CN106217275A - A kind of resin wheel of high porosity - Google Patents
A kind of resin wheel of high porosity Download PDFInfo
- Publication number
- CN106217275A CN106217275A CN201610609386.5A CN201610609386A CN106217275A CN 106217275 A CN106217275 A CN 106217275A CN 201610609386 A CN201610609386 A CN 201610609386A CN 106217275 A CN106217275 A CN 106217275A
- Authority
- CN
- China
- Prior art keywords
- parts
- base material
- high porosity
- resin wheel
- diluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
Abstract
The resin wheel of a kind of high porosity, it includes the raw material of following parts by weight: base material 100 parts, epoxy resin latex 10 ~ 15 parts, diluent 10 ~ 15 parts, hollow glass micropearl 0.3 ~ 1 part, coupling agent 1 ~ 2 part, 3 ~ 8 parts of firming agent, modified filler 5 ~ 10 parts；Described base material is micron-sized bortz and the mixture of zircon sand grain, and its mass parts ratio is 1 ~ 3:1.The present invention is a kind of porosity height, the resin wheel of even air hole distribution, and emery wheel layer tissue uniformity is high, can continue need not repair from sharp, porosity height holds considers to be worth doing, substrate surface damage layer is low, substrate base material is had good grinding performance, improves working (machining) efficiency and reduce processing cost.
Description
Technical field
The invention belongs to substrate base Ultraprecision Machining field, be specifically related to the resin wheel of a kind of high porosity.
Background technology
Along with opto-electronic device industry and the fast development of microelectric technique, the most crisp to SiC, GaAs, monocrystalline sapphire etc.
The processing request of crystal substrates is more and more harsher, and these crystal substrates hardness are high, fragility are big, anisotropy and chemical stability
Good, do not require nothing more than high machining accuracy, working (machining) efficiency and relatively low processing cost, the most exigent surface quality, wafer
Surface roughness reaches Subnano-class, and either the most sub-surface, surface does not all have micro-crack, spots, fault, dislocation and distortion
Defect and the damages such as layer.The process issues of crystal substrates is mainly surface quality difference and processing cost is high at present.
Mostly porous resin emery wheel was water soluble particle or hollow material to be mixed in the slip of flowing in the past, is formed and " accounts for
Position " situation, produce pore.Water soluble particle method is mainly by being joined in abrasive material by the water soluble particle that can form hole
" occupy-place ".Hollow material rule is by adding the spherical closed-cell materials of the class of hollow to manufacture loose structure in emery wheel.These are two years old
Plant and use the method many air hole grinding wheels of manufacture of " occupy-place " can be restricted by the upper limit of solid substance quantity, cause on the porosity of resin wheel
Limit is restricted；Resin liquid viscosity is big simultaneously, and the mix homogeneously difficulty causing molding mass is big, and this causes resin to a certain extent
The gas cell distribution of emery wheel is uneven.
Summary of the invention
Not enough for prior art, the invention provides that a kind of porosity is high, even air hole distribution resin wheel.
The present invention solve above-mentioned technical problem use technical scheme be: the resin wheel of a kind of high porosity, including with
The raw material of lower parts by weight: base material 100 parts, epoxy resin latex 10 ~ 15 parts, diluent 10 ~ 15 parts, hollow glass micropearl 0.3 ~
1 part, coupling agent 1 ~ 2 part, 3 ~ 8 parts of firming agent, modified filler 5 ~ 10 parts；
Described base material is micron-sized bortz and the mixture of zircon sand grain, and its mass parts ratio is 1 ~ 3:1.
Further, described diluent is isobutanol.
Further, described diamond is plating nickel gold hard rock.
Further, one or more during described modified filler is hydroxylapatite powder, sepiolite powder, Colophonium rock dust with
The mixture that biphosphate is received, the quality accounting that described biphosphate is contained in modified filler is 10 ~ 20%.
In the preparation, after being dried by hollow glass micropearl, after mixing homogeneously, cross 100-120 eye mesh screen with base material；By epoxy
Resin emulsion after agitating heating 2-5 minute, adds diluent and the coupling agent of the 30-40% of diluent total amount under 75 DEG C of water-baths,
Continuation agitating heating, after 6 minutes, adds step hollow glass micropearl and the mixture of diamond, continues agitating heating 6 minutes；Will
Above-mentioned middle bath temperature drops to 55 DEG C, by adding after remaining diluent and firming agent mix homogeneously, is poured into after stirring
In mould, harden after 5h at 85 DEG C, then carry out solidifying, the room temperature demoulding, obtain emery wheel ring, processed after i.e. obtain described superhard
Resin wheel.
Compared with prior art, what the present invention possessed has the beneficial effect that
Using the diluent in the present invention and hollow glass micropearl, diluent can well play fine dilution effect, and not
React with hollow glass micropearl；By hollow glass micropearl being carried out baking oven foaming and sieving, sand can well be controlled
The porosity of wheel and aperture, the porosity preparing emery wheel may be up to 50%-60%, and pore size 100-200 μm, prepares
Emery wheel layer tissue uniformity is high, can continue need not repair from sharp, and porosity height holds considers to be worth doing, and substrate surface damage layer is low, to substrate
Substrate material has good grinding performance, improves working (machining) efficiency and reduces processing cost.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described further.
Embodiment 1: the resin wheel of a kind of high porosity, including the raw material of following parts by weight: base material 100 parts, epoxy
Resin emulsion 10 parts, diluent 10 parts, hollow glass micropearl 0.3 part, coupling agent 1 part, 3 parts of firming agent, modified filler 5 parts；Institute
The base material stated is micron-sized bortz and the mixture of zircon sand grain, and its mass parts is than for 1:1.
Further, described diluent is isobutanol；Described diamond is plating nickel gold hard rock；Described modified filler is hydroxyl
The mixture that floats and Colophonium rock dust are received with biphosphate, the quality accounting that described biphosphate is contained in modified filler is
10%。
Embodiment 2: the resin wheel of a kind of high porosity, including the raw material of following parts by weight: base material 100 parts, epoxy
Resin emulsion 15 parts, diluent 15 parts, hollow glass micropearl 1 part, coupling agent 2 parts, 8 parts of firming agent, modified filler 10 parts；Described
Base material be micron-sized bortz and the mixture of zircon sand grain, its mass parts is than for 3:1.
Further, described diluent is isobutanol；Described diamond is plating nickel gold hard rock；Described modified filler is hydroxyl
The mixture that floats, sepiolite powder and Colophonium rock dust are received with biphosphate, described biphosphate is contained in modified filler
Quality accounting is 20%.
Embodiment 3: the resin wheel of a kind of high porosity, including the raw material of following parts by weight: base material 100 parts, epoxy
Resin emulsion 12 parts, diluent 12 parts, hollow glass micropearl 0.6 part, coupling agent 1.5 parts, 5 parts of firming agent, modified filler 7 parts；
Described base material is micron-sized bortz and the mixture of zircon sand grain, and its mass parts is than for 2:1.
Further, described diluent is isobutanol；Described diamond is plating nickel gold hard rock；Described modified filler is hydroxyl
The mixture that floats and biphosphate are received, the quality accounting that described biphosphate is contained in modified filler is 15%.
Claims (5)
1. the resin wheel of a high porosity, it is characterised in that: include the raw material of following parts by weight: base material 100 parts, epoxy
Resin emulsion 10 ~ 15 parts, diluent 10 ~ 15 parts, hollow glass micropearl 0.3 ~ 1 part, coupling agent 1 ~ 2 part, 3 ~ 8 parts of firming agent, change
Property filler 5 ~ 10 parts；
Described base material is micron-sized bortz and the mixture of zircon sand grain, and its mass parts ratio is 1 ~ 3:1.
The resin wheel of a kind of high porosity the most according to claim 1, it is characterised in that: include following parts by weight
Raw material: base material 100 parts, epoxy resin latex 12 parts, diluent 12 parts, hollow glass micropearl 0.6 part, coupling agent 1.5 parts, solidification
Agent 5 parts, modified filler 7 parts；Described base material is micron-sized bortz and the mixture of zircon sand grain, and its mass parts ratio is
2:1。
The resin wheel of a kind of high porosity the most according to claim 1 and 2, it is characterised in that: described diluent is different
Butanol.
The resin wheel of a kind of high porosity the most according to claim 1 and 2, it is characterised in that: described diamond is plating
Nickel diamond.
The resin wheel of a kind of high porosity the most according to claim 1 and 2, it is characterised in that: described modified filler is
One or more mixture received with biphosphate in hydroxylapatite powder, sepiolite powder, Colophonium rock dust, described biphosphate
The quality accounting being contained in modified filler is 10 ~ 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610609386.5A CN106217275A (en) | 2016-07-29 | 2016-07-29 | A kind of resin wheel of high porosity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610609386.5A CN106217275A (en) | 2016-07-29 | 2016-07-29 | A kind of resin wheel of high porosity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106217275A true CN106217275A (en) | 2016-12-14 |
Family
ID=57535658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610609386.5A Pending CN106217275A (en) | 2016-07-29 | 2016-07-29 | A kind of resin wheel of high porosity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106217275A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110270939A (en) * | 2019-04-23 | 2019-09-24 | 厦门家和兴钻石工具有限公司 | A kind of diamond flexible disc and preparation method thereof |
| CN110842800A (en) * | 2019-11-26 | 2020-02-28 | 惠安宇信金刚石工具有限公司 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008272835A (en) * | 2005-08-05 | 2008-11-13 | Kurenooton Kk | Resinoid grinding wheel and its manufacturing method |
| CN102120315A (en) * | 2010-12-01 | 2011-07-13 | 浙江浦江敏锐精密机械科技有限公司 | Polishing disk for polishing crystal glass |
| CN104493734A (en) * | 2014-12-23 | 2015-04-08 | 广东奔朗新材料股份有限公司 | Latent curing epoxy resin binder diamond grinding tool and preparation method thereof |
| CN105290985A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Ultra-hard resin grinding wheel |
-
2016
- 2016-07-29 CN CN201610609386.5A patent/CN106217275A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008272835A (en) * | 2005-08-05 | 2008-11-13 | Kurenooton Kk | Resinoid grinding wheel and its manufacturing method |
| CN102120315A (en) * | 2010-12-01 | 2011-07-13 | 浙江浦江敏锐精密机械科技有限公司 | Polishing disk for polishing crystal glass |
| CN104493734A (en) * | 2014-12-23 | 2015-04-08 | 广东奔朗新材料股份有限公司 | Latent curing epoxy resin binder diamond grinding tool and preparation method thereof |
| CN105290985A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Ultra-hard resin grinding wheel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110270939A (en) * | 2019-04-23 | 2019-09-24 | 厦门家和兴钻石工具有限公司 | A kind of diamond flexible disc and preparation method thereof |
| CN110270939B (en) * | 2019-04-23 | 2020-09-08 | 厦门家和兴钻石工具有限公司 | Diamond soft abrasive disc and preparation method thereof |
| CN110842800A (en) * | 2019-11-26 | 2020-02-28 | 惠安宇信金刚石工具有限公司 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
| CN110842800B (en) * | 2019-11-26 | 2021-02-05 | 惠安宇信金刚石工具有限公司 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
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| PB01 | Publication | ||
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Application publication date: 20161214 |