate by a conventional hanging electroforming apparatus, and the second figure shows each of the obliquely-rotating cathode electroforming apparatuses of the insoluble anode of the present invention. Schematic diagram of the configuration of the components; The third diagram shows an embodiment of electroforming the electroformed substrate by the obliquely-rotating cathode electroforming apparatus of the insoluble anode of the present invention. [Main component symbol description]
1 掛鍍式電鑄設備 10 電鑄槽 11 溶解性陽極 12 斜置式旋轉陰極導電板 2 電鑄基材 3 不溶解性陽極之斜置式旋轉 陰極電禱設備 30 電鑄槽 31 驅動機構 -15- 2008068151 Hanging electroforming equipment 10 Electroforming tank 11 Solvent anode 12 Inclined rotating cathode conductive plate 2 Electroforming substrate 3 Inclined rotating cathode electro-pray equipment 30 insoluble anode Electroforming groove 31 Drive mechanism-15- 200806815
311 驅動馬達 312 轉軸 32 塑膠聯結器定位機構 33 斜置式旋轉陰極導電板 331 導電機構 34 電鑄液傳輸管路 34a 電鑄液流入口 34b 電鑄液流出口 341 幫浦 342 循環過濾裝置 343 節流閥 35 電鑄液喷射機構 351 電鑄液喷射元件 36 陽極多孔網板 361 貫孔 37 電流傳導回路 38 加熱裝置 381 加熱棒 382 熱電偶 4 電鑄金屬層 A 傳導方向 L 電鑄液 LI 電鑄液流311 drive motor 312 shaft 32 plastic coupling positioning mechanism 33 oblique rotating cathode conductive plate 331 conductive mechanism 34 electroforming liquid transfer line 34a electroforming liquid inlet 34b electroforming liquid outlet 341 pump 342 circulation filter device 343 throttling Valve 35 Electroforming fluid injection mechanism 351 Electroforming fluid injection element 36 Anode porous mesh plate 361 Through hole 37 Current conduction circuit 38 Heating device 381 Heating rod 382 Thermocouple 4 Electroforming metal layer A Conduction direction L Electroforming liquid LI Electroforming solution flow
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