CN110844324A - 一种fpc载带 - Google Patents
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Abstract
本发明涉及电子产品输送带产品技术领域,特指一种用于电子产品输送的一种FPC载带。一种FPC载带,其包括:以FPC形成的基材层,以及分别覆盖在基材层上下表面的表层和底层,所述的基材层上通过模切的方式均匀成型分布有定位孔;所述的表层采用透明的PET材料,其通过PU胶粘贴于基材层的表面;所述的底层采用透明的PET材料,其PU胶粘贴于基材层的底面;所述表层、底层、PU胶中至少有一层材料中添加有防静电剂。本发明通过定位孔对电子产品进行定位,便于机械手的精准夹取,减少了后续的定位工序,提高生产效率;本发明中设置防静电剂,对电子产品进行保护,不会因静电造成对电子产品的损坏。
Description
技术领域:
本发明涉及电子产品输送带产品技术领域,特指一种用于电子产品输送的一种FPC载带。
背景技术:
在电子产品生产组装过程中,需要输送许多精细灵敏的电子元器件,这些电子元器件在输送时并不能使用传统的传输带。FPC是一种柔性电路。其是以聚脂薄膜或聚酰亚胺为基材制成的一种具有高度可靠性,绝佳曲挠性的印刷电路,通过在可弯曲的轻薄塑料片上嵌入电路设计,使在窄小和有限空间中堆嵌大量精密元件,从而形成可弯曲的挠性电路。此种电路可随意弯曲、折迭重量轻,体积小,散热性好,安装方便。正式基于FPC的这种特性,本发明人将其作为一种载带用于固定电子元件等产品,进行输送。
但是,随着机械自动化程度越来越高,现有的电子产品在生产组装过程中,基本都是通过机械手来抓取料件。通过载带输送的电子元器件必须保证精确的定位,否则无法与及机械手配合,实现自动上料功能。为了解决这一技术问题,本发明人提出了以下技术方案。
发明内容:
本发明所要解决的技术问题在于克服现有产品的不足,提供一种FPC载带。
为了解决上述技术问题,本发明采用了下述技术方案:一种FPC载带,其包括:以FPC形成的基材层,以及分别覆盖在基材层上下表面的表层和底层,所述的基材层上通过模切的方式均匀成型分布有定位孔;所述的表层采用透明的PET材料,其通过PU胶粘贴于基材层的表面;所述的底层采用透明的PET材料,其PU胶粘贴于基材层的底面;所述表层、底层、PU胶中至少有一层材料中添加有防静电剂。
进一步而言,上述技术方案中,所述的表层中添加有聚氨酯防静电剂,添加量为1-3%。
进一步而言,上述技术方案中,所述的底层中添加有聚氨酯防静电剂,添加量为1-3%。
进一步而言,上述技术方案中,所述的用于粘接基材层与表层的PU胶中添加有聚氨酯防静电剂,添加量为1-5%。
进一步而言,上述技术方案中,所述的用于粘接基材层与底层的PU胶中添加有聚氨酯防静电剂,添加量为1-5%。
采用上述技术后,本发明的载带采用一种“三明治”结构,其中基材层上均匀开设有定位孔,该定位孔用于放置电子元件等产品,通过定位孔实现对电子元件等产品的定位,以方便机械手的准确夹取。将采用上述技术方案后,本发明与现有技术相比较具有如下有益效果:
1、本发明通过定位孔对电子产品进行定位,便于机械手的精准夹取,减少了后续的定位工序,提高生产效率;
2、本发明中设置防静电剂,对电子产品进行保护,不会因静电造成对电子产品的损坏。
附图说明:
图1是本发明的结构示意图;
具体实施方式:
下面结合具体实施例和附图对本发明进一步说明。
见图1所示,本发明为一种用于电子产品输送的载带,其包括:基材层1,以及分别覆盖在基材层1上下表面的表层2和底层3。
所述的基材层1采用FPC。其可以采用已经成型的FPC,也可以直接采用没有附加电路的材料,即直接通过聚脂薄膜或聚酰亚胺为基材制作的片材。在基材层1上通过模切的方式均匀成型分布有定位孔10。制作方法为,将基材层1通过自动模切模具,在其上连续、均匀开设定位孔10。定位孔10的形状和大小可根据实际生产用的电子元件等产品进行设定。基材层1的厚度也根据实际生产进行制作,通常其厚度在0.5-3mm之间。
所述的表层2采用透明PET材料,其粘贴于基材层1的表面,表层2通过PU胶粘贴在基材层1的上表面。所述的底层3也采用透明的PET材料,其粘贴于基材层1的底面。
生产时,将PU胶涂布在基材层1的上下表面,然后将表层2和底层3分别复合在基材层1的上下表面即可。
表层2和底层3均采用PET材料制作的离型膜,便于表层2和底层3与基材层1的分离。
由于本发明是为了用于电子元器件等电子产品的输送,所以为了避免在传输过程中应为静电对电子产品造成损害,所述的基材层1、表层2、底层3中至少有一层材料中添加有防静电剂。在实际生产中,采用可采用以下方式:
第一种方式:
在PU胶中加入放静电剂。即在PU胶中加入重量比为1-5%的防静电剂。优选为2%。防静电剂优选聚氨酯防静电剂。聚氨酯防静电剂是一种季铵盐阳离子表面活性剂与非离子型表面活性剂组成的复合物,其可以相助降低塑胶材料的表面电阻,具有高效的抗静电效果。聚氨酯防静电剂属于内加型防静电剂,所以其添加量可以适当多一些。
使用时,将添加有聚氨酯防静电剂的PU胶涂布在基材层1的正面两面,然后将表层2和底层3复合在基材层1的正面两面即可。
对本实施例进行测试,测试结果如下:
第二种方式:
在表层2和底层3中分别加入防静电剂。表层2中同样是添加有聚氨酯防静电剂,添加量为1-3%。底层3中也添加有聚氨酯防静电剂,添加量为1-3%。
上述两种方式也可结合使用,即在PU胶以及表层2和底层3中均加入有防静电剂。这样就可以形成上下供四层抗静电效果。采用这种方式是为了更好的提供抗静电效果,确保电子产品的安全。同时,也是为了防止PU胶中的聚氨酯防静电剂析出,所以在表层2和底层3中也加入聚氨酯防静电剂,以确保整个载带的抗静电效果。
使用本发明前,将制作号的基材层1与底层复合,然后将电子产品放置在基材层1的定位孔10中,再将表层覆盖在基材层1的表面即可。需要使用电子产品是,将整个载带通过传输装置输送,并可通过收卷装置将表层2由基材层1上剥离,显露出电子产品,供机械手抓取。
对本实施例进行测试,测试结果如下:
当然,以上所述仅为本发明的具体实施例而已,并非来限制本发明实施范围,凡依本发明申请专利范围所述构造、特征及原理所做的等效变化或修饰,均应包括于本发明申请专利范围内。
Claims (5)
1.一种FPC载带,其包括:以FPC形成的基材层(1),以及分别覆盖在基材层(1)上下表面的表层(2)和底层(3),其特征在于:
所述的基材层(1)上通过模切的方式均匀成型分布有定位孔(10);
所述的表层(2)采用透明的PET材料,其通过PU胶粘贴于基材层(1)的表面;
所述的底层(3)采用透明的PET材料,其PU胶粘贴于基材层(1)的底面;
所述表层(2)、底层(3)、PU胶中至少有一层材料中添加有防静电剂。
2.根据权利要求1所述的一种FPC载带,其特征在于:所述的表层(2)中添加有聚氨酯防静电剂,添加量为1-3%。
3.根据权利要求1所述的一种FPC载带,其特征在于:所述的底层(3)中添加有聚氨酯防静电剂,添加量为1-3%。
4.根据权利要求1所述的一种FPC载带,其特征在于:所述的用于粘接基材层(1)与表层(2)的PU胶中添加有聚氨酯防静电剂,添加量为1-5%。
5.根据权利要求2所述的一种FPC载带,其特征在于:所述的用于粘接基材层(1)与底层(3)的PU胶中添加有聚氨酯防静电剂,添加量为1-5%。
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CN203497394U (zh) * | 2013-09-06 | 2014-03-26 | 王子控股株式会社 | 电子元件载带 |
CN104960292A (zh) * | 2015-06-17 | 2015-10-07 | 浙江洁美电子科技股份有限公司 | 电子元器件收纳载带的封装带及其制备方法 |
CN205312215U (zh) * | 2015-12-31 | 2016-06-15 | 广东爱晟电子科技有限公司 | 一种热敏电阻芯片包装编带及卷盘 |
CN107492505A (zh) * | 2016-06-13 | 2017-12-19 | 三星电子株式会社 | 制造半导体封装的方法和用于其的载带膜 |
CN208649214U (zh) * | 2018-07-31 | 2019-03-26 | 苏州思锐达新材料有限公司 | 低温成型离型载带 |
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