CN110842800B - Diamond resin bonding agent abrasive disc and preparation method and application thereof - Google Patents
Diamond resin bonding agent abrasive disc and preparation method and application thereof Download PDFInfo
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- CN110842800B CN110842800B CN201911177454.5A CN201911177454A CN110842800B CN 110842800 B CN110842800 B CN 110842800B CN 201911177454 A CN201911177454 A CN 201911177454A CN 110842800 B CN110842800 B CN 110842800B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides a diamond resin bonding agent abrasive disc and a preparation method and application thereof, belonging to the technical field of polishing abrasive tools. The diamond resin bonding agent abrasive disc comprises the following preparation raw materials in parts by mass: 20-40 parts of thermosetting resin, 4-30 parts of curing agent, 15-30 parts of diamond, 10-20 parts of auxiliary abrasive, 10-30 parts of micron filler, 1-10 parts of nano filler and 1-5 parts of coupling agent. The diamond resin bonding agent abrasive disc is used for polishing marble and has the advantages of good polishing effect, high efficiency, environmental protection, safety and the like.
Description
Technical Field
The invention relates to the technical field of polishing grinding tools, in particular to a diamond resin bonding agent grinding disc and a preparation method and application thereof.
Background
Marble generally refers to all kinds of limestone with patterns of various colors, and is widely used for indoor and outdoor decoration and various artworks due to its strong strength, self-patterned appearance and good processability. Grinding and polishing are indispensable processing technologies in practical application of marble.
Grinding polishing plates (called abrasive plates for short) are common tools used in marble polishing. The grinding disc is a processing tool which is made by using a superhard material as an abrasive material, using polymer resin as a bonding agent and adding a proper filling material through the processing processes of preparation, mixing, curing and the like, has a certain geometric shape and can meet different grinding requirements. However, the hardness of the marble is relatively small compared to other stone materials, and thus, grinding and polishing materials and processes are different. Generally, the polishing mechanism of marble is mainly based on physical methods and chemical methods. The physical method is that the high-hardness abrasive material cuts and rubs the convex surface of the marble through the mechanical grinding action, thereby reducing the surface roughness and achieving the purpose of polishing. The chemical method is to add relevant chemical substances such as oxalic acid into the grinding tool, and the chemical substances and the components on the surface of the marble are subjected to chemical reaction to dissolve and adsorb the relevant substances so as to achieve the purpose of polishing.
However, in the actual polishing process, the polishing of the marble still has the following problems. Firstly, in chemical polishing, a certain amount of chemical agents such as oxalic acid and other low molecular substances are generally added, and the chemical agents are easy to migrate in the long-term storage process, so that the stability of the polishing efficiency is reduced, and a certain degree of pollution is caused to human bodies and the environment. Second, it is difficult to achieve the gloss and clarity required for practical marble applications by physical polishing, and the matrix resin in the grinding chip is easily left on the surface during polishing to cause fogging. Currently, polishing of marble is mainly based on a physical and chemical combination method. Therefore, how to realize efficient and environment-friendly marble polishing by designing the material of the grinding tool has important value.
Disclosure of Invention
The invention aims to provide a diamond resin bonding agent abrasive disc, a preparation method and application thereof.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a diamond resin bonding agent abrasive disc which comprises the following preparation raw materials in parts by mass: 20-40 parts of thermosetting resin, 4-30 parts of curing agent, 15-30 parts of diamond, 10-20 parts of auxiliary abrasive, 10-30 parts of micron filler, 1-10 parts of nano filler and 1-5 parts of coupling agent.
Preferably, the thermosetting resin includes one or more of epoxy resin, modified epoxy resin, phenolic resin, modified phenolic resin, polyimide resin, modified polyimide resin, cyanate resin, modified cyanate resin, melamine resin, and modified melamine resin.
Preferably, the diamond comprises one or more of single crystal diamond, polycrystalline diamond and microcrystalline diamond, and the particle size of the diamond is 25-3000 meshes.
Preferably, the auxiliary abrasive comprises one or more of silicon carbide, corundum, zirconia, boron nitride and zirconium carbide, and the particle size of the auxiliary abrasive is 25-3000 meshes.
Preferably, the micron filler comprises one or more of micron silicon dioxide, talcum powder, zinc oxide, magnesium hydroxide, calcium carbonate, glass fiber powder, carbon fiber powder and hollow glass beads, and the particle size of the micron filler is 25-5000 meshes.
Preferably, the nanofiller comprises one or more of nanosilica, carbon nanotubes, graphene nanoplatelets, nanodiamonds and boron nitride nanoplatelets.
Preferably, the particle size of the nano silicon dioxide is 15-100 nm; the diameter of the carbon nano tube is 10-80 nm, and the length of the carbon nano tube is 10-50 mu m; the thickness of the graphene nanosheet is 5-15 nm; the particle size of the nano diamond is 5-100 nm, and the thickness of the boron nitride nanosheet is 20-100 nm.
Preferably, the coupling agent is a silane coupling agent and/or a titanate coupling agent.
The invention provides a preparation method of the diamond resin bonding agent abrasive disc in the scheme, which comprises the following steps:
mixing the preparation raw materials to obtain a mixture;
and injecting the mixture into a mold for hot-pressing sintering to obtain the diamond resin bonding agent abrasive disc.
The invention also provides the application of the diamond resin bonding agent abrasive disc prepared by the preparation method in the scheme or the application of the diamond resin bonding agent abrasive disc prepared by the preparation method in marble polishing.
The invention provides a diamond resin bonding agent abrasive disc which comprises the following preparation raw materials in parts by mass: 20-40 parts of thermosetting resin, 4-30 parts of curing agent, 15-30 parts of diamond, 10-20 parts of auxiliary abrasive, 10-30 parts of micron filler, 1-10 parts of nano filler and 1-5 parts of coupling agent. The abrasive disc has low thermosetting resin content and low hardness of thermosetting resin, so that diamonds, auxiliary abrasive materials, fillers and the like are more easily meshed with and fully contacted with the concave-convex surface of a processing object, the polishing speed is increased, the polishing efficiency and the polishing degree are improved, and the marble surface cannot be atomized due to resin residues; according to the polishing principle of the marble, the nano filler is introduced into the abrasive disc, and on the basis of increasing the strength of matrix resin, the size and the proportion of the filler in the abrasive disc are reasonably designed, so that each component can fully play a polishing role, and the abrasive disc has high polishing efficiency and obvious effect.
The invention does not add common micromolecule chemical substances (such as oxalic acid and the like) in marble polishing, has good abrasive disc stability, and is more environment-friendly and safer in the polishing process.
The grinding piece disclosed by the invention is used for grinding marble ground under the same condition, and an experimental result shows that the polishing degree of the grinding piece on marble is 2 times that of a marble polishing diamond resin bonding agent grinding tool on the market, the service life of the grinding piece is 2-3 times that of the marble polishing diamond resin bonding agent grinding tool on the market, and the grinding piece has higher definition.
The invention provides the preparation method of the diamond resin bonding agent abrasive disc in the scheme, the hot-pressing sintering mode is adopted, the filler is uniformly dispersed, the production process is green and environment-friendly, the demoulding is simple, the finished product rate of products is high, and the production efficiency is high.
Detailed Description
The invention provides a diamond resin bonding agent abrasive disc which comprises the following preparation raw materials in parts by mass: 20-40 parts of thermosetting resin, 4-30 parts of curing agent, 15-30 parts of diamond, 10-20 parts of auxiliary abrasive, 10-30 parts of micron filler, 1-10 parts of nano filler and 1-5 parts of coupling agent.
In the present invention, the starting materials used are all commercially available products well known in the art, unless otherwise specified.
The diamond resin bonding agent abrasive disc comprises, by mass, 20-40 parts of thermosetting resin, preferably 25-35 parts of thermosetting resin. In the present invention, the thermosetting resin preferably includes one or more of an epoxy resin, a modified epoxy resin, a phenol resin, a modified phenol resin, a polyimide resin, a modified polyimide resin, a cyanate resin, a modified cyanate resin, a melamine resin, and a modified melamine resin. The present invention has no special requirement for the specific types of the epoxy resin, the modified epoxy resin, the phenolic resin, the modified phenolic resin, the polyimide resin, the modified polyimide resin, the cyanate resin, the modified cyanate resin, the melamine resin and the modified melamine resin, and all of them are well known in the art. Specifically, the epoxy resin may be, but is not limited to, bisphenol a epoxy resin, bisphenol F epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, aliphatic glycidyl ether epoxy resin; the modified epoxy resin can be, but is not limited to, modified bisphenol a epoxy resin, modified bisphenol F epoxy resin, modified aliphatic glycidyl ether epoxy resin, modified glycidyl ester epoxy resin, modified glycidyl amine epoxy resin, phenolic modified epoxy resin, polyurethane modified epoxy resin, halogenated epoxy resin; the modified phenolic resin can be, but is not limited to, polyvinyl acetal modified phenolic resin, polyamide modified phenolic resin, epoxy modified phenolic resin, organic silicon modified phenolic resin and xylene modified phenolic resin. The invention adopts the thermosetting resin as the matrix resin, the content of the thermosetting resin in the grinding disc is low, and the hardness of the thermosetting resin is lower, so that diamonds, auxiliary abrasive materials, fillers and the like are more easily meshed with and fully contacted with the concave-convex surface of a processing object, the polishing speed is increased, the polishing efficiency and the polishing degree are improved, and the problem of atomization caused by resin residue on a marble surface is avoided.
The preparation raw materials of the diamond resin bonding agent abrasive disc comprise 4-30 parts of curing agent, preferably 8-25 parts by mass based on the mass part of the thermosetting resin. The present invention does not require any particular kind of curing agent, and any curing agent known in the art may be used, and specifically, but not limited to, one or more of polyetheramines, aliphatic amines, aromatic amines, acid anhydrides, dicyandiamide, imidazole and a salt thereof, low molecular weight polyamide resins, boron trifluoride complexes, propylene carbonate, and ammonium chloride.
The preparation raw materials of the diamond resin bonding agent abrasive disc comprise, by mass, 15-30 parts of diamond, preferably 18-26 parts of diamond, and more preferably 20-25 parts of diamond. In the present invention, the diamond preferably includes one or more of single crystal diamond, polycrystalline diamond and microcrystalline diamond; the particle size of the diamond is preferably 25-3000 meshes, and more preferably 500-3000 meshes. In the present invention, the diamond serves as a main component of the grinding chip and plays a role of grinding and polishing.
The preparation raw materials of the diamond resin bonding agent abrasive disc comprise 10-20 parts of auxiliary abrasive, preferably 12-18 parts by mass of thermosetting resin. In the present invention, the auxiliary abrasive preferably includes one or more of silicon carbide, corundum, zirconia, boron nitride, and zirconium carbide; the particle size of the auxiliary abrasive is preferably 25-3000 meshes, and more preferably 800-3000 meshes. In the invention, the auxiliary abrasive material is used for assisting diamond and improving grinding and polishing efficiency.
Based on the mass parts of the thermosetting resin, the preparation raw materials of the diamond resin bonding agent abrasive disc comprise 10-30 parts of micron filler, preferably 15-25 parts. In the present invention, the micron filler preferably comprises one or more of micron silica, talc, zinc oxide, magnesium hydroxide, calcium carbonate, glass fiber powder, carbon fiber powder and hollow glass beads; the particle size of the micron filler is preferably 25-5000 meshes, more preferably 800-4000 meshes, and more preferably 1000-3000 meshes. In the invention, the micron filler can improve the strength, hardness, heat resistance and the like of the grinding plate, thereby improving the polishing efficiency and the service life of the grinding plate.
Based on the mass parts of the thermosetting resin, the preparation raw materials of the diamond resin bonding agent abrasive disc comprise 1-10 parts of nano filler, and preferably 3-8 parts. In the present invention, the nanofiller preferably comprises one or more of nanosilica, carbon nanotubes, graphene nanoplatelets, nanodiamonds and boron nitride nanoplatelets. In the invention, the particle size of the nano silicon dioxide is preferably 15-100 nm, and more preferably 30-80 nm; the diameter of the carbon nano tube is preferably 10-80 nm, and the length of the carbon nano tube is preferably 10-50 mu m; the thickness of the graphene nanosheet is preferably 5-15 nm; the particle size of the nano diamond is preferably 5-100 nm, and more preferably 20-80 nm; the thickness of the boron nitride nanosheet is preferably 20-100 nm. According to the invention, the nano filler is introduced into the abrasive disc, so that the strength of matrix resin can be increased, and the reinforcing effect of the matrix resin and the micron filler can be improved through a multi-scale effect under the cooperation effect of the matrix resin and the micron filler, so that the abrasive disc has higher polishing efficiency and better polishing effect.
The preparation raw materials of the diamond resin bonding agent abrasive disc comprise 1-5 parts of coupling agent, preferably 2-4 parts by mass based on the mass parts of thermosetting resin. In the present invention, the coupling agent is preferably a silane coupling agent and/or a titanate coupling agent; the silane coupling agent preferably comprises gamma-aminopropyltriethoxysilane (KH550) and/or gamma-glycidoxypropyltrimethoxysilane (KH 560); the titanate coupling agent preferably comprises tetraisopropylbis (dioctylphosphite) titanate (NDZ-401) and/or propyldioleacyloxy (dioctylphosphatoxy) titanate (HY-101). In the present invention, the coupling agent functions to improve the adhesive strength between the abrasive, the filler and the resin.
The invention provides a preparation method of the diamond resin bonding agent abrasive disc in the scheme, which comprises the following steps:
mixing the preparation raw materials to obtain a mixture;
and injecting the mixture into a mold for hot-pressing sintering to obtain the diamond resin bonding agent abrasive disc.
The preparation raw materials are mixed to obtain a mixture. The invention preferably realizes the mixing of the preparation raw materials under the condition of stirring. The invention has no special requirements on the stirring speed and time, and can realize the uniform mixing of the preparation raw materials.
After the mixture is obtained, the mixture is injected into a die for hot-pressing sintering to obtain the diamond resin bonding agent abrasive disc.
Before hot-pressing sintering, the top surface of the incompletely solidified abrasive disc is preferably covered by a cotton cloth layer so as to facilitate subsequent product production.
In the invention, the temperature of the hot-pressing sintering is preferably 100-180 ℃, and more preferably 140-160 ℃; the heat preservation time is preferably 3-10 minutes, and more preferably 5-7 minutes; the pressure is preferably 2 to 5MPa, more preferably 3 to 4 MPa. The grinding plate is solidified in the hot-pressing sintering process.
After the hot-pressing sintering, the invention preferably further comprises the step of carrying out heat treatment on the product obtained by the hot-pressing sintering, wherein the temperature of the heat treatment is preferably 120-180 ℃, and the time is preferably 1-2 hours. The invention ensures the complete solidification of the diamond resin bonding agent abrasive disc by utilizing heat treatment. The present invention preferably performs the heat treatment in an oven.
The invention provides the diamond resin bonding agent abrasive disc prepared by the preparation method in the scheme or the application of the diamond resin bonding agent abrasive disc prepared by the preparation method in marble polishing. The invention is not particularly limited to the described modes of application, and may be applied in any manner known to those skilled in the art.
The diamond resin bonded abrasive disc provided by the present invention, the manufacturing method and the application thereof will be described in detail with reference to the following examples, but they should not be construed as limiting the scope of the present invention.
Example 1
According to the mass parts, 30 parts of nylon modified bisphenol A epoxy resin, 8 parts of polyether amine curing agent (model number D230), 25 parts of polycrystalline diamond micro powder with the granularity number of 800 meshes, 10 parts of silicon carbide micro powder with the granularity number of 1000 meshes, 5 parts of corundum with the granularity number of 800 meshes, 25 parts of talcum powder with the granularity number of 1000 meshes, 5 parts of glass fiber with the granularity number of 800 meshes, 3 parts of nano silica ball with the diameter of 30nm and KH5501 parts are mechanically stirred, the mixture is injected into a die, cotton cloth with the size consistent with that of the die covers the top surface of an incompletely cured grinding tool, the temperature is increased to 120 ℃ from room temperature, the temperature is kept (the pressure of 4 MPa) for 5 minutes, hot-pressing sintering is carried out, and then the grinding disc is taken out and is placed into an oven to be baked for 1 hour at the temperature of 140.
Example 2
According to the mass parts, 25 parts of polyamide modified phenolic resin, 15 parts of anhydride curing agent (methyl hexahydrophthalic anhydride, MHHPA), 0.25 part of aromatic tertiary amine curing agent (DMP-30), 20 parts of polycrystalline diamond micropowder with the granularity number of 800 meshes, 10 parts of silicon carbide micropowder with the granularity number of 1000 meshes, 3 parts of white corundum with the granularity number of 800 meshes, 3 parts of zirconia with the granularity number of 1000 meshes, 20 parts of calcium carbonate with the granularity number of 2000 meshes, 5 parts of carbon fiber powder with the granularity number of 1000 meshes, 2 parts of carbon nano tubes with the diameter of 20nm and KH5601 parts are mechanically stirred, and injecting the mixture into a mold in a hot-pressing sintering mode, covering the surface of the top of the incompletely cured grinding tool with cotton cloth with the size consistent with that of the mold, heating to 120 ℃ from room temperature, keeping the temperature and pressure (3MPa pressure) for 8 minutes, performing hot-pressing sintering, and then baking in an oven at 140 ℃ for 1 hour to obtain the diamond resin bonding agent grinding sheet.
Example 3
According to the mass parts, 30 parts of epoxy modified phenolic resin, 10 parts of aromatic amine curing agent (DETDA), 25 parts of polycrystalline diamond micro powder with the granularity number of 800 meshes, 15 parts of zirconia micro powder with the granularity number of 2000 meshes, 5 parts of white corundum with the granularity number of 1500 meshes, 15 parts of calcium carbonate with the granularity number of 3000 meshes, 8 parts of magnesium hydroxide with the granularity number of 2000 meshes, 4 parts of graphene nanosheet with the thickness of 8nm and KH5501 parts of the mixture are mechanically stirred and then injected into a mold in a hot-pressing sintering mode, cotton cloth with the size consistent with that of the mold covers the top surface of an incompletely cured grinding tool, the temperature is raised to 130 ℃ from room temperature, the temperature and the pressure are maintained (4MPa pressure) for 10 minutes, the mixture is subjected to hot-pressing sintering, and then the grinding disc is taken out and then put into an oven 140 for baking for 1 hour.
Example 4
According to the mass parts, 35 parts of organic silicon modified phenolic resin, 15 parts of low molecular weight polyamide resin (SF-650), 2 parts of boron trifluoride complex (boron trifluoride ethylamine), 20 parts of polycrystalline diamond micro powder with the granularity number of 1500 meshes, 12 parts of silicon carbide micro powder with the granularity number of 2000 meshes, 4 parts of zirconia with the granularity number of 2000 meshes, 12 parts of micron silica with the granularity number of 3000 meshes, 10 parts of hollow glass micro-beads with the granularity number of 2000 meshes, 2 parts of nano-diamond with the grain diameter of 10nm and NDZ-4011 parts are mechanically stirred, and (3) injecting the mixture into a mold in a hot-pressing sintering mode, covering the surface of the top of the incompletely cured grinding tool with cotton cloth with the size consistent with that of the mold, heating to 120 ℃ from room temperature, keeping the temperature and pressure (3MPa pressure) for 10 minutes, carrying out hot-pressing sintering, taking out the grinding piece, and baking in an oven at 150 ℃ for 1 hour to obtain the diamond resin bonding agent grinding piece.
Example 5
According to the mass parts, 25 parts of polyamide modified phenolic resin, 6 parts of propylene carbonate, 2 parts of ammonium chloride, 25 parts of polycrystalline diamond micro powder with the granularity number of 1500 meshes, 10 parts of silicon carbide micro powder with the granularity number of 3000 meshes, 6 parts of boron nitride with the granularity number of 1500 meshes, 15 parts of talcum powder with the granularity number of 3000 meshes, 2 parts of nano silicon dioxide with the particle size of 20nm, 1 part of carbon nano tube with the diameter of 10nm and KH5601 parts are mechanically stirred, the mixture is injected into a die in a hot-pressing sintering mode, cotton cloth with the size consistent with that of the die covers the top surface of an incompletely cured grinding tool, the temperature is increased to 120 ℃ from room temperature, the temperature and the pressure are kept (5MPa pressure) for 10 minutes, the hot-pressing sintering is carried out, and then the grinding disc is taken out and is placed into an oven to be baked for 1 hour at the temperature.
Example 6
According to the mass parts, 30 parts of epoxy resin modified phenolic resin, 5 parts of propylene carbonate, 2 parts of ammonium chloride, 20 parts of polycrystalline diamond micro powder with the granularity of 3000 meshes, 10 parts of silicon carbide micro powder with the granularity of 3000 meshes, 4 parts of boron nitride with the granularity of 3000 meshes, 10 parts of calcium carbonate with the granularity of 2000 meshes, 2 parts of carbon nano tube with the particle size of 20nm, 1 part of nano diamond with the particle size of 8nm and HY-1011 parts are mechanically stirred, the mixture is injected into a die in a hot-pressing sintering mode, cotton cloth with the size consistent with that of the die covers the top surface of an incompletely cured grinding tool, the temperature is increased to 120 ℃ from room temperature, the temperature and the pressure are kept (5MPa pressure) for 5 minutes, hot-pressing sintering is carried out, then the grinding disc is taken out and is placed into an oven for baking at 140 ℃ for 1 hour, and the grinding disc of the diamond.
Example 7
According to the mass parts, 35 parts of epoxy resin modified phenolic resin, 7 parts of propylene carbonate, 2 parts of ammonium chloride, 25 parts of polycrystalline diamond micro powder with the granularity number of 3000 meshes, 8 parts of silicon carbide micro powder with the granularity number of 5000 meshes, 2 parts of zirconium carbide with the granularity number of 3000 meshes, 4 parts of boron nitride with the granularity number of 3000 meshes, 15 parts of calcium carbonate with the granularity number of 5000 meshes, 1 part of nano diamond with the particle size of 8nm, 2 parts of graphene nano sheet with the thickness of 5nm and HY-1011 parts are mechanically stirred, and (3) injecting the mixture into a mold in a hot-pressing sintering mode, covering cotton cloth with the size consistent with that of the mold on the top surface of the incompletely cured grinding tool, heating to 120 ℃ from room temperature, keeping the temperature and pressure (5MPa pressure) for 5 minutes, carrying out hot-pressing sintering, taking out the grinding piece, and baking in an oven at 140 ℃ for 1 hour to obtain the diamond resin bonding agent grinding piece.
Comparative example 1
The diamond resin polishing tablet is sold in the market, the granularity number of each diamond resin polishing tablet is 9 grinding tools with 800 meshes, and the resin bonding agent is phenolic resin.
Comparative example 2
The diamond resin polishing sheet is sold in the market, the granularity number of each diamond resin polishing sheet is 1500-mesh grinding tools 9, and the resin bonding agent is phenolic resin.
Comparative example 3
The diamond resin polishing sheet is commercially available, the grain size number of the diamond resin polishing sheet is 9 grinding tools with 3000 meshes, and the resin bonding agent is phenolic resin.
To better illustrate the polishing effect of the present invention, the examples and comparative examples were tested. The method comprises the following steps of taking gray marble as a test ground, taking Klindex Rockey as polishing equipment (weight is 41 kg, rotating speed is 175-400 r/min), carrying out wet grinding polishing, and measuring the glossiness and the definition of the marble ground, wherein specific results are shown in Table 1.
TABLE 1 gloss and clarity for examples and comparative examples
| Degree of gloss | Definition of | Surface fogging | |
| Example 1 | 29.4 | 89.6 | Is free of |
| Example 2 | 27.9 | 83.4 | Is free of |
| Example 3 | 30.7 | 84.6 | Is free of |
| Comparative example 1 | 20.8 | 51.2 | Is provided with |
| Example 4 | 65.9 | 92.7 | Is free of |
| Example 5 | 69.1 | 94.5 | Is free of |
| Comparative example 2 | 40.2 | 60.3 | Is provided with |
| Example 6 | 79.6 | 96.3 | Is free of |
| Example 7 | 72.3 | 98.7 | Is free of |
| Comparative example 3 | 80.5 | 67.9 | Is free of |
As can be seen from the results in table 1, the diamond resin bonded abrasive disc prepared according to the present invention has higher gloss and clarity in polishing for marble and no surface fogging than commercially available diamond resin polished discs (containing no nanofillers) of the same particle size.
According to the embodiment, the diamond resin bonding agent abrasive disc is used for polishing marble and has the advantages of being good in polishing effect, high in efficiency, environment-friendly, safe and the like.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The diamond resin bonding agent abrasive disc is characterized by comprising the following preparation raw materials in parts by mass: 20-40 parts of thermosetting resin, 4-30 parts of curing agent, 15-30 parts of diamond, 10-20 parts of auxiliary abrasive, 10-30 parts of micron filler, 1-10 parts of nano filler and 1-5 parts of coupling agent;
the nanofiller comprising one or more of carbon nanotubes, nanodiamonds and boron nitride nanoplates;
the diameter of the carbon nano tube is 10-80 nm, and the length of the carbon nano tube is 10-50 mu m; the particle size of the nano diamond is 5-100 nm, and the thickness of the boron nitride nanosheet is 20-100 nm.
2. The diamond resin bond abrasive disc of claim 1, wherein the thermosetting resin comprises one or more of epoxy resin, modified epoxy resin, phenolic resin, modified phenolic resin, polyimide resin, modified polyimide resin, cyanate resin, modified cyanate resin, melamine resin, and modified melamine resin.
3. The diamond resin bond abrasive disc of claim 1, wherein the diamond comprises one or more of single crystal diamond, polycrystalline diamond, and microcrystalline diamond, and the diamond has a grain size of 25 to 3000 mesh.
4. The diamond resin bond grinding plate according to claim 1, wherein the auxiliary abrasive comprises one or more of silicon carbide, corundum, zirconia, boron nitride and zirconium carbide, and the particle size of the auxiliary abrasive is 25-3000 meshes.
5. The diamond resin binder abrasive disc of claim 1, wherein the micron filler comprises one or more of micron silica, talc, zinc oxide, magnesium hydroxide, calcium carbonate, glass fiber powder, carbon fiber powder and hollow glass beads, and the particle size of the micron filler is 25-5000 meshes.
6. The diamond resin bond abrasive disc of claim 1, wherein the coupling agent is a silane coupling agent and/or a titanate coupling agent.
7. A method for manufacturing a diamond resin bonded abrasive disc according to any one of claims 1 to 6, comprising the steps of:
mixing the preparation raw materials to obtain a mixture;
and injecting the mixture into a mold for hot-pressing sintering to obtain the diamond resin bonding agent abrasive disc.
8. Use of the diamond resin bonded abrasive sheet according to any one of claims 1 to 6 or the diamond resin bonded abrasive sheet manufactured by the manufacturing method according to claim 7 for marble polishing.
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| CN201911177454.5A CN110842800B (en) | 2019-11-26 | 2019-11-26 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
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| CN201911177454.5A CN110842800B (en) | 2019-11-26 | 2019-11-26 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
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| CN110842800B true CN110842800B (en) | 2021-02-05 |
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| CN201911177454.5A Active CN110842800B (en) | 2019-11-26 | 2019-11-26 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
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| CN111360706A (en) * | 2020-03-19 | 2020-07-03 | 惠安宇信金刚石工具有限公司 | Polishing pad, preparation method thereof and application thereof in marble polishing |
| CN111922928B (en) * | 2020-07-02 | 2021-09-03 | 郑州磨料磨具磨削研究所有限公司 | High-shape-retention composite bond superhard grinding wheel and preparation method thereof |
| CN111843865A (en) * | 2020-07-30 | 2020-10-30 | 惠安宇信金刚石工具有限公司 | Polishing belt and preparation method and application thereof |
| CN112223108A (en) * | 2020-08-31 | 2021-01-15 | 东莞金太阳研磨股份有限公司 | Formula and manufacturing method of diamond grinding pad |
| CN112428163A (en) * | 2020-11-17 | 2021-03-02 | 东莞市晶菱磨料磨具科技有限公司 | Production formula and production process of resin polishing wheel |
| CN113043181A (en) * | 2021-02-02 | 2021-06-29 | 泉州众志新材料科技有限公司 | Forming method of resin diamond abrasive disc |
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| CN114227386A (en) * | 2021-05-26 | 2022-03-25 | 江西省世宇金属制品有限责任公司 | Novel polishing process |
| CN115338785B (en) * | 2022-08-19 | 2024-09-27 | 安徽凯耐德研磨制品有限公司 | Manufacturing method of KF (KF) powerful polishing sheet |
| CN115338786B (en) * | 2022-08-22 | 2024-07-02 | 广东新劲刚金刚石工具有限公司 | Casting elastic grinding block and preparation method thereof |
| CN115785906A (en) * | 2022-10-31 | 2023-03-14 | 南京航空航天大学 | Bonding method magnetic abrasive material with adjustable self-sharpening property and preparation method thereof |
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