CN110899894B - Air leakage prevention spraying and sucking device and method for multi-channel laser tin ball welding - Google Patents
Air leakage prevention spraying and sucking device and method for multi-channel laser tin ball welding Download PDFInfo
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- CN110899894B CN110899894B CN201911185398.XA CN201911185398A CN110899894B CN 110899894 B CN110899894 B CN 110899894B CN 201911185398 A CN201911185398 A CN 201911185398A CN 110899894 B CN110899894 B CN 110899894B
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- suction
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- spray head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an air leakage preventing spray-suction device and method for laser multichannel tin ball welding. The device comprises a suction assembly, wherein the suction assembly comprises a spray head fixing plate, the spray head fixing plate is connected with a communicating pipe joint, the spray head fixing plate is connected with a communicating spray head, and the spray head is provided with a plurality of solder ball suction and spray pipelines and an air passage; still be equipped with the leak protection subassembly in the shower nozzle, the leak protection subassembly includes the trimmer, and the trimmer is located the air flue on the tin ball is inhaled and is spouted the pipeline, has seted up on the trimmer and can inhale the communicating air vent of spouting the pipeline with the tin ball, still includes the motion structure of trimmer, and the motion structure is connected with the trimmer, and the leak protection subassembly still includes the installation department, and the installation department is connected with the shower nozzle. The device of the invention prevents the solder balls in some solder ball suction and spray pipelines from being unable to smoothly separate from the spray head due to air leakage when the spray head releases the solder balls, thereby effectively improving the production process and increasing the processing yield.
Description
Technical Field
The invention belongs to the laser welding technology, and particularly relates to a laser welding tin ball conveying device.
Background
The laser tin ball welding is widely applied to welding micro, small and precise parts. The transportation of solder balls is a key device for the welding of precise parts. It is desirable to obtain a highly efficient and stable transportation device for solder balls. For example, in "a laser solder ball bonding apparatus" disclosed in CN 109570681 a, an upper flange and a lower flange are respectively disposed on the upper and lower sides of a rotating plate, and a storage barrel is disposed on the upper flange. The upper flange plate is provided with a feed hole which is communicated up and down, the distance between the bottom of the feed hole and the rotation is smaller than the diameter of the solder ball, the lower flange plate is provided with a discharge hole which is communicated up and down, and the feed hole and the discharge are both opposite to the first circumferential line. Because the diameter of the solder ball is very small, in order to ensure the rigidity of the rotating disc and the planeness of two planes, the processing requirement is extremely high, and the processing difficulty and the processing cost are increased; meanwhile, the structures of the upper inlet and the lower outlet are in surface contact, and the sealing requirement is high. Therefore, the above-described device requires maintenance and repair from time to time when in use.
The applicant has proposed a "automated laser multi-channel solder ball bonding apparatus and method", CN 109551069A. The device does not have a moving part, the solder balls are sucked into the row-shaped suction pipe below the device, and are put down from the row-shaped suction pipe after reaching a working position, so that the problem that the device is high in installation and processing precision requirements is well solved. But still presents the problem of sealing. The row-shaped suction pipes share one sealing channel, all the row-shaped suction pipes suck or release the solder balls and control air pressure through air inlet and air outlet of two pipe joints, the suction and the release actions are consistent, and if one suction pipe does not suck the solder ball when the solder ball is sucked, the air leakage pressure in the whole device is unstable.
Disclosure of Invention
The invention aims to solve the problems and provides an anti-leakage air spray-suction device and an air spray-suction method for multi-channel laser tin ball welding.
One of the technical schemes of the invention is as follows: the air leakage preventing spray suction device for the laser multi-channel tin ball welding comprises a suction assembly, wherein the suction assembly comprises a spray head fixing plate, the spray head fixing plate is connected with a communicated pipe joint, the spray head fixing plate is connected with a communicated spray head, and the spray head is provided with a plurality of tin ball suction and spray pipelines and air passages; still be equipped with the leak protection subassembly in the shower nozzle, the leak protection subassembly includes the trimmer, and the trimmer is located the air flue on the tin ball is inhaled and is spouted the pipeline, has seted up on the trimmer and can inhale the communicating air vent of spouting the pipeline with the tin ball, still includes the motion structure of trimmer, and the motion structure is connected with the trimmer, and the leak protection subassembly still includes the installation department, and the installation department is connected with the shower nozzle.
The adjusting sheet is positioned above the solder ball sucking and spraying pipeline, and can adjust and move above the solder ball sucking and spraying pipeline, and the movement can be linear movement in a single direction or movement in two directions of X-Y in a plane. The adjusting sheet can be attached to the surface of the solder ball suction and spray pipeline under the action of air pressure, so that the vent hole on the adjusting sheet is communicated with one solder ball suction and spray pipeline; or suspended above the solder ball suction and spray pipelines, so that all the solder ball suction and spray pipelines are communicated with the air passage.
The further optimized technical scheme is as follows: the spray head comprises a connecting part, a solder ball suction and spray pipeline setting part, an open containing cavity is arranged between the connecting part and the solder ball suction and spray pipeline setting part, an air passage is arranged in the connecting part and communicated with the containing cavity, and the moving structure is arranged in the containing cavity.
The connecting part is used for connecting and sealing with the nozzle fixing plate, and the moving structure is arranged in the open cavity of the nozzle to realize the high integration of the parts of the device.
The further optimized technical scheme is as follows: the mounting part comprises a mounting plate, and the mounting plate is connected with the side wall of the spray head cavity and seals the spray head cavity; a movement structure is connected between the adjusting sheet and the mounting plate.
The mounting plate is arranged on the side wall of the spray cavity as a mounting bracket of the movement mechanism, which is beneficial to the arrangement of the spatial layout of components and reduces the occupied space of the components.
The further optimized technical scheme is as follows: the motion structure comprises a traction mechanism and a reset mechanism.
The traction mechanism realizes the movement of the adjusting sheet in one direction or two directions, and the adjusting sheet is reset by the resetting device. When the traction mechanism is adopted, the output end of the mechanism movement is flexibly connected with the adjusting sheet so as to ensure that the adjusting sheet can realize small-distance floating in the vertical direction.
The further optimized technical scheme is as follows: the traction mechanism comprises a first movement direction traction mechanism and/or a second movement direction traction mechanism, and the resetting mechanism comprises a first resetting mechanism and/or a second movement direction traction mechanism which are arranged corresponding to the traction mechanism.
The further optimized technical scheme is as follows: the traction mechanism is an electromagnet arranged on the side edge of the adjusting sheet, and the reset mechanism is a spring arranged on the opposite side edge of the adjusting sheet. The adjusting sheet is made of magnetic materials.
The magnetic adjusting adjustment sheet is used, so that the arrangement of parts is facilitated, meanwhile, when the magnetic force does not act, the adjustment sheet can float up and down, and the control method is simpler.
The further optimized technical scheme is as follows: the mounting panel includes the drive mechanism mounting panel, with the relative canceling release mechanical system mounting panel that sets up of drive mechanism mounting panel.
The further optimized technical scheme is as follows: and a sealing gasket is arranged between the mounting plate and the spray head.
The device has a simple structure, and the components are skillfully arranged and occupy small space.
The further optimized technical scheme is as follows: the traction mechanism comprises a first direction traction mechanism and a second direction traction mechanism which are perpendicular to each other; the reset mechanism comprises a first direction reset mechanism and a second direction reset mechanism which are mutually vertical; the plurality of solder ball suction and spray pipelines are four suction and spray pipelines which are arranged in a rectangular or square shape.
The arrangement structure is beneficial to processing, mounting and connecting of parts.
The device has the advantages of simple structure, skillful arrangement of parts, small occupied space, convenient installation and simple control operation.
The second technical scheme of the invention is as follows: the air leakage preventing spray sucking method for the multi-channel laser tin ball welding is based on the device, when tin balls are adsorbed, a pipe joint is communicated with negative pressure, an adjusting sheet is in a floating state under the action of the negative pressure, and a plurality of tin ball spray sucking pipelines suck the tin balls at the same time; when placing the tin ball, the pipe joint is communicated with positive pressure, the adjusting sheet is pressed down and attached under the action of the positive pressure, the adjusting sheet is adjusted to enable the vent hole on the adjusting sheet to be communicated with one tin ball suction and spray pipeline in the tin ball suction and spray pipelines, and the tin ball in the pipeline is sprayed and put down.
The device and the method prevent the solder balls in some solder ball suction and spray pipelines from being incapable of smoothly separating from the spray head due to air leakage when the spray head loses the solder balls, can effectively improve the production process and improve the processing yield; the method is simple and easy to operate, and reduces the labor cost. The suction and spray pipelines of each solder ball can be effectively controlled, the solder balls which cannot be placed due to air leakage can be placed, and the production efficiency is greatly improved.
Drawings
FIG. 1 is a schematic perspective view of an air leakage preventing device for multi-channel laser soldering;
FIG. 2 is a perspective view of the suction assembly;
FIG. 3 is a sectional view of the whole multi-channel solder ball soldering leakage-preventing laser device;
FIG. 4 is a cross-sectional view of the aspirating assembly in the direction A-A;
FIG. 5 is a perspective view of the air leakage preventing assembly;
FIG. 6 is a sectional view of the whole multi-channel solder ball soldering leakage preventing laser device in the A-A direction;
FIG. 7 is a schematic view of an electromagnet;
FIG. 8 is a perspective assembly view of the first magnet, the first side sealing gasket and the first magnet mounting plate;
FIG. 9 is a cross-sectional view of a tab;
FIG. 10 is a perspective view of the first spring pull plate;
FIG. 11 is a schematic perspective view of the first spring plate and the third gasket;
FIG. 12 is a sectional view of the whole multi-channel solder ball soldering leakage preventing laser device in the B-B direction;
fig. 13 is a perspective view of the first pull spring.
In the figure: 1-a suction assembly, 11-a pipe joint, 12-a nozzle holder, 121-a holder threaded hole, 122-a holder pin hole, 123-a holder second threaded hole, 124-a holder cavity, 125-a holder third threaded hole, 13-a nozzle, 131-a nozzle counter bore, 132-a nozzle cavity, 133-a first side cavity, 134-a second side cavity, 135-a third side cavity, 136-a fourth side cavity, 1371-a nozzle first, 1372-a nozzle second, 1373-a nozzle third, 1374-a nozzle fourth, 1381-a first nozzle side, 1382-a second nozzle side, 1383-a third nozzle side, 1384-a fourth nozzle side, 1391-a nozzle first plane, 1392-a nozzle second plane, 14-a sealing gasket, 141-a gasket fixation hole, 142-a gasket perforation, 2-an air assembly, 201-a first magnet mounting plate, 2011-a first mounting plate counter bore, 2012-a first mounting plate cavity, 2013-a first mounting plate circular hole, 202-a first side sealing gasket, 2021-a first gasket central hole, 2022-a first gasket circular hole, 203-a first electromagnet, 204-a first spring pulling plate, 2041-a first pulling plate circular hole, 2042-a first pulling plate through hole, 2043-a first pulling plate blind hole, 205-a second side sealing gasket, 2051-a second gasket circular hole, 206-a first pin, 207-a first pulling spring, 2071-a first tension spring first hook, 2072-a first tension spring second hook, 208-a second pin, 209-an adjustment sheet, 2091-an adjustment sheet central hole, 2092-a second adjustment sheet through hole, 2093-a second blind hole, 2094-a first adjustment sheet through hole, 2095-a first adjustment sheet blind hole, 210-a second spring pulling plate, 2101-a second pulling plate circular hole, 2102-a second pulling plate through hole, 2103-a second pulling plate blind hole, 211-a pin-a third adjustment sheet, 212-a second adjustment sheet, 2101-a second adjustment sheet through hole, 2122-second tension spring two hook, 213-fourth pin, 214-third sealing gasket, 2141-third gasket circular hole, 215-second magnet mounting plate, 2151-second mounting plate counter bore, 2152-second mounting plate cavity, 2153-second mounting plate circular hole, 216-fourth sealing gasket, 2161-fourth gasket central circular hole, 2162-fourth gasket circular hole, 217-second electromagnet
Detailed Description
The following detailed description is provided for the purpose of explaining the claimed embodiments of the present invention so that those skilled in the art can understand the claims. The scope of the invention is not limited to the following specific implementation configurations. It is intended that the scope of the invention be determined by those skilled in the art from the following detailed description, which includes claims that are directed to this invention.
As shown in FIG. 1, the gas leakage preventing device for multi-channel solder ball soldering of laser comprises a suction assembly 1 and a gas leakage preventing assembly 2.
As shown in fig. 2, 3 and 4, the suction assembly 1 comprises a pipe joint 11, a nozzle fixing plate 12, a nozzle 13 and a sealing gasket 14. Two identical pipe joints 11 are respectively installed on the fixing plate 12 through two identical fixing plate second threaded holes 123 on the upper side of the nozzle fixing plate 12, the two identical fixing plate second threaded holes 123 are respectively communicated with two identical fixing plate accommodating cavities (air passages, pipe joint communication air passages) 124, the two identical fixing plate accommodating cavities (air passages) 124 are respectively communicated with the nozzle accommodating cavity (air passage) 132 through two identical gasket through holes 142, the nozzle accommodating cavity (air passage) 132 is respectively communicated with 4 identical spray holes one 1371, two spray holes 1372, three spray holes 1373 and four spray holes 1374 (four solder ball suction and spray pipelines) on the lower side of the nozzle 13, and the periphery of the nozzle accommodating cavity 132 is also respectively communicated with the first side accommodating cavity 133, the second accommodating cavity 134, the third side accommodating cavity 135 and the fourth side accommodating cavity 136 (open accommodating cavity).
The nozzle fixing plate 12 is provided with two identical fixing plate first threaded holes 121 and a fixing plate pin hole 122, which can be used to fix the whole laser multi-channel solder ball soldering air leakage prevention device at a designated position.
The sealing gasket 14 is placed between the head fixing plate 12 and the head 13, and the head 13 and the sealing gasket 14 are fixed to the lower side of the head fixing plate 12 by screws through two identical head counter bores 131, two identical gasket fixing holes 141, and two identical fixing plate third screw holes 125, respectively.
As shown in fig. 5 and 6, the air leakage preventing assembly 2 includes a first magnet mounting plate 201, a first side sealing gasket 202, a first electromagnet 203, a first spring pulling plate 204, a second side sealing gasket 205, a first pin 206, a first pulling spring 207, a second pin 208, a tab 209, a second spring pulling plate 210, a third pin 211, a second pulling spring 212, a fourth pin 213, a third sealing gasket 214, a second magnet mounting plate 215, a fourth sealing gasket 216, and a second electromagnet 217. The first magnet mounting plate 201 is perpendicular to the second magnet mounting plate 215; the first spring pull plate 204 is perpendicular to the second spring pull plate 210. The first magnet mounting plate 201 is opposite to the first spring pulling plate 204; the second magnet mounting plate 215 is opposite to the second spring pulling plate 210.
As shown in fig. 5, 6 and 7, the second electromagnet 217 is installed in the second mounting plate accommodating cavity 2152 through the second mounting plate circular hole 2153 and the magnet screw hole 2031, and then the second electromagnet 217 is inserted into the second side accommodating cavity 134 through the fourth gasket central circular hole 2161, and installed on the first nozzle side 1381 through two identical second mounting plate counter bores 2151, two identical fourth gasket circular holes 2162 and two identical screw holes corresponding to the positions on the nozzle 13.
As shown in fig. 5, 6 and 8, another identical first electromagnet 203 passes through the first gasket central hole 2021 and is placed in the third side receiving cavity 135, and is installed on the second nozzle side 1382 through four identical first mounting plate counter bores 2011, four identical first gasket circular holes 2022 and four identical screw holes at corresponding positions on the nozzle 13.
The gasket plays a sealing role.
As shown in fig. 3, 5 and 6, a tab 209 is placed on the lower surface of the nozzle chamber (air passage) 132 (above the four solder ball suction/ejection channels).
The specific structure is as shown in fig. 9-13, the second pin 208 penetrates into the first adjustment piece blind hole 2095 through the first adjustment piece through hole 2094 and the first extension spring first hook 2071 of the first pull spring 207, the first adjustment piece through hole 2094 and the first adjustment piece blind hole 2095 are both tight transition fit, the second pin 208 cannot fall off after penetrating, the first extension spring second hook 2072 of the first spring 207 is hooked on the first pin 206, the first pin 206 penetrates into the first pull plate blind hole 2043 through the first pull plate through hole 2042 and the first spring second hook 2072, the first pull plate through hole 2042 and the first pull plate blind hole 2043 are both tight transition fit, the first pin 206 cannot fall off after penetrating, two identical screws can be mounted on the third spray head side 1383 through two identical first drawplate circular holes 2041, two identical second shim circular holes 2051, and two identical threaded holes in corresponding positions on the spray head 13.
The third pin 211 penetrates into the second adjustment sheet blind hole 2093 through the second adjustment sheet through hole 2092 after passing through the second spring first hook 2121 of the second adjustment sheet 212, the second adjustment sheet through hole 2092 and the second adjustment sheet blind hole 2093 are both in tight transition fit, the third pin 211 cannot fall off after penetrating, the first spring second hook 2122 of the second adjustment sheet 212 is hooked on the fourth pin 213, the fourth pin 213 penetrates into the second pull plate blind hole 2103 after penetrating through the second pull plate through hole 2102 and the second spring second hook 2122, the second pull plate through hole 2102 and the second pull plate blind hole 2103 are both in tight transition fit, the fourth pin 213 cannot fall off, and two identical screws can penetrate through two identical second pull plate round holes 2101, two identical third gasket round holes 2141 and two identical screw holes at corresponding positions on the spray head 13 and are mounted on the side surface 1384 of the fourth spray head.
The tab 209 is capable of translating X, Y in two directions in a flat chamber formed by a first plane 1391 and a second plane 1392 of the nozzle, and the Z-direction is only small and can move only a very small extent.
When the solder balls can be placed in the whole laser multi-channel solder ball welding anti-air-leakage device, the central hole 2091 of the adjusting piece is just above the first nozzle hole 1371 and aligned with the first nozzle hole 1371 in a default state, and the solder balls can be placed in the first nozzle hole 1371. When the second electromagnet 217 starts to work, the second electromagnet 217 generates an attractive force on the adjustment sheet 209, the adjustment sheet 209 collides with the second electromagnet 217, at this time, the central hole 2091 of the adjustment sheet is just above the second nozzle hole 1372 and aligned with the second nozzle hole 1372, and the second nozzle hole 1372 can be used for placing solder balls. When the first electromagnet 203 and the second electromagnet 217 work simultaneously, the tab 209 is attracted and collided by the first electromagnet 203 and the second electromagnet 217 simultaneously, the central hole 2091 of the tab is just above the third nozzle hole 1373 and aligned with the third nozzle hole 1373, and the third nozzle hole 1373 can be used for placing solder balls. When the second electromagnet 217 is stopped, only the first electromagnet 203 works alone, the tab 209 is separated from the second electromagnet 217 under the pulling force of the first pull spring 207, the tab 209 is restored to the original position in the X direction, the central hole 2091 of the tab is just above the fourth nozzle hole 1374 and aligned with the fourth nozzle hole 1374, and the fourth nozzle hole 1374 can be used for placing solder balls. And simultaneously stopping the operation of the first electromagnet 203 and the second electromagnet 217, restoring the tab 209 in two directions X, Y under the pulling force of the first pull spring 207 and the second pull spring 212, returning the tab 209 to the initial position again, and placing the solder balls in the first nozzle holes 1371.
The air pressure inside the whole device can be adjusted by introducing air through the two pipe joints 11, the lower surface of the adjusting sheet 209 is tightly attached to or suspended in the device, when the spray head 13 needs to absorb the solder balls, the adjusting sheet 209 is suspended, each spray head hole can absorb a proper amount of solder balls, when the spray head 13 needs to place the solder balls, the adjusting sheet 209 is tightly attached, and only the spray head holes aligned with the adjusting sheet central hole 2091 can place the solder balls.
The specific spraying and sucking method of the device comprises the following steps:
1. the whole laser multi-channel tin ball welding air leakage prevention device is completely assembled;
2. fixing the whole laser multi-channel tin ball welding air leakage prevention device at a specified position capable of moving up and down;
3. the whole device is aerated through two pipe joints 11, and the air pressure is adjusted to a specified value;
4. the whole laser multi-channel tin ball welding air leakage prevention device is controlled to move downwards, when tin balls are adsorbed, the pipe joint is communicated with negative pressure, the adjusting piece is in a floating state under the action of the negative pressure, the tin balls are simultaneously adsorbed by the tin ball adsorption and injection pipelines, and a proper amount of tin balls are adsorbed by the tin ball adsorption and injection pipelines of the spray head 13;
5. when placing the solder ball, adjusting the air pressure to be positive pressure, attaching the adjusting sheet to ensure that the first nozzle hole is communicated with the vent hole of the adjusting sheet, and placing the solder ball in the first nozzle hole 1371;
6. the second electromagnet 217 starts to work, the second nozzle hole is communicated with the vent hole of the adjusting sheet, and the solder ball is placed in the second nozzle hole 1372;
7. simultaneously, the first electromagnet 203 starts to work, so that the third nozzle hole is communicated with the vent hole of the adjusting sheet, and the third nozzle hole 1373 is used for placing solder balls;
8. stopping the operation of the second electromagnet 217 to communicate the fourth nozzle hole with the vent hole of the adjustment sheet, and placing the solder ball in the fourth nozzle hole 1373;
9. and simultaneously stopping the work of the two electromagnets, and replacing the solder balls in the first nozzle holes 1371.
The steps are not fixed, and the vent hole of the adjusting sheet can be controlled to be communicated with any solder ball sucking and spraying pipeline at will according to requirements.
Claims (8)
1. A laser multichannel tin ball welding leakage-proof air spray-suction device comprises a suction assembly, wherein the suction assembly comprises a spray head fixing plate, the spray head fixing plate is connected with a communicated pipe joint, the spray head fixing plate is connected with a communicated spray head, the spray head is provided with a plurality of tin ball suction-spray pipelines and air passages, and is characterized in that the spray head is internally provided with a leakage-proof assembly, the leakage-proof assembly comprises an adjusting piece, the adjusting piece is positioned in the air passages on the tin ball suction-spray pipelines, the adjusting piece is provided with air holes communicated with the tin ball suction-spray pipelines, and the leakage-proof assembly also comprises a movement structure of the adjusting piece, the movement structure is connected with the adjusting piece, and the leakage-proof assembly also comprises a mounting part which is connected with the spray head; the motion structure comprises a traction mechanism and a reset mechanism; the traction mechanism comprises a first movement direction traction mechanism and/or a second movement direction traction mechanism, and the reset mechanism comprises a first movement direction reset mechanism and/or a second movement direction reset mechanism which are arranged corresponding to the traction mechanism.
2. The apparatus as claimed in claim 1, wherein the nozzle comprises a connection portion, a solder ball suction/ejection channel arrangement portion, an open cavity is disposed between the connection portion and the solder ball suction/ejection channel arrangement portion, an air passage is disposed in the connection portion and is communicated with the cavity, and the movement structure is disposed in the cavity.
3. The leak-proof air injection and suction device for multi-channel solder ball bonding of laser as claimed in claim 1 or 2, wherein the mounting portion comprises a mounting plate connected to a sidewall of the nozzle chamber to seal the nozzle chamber; a movement structure is connected between the adjusting sheet and the mounting plate.
4. An anti-leaking spray-sucking device for laser multi-channel solder ball bonding as claimed in claim 1, wherein the pulling mechanism is an electromagnet disposed on the side of the adjustment sheet, and the restoring mechanism is a spring disposed on the opposite side of the adjustment sheet.
5. An anti-leak air ejector apparatus for laser multi-channel solder ball bonding as claimed in claim 3, wherein said mounting plate includes a pulling mechanism mounting plate, and a restoring mechanism mounting plate disposed opposite to the pulling mechanism mounting plate.
6. An anti-leak air injection device for multi-channel solder ball bonding of laser as claimed in claim 3, wherein a gasket is disposed between the mounting plate and the nozzle.
7. The laser multi-channel solder ball welding air leakage preventing spraying and sucking device as claimed in claim 1, wherein the drawing mechanism includes a first moving direction drawing mechanism and a second moving direction drawing mechanism perpendicular to each other; the reset mechanism comprises a first movement direction reset mechanism and a second movement direction reset mechanism which are mutually vertical; the plurality of solder ball suction and spray pipelines are four suction and spray pipelines which are arranged in a rectangular shape.
8. A leak-proof air-jet method for soldering a multi-channel laser solder ball is based on the device of claim 1, when the solder ball is absorbed, the pipe joint is communicated with negative pressure, the adjusting sheet is in a floating state under the action of the negative pressure, and a plurality of solder ball jet pipelines suck the solder ball at the same time; when placing the tin ball, the pipe joint is communicated with positive pressure, the adjusting sheet is pressed down and attached under the action of the positive pressure, the adjusting sheet is adjusted to enable the vent hole on the adjusting sheet to be communicated with one tin ball suction and spray pipeline in the tin ball suction and spray pipelines, and the tin ball in the pipeline is sprayed and put down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911185398.XA CN110899894B (en) | 2019-11-27 | 2019-11-27 | Air leakage prevention spraying and sucking device and method for multi-channel laser tin ball welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911185398.XA CN110899894B (en) | 2019-11-27 | 2019-11-27 | Air leakage prevention spraying and sucking device and method for multi-channel laser tin ball welding |
Publications (2)
| Publication Number | Publication Date |
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| CN110899894A CN110899894A (en) | 2020-03-24 |
| CN110899894B true CN110899894B (en) | 2021-11-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007275950A (en) * | 2006-04-10 | 2007-10-25 | Aji Kk | Joining device, loading device, joining method, and loading method |
| JP4320350B2 (en) * | 2006-08-23 | 2009-08-26 | Ｔｄｋ株式会社 | Conductive member supply apparatus and conductive member supply method |
| DE102012022669B4 (en) * | 2012-11-21 | 2022-10-13 | Illinois Tool Works Inc. | selective soldering system |
| US9721855B2 (en) * | 2014-12-12 | 2017-08-01 | International Business Machines Corporation | Alignment of three dimensional integrated circuit components |
| CN105108264B (en) * | 2015-09-23 | 2017-03-15 | 武汉凌云光电科技有限责任公司 | A kind of stannum ball pump head for laser soldering |
| CN205218294U (en) * | 2015-11-05 | 2016-05-11 | 武汉凌云光电科技有限责任公司 | Gravity flow soldering ware |
| CN110280860A (en) * | 2019-07-19 | 2019-09-27 | 深圳市诺顿激光科技有限公司 | Tin ball bonding connection device |
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