CN110876238A

CN110876238A - Circuit board and its manufacturing method, and assembly of circuit board and electronic element and its assembling method

Info

Publication number: CN110876238A
Application number: CN201811019107.5A
Authority: CN
Inventors: 王建华; 凡秀杰; 庄玉山; 钟仲宏
Original assignee: Jabil Electronics (guangzhou) Co Ltd
Current assignee: Jabil Electronics (guangzhou) Co Ltd; Jabil Circuit Guangzhou Ltd
Priority date: 2018-09-03
Filing date: 2018-09-03
Publication date: 2020-03-10
Anticipated expiration: 2038-09-03
Also published as: CN110876238B

Abstract

A method for manufacturing a circuit board includes the steps of: providing a base material, wherein the base material is provided with a substrate, two conductive parts and a photosensitive layer, and the conductive parts are provided with via holes; placing a photomask at a position corresponding to the photosensitive layer, wherein the photomask is provided with a light-transmitting area, two first light-shading areas and a second light-shading area, and the photosensitive layer is exposed through the photomask so as to be divided into an exposed area, two first unexposed areas and a second unexposed area; and developing the photosensitive layer to remove the first unexposed area and the second unexposed area, so that the exposed area forms a solder mask layer exposing the conductive parts and a part of the substrate, the solder mask layer is provided with an opening exposing a part of the substrate, the opening is formed by removing the second unexposed area in the photosensitive layer, namely a part of area between the conductive parts, and the opening is rectangular.

Description

Circuit board and its manufacturing method, and assembly of circuit board and electronic element and its assembling method

Technical Field

The present invention relates to a circuit board, and more particularly, to a circuit board and a method of manufacturing the same, and an assembly of the circuit board and an electronic component and a method of assembling the same.

Background

Through-hole technology (Through-hole technology) is one way to mount electronic components to a circuit board. A plurality of welding pins of an electronic element are respectively inserted into a plurality of Plated Through Holes (PTH) of a circuit board, and then the welding pins are welded in the plated through holes by a wave soldering method, so that the electronic element is installed and fixed on the circuit board.

In the soldering process, the solder mask layer of the circuit board is softened under the influence of high temperature, so that the surface roughness of the solder mask layer is reduced. Therefore, when the solder passes through the surface of the solder resist, the solder balls in fine particles are easily adhered and remain on the surface of the solder resist. If the solder ball loosens and touches two adjacent solders soldered to the solder pin, a short circuit may occur in a conductor formed by the two adjacent solders. Therefore, after the soldering process is completed, the solder balls adhered to and remaining on the solder resist surface are manually cleaned. However, the manual cleaning method is not only inefficient, but also is prone to consuming labor, time and labor costs.

Disclosure of Invention

It is an object of the present invention to provide a method of manufacturing a circuit board that overcomes at least one of the disadvantages of the background art.

The purpose of the invention and the problem of the background technology are realized by adopting the following technical scheme, and the manufacturing method of the circuit board provided by the invention comprises the following steps:

providing a base material, wherein the base material is provided with a substrate, at least two conductive parts which penetrate through the substrate and are spaced, and a photosensitive layer which is formed on one side of the substrate and shields the conductive parts, and the conductive parts are provided with through holes;

placing a photomask at a position corresponding to the photosensitive layer, wherein the photomask is provided with a light-transmitting area, two first shading areas respectively corresponding to the conductive parts and a second shading area arranged between the first shading areas at intervals, and the photosensitive layer is exposed through the photomask to enable the photosensitive layer to be divided into an exposed area corresponding to the light-transmitting area, two first unexposed areas respectively corresponding to the first shading areas and a second unexposed area corresponding to the second shading area and arranged between the first unexposed areas at intervals; and

and developing the photosensitive layer to remove the first unexposed area and the second unexposed area, so that the exposed area forms a solder mask layer exposing the conductive parts and a part of the substrate, the solder mask layer is provided with an opening exposing a part of the substrate, the opening is formed by removing the second unexposed area in the photosensitive layer, namely a part of area between the conductive parts, and the opening is rectangular.

placing a photomask at a position corresponding to the photosensitive layer, and exposing the photosensitive layer through the photomask; and

developing the photosensitive layer to remove the unexposed area of the photosensitive layer, so that the exposed area of the photosensitive layer forms a solder mask layer exposing the conductive parts and a part of the substrate, wherein the solder mask layer is provided with openings exposing a part of the substrate and spaced between the conductive parts, the openings are formed by removing a part of the area corresponding to the conductive parts in the photosensitive layer, and the openings are rectangular.

providing a substrate comprising an insulating layer and a copper foil layer on at least one surface of the insulating layer;

forming at least two through holes in the substrate;

forming at least two ring pads communicated with the copper foil layer on the surface of the substrate along the peripheries of the at least two through holes respectively; and

and forming a solder mask layer between the ring pads, wherein the solder mask layer between the ring pads is provided with a rectangular opening exposing the surface of the substrate.

It is another object of the present invention to provide a circuit board that overcomes at least one of the disadvantages of the background art.

The circuit board comprises a substrate, at least two conductive parts penetrating through the substrate and spaced from each other, and a solder mask layer, wherein the conductive parts are provided with via holes, the solder mask layer is formed on one side of the substrate and exposes the conductive parts, the solder mask layer is provided with openings which expose a part of the substrate and are spaced between the conductive parts, and the openings are rectangular.

In some embodiments, the conductive portion has a gasket surrounding an outer periphery of the via hole, the conductive portion and the opening are arranged at intervals along a first direction, a width of the opening extends along the first direction, a length of the opening extends along a second direction perpendicular to the first direction, and the length of the opening is greater than a sum of a length of the gasket taken along the second direction and five percent of a length of the gasket.

It is a further object of the present invention to provide a method for assembling a circuit board and an electronic component that overcomes at least one of the disadvantages of the background art.

The object of the present invention and the problem of the background art are achieved by the following technical solutions, and the method for assembling the circuit board and the electronic component according to the present invention comprises the following steps:

providing a circuit board, wherein the circuit board comprises a substrate, at least two conductive parts which penetrate through the substrate and are arranged at intervals, and a solder mask layer, wherein a conducting hole is formed in each conductive part, the solder mask layer is formed on one side of the substrate and exposes the conductive parts, an opening which exposes one part of the substrate and is arranged between the conductive parts at intervals is formed in the solder mask layer, and the opening is rectangular;

inserting two welding pins of an electronic element into the through holes respectively; and

and welding the welding foot to the conductive part.

In some embodiments, the conductive portions and the openings are arranged at intervals along a first direction, and the circuit board is driven to move along the first direction and the soldering pins are soldered to the conductive portions in a wave soldering manner.

In some embodiments, the conductive portion and the opening are arranged at intervals along a first direction, and the soldering foot is soldered to the conductive portion by moving a soldering nozzle along the first direction and using a selective wave soldering method.

It is a further object of the present invention to provide a combination of a circuit board and an electronic component that overcomes at least one of the disadvantages of the background art.

The invention aims to solve the technical problems and adopts the following technical scheme that the combined body provided by the invention comprises a circuit board and an electronic element, wherein the circuit board comprises a substrate, at least two conductive parts which penetrate through the substrate and are spaced, and a solder mask layer, wherein the conductive parts are provided with conducting holes, the solder mask layer is formed on one side of the substrate and exposes the conductive parts, the solder mask layer is provided with openings which expose a part of the substrate and are spaced between the conductive parts, the openings are rectangular, the electronic element is provided with two welding pins which are respectively inserted into the conducting holes, and the welding pins are welded on the conductive parts through welding materials.

The invention has the beneficial effects that: the solder mask layer of the circuit board is provided with the opening for exposing one part of the substrate between every two adjacent conductive parts, so that the solder balls can be reduced or even prevented from being adhered and remained on the surface of the solder mask layer in the welding process, and the working time and labor cost required by subsequent solder ball cleaning can be saved.

Drawings

FIG. 1 is a flow chart of one embodiment of a method of manufacturing a circuit board according to the present invention;

FIG. 2 is a bottom view of a substrate used in the embodiment;

FIG. 3 is a fragmentary cross-sectional view of a substrate used in the embodiment;

FIG. 4 is a fragmentary cross-sectional view of the substrate used in the embodiment illustrating exposure of two photosensitive layers through two masks, respectively;

FIG. 5 is a fragmentary bottom view of the mask used in the embodiment, illustrating that the mask has a transparent region, a plurality of first light-shielding regions and a plurality of second light-shielding regions, each second light-shielding region being spaced between every two adjacent first light-shielding regions;

FIG. 6 is a fragmentary cross-sectional view of a circuit board manufactured according to the embodiment, illustrating the photosensitive layer is developed by developing solution to form two solder masks;

FIG. 7 is a fragmentary bottom view of the circuit board manufactured by the embodiment illustrating the solder mask layer having a plurality of openings formed therein, each opening being spaced between every two adjacent conductive portions;

FIG. 8 is a flowchart illustrating a method of assembling the circuit board and an electronic component according to the embodiment;

fig. 9 is a fragmentary cross-sectional view illustrating the insertion of the soldering pins of the electronic component into the through holes of the circuit board, respectively;

FIG. 10 is a fragmentary cross-sectional view illustrating a welding nozzle moved upwardly to a welding position such that molten solder at the tip of the welding nozzle fills the via and encapsulates the solder legs;

FIG. 11 is a fragmentary cross-sectional view illustrating the movement of the solder nozzle in the first direction to sequentially pass molten solder through the remaining conductive portions;

FIG. 12 is a fragmentary cross-sectional view illustrating the welding nozzle moved downwardly to an exit position; and

FIG. 13 is a fragmentary cross-sectional view illustrating the movement of the circuit board in the first direction to sequentially pass the conductive portions of the circuit board over molten solder on a solder pot.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

Before the present invention is described in detail, it is noted that like elements are represented by like reference numerals throughout the following description.

Referring to fig. 1, fig. 1 is a flow chart illustrating steps of a method for manufacturing a circuit board according to an embodiment of the present invention, the method includes the following steps: a substrate providing step S1, an exposure step S2, and a development step S3.

Referring to fig. 1, 2 and 3, in the step S1 of providing the substrate, the substrate 1 has a substrate 11, a plurality of conductive portions 12, two

copper foil layers

13 and 14, and two

photosensitive layers

15 and 16. The substrate 11 has an insulating layer 110 composed of synthetic resin and reinforcing material, the insulating layer 110 having a first surface 111 and a second surface 112 opposite to the first surface 111. The two

copper foil layers

13 and 14 are respectively covered on the first surface 111 and the second surface 112. The substrate 11 is drilled to form a plurality of through holes 113 penetrating the first surface 111 and the second surface 112 and arranged at intervals along a first direction X on the substrate 11. The conductive portions 12 are arranged at intervals along the first direction X by forming the corresponding conductive portions 12 by electroplating copper in each of the through holes 113. Each conductive portion 12 has a peripheral wall 121 formed on the inner peripheral surface of the corresponding through hole 113 and protruding out of the first surface 111 and the second surface 112, a ring pad 122 formed on the first surface 111 and connected to one end of the peripheral wall 121, and a ring pad 123 formed on the second surface 112 and connected to the other end of the peripheral wall 121. The peripheral wall 121 of each conductive portion 12 and the

ring pads

122 and 123 together define a via hole 124, and the via hole 124 in this embodiment is a plated through hole. Each conductive portion 12 is connected to the copper foil layer 13 covering the first surface 111 via a ring pad 122, and is connected to the copper foil layer 14 covering the second surface 112 via a ring pad 123.

The liquid photosensitive agent is coated on the first surface 111 and the second surface 112 by, for example, screen printing (screen printing), and then the liquid photosensitive agent is pre-baked. The photosensitive layer 15 is formed when the liquid photosensitive agent applied to the first surface 111 is cooled, and the photosensitive layer 16 is formed when the liquid photosensitive agent applied to the second surface 112 is cooled. The photosensitive layer 15 shields the conductive part 12 and the copper foil layer 13 on the first surface 111, and the photosensitive layer 16 shields the conductive part 12 and the copper foil layer 14 on the second surface 112.

Referring to fig. 1, 4 and 5, in the exposure step S2, the substrate 1 is placed in an exposure machine (not shown), one mask 2 is placed at a position corresponding to the photosensitive layer 15, and the other mask 3 is placed at a position corresponding to the photosensitive layer 16. The mask 2 has a light-transmitting region 21, a plurality of first light-shielding regions 22 corresponding to the conductive portions 12, and a plurality of second light-shielding regions 23. The first light-shielding regions 22 are arranged at intervals along the first direction X, and an outline and a size of each first light-shielding region 22 are the same as an outline and a size of the ring pad 122 of the corresponding conductive portion 12, so that each first light-shielding region 22 can shield an area of the corresponding conductive portion 12 exposed on the first surface 111. Each second light-shielding region 23 is located between every two adjacent first light-shielding regions 22 at intervals, and the second light-shielding regions 23 and the first light-shielding regions 22 are arranged at intervals along the first direction X. Each of the second light-shielding regions 23 has a rectangular shape and has a width W1 and a length L1. The width W1 extends in the first direction X, and the width W1 is 0.35 millimeters (mm), for example. The length L1 extends in a second direction Y perpendicular to the first direction X, and the length L1 is greater than the sum of the length of the first light-shielding region 22 taken in the second direction Y and five percent of the length of the first light-shielding region 22. The mask 3 has a light-transmitting area 31 and a plurality of light-shielding areas 32 corresponding to the conductive portions 12, respectively. The light-shielding regions 32 are arranged at intervals along the first direction X, and the outline and the size of each light-shielding region 32 are the same as the outline and the size of the ring pad 123 of the corresponding conductive portion 12, so that the light-shielding regions 32 can shield the area of the corresponding conductive portion 12 exposed on the second surface 112.

Referring to fig. 4, the exposure machine irradiates the mask 2 with the uv light U1, and when the uv light U1 irradiates the transparent region 21, the uv light U21 irradiates the photosensitive layer 15, so that the photosensitive layer 15 is divided into an exposure region 151 corresponding to the transparent region 21 and irradiated by the uv light U1, and the exposure region 151 is irradiated by the uv light U1 to generate a polymerization reaction. When the ultraviolet light U1 irradiates the first light-shielding region 22 and the second light-shielding region 23, the ultraviolet light U1 is shielded from passing through the mask 2, so that the photosensitive layer 15 is divided into a plurality of first unexposed regions 152 respectively corresponding to the first light-shielding regions 22 and not irradiated by the ultraviolet light U1, and a plurality of second unexposed regions 153 respectively corresponding to the second light-shielding regions 23 and not irradiated by the ultraviolet light U1. By exposing the photosensitive layer 15 through the mask 2, the pattern on the mask 2 can be transferred onto the photosensitive layer 15.

On the other hand, the mask 3 is irradiated with the ultraviolet light U2 through the exposure machine, when the ultraviolet light U2 irradiates the light-transmitting region 31, the ultraviolet light U2 irradiates the photosensitive layer 16 through the light-transmitting region 31, so that the photosensitive layer 16 divides an exposure region 161 corresponding to the light-transmitting region 31 and irradiated with the ultraviolet light U2, and the exposure region 161 is irradiated with the ultraviolet light U2 to generate a polymerization reaction. When the ultraviolet light U2 irradiates the light-shielding region 32, it is shielded from passing through the mask 3, so that the photosensitive layer 16 is divided into a plurality of unexposed regions 162 respectively corresponding to the light-shielding region 32 and not irradiated by the ultraviolet light U2.

Referring to fig. 1, 4 and 6, in the developing step S3, the first unexposed region 152 and the second unexposed region 153 of the photosensitive layer 15 are developed by the developing solution to remove the first unexposed region 152 and the second unexposed region 153, so that the exposed region 151 remains on the first surface 111 and exposes the conductive portion 12 shielded by the first unexposed region 152 and a portion of the first surface 111 of the substrate 11 shielded by the second unexposed region 153. The unexposed regions 162 of the photosensitive layer 16 are developed by the developing solution to remove the unexposed regions 162, leaving the exposed regions 161 on the second surface 112 and exposing the conductive parts 12 masked by the unexposed regions 162. Thereafter, the exposed

regions

151 and 161 are baked and hardened to form solder masks 151 'and 161', respectively, thereby completing the manufacture of the circuit board 10.

Referring to fig. 4, 6 and 7, the solder mask layer 151' is formed with a plurality of openings 154 respectively corresponding to the positions of the second unexposed areas 153, and each of the openings 154 exposes a portion of the first surface 111. Since the opening 154 is formed by developing and removing the second unexposed area 153, i.e. by removing a portion of the photosensitive layer 15 corresponding to the area between each two adjacent conductive parts 12, and the second unexposed area 153 is transferred to the photosensitive layer 15 through the mask 2 and corresponds to the pattern of the second light-shielding area 23, the shape of the opening 154 is the same as the shape of the second unexposed area 153 and the shape of the second light-shielding area 23. The opening 154 is rectangular and has a width W2 and a length L2. The width W2 extends in the first direction X, and the width W2 is 0.35 mm in size. The length L2 extends in the second direction Y, and the length L2 is greater than the sum of the length of the pad 122 of the conductive portion 12 taken in the second direction Y and five percent of the length of the pad 122.

It should be noted that, for convenience of description, only the mask 2 having the first light-shielding region 22 and the second light-shielding region 23 is described, and the mask 3 having the light-shielding region 32. However, in practical applications, the mask 2 is provided with other light-shielding regions corresponding to the exposed areas of the copper foil layer 13 covering the first surface 111, so that the ultraviolet light U1 will not irradiate the photosensitive layer 15 corresponding to the exposed areas. Thus, in the subsequent developing step S3, the areas not irradiated by the ultraviolet light U1 can be removed by the developer, so that the photosensitive layer 15 is exposed in the areas where the copper foil layer 13 is to be exposed. Similarly, the mask 3 is also provided with other light-shielding regions corresponding to the exposed regions of the copper foil layer 14 covering the second surface 112, so that the exposed regions of the copper foil layer 14 can be exposed to the photosensitive layer 16 after the subsequent developing step S3.

Referring to fig. 8, fig. 8 is a flowchart illustrating steps of a method for assembling the circuit board 10 and the electronic component 4 according to the present embodiment, the method includes the following steps: providing a circuit board step S4, an electronic component plugging step S5, and a soldering step S6.

Referring to fig. 8 and 9, in the step S4 of providing a circuit board, the circuit board 10 manufactured by the aforementioned manufacturing method is provided.

In the electronic component inserting step S5, the electronic component 4 is exemplified by a Liquid Crystal Display (LCD) having a body 41 and a plurality of soldering pins 42 protruding out of the bottom end of the body 41. The electronic component 4 is placed on the solder mask 161' facing the circuit board 10 such that the solder tails 42 of the electronic component 4 are aligned with the vias 124 of the circuit board 10, respectively. Next, the electronic component 4 is moved toward the circuit board 10 along a third direction Z perpendicular to the first direction X and the second direction Y (as shown in fig. 7), so that the soldering pins 42 are inserted into the through holes 124 and protrude out of the ring pads 122 and the solder mask layer 151', respectively.

Referring to fig. 8, 10, 11 and 12, in the soldering step S6, the circuit board 10 and the electronic component 4 plugged thereon are placed and positioned in a soldering machine (not shown), which is a selective wave soldering machine (selective wave soldering machine) as an example. A soldering nozzle 5 of the soldering machine faces the solder mask 151' of the circuit board 10, and the soldering nozzle 5 is moved to an alignment position as shown in fig. 9 according to a planned soldering path, so that the soldering nozzle 5 is aligned under one of the conductive portions 12 at one outer end among the conductive portions 12 arranged in the row. Subsequently, the soldering nozzle 5 is moved upward along the third direction Z to a soldering position as shown in fig. 10, so that the molten solder 6 at the top of the soldering nozzle 5 contacts the ring pad 122 of the corresponding conductive part 12, and the molten solder 6 flows into the via hole 124 by capillary action and flows upward along the via hole 124, so that the molten solder 6 fills the via hole 124 and covers the soldering foot 42. Next, the soldering nozzle 5 is moved horizontally in the first direction X, so that the molten solder 6 at the tip of the soldering nozzle 5 sequentially passes through the ring pads 122 of the remaining conductive parts 12. When the molten solder 6 touches the ring pad 122 of the remaining conductive part 12, it flows into the via hole 124 by capillary action and fills the via hole 124.

After the soldering nozzle 5 moves to the position shown in fig. 11 along the soldering path to fill the through hole 124 with the molten solder 6, the soldering nozzle 5 moves downward along the third direction Z to a retracted position shown in fig. 12, so that the molten solder 6 is separated from the ring pad 122 and the solder mask layer 151' of the conductive portion 12 at the other outer end. After the molten solder 6 filling the through hole 124 and covering the soldering foot 42 is cooled and hardened, the soldering operation is completed, so that the electronic component 4 is fixed on the circuit board 10.

During the process of horizontally moving the soldering nozzle 5 from the position aligned with one of the conductive parts 12 to the position aligned with the next conductive part 12 along the first direction X, the molten solder 6 at the tip of the soldering nozzle 5 passes through the solder mask layer 151' between the two conductive parts 12. Since the opening 154 for exposing a portion of the first surface 111 is formed between every two adjacent conductive portions 12 of the solder mask layer 151 ', and the opening 154 is rectangular, the structure of the solder mask layer 151' existing between the two adjacent conductive portions 12 can be reduced, so as to reduce the area of the solder mask layer 151 'contacted by the molten solder 6 during the movement of the soldering nozzle 5, thereby reducing the probability of the molten solder 6 generating tiny granular solder balls adhering to and remaining on the surface of the solder mask layer 151'. Further, in the substrate 11, compared to the solder mask layer 151 'softened by the high temperature of the molten solder 6, the surface roughness of the solder mask layer 151' after softening is reduced and smaller than the surface roughness of the first surface 111 of the substrate 11, so that when the molten solder 6 passes through the first surface 111 exposed by the opening 154, the solder balls in fine particles are less likely to adhere to and remain on the first surface 111. Therefore, the adhesion and residue of the solder balls on the surface of the solder mask layer 151' can be reduced or even prevented, thereby saving the labor time and labor cost required for cleaning the solder balls.

Referring to fig. 13, in another embodiment of the present embodiment, the welding machine is a wave welding machine (wave welding machine), for example. The circuit board 10 and the electronic components 4 plugged thereto are transported by a transport mechanism (not shown) of the soldering machine in a first direction X so that the rows of conductive parts 12 of the circuit board 10 pass over the molten solder 6 in a solder pot 7 in sequence. When the molten solder 6 touches the ring pad 122 of the corresponding conductive part 12, the molten solder 6 flows into the via hole 124 by capillary action and flows upward along the via hole 124, so that the molten solder 6 fills the via hole 124 and covers the solder foot 42. The electronic component 4 can also be fixed on the circuit board 10 after the molten solder 6 filling the via hole 124 and covering the solder foot 42 is cooled and hardened.

In summary, in the solder mask layer 151 ' of the circuit board 10 of the present embodiment, by providing the opening 154 between every two adjacent conductive portions 12 for exposing a portion of the first surface 111 of the substrate 11, in the soldering step S6, the area where the molten solder 6 contacts the solder mask layer 151 ' can be reduced, so as to reduce the probability that the molten solder 6 generates the solder balls with fine particles to adhere to and remain on the surface of the solder mask layer 151 '. Furthermore, since the surface roughness of the solder mask layer 151' is reduced after softening and is smaller than the surface roughness of the first surface 111 of the substrate 11, when the molten solder 6 passes through the first surface 111 exposed by the opening 154, the solder balls in fine particles are less likely to adhere to and remain on the first surface 111. Therefore, the adhesion of the solder balls and the residue on the surface of the solder mask layer 151' can be reduced or even prevented, so that the labor hour and the labor cost required by the subsequent solder ball cleaning can be saved, and the purpose required by the invention can be really achieved.

Claims

1. A method of manufacturing a circuit board, comprising the steps of:

2. A method of manufacturing a circuit board, comprising the steps of:

3. The utility model provides a circuit board, its characterized in that, the circuit board includes the base plate, at least two run through base plate and looks spaced conductive part, and the solder mask layer, the conductive part is formed with the conducting hole, the solder mask layer form in base plate one side makes the conductive part exposes, the solder mask layer is formed with the messenger partly exposes and the interval is located opening between the conductive part, the opening is the rectangle form.

4. The circuit board of claim 3, wherein the conductive portion has a collar surrounding an outer periphery of the via, the conductive portion and the opening are spaced apart in a first direction, a width of the opening extends in the first direction, a length of the opening extends in a second direction perpendicular to the first direction, and the length of the opening is greater than a sum of a length of the collar taken in the second direction and five percent of a length of the collar.

5. A method of assembling a circuit board with an electronic component, the method comprising:

and welding the welding foot to the conductive part.

6. The method as claimed in claim 5, wherein the conductive portions and the openings are spaced apart along a first direction, and the circuit board is driven along the first direction to solder the solder pins to the conductive portions by wave soldering.

7. The method of claim 5, wherein the conductive portions and the openings are spaced apart in a first direction, and the bonding feet are selectively wave soldered to the conductive portions by moving a soldering nozzle in the first direction.

8. The utility model provides a combination of circuit board and electronic component, its characterized in that, the combination contains circuit board and electronic component, the circuit board includes the base plate, at least two runs through base plate and looks spaced conductive part, and the solder mask layer, the conductive part is formed with the conducting hole, the solder mask layer form in base plate one side makes the conductive part exposes, the solder mask layer is formed with the messenger a part of base plate exposes and the interval is located opening between the conductive part, the opening is the rectangle form, electronic component has two and inserts respectively welding foot in the conducting hole, welding foot pass through the solder and weld in the conductive part.

9. The combination of a circuit board and an electronic component as claimed in claim 8, wherein the conductive portion has a gasket surrounding an outer periphery of the via hole, the conductive portion and the opening are spaced apart in a first direction, a width of the opening extends in the first direction, a length of the opening extends in a second direction perpendicular to the first direction, and the length of the opening is greater than a sum of a length of the gasket taken in the second direction and five percent of a length of the gasket.

10. A method of manufacturing a circuit board, comprising the steps of:

forming at least two through holes in the substrate;