CN110900860A - 一种砂浆罐、切割装置及晶棒的切割方法 - Google Patents
一种砂浆罐、切割装置及晶棒的切割方法 Download PDFInfo
- Publication number
- CN110900860A CN110900860A CN201911259537.9A CN201911259537A CN110900860A CN 110900860 A CN110900860 A CN 110900860A CN 201911259537 A CN201911259537 A CN 201911259537A CN 110900860 A CN110900860 A CN 110900860A
- Authority
- CN
- China
- Prior art keywords
- mortar
- mortar tank
- powder particles
- tank body
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911259537.9A CN110900860B (zh) | 2019-12-10 | 2019-12-10 | 一种砂浆罐、切割装置及晶棒的切割方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911259537.9A CN110900860B (zh) | 2019-12-10 | 2019-12-10 | 一种砂浆罐、切割装置及晶棒的切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110900860A true CN110900860A (zh) | 2020-03-24 |
CN110900860B CN110900860B (zh) | 2021-11-02 |
Family
ID=69824014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911259537.9A Active CN110900860B (zh) | 2019-12-10 | 2019-12-10 | 一种砂浆罐、切割装置及晶棒的切割方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110900860B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009056553A (ja) * | 2007-08-31 | 2009-03-19 | Sumco Techxiv株式会社 | ワイヤソースラリの磁性異物除去装置 |
CN102335970A (zh) * | 2011-07-30 | 2012-02-01 | 常州天合光能有限公司 | 切片砂浆质量的控制装置 |
CN104002390A (zh) * | 2014-04-09 | 2014-08-27 | 浙江工业大学 | 一种用于非磁性材料切割在线分离回收废砂浆的简易系统及方法 |
CN204136257U (zh) * | 2014-08-25 | 2015-02-04 | 海润光伏科技股份有限公司 | 去铁粉砂浆罐 |
CN204894262U (zh) * | 2015-09-06 | 2015-12-23 | 陕西天宏硅材料有限责任公司 | 用于硅片切割砂浆的金属离子吸收装置 |
CN205343492U (zh) * | 2015-12-18 | 2016-06-29 | 英利能源(中国)有限公司 | 一种去除浆料铁粉系统 |
CN106965340A (zh) * | 2017-05-17 | 2017-07-21 | 安徽久能信息科技有限公司 | 一种太阳能硅片线切割废砂浆铁粉在线回收装置 |
CN108745627A (zh) * | 2018-06-21 | 2018-11-06 | 郑州睿科生化科技有限公司 | 一种碳化硅微粉除杂装置及其工艺 |
-
2019
- 2019-12-10 CN CN201911259537.9A patent/CN110900860B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009056553A (ja) * | 2007-08-31 | 2009-03-19 | Sumco Techxiv株式会社 | ワイヤソースラリの磁性異物除去装置 |
CN102335970A (zh) * | 2011-07-30 | 2012-02-01 | 常州天合光能有限公司 | 切片砂浆质量的控制装置 |
CN104002390A (zh) * | 2014-04-09 | 2014-08-27 | 浙江工业大学 | 一种用于非磁性材料切割在线分离回收废砂浆的简易系统及方法 |
CN204136257U (zh) * | 2014-08-25 | 2015-02-04 | 海润光伏科技股份有限公司 | 去铁粉砂浆罐 |
CN204894262U (zh) * | 2015-09-06 | 2015-12-23 | 陕西天宏硅材料有限责任公司 | 用于硅片切割砂浆的金属离子吸收装置 |
CN205343492U (zh) * | 2015-12-18 | 2016-06-29 | 英利能源(中国)有限公司 | 一种去除浆料铁粉系统 |
CN106965340A (zh) * | 2017-05-17 | 2017-07-21 | 安徽久能信息科技有限公司 | 一种太阳能硅片线切割废砂浆铁粉在线回收装置 |
CN108745627A (zh) * | 2018-06-21 | 2018-11-06 | 郑州睿科生化科技有限公司 | 一种碳化硅微粉除杂装置及其工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN110900860B (zh) | 2021-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7559824B2 (en) | Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof | |
KR100563018B1 (ko) | 마이크로전자장치 기판 조립체의 기계적 또는 화학기계적평탄화용 슬러리 및, 그 제조와 이용 방법 및 장치 | |
US5245790A (en) | Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers | |
US6152805A (en) | Polishing machine | |
CN1222985C (zh) | 半导体装置的制造方法以及研磨装置 | |
JP3052896B2 (ja) | 研磨布表面のドレス治具及びその製造方法 | |
CN100449704C (zh) | 研磨头的清洗装置 | |
KR100315722B1 (ko) | 기판표면을평탄화하기위한연마기 | |
JP2815349B1 (ja) | 化学機械的ポリシング装置のパッドコンディショナ | |
JP3534115B1 (ja) | エッジ研磨した窒化物半導体基板とエッジ研磨したGaN自立基板及び窒化物半導体基板のエッジ加工方法 | |
EP0566258A1 (en) | Improved slurry polisher using ultrasonic agitation | |
TW201021969A (en) | Substrate polishing apparatus and method of polishing substrate using the same | |
US20120315739A1 (en) | Manufacturing method for semiconductor wafer | |
CN205021392U (zh) | 用于基板抛光的装置 | |
TW510812B (en) | Method of reducing particle size and increasing uniformity of particles in a colloidal suspension, method of manufacturing integrated circuits, and filter having an input and an output | |
JP2005271111A (ja) | 基板研磨装置及び基板研磨方法 | |
CN110900860B (zh) | 一种砂浆罐、切割装置及晶棒的切割方法 | |
CN114231182A (zh) | 一种易解理氧化镓晶片化学机械抛光工艺、抛光液及其制备方法 | |
CN105583720A (zh) | SiC基板的研磨方法 | |
TW201542790A (zh) | GaN單結晶材料之硏磨加工方法 | |
JP4280557B2 (ja) | 洗浄装置および研磨装置 | |
TWI277474B (en) | Electrolytic processing apparatus | |
JP2004306210A (ja) | ガラス研磨における排出水中の酸化セリウム系研磨剤と水を再利用するための処理方法とその処理装置 | |
JPH06106478A (ja) | 研磨装置への研磨剤の供給方法とその供給装置 | |
CN114800253B (zh) | 一种碳化硅晶圆的研磨装置及方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210922 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address |