CN115863515A - Transfer device, transfer equipment and transfer method - Google Patents

Abstract

The invention relates to the technical field of mechanical equipment, and discloses a transfer device, transfer equipment and a transfer method, wherein the transfer device is used for transferring a target substrate to a bearing substrate and comprises the following components: a first conduit comprising a first end and a second end, the first end for connection to a fluid source; the nozzle assembly is arranged at the second end of the first pipeline and used for jetting fluid to a corresponding target substrate or a bearing substrate; the switch assembly is arranged on the first pipeline and used for controlling the on-off of the first pipeline. The transfer device, the transfer equipment and the transfer method solve the problems that the movement speed of the thimble is restricted by the quality of an assembly, the thimble carrier is easy to break down and the thimble is easy to damage when the micro electronic element is transferred from the bearing film to the substrate in a micro thimble piercing-falling mode.

Description

Transfer device, transfer equipment and transfer method

Technical Field

The invention relates to the technical field of mechanical equipment, in particular to a transfer device, transfer equipment and a transfer method.

Background

In the production process of the Micro/MiniLED liquid crystal panel, a large number of microelectronic elements (e.g., LED chips) need to be transferred from a carrier film, which is usually made of a transparent or translucent material and has a certain elasticity, to a substrate (substrate), and the microelectronic elements are usually arranged in an array on the carrier film.

In the prior art, a microelectronic element is attached to a surface of a carrier film facing a substrate, and the microelectronic element is transferred from the carrier film to the substrate (substrate) by fine lift-off. The process of punching the micro electronic element by the micro thimble requires high frequency, high speed, high precision and other characteristics, and the micro thimble is driven by a linear motor or a rotary motor to drive a linear module. This method has the following disadvantages:

(1) The carrier must drive the thimble to reciprocate, need frequent acceleration and deceleration, and thimble itself and carrier are generally made of metal, and the quality of assembly can restrict the movement speed to the efficiency that limits LED wafer and shifts.

(2) Because frequently add deceleration, if the thimble carrier is linear electric motor, need to keep the heavy current for a long time, if the thimble carrier drives sharp module for rotating electrical machines, then need frequently extrude drive mechanism, these two kinds of circumstances all lead to thimble carrier trouble easily.

(3) The pulling of the wafer depends on the impact of the thimble, the needle point of the thimble can be damaged due to long-term high-frequency impact, and the production efficiency can be reduced and the production cost can be increased due to the replacement of the thimble.

(4) When the thimble carrier equipment is damaged, the movement distance and speed cannot be accurately controlled, and the glass substrate is damaged at great risk, so that unnecessary loss is caused.

Disclosure of Invention

The invention provides a transfer device, transfer equipment and a transfer method, which can solve the problems that the movement speed of an ejector pin is limited by the quality of an assembly, the ejector pin carrier is easy to fail and the ejector pin is easy to damage when a micro electronic element is transferred from a bearing film to a substrate in a micro ejector pin pricking mode.

In order to achieve the purpose, the invention provides the following technical scheme:

the present invention provides a transfer device for transferring a target substrate onto a carrier substrate, the transfer device comprising:

a first conduit comprising a first end and a second end, the first end for connection to a fluid source;

the nozzle assembly is arranged at the second end of the first pipeline and is used for ejecting fluid to the corresponding target substrate or the bearing substrate;

and the switch assembly is arranged on the first pipeline and used for controlling the on-off of the first pipeline.

The transfer device provided by the invention comprises a first pipeline, a nozzle assembly arranged at the second end of the first pipeline and a switch assembly arranged on the first pipeline and used for controlling the on-off of the first pipeline, wherein the nozzle assembly is used for being matched with the switch assembly and jetting fluid to a corresponding target substrate or a target substrate bearing body, so that the transfer device provided by the invention can assist the target substrate to be transferred to a bearing substrate under the action of the fluid. The switch component controls the on-off of the fluid to realize the transfer of the target base material to the bearing base material, and the carrier-free driving thimble reciprocates, so that the problems of limited movement speed of the mass of the assembly, failure of the thimble carrier and damage of the thimble do not exist, the transfer of the target base material to the bearing base material is more stable and efficient (namely high frequency), the service life of the transfer device is longer, and the cost is saved; meanwhile, the plasticity of the fluid can reduce or even avoid the target base material and the bearing base material from being damaged, and the damage to the target base material and the bearing base material can be reduced or even avoided.

Optionally, the transfer device comprises a pressure regulating assembly, the first end of the first pipeline is connected with the pressure regulating assembly, and the pressure regulating assembly is used for being connected with a fluid source.

Optionally, the switch assembly comprises a switch valve.

Optionally, the distance between the switch assembly and the nozzle assembly is greater than 0 and less than or equal to 200mm.

Optionally, the transfer device includes a second pipeline and a pressure relief assembly, one end of the second pipeline is communicated with a portion of the first pipeline between the nozzle assembly and the switch assembly, and the other end of the second pipeline is communicated with the pressure relief assembly.

Optionally, the pressure relief assembly comprises a pressure relief valve.

Optionally, a distance between the pressure relief assembly and the nozzle assembly is greater than 0 and less than or equal to 200mm.

Optionally, the transfer device further comprises a nozzle connecting tube, one end of the nozzle connecting tube is communicated with the fluid ejection channel in the nozzle assembly, and the other end of the nozzle connecting tube is communicated with the first pipeline.

Optionally, the transfer device includes a nozzle driving part connected to the nozzle connecting pipe, and the nozzle driving part is configured to drive the nozzle connecting pipe and the nozzle assembly to move along a first direction, a second direction, and a third direction;

wherein the first direction, the second direction and the third direction are perpendicular to each other.

Optionally, the nozzle assembly comprises:

a nozzle provided with a fluid ejection channel;

the shell is internally provided with an accommodating cavity, the shell is provided with a first interface and a second interface which are communicated with the accommodating cavity, the first interface is used for being connected with an external fluid pipeline, and the second interface is hermetically connected with the nozzle;

and the nozzle opening and closing assembly is arranged in the accommodating cavity of the shell and is used for controlling whether the fluid spraying channel is communicated with the accommodating cavity or not.

Optionally, the nozzle opening and closing assembly comprises a valve rod, a valve rod driving assembly and a valve rod resetting assembly, wherein the valve rod driving assembly is used for driving the valve rod to be far away from the nozzle, so that the fluid spraying channel is communicated with the accommodating cavity;

the valve rod resetting assembly is used for enabling the valve rod to block the fluid spraying channel.

Optionally, the valve stem drive assembly comprises a coil and a ferromagnetic drive stem;

the accommodating cavity comprises a first cavity for accommodating the coil and a second cavity communicated with the first interface and the second interface, the coil is positioned in the first cavity, and the driving rod extends out of the first cavity and is connected with one end, far away from the nozzle, of the valve rod;

when the coil is electrified, the driving rod can drive the valve rod to move in the direction away from the nozzle; when the coil is powered off, the valve rod resets under the action of the valve rod resetting component to block the fluid spraying channel.

Optionally, a flange is arranged at one end of the driving rod close to the valve rod;

the valve rod reset assembly comprises an elastic reset piece which is sleeved on the driving rod and is positioned between the flanging and the first cavity;

when the coil is powered off, the driving rod drives the valve rod to reset under the action of the elastic resetting piece, so that the valve rod blocks the fluid spraying channel.

Optionally, in the accommodating cavity, at least two annular sealing portions are arranged between the first cavity and the second cavity, and the at least two annular sealing portions are arranged at intervals along the length direction of the valve rod;

the valve rod passes through the annular hole of each annular sealing part.

Optionally, the nozzle assembly comprises an adjustment stem;

the casing is kept away from the one end of nozzle is equipped with the regulation hole, adjust the pole set up in adjusting the hole, and with the actuating lever is relative, just it stretches into to adjust the distance in hole can adjust.

Optionally, the nozzle assembly is a gas nozzle assembly.

The present invention also provides a transfer apparatus comprising: a target substrate carrier for carrying a target substrate, a carrier substrate mounting body for disposing a carrier substrate, and the transfer apparatus provided in any one of the above technical solutions, wherein the target substrate carrier is opposite to the carrier substrate mounting body, and a surface of the target substrate carrier for disposing the target substrate faces the carrier substrate mounting body;

the transfer device is used for reducing the distance between the target substrate and the bearing substrate installation body so as to transfer the target substrate to the bearing substrate.

The transfer device provided by the invention reduces the distance between the target substrate bearing body and the bearing substrate mounting body through the transfer device, so that the target substrate is transferred onto the bearing substrate, and particularly, the transfer device assists the target substrate to be transferred onto the bearing substrate through the action of the fluid. The switch component controls the on-off of the fluid to realize the transfer of the target base material to the bearing base material, and the carrier-free driving thimble reciprocates, so that the problems of limited movement speed of the mass of the assembly, failure of the thimble carrier and damage of the thimble do not exist, the transfer of the target base material to the bearing base material is more stable and efficient, the service life of the transfer device is longer, and the cost is saved; meanwhile, the plasticity of the fluid can reduce or even avoid the target base material and the bearing base material from being damaged, and can reduce or even avoid the target base material and the bearing base material from being damaged.

Optionally, the transfer apparatus comprises one said transfer device.

Optionally, the transfer apparatus includes a plurality of the transfer devices, each of the transfer devices is disposed on a side of the target substrate carrier facing away from the carrier substrate mounting body, and each of the nozzle assemblies is opposite to the target substrate carrier;

or each transfer device is arranged on one side of the bearing substrate mounting body, which is far away from the target substrate bearing body, and each nozzle assembly is opposite to the bearing substrate mounting body;

or, the target substrate supporting body and the supporting substrate installation body constitute a supporting unit, each transfer device is symmetrically distributed on two sides of the supporting unit, and each nozzle assembly is opposite to the corresponding target substrate supporting body or the corresponding supporting substrate installation body.

Optionally, the target substrate supporting body is an elastic supporting body, and a surface of the elastic supporting body facing the supporting substrate mounting body has viscosity for adhering the target substrate;

the transfer device is positioned on one side of the target substrate bearing body, which is far away from the bearing substrate mounting body.

Optionally, the target substrate supporting body is a rigid supporting body, and the surface of the rigid supporting body facing the supporting substrate mounting body has viscosity for adhering the member to be transferred;

the rigid supporting body is provided with a bonding area for bonding the target base material, and a fluid passing hole is arranged in the bonding area and has a smaller size than the bonding area;

the transfer device is positioned on one side of the target substrate bearing body, which is far away from the bearing substrate mounting body.

Optionally, the transfer apparatus comprises a first drive assembly for driving the target substrate carrier, the first drive assembly being configured to drive the target substrate carrier in motion to change the orientation of the target substrate.

Optionally, the transfer apparatus comprises a second drive assembly for driving the carrier substrate mount to move to change the orientation of the carrier substrate.

Optionally, the transfer apparatus comprises a camera assembly for determining the relative position of the target substrate on the target substrate carrier and the carrier substrate.

Optionally, the target substrate supporting body is a transparent supporting body or a semitransparent supporting body, the camera module comprises a camera, and the camera is located on one side of the target substrate supporting body, which deviates from the supporting substrate mounting body.

Optionally, the camera assembly includes a camera driving portion, and the camera driving portion is connected to the camera and configured to drive the camera to change a relative position between the camera and each target substrate on the target substrate supporting body.

The invention also provides a transfer method using the transfer device, which comprises the following steps:

target base material to be transferred is in place;

and opening the switch assembly and the nozzle assembly to enable the nozzle assembly to spray the fluid to the corresponding target substrate or the bearing substrate.

According to the transfer method provided by the invention, the target base material is transferred onto the bearing base material through the fluid sprayed by the nozzle assembly, the plasticity of the fluid can reduce or even avoid the target base material and the bearing base material from being damaged, and the damage to the target base material and the bearing base material can be reduced or even avoided.

Drawings

FIG. 1 is a schematic view of a nozzle assembly according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a transfer device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a transfer apparatus in a first working state according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a transfer device in a second working state according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a transfer apparatus in a third operating state according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a transfer apparatus in a fourth operating state according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a transfer apparatus in a fifth operating state according to an embodiment of the present invention.

Icon: 100-a target substrate; 200-a carrier substrate; 300-a target substrate carrier; 400-a carrier substrate mount; 1-a first conduit; 11-first stage; 12-a second segment; 13-a third stage; 14-a line connection; 2-a pressure regulating assembly; 3-a switching assembly; 4-a nozzle assembly; 41-a nozzle; 411-fluid ejection channel; 42-nozzle connection tube; 43-nozzle drive section; 44-a housing; 441-a first interface; 443-a second cavity; 444-first portion; 445-second section; 446-annular seal; 447-a first cavity; 448-an annular guide; 45-valve stem; 46-a valve stem drive assembly; 461-coil; 462-a drive rod; 463-flanging; 47-a valve stem reset assembly; 48-adjusting rod; 49-control cables; 5-a second conduit; 6-a pressure relief assembly; 7-a first drive assembly; 8-a second drive assembly; 9-camera.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In an alternative implementation, as shown in fig. 2, a transfer apparatus for transferring a target substrate 100 (e.g., microelectronic device) onto a carrier substrate 200 (e.g., a glass substrate) includes:

a first conduit 1, the first conduit 1 comprising a first end and a second end, the first end for connection to a fluid source;

the nozzle assembly 4 is arranged at the second end of the first pipeline 1 and used for jetting fluid to the corresponding target substrate 100 or the bearing substrate 200;

and the switch component 3 is arranged on the first pipeline 1 and used for controlling the on-off of the first pipeline 1.

The transfer device provided by this embodiment includes a first pipeline 1, a nozzle assembly 4 disposed at a second end of the first pipeline 1, and a switch assembly 3 disposed on the first pipeline 1 and used for controlling on/off of the first pipeline 1, where the nozzle assembly 4 is used for cooperating with the switch assembly 3 to eject a fluid to a corresponding target substrate 100 or target substrate carrier 300, so that the transfer device provided by this embodiment can assist the target substrate 100 to be transferred onto the carrier substrate 200 through the action of the fluid. The switch component 3 controls the on-off of the fluid to realize the transfer of the target base material 100 to the bearing base material 200, and the carrier does not drive the thimble to reciprocate, so that the problems of the mass of the assembly restricting the movement speed, the failure of the thimble carrier and the damage of the thimble do not exist, the transfer of the target base material 100 to the bearing base material 200 is more stable and efficient (namely high frequency), the service life of the transfer device is longer, and the cost is more favorably saved; meanwhile, the plasticity of the fluid can reduce or even avoid the target substrate 100 and the carrying substrate 200 from being damaged, and can reduce or even avoid the target substrate 100 and the carrying substrate 200 from being damaged.

The target substrate carrier 300 is used for carrying the target substrate 100. In one implementation, the target substrate carrier 300 has certain viscosity and certain elasticity, can stick to the target substrate 100, prevent it from falling off due to gravity, and can arch toward the carrier substrate 200 on the carrier substrate mounting body 400 under the action of external force, thereby realizing the transfer of the target substrate 100 to the carrier substrate 200. The bonding portion of the target substrate 100 on the carrier substrate 200 is provided with an adhesive layer by coating, dispensing, soldering or electroplating, and the adhesive force of the adhesive layer to the target substrate 100 is slightly greater than the adhesive force of the target substrate carrier 300 to the target substrate 100, so that the target substrate 100 separated from the target substrate carrier 300 can be firmly bonded to the carrier substrate 300.

The microelectronic element mentioned in this embodiment includes, but is not limited to, a micro led/miniLED chip.

In order to adjust the flow rate of the fluid ejected from the nozzle assembly 4 according to actual conditions and to make the flow rate of the fluid ejected from the nozzle assembly 4 more stable, in an optional implementation manner, the transfer device includes a pressure adjusting assembly, the first end of the first pipeline 1 is connected to the pressure adjusting assembly 2, and the pressure adjusting assembly 2 is used for being connected to a fluid source.

When the pressure regulating assembly 2 is specifically arranged, in order to make the fluid pressure in the pipeline reach the required pressure and make the transfer of the target substrate 100 to the supporting substrate 200 more stable, in an optional implementation manner, the pressure regulating assembly 2 includes a constant pressure regulating valve.

When the switch assembly 3 is specifically arranged, in an alternative implementation, the switch assembly 3 includes a switch valve.

In order to avoid the influence of fluid on the target substrate carrier 300 in the space between two target substrates 100, the transfer device may be used for continuous transfer of a plurality of target substrates 100, and in an alternative implementation, the transfer device includes a second conduit 5 and a pressure relief assembly 6, wherein one end of the second conduit 5 is communicated with the first conduit 1 between the nozzle assembly 4 and the switch assembly 3, and the other end is communicated with the pressure relief assembly 6.

Specifically, the first pipeline 1 may include a first section 11, a second section 12, and a third section 13, the second section 12, the third section 13, and the second pipeline 5 are connected by a pipeline connector 14 (e.g., a three-way joint), the first section 11 is used to connect the pressure regulating assembly 2 and the switch assembly 3, the second section 12 is connected to the switch assembly 3 and the pipeline connector 14, the third section 13 is connected to the pipeline connector 14 and the nozzle assembly 4, and one end of the second pipeline 5, which is far away from the connector, is connected to the pressure relief assembly 6.

The first section 11, the second section 12 and the second duct 5 may all be hoses.

In one particular implementation, the pressure relief assembly 6 may include a pressure relief valve.

The pressure release valve is opened after the target substrate 100 and the bearing substrate 200 are attached to each other, so that pressure is released; and is closed before the on-off valve is opened again (supplied with air) to avoid the insufficient pressure of the fluid ejected from the nozzle.

The constant pressure regulating valve, the switch valve and the pressure relief valve can be electromagnetic valves.

The distances between the switch assembly 3 and the pressure relief assembly 6 and the nozzle assembly 4 can be greater than 0 and less than or equal to 200mm, and specifically, the distances can refer to the length of a pipeline.

In an alternative implementation, the transfer device comprises a nozzle connection tube 42, one end of the nozzle connection tube 42 being in communication with the fluid ejection channel in the nozzle assembly 4 and the other end being in communication with the first conduit 1. That is, the nozzle assembly 4 communicates with the first duct 1 through the nozzle connection pipe 42.

Further, in an alternative implementation manner, the transferring device includes a nozzle driving part 43 connected to the nozzle connecting pipe 42, and the nozzle driving part 43 is configured to drive the nozzle connecting pipe 42 and the nozzle 41 to move along the first direction, the second direction, and the third direction;

wherein, the first direction, the second direction and the third direction can be vertical two by two.

In the case of the target substrate carrier 300 being horizontally disposed, the first direction may be an X-axis direction parallel to a plane of the target substrate carrier 300, the second direction may be a Y-axis direction parallel to the plane of the target substrate carrier 300, and the third direction may be a Z-axis direction perpendicular to the plane of the target substrate carrier 300.

When specifically setting up above-mentioned nozzle connecting pipe 42, nozzle connecting pipe 42 can be the rigid connection pipe, and the rigid connection pipe is corrosion-resistant, can increase of service life, simultaneously, improves its stability of motion under nozzle drive portion 43 drives.

In an alternative implementation, as shown in fig. 1, the nozzle assembly 4 includes:

a nozzle 41 provided with a fluid ejection passage 411;

a housing 44 having a receiving cavity formed therein, the housing 44 having a first port 441 and a second port communicating with the receiving cavity, the first port 441 being used for connecting with an external fluid pipeline, and the second port being hermetically connected with the nozzle 41;

and a nozzle opening and closing assembly disposed in the accommodating chamber of the housing 44 for controlling whether the fluid spraying channel 411 is communicated with the accommodating chamber.

The nozzle assembly 4 provided in this embodiment includes a housing 44, a nozzle 41 hermetically connected to a second port of the housing 44, and a nozzle opening and closing assembly disposed in a receiving cavity of the housing 44, wherein the first port 441 of the housing 44 is used for being connected to an external fluid pipeline, and the nozzle opening and closing assembly can control whether the fluid ejection channel 411 is communicated with the receiving cavity. When the first port 441 of the housing 44 is connected to an external fluid pipeline, the fluid ejection channel 411 is connected to the receiving cavity through the nozzle opening/closing assembly, and the fluid entering the receiving cavity can be ejected from the nozzle 41, so that the nozzle assembly provided in this embodiment can transfer the target substrate 100 on the target substrate carrier 300 to the carrier substrate 200 on the carrier substrate mounting body 400.

Illustratively, the nozzle 41 is threadedly connected with the second interface of the housing 44; specifically, in the nozzle assembly, the number of the nozzles 41 may be one or more. The relative position between the nozzles 41 may be fixed or adjustable; the nozzles 41 may be operated simultaneously (that is, simultaneously discharge the fluid and simultaneously stop the discharge of the fluid), or may be operated simultaneously.

The nozzle 41 is used to eject a gas flow to transfer the target substrate 100 from the target substrate carrier 300 to the carrier substrate 200. Illustratively, the orifice of the nozzle 41 may be a fine circle to make the ejected air flow more concentrated and smoother; when the transfer device is located on the side of the target substrate carrier 300 away from the carrier substrate mounting body 400, the distance between the position of the nozzle 41 during air injection and the target substrate carrier 300 may be about 0.5mm, so as to reduce air flow diffusion as much as possible; the diameter of the nozzle 41 may be about 20% to 30% of the size of the target substrate 100 to ensure the force and range of action on the target substrate carrier 300.

When the nozzle opening and closing assembly is specifically arranged, in an optional implementation manner, the nozzle opening and closing assembly comprises a valve rod 45, a valve rod driving assembly 46 and a valve rod resetting assembly 47, wherein the valve rod driving assembly 46 is used for driving the valve rod 45 to be far away from the nozzle 41, so that the fluid spraying channel 411 is communicated with the accommodating cavity; the valve stem reset assembly 47 is used to cause the valve stem 45 to block the fluid ejection channel 411.

With the above-described valve stem drive assembly 46 in particular, in an alternative implementation, the valve stem drive assembly 46 includes a coil 461 and a ferromagnetic drive rod 462;

the accommodating cavity comprises a first cavity 447 for accommodating the coil 461 and a second cavity 443 communicated with the first interface 441 and the second interface, the coil 461 is positioned in the first cavity 447, and the driving rod 462 extends out of the first cavity 447 and is connected with one end of the valve rod 45 away from the nozzle 41;

when the coil 461 is electrified, the driving rod 462 can drive the valve rod 45 to move in the direction away from the nozzle 41; when the coil 461 is de-energized, the valve stem 45 is reset by the valve stem reset assembly 47, blocking the fluid ejection passage 411.

Illustratively, the coil 461 is connected to the control cable 49 for energizing and de-energizing; the housing 44 includes a first portion 444 formed with a first accommodation chamber and a second portion 445 formed with a second accommodation chamber, the first portion 444 includes a limit step for limiting the coil 461, at least two annular sealing portions 446 mentioned below are provided on the second portion 445, and the first portion 444 and the second portion 445 are fixedly connected.

Alternatively, the coil 461 may be an electromagnet, and when the electromagnet is powered, the driving rod 462 can drive the valve rod 45 to move in a direction away from the nozzle 41; when the power is off, the valve rod 45 is reset under the action of the valve rod resetting component 47, and the fluid spraying channel 411 is blocked.

In one embodiment, the end of the driving rod 462 near the valve rod 45 may be provided with a flange 463;

the valve rod resetting assembly 47 comprises an elastic resetting piece which is sleeved on the driving rod 462 and is positioned between the flange 463 and the first cavity 447;

when the coil 461 is powered off, the driving rod 462 drives the valve rod 45 to reset under the action of the elastic resetting piece, so that the valve rod 45 blocks the fluid spraying channel 411.

The reset of the driving rod 462 is realized through the elastic reset piece, the structure of the nozzle assembly can be simplified, and the cost is saved.

In an alternative implementation manner, in the accommodating cavity, at least two annular sealing portions 446 are arranged between the first cavity 447 and the second cavity 443, and the at least two annular sealing portions 446 are arranged at intervals along the length direction of the valve rod 45;

the valve stem 45 passes through the annular hole of each annular seal 446.

At least two annular sealing parts 446 arranged between the first cavity 447 and the second cavity 443 at intervals can not only ensure the sealing between the first cavity 447 and the second cavity 443, but also play a guiding role in the movement of the valve rod 45, and ensure the accuracy of the movement direction of the valve rod 45.

In an alternative implementation, the second cavity 443 may be provided with an annular guide portion 448 near the nozzle 41, the valve rod 45 passes through an annular hole of the annular guide portion 448, and the annular hole of the annular guide portion 448 has a gap with a side wall of the valve rod 45. In this way, the annular guide portion 448 can guide the movement of the valve rod 45 without affecting the fluid ejection passage of the fluid inlet nozzle 41 in the second cavity 443.

In an alternative implementation, the nozzle assembly includes an adjustment rod 48, an end of the housing 44 remote from the nozzle 41 is provided with an adjustment hole, the adjustment rod 48 is disposed in the adjustment hole and opposite to the driving rod 462, and a distance of the adjustment rod 48 extending into the adjustment hole can be adjusted.

Set up the regulation hole in the one end of keeping away from nozzle 41 at casing 44, adjust the pole 48 and set up in adjusting the hole to relative with actuating lever 462, and the distance that adjusts pole 48 stretched into the regulation hole can be adjusted, thereby make valve rod 45 keep away from nozzle 41 under the effect of valve rod drive assembly 46 the distance can be adjusted, this makes operating personnel can adjust the stroke of valve rod 45 reciprocating motion according to actual conditions, make the nozzle assembly 4 that this embodiment provided can compromise reaction rate and spun fluid intensity as far as possible.

For example, a limit groove may be formed at an end of the adjustment rod 48 facing the driving rod 462, a limit protrusion corresponding to the limit groove may be formed at an end of the driving rod 462 adjacent to the adjustment rod 48, and when the valve rod 45 blocks the fluid discharge passage 411 of the nozzle 41, a portion of the limit protrusion of the driving rod 462 is located in the limit groove of the adjustment rod 48.

Illustratively, the adjustment rod 48 may be a threaded rod and the adjustment holes are threaded holes corresponding to the adjustment rod 48.

Obviously, when the transfer device employs the above-described nozzle assembly 4, the pressure relief assembly 6 need not be provided.

In an alternative implementation, the nozzle assembly 4 is a gas nozzle assembly, i.e., the transfer device provided in this embodiment transfers the target substrate 100 from the target substrate carrier 300 to the carrier substrate 200 in a high-frequency damage-free manner by means of gas injection (e.g., high-pressure gas injection).

At this time, the air inlet pressure is adjusted by the constant pressure regulating valve, and the on-off and the rapid discharge of the high-pressure gas are controlled by the cooperation of the switch valve (e.g., the air inlet solenoid valve) and the pressure release valve (e.g., the air release solenoid valve), so as to ensure that the air flow blown out from the nozzle 41 is rapidly discharged after the target substrate is attached to the carrier substrate, and thus the target substrate carrier 300 can be rapidly restored.

Wherein, the switch valve and the pressure release valve can adopt high-frequency electromagnetic valves; the opening and closing action time of the switch valve is less than 1ms, and the opening duration time of each time is not less than 2ms, so that the air flow strength is ensured. The distance between the switch assembly 3 (e.g. switch valve) and the nozzle 41 should be as short as possible within 200mm to ensure the response speed of the jet stream while ensuring sufficient assembly space. The pressure relief valve is used for quickly relieving air pressure between the switch valve and the nozzle 41, and on the premise of ensuring enough assembly space, the distance between a pressure relief component (such as the pressure relief valve) and the nozzle 41 is controlled within 200mm as short as possible so as to ensure the response speed of stopping the injection of the injection airflow.

As shown in fig. 3-7, the present embodiment provides a transfer apparatus comprising a target substrate carrier 300 for carrying a target substrate 100, a carrier substrate mount 400 for disposing a carrier substrate 200, and the above transfer device, wherein the target substrate carrier 300 is opposite to the carrier substrate mount 400, and a surface of the target substrate carrier 300 for disposing the target substrate 100 faces the carrier substrate mount 400; the transfer device is used to reduce the distance between the target substrate 100 and the carrier substrate mount 400, so that the target substrate 100 is transferred onto the carrier substrate 200.

The transfer apparatus provided in this embodiment reduces the distance between the target substrate carrier 300 and the carrier substrate mounting body 400 through the transfer device, so as to transfer the target substrate 100 onto the carrier substrate 200, specifically, the transfer device assists the target substrate 100 to be transferred onto the carrier substrate 200 through the action of the fluid. The switch component 3 controls the on-off of the fluid to realize the transfer of the target base material 100 to the bearing base material 200, and the carrier does not drive the thimble to reciprocate, so that the problems of the mass of the assembly restricting the movement speed, the failure of the thimble carrier and the damage of the thimble do not exist, the transfer of the target base material 100 to the bearing base material 200 is more stable and efficient, the service life of the transfer device is longer, and the cost is saved; meanwhile, the plasticity of the fluid can reduce or even avoid the target substrate 100 and the carrying substrate 200 from being damaged, and can reduce or even avoid the target substrate 100 and the carrying substrate 200 from being damaged.

When the target substrate 100 is not transferred to the mount substrate 200, the distance between the target substrate carrier 300 and the mount substrate assembly 400 is greater than the thickness of the target substrate 100.

The transfer apparatus may include one transfer device or a plurality of transfer devices.

When the transfer apparatus includes a plurality of transfer devices, each transfer device may be disposed on a side of the target substrate carrier 300 away from the carrier substrate mount 400, so that the transfer of the target substrate 100 to the carrier substrate 200 is realized through each nozzle assembly 4; each transfer device may also be disposed on a side of the target substrate carrier 300 away from the carrier substrate mount 400, so that the target substrate 100 is transferred to the carrier substrate 200 through each nozzle assembly 4.

It is also possible that the target substrate carrier 300 and the carrier substrate mount 400 constitute a carrier unit, each transfer device is symmetrically distributed on both sides of the carrier unit (obviously, a side of the target substrate carrier 300 facing away from the carrier substrate mount 400 and a side of the carrier substrate mount 400 facing away from the target substrate carrier 300), and each nozzle assembly 4 is opposite to the corresponding target substrate carrier 300 or carrier substrate mount 400.

It should be noted that, when the transfer device is disposed on the side of the carrier substrate mounting body 400 away from the target substrate carrier 300, both the carrier substrate 200 and the carrier substrate mounting body 400 have elasticity.

When the transfer device is disposed on the side of the target substrate carrier 300 away from the carrier substrate mounting body 400, the target substrate carrier 300 may be an elastic carrier, and the surface of the elastic carrier facing the carrier substrate mounting body 400 has viscosity and is provided with a circuit for bonding the target substrate 100.

At this time, the constant air flow ejected from the nozzle 41 blows the elastic support body into a tapered shape with its apex angle directed toward the mount body 400 of the mount base material 200 (as shown in fig. 5 and 7), and the target base material 100 is attached to the corresponding position of the mount base material 200.

As an alternative, the target substrate carrier 300 may also be a rigid carrier, the face of which facing the carrier substrate mounting body 400 has adhesive properties for adhering the transfer-ready member; the rigid support body has a bonding region for bonding the target substrate 100, and a fluid passage hole having a size smaller than that of the bonding region is provided in the bonding region.

In an alternative implementation, the transfer apparatus includes a first driving assembly 7 for driving the target substrate carrier 300, and the first driving assembly 7 is used for driving the target substrate carrier 300 to move so as to change the orientation of the target substrate 100, so that the direction and the position of the target substrate 100 on the target substrate carrier 300 correspond to the corresponding tape-attaching position on the carrier substrate 200.

Still taking the target substrate carrier 300 horizontally disposed, in this case, the first driving module 7 may be used to drive the target substrate carrier 300 to realize the first direction movement, the second direction movement, the third direction movement and the plane rotation. Specifically, the first driving assembly 7 includes a first direction driving assembly, a second direction driving assembly, a third direction driving assembly, and a plane rotation driving assembly.

In an alternative implementation, the transfer apparatus includes a second driving assembly 8 for driving the carrier substrate mount 400, and the second driving assembly 8 is used for driving the carrier substrate mount 400 to move so as to change the orientation of the carrier substrate 200.

Still taking the target substrate carrier 300 horizontally disposed, in this case, the second driving assembly 8 may be used to drive the substrate carrier 400 to realize the first direction movement, the second direction movement, the third direction movement and the plane rotation.

It should be noted that any two or all three of the nozzle assembly 4, the target substrate carrier 300 and the carrier substrate mounting body 400 move to enable the target substrate 100 on the target substrate carrier 300 and the carrier substrate 200 on the carrier substrate mounting body 400 to reach the position to be bonded, and the target substrate 100 can be transferred from the target substrate carrier 300 to the carrier substrate 200 by the cooperation of the nozzle assembly 4, the pressure regulating assembly 2 and the switch assembly 3.

The target substrates 100 are typically arranged in an array on the target substrate carrier 300, and the spacing between adjacent target substrates 100 is larger than the dimension of the target substrates 100 in the same direction. The transfer apparatus provided in this embodiment may be configured to transfer one target substrate 100 at a time, or may be configured to transfer a plurality of target substrates 100 at a time. The transfer of a plurality of target substrates 100 at a time may be achieved by the nozzle assembly 4 including a plurality of nozzles 41 in the transfer device, or may be achieved by the transfer apparatus including a plurality of transfer devices.

In an alternative implementation, the transfer apparatus includes a camera assembly for detecting the relative position of the target substrate 100 on the target substrate carrier 300 and the position to be bonded on the carrier substrate 200.

In an alternative implementation, the camera assembly includes a light source (e.g., an LED light source) for illumination, which is on the same side as the camera head 9.

Specifically, the target substrate supporting body 300 is a transparent supporting body or a semitransparent supporting body, the camera module includes a camera 9, and the camera 9 is located on one side of the target substrate supporting body 300 departing from the supporting substrate mounting body 400.

Further, the camera assembly may include a camera driving part connected to the camera 9 for driving the camera 9 to change the relative position of the camera 9 and each target substrate 100 on the target substrate carrier 300.

Still taking the target substrate carrier 300 horizontally disposed, in this case, the camera driving part may be used to drive the camera 9 to realize the first direction movement, the second direction movement and the third direction movement.

In an alternative implementation, the nozzle driving part 43 may double as a camera driving part, i.e. the nozzle driving part 43 can also be used to drive the camera 9.

When the target substrate supporting body 300 is a non-transparent supporting body, the camera module may include two cameras 9, where the two cameras 9 are both located between the target substrate supporting body 300 and the supporting substrate mounting body 400, one is used for detecting the position of the target substrate, and the other is used for detecting the position to be attached to the supporting substrate.

The operation of the transfer apparatus provided in this embodiment will be described by taking the nozzle assembly 4 as a gas nozzle assembly.

The action steps of the transfer device provided by this embodiment may be as follows:

step S1, determining the position relation among the first driving assembly 7, the second driving assembly 8 and the nozzle driving part 43 through calibration;

s2, driving a camera 9 through a camera driving part, photographing the bearing substrate, and confirming all positions to be attached on the bearing substrate;

step S3, after the target substrate is loaded on the target substrate bearing body 300, driving the target substrate bearing body 300 through the first driving component 7, driving the camera 9 through the camera driving part, photographing all target substrates 100 to be attached on the target substrate bearing body 300, collecting data, and confirming the position relation of all target substrates 100, the nozzle 41 and the bearing substrate 200;

s4, adjusting a pressure regulating valve to enable the ejected air flow to provide proper pressure, driving the nozzle connecting pipe 42 by the nozzle driving part 43, and further driving the nozzle 41 to move downwards along the Z-axis direction until reaching a set distance from the target substrate carrier 300;

step S5, the first driving assembly 7 drives the carrier film to move and rotate, so that the target substrate 100 moves to a designated position and an angle to be bonded, and meanwhile, the nozzle driving portion 43 drives the nozzle connecting pipe 42 to drive the nozzle 41 to move, so that the nozzle 41 is aligned with the target substrate (as shown in fig. 4);

step S6, opening the switch valve, allowing high-pressure gas to flow into the nozzle 41 through the first pipeline 1, the nozzle connection pipe 42, and the like, so that the nozzle 41 ejects gas with a desired pressure, and blowing the target substrate 100 from the target substrate carrier 300 onto the position to be bonded of the carrier substrate 200, thereby bonding the target substrate 100 to the carrier substrate 200 (as shown in fig. 5);

s7, closing the switch valve, opening the pressure release valve, quickly deflating, enabling the target substrate bearing body 300 to restore to the original state, and closing the pressure release valve after deflation;

step S8, the first driving assembly 7 drives the target substrate carrier 300 to move in the X-axis and/or Y-axis and/or rotation direction, so as to move the next target substrate 100 to the position and angle to be bonded, and simultaneously the nozzle driving portion 43 drives the nozzle connecting tube 42, further drives the nozzle 41 to move to the position of the target substrate 100 along the X-axis and/or Y-axis direction, and prepares to blow down the target substrate 100 from the target substrate carrier 300 (as shown in fig. 6);

step S9, repeating step S6, and attaching the target substrate 100 to the carrier substrate 200 (as shown in fig. 7);

step S10, repeating the above steps S6 to S9, and completing the bonding of all or the required number of the target substrates 100 on the target substrate carrier 300 to the corresponding positions to be bonded of the carrier substrate 200.

A transfer method provided by this embodiment uses the above transfer apparatus, and the transfer method includes:

target base material to be transferred is in place;

the switch assembly 3 and the nozzle assembly are turned on, so that the nozzle assembly 4 ejects the fluid to the corresponding target substrate 100 or the carrier substrate 200.

In the transfer method provided by this embodiment, the target substrate 100 is transferred onto the carrier substrate 200 by the fluid ejected from the nozzle assembly 4, and the plasticity of the fluid can reduce or even avoid the target substrate 100 and the carrier substrate 200 from being damaged, and can reduce or even avoid the target substrate 100 and the carrier substrate 200 from being damaged.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (27)

1. A transfer device for transferring a target substrate to a carrier substrate, comprising:

a first conduit comprising a first end and a second end, the first end for connection to a fluid source;

the nozzle assembly is arranged at the second end of the first pipeline and used for ejecting fluid to the corresponding target substrate or the bearing substrate;

and the switch assembly is arranged on the first pipeline and used for controlling the on-off of the first pipeline.

2. The transfer device of claim 1, including a pressure regulating assembly, the first end of the first conduit being connected to the pressure regulating assembly, the pressure regulating assembly being adapted to be connected to a fluid source.

3. The transfer device of claim 1, wherein the switch assembly comprises a switch valve.

4. The transfer device of claim 1, wherein the distance between the switch assembly and the nozzle assembly is greater than 0 and less than or equal to 200mm.

5. The transfer device of claim 1, comprising a second conduit and a pressure relief assembly, wherein the second conduit communicates at one end with the first conduit at a location between the nozzle assembly and the switch assembly and at one end with the pressure relief assembly.

6. The transfer device of claim 5, wherein the pressure relief assembly comprises a pressure relief valve.

7. The transfer device of claim 5, wherein the distance between the pressure relief assembly and the nozzle assembly is greater than 0 and less than or equal to 200mm.

8. The transfer device of claim 1, further comprising a nozzle connecting tube, one end of which communicates with the fluid ejection channel in the nozzle assembly and the other end of which communicates with the first conduit.

9. The transfer device of claim 8, comprising a nozzle driving part connected to the nozzle connection tube, the nozzle driving part being configured to move the nozzle connection tube and the nozzle assembly in a first direction, a second direction and a third direction;

wherein the first direction, the second direction and the third direction are perpendicular to each other.

10. The transfer device of any one of claims 1-9, wherein the nozzle assembly comprises:

a nozzle provided with a fluid ejection channel;

the shell is internally provided with an accommodating cavity, the shell is provided with a first interface and a second interface which are communicated with the accommodating cavity, the first interface is used for being connected with an external fluid pipeline, and the second interface is connected with the nozzle in a sealing way;

and the nozzle opening and closing assembly is arranged in the accommodating cavity of the shell and is used for controlling whether the fluid spraying channel is communicated with the accommodating cavity or not.

11. The transfer device of claim 10 wherein said nozzle opening and closing assembly includes a valve stem, a valve stem drive assembly and a valve stem return assembly, said valve stem drive assembly for moving said valve stem away from said nozzle to place said fluid ejection channel in communication with said receiving chamber;

the valve rod resetting assembly is used for enabling the valve rod to block the fluid spraying channel.

12. The transfer device of claim 11 wherein the valve stem drive assembly comprises a coil and a ferromagnetic drive stem;

the accommodating cavity comprises a first cavity for accommodating the coil and a second cavity communicated with the first interface and the second interface, the coil is positioned in the first cavity, and the driving rod extends out of the first cavity and is connected with one end, far away from the nozzle, of the valve rod;

when the coil is electrified, the driving rod can drive the valve rod to move in the direction away from the nozzle; when the coil is powered off, the valve rod resets under the action of the valve rod resetting assembly to block the fluid spraying channel.

13. The transfer device of claim 12 wherein the end of the drive stem adjacent the valve stem is flanged;

the valve rod reset assembly comprises an elastic reset piece which is sleeved on the driving rod and is positioned between the flanging and the first cavity;

when the coil is powered off, the driving rod drives the valve rod to reset under the action of the elastic resetting piece, so that the valve rod blocks the fluid spraying channel.

14. The transfer device of claim 12, wherein at least two annular seals are disposed in the receiving chamber between the first chamber and the second chamber, the at least two annular seals being spaced apart along the length of the valve stem;

the valve rod penetrates through the annular hole of each annular sealing part.

15. The transfer device of any one of claims 12-14, wherein the nozzle assembly comprises an adjustment rod;

the casing is kept away from the one end of nozzle is equipped with the regulation hole, adjust the pole set up in adjusting the hole, and with the actuating lever is relative, just it stretches into to adjust the distance in hole can adjust.

16. The transfer device of claim 10, wherein the nozzle assembly is a gas nozzle assembly.

17. A transfer apparatus, comprising: a target substrate support for supporting a target substrate, a support substrate mount for mounting a support substrate, and the transfer device of any one of claims 1-16, wherein the target substrate support is opposite to the support substrate mount, and the target substrate support is configured to mount the target substrate with its side facing the support substrate mount;

the transfer device is used for reducing the distance between the target substrate and the bearing substrate installation body so as to transfer the target substrate to the bearing substrate.

18. The transfer apparatus of claim 17 including one of said transfer devices.

19. The transfer apparatus of claim 17, comprising a plurality of said transfer devices, each said transfer device being disposed on a side of said target substrate carrier facing away from said carrier substrate mount, each said nozzle assembly being opposite said target substrate carrier;

or each transfer device is arranged on one side of the bearing substrate mounting body, which is far away from the target substrate bearing body, and each nozzle assembly is opposite to the bearing substrate mounting body;

or, the target substrate supporting body and the supporting substrate mounting body form a supporting unit, each transfer device is symmetrically distributed on two sides of the supporting unit, and each nozzle assembly is opposite to the corresponding target substrate supporting body or the corresponding supporting substrate mounting body.

20. The transfer apparatus according to claim 17, wherein the target substrate supporting body is an elastic supporting body, a face of the elastic supporting body facing the supporting substrate mounting body has an adhesive property for adhering the target substrate;

the transfer device is positioned on one side of the target substrate bearing body, which is deviated from the bearing substrate installation body.

21. The transfer apparatus according to claim 17, wherein the target substrate carrier is a rigid carrier having an adhesive property on a face thereof facing the carrier substrate mounting body for adhering the member to be transferred;

the rigid supporting body is provided with a bonding area for bonding the target base material, and a fluid passing hole is arranged in the bonding area and has a smaller size than the bonding area;

the transfer device is positioned on one side of the target substrate bearing body, which is far away from the bearing substrate mounting body.

22. The transfer apparatus according to any one of claims 17 to 21, comprising a first drive assembly for driving the target substrate carrier, the first drive assembly being configured to drive the target substrate carrier in motion to change the orientation of the target substrate.

23. A transfer apparatus according to any of claims 17 to 21, comprising a second drive assembly for driving the carrier substrate mount, the second drive assembly being adapted to drive movement of the carrier substrate mount to change the orientation of the carrier substrate.

24. The transfer apparatus according to any of claims 17-21 comprising a camera assembly for determining the relative position of a target substrate on the target substrate carrier and the carrier substrate.

25. The transfer apparatus according to claim 24, wherein the target substrate carrier is a transparent carrier or a translucent carrier, and the camera assembly comprises a camera positioned on a side of the target substrate carrier facing away from the carrier substrate mount.

26. The transfer apparatus of claim 25, wherein the camera assembly comprises a camera drive coupled to the camera for driving the camera to change the relative position of the camera to each of the target substrates on the target substrate carrier.

27. A transfer method using the transfer apparatus according to any one of claims 17 to 26, comprising:

target base material to be transferred is in place;

and opening the switch assembly and the nozzle assembly to enable the nozzle assembly to spray the fluid to the corresponding target substrate or the bearing substrate.

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