CN102513944A - Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool - Google Patents
Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool Download PDFInfo
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- CN102513944A CN102513944A CN2011104489403A CN201110448940A CN102513944A CN 102513944 A CN102513944 A CN 102513944A CN 2011104489403 A CN2011104489403 A CN 2011104489403A CN 201110448940 A CN201110448940 A CN 201110448940A CN 102513944 A CN102513944 A CN 102513944A
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Abstract
The invention discloses a resin-bonded grinding tool for processing sapphire crystals and a preparation method for the resin-bonded grinding tool. The resin-bonded grinding tool for processing the sapphire crystals is obtained by mixing, hot-pressing, post-curing and post-trimming forming materials and a matrix, wherein the forming materials include diamond abrasives, thermosetting resin powder, filling agents, silicon carbide whiskers and wetting agents. The silicon carbide whiskers with the Mohs hardness of 9.5 grades are added into the resin-bonded grinding tool, so that the grinding tool for grinding the sapphire crystals is high in efficiency and long in service life, and the surface smoothness of the sapphire crystals can be improved by means of the polishing function of the silicon carbide whiskers.
Description
Technical field
The present invention relates to a kind of resin abrasive tools and preparation method thereof, relate in particular to a kind of sapphire crystal processing with resin abrasive tools and preparation method thereof.
Background technology
Sapphire crystal is widely used in LED illumination substrate, missile homer ball cover, high energy detection and high power light laser window as a kind of crystalline material that integrates good optical property, physical property, mechanical performance and chemical property.
Sapphire crystal is α-AL
2O
3Crystal, Mohs' hardness is 9 grades, is difficult to process.As adopt the metal-bonded diamond grinding tool that sapphire crystal is added man-hour, because the bond self-sharpening is poor, adds the man-hour surface and be prone to get clogged, thereby pull sapphire surface, even produce darker cut and cracked; Adopt the resinoid bond diamond abrasive tool that sapphire crystal is added man-hour; Though well there is not obstructing problem in self-sharpening; But resinoid bond is relatively poor to durability of diamond; Diamond does not have just to make full use of and comes off, and causes grinding tool short, grinding tool face shape poor stability in service life, and the face shape of institute's worked crystal is bad.
Summary of the invention
The object of the present invention is to provide the processing of a kind of sapphire crystal with resin abrasive tools and preparation method thereof, when solving resin abrasive tools processing sapphire crystal, lack service life, the problem of grinding tool face shape poor stability.
Silicon carbide whisker is the mono-crystlling fibre that certain draw ratio is arranged, and has high strength, high rigidity, highly corrosion resistant, and superior functions such as high-termal conductivity and low-expansion coefficient are a kind of good reinforcing and toughening materials.The Mohs' hardness of carborundum is a kind of important abrasive material up to 9.5 grades simultaneously.The present invention introduces silicon carbide whisker in resin abrasive tools; Not only possibly improve abrasive wheel body intensity improves outside the grinding tool face shape stability; Silicon carbide whisker can also carry out grinding and polishing to the sapphire crystal that hardness is slightly less than it, thereby improves sapphire crystal processing fineness.The silicon carbide whisker description is more; The inventor finds in process of the test; If silicon carbide whisker is selected the improper sapphire crystal surface that very easily scratches, the inventor through repetitious experiment after, find that the adding draw ratio is that 20-50, granularity are the silicon carbide whisker of cube phase beta crystal of 1～10 μ m in resin abrasive tools; Not only improve grinding tool face shape stability, prolong resin abrasive tools service life, the grinding and polishing sapphire crystal, and can not scratch the sapphire crystal surface.
Wetting agent is the interim binding agent in the resin abrasive tools molding mass, it with abrasive surface wetting after, make bond can be bonded at the surface of abrasive material uniformly, thereby prevent the generation of component layering.The inventor finds through experiment, and aqueous silane coupler is used as wetting agent, not only can prevent the component layering, and can improve the cementitiousness of face shape stability, reinforcer and the resin boundary surface of resin abrasive tools.
Resin abrasive tools is used in sapphire crystal processing of the present invention, and its preparation method is following:
(1) bortz powder, heat reactive resin powder, filler, silicon carbide whisker and wetting agent are carried out batch mixing by the example ratio, obtain molding mass;
(2) molding mass is packed in the mould with matrix, under 140 ℃～210 ℃ of temperature, pressure 2～10MPa, molding mass compression moulding on matrix, is incubated precuring in 30～60 minutes, the demoulding obtains the processing of precuring sapphire crystal and uses resin abrasive tools;
(3) processing of precuring sapphire crystal is continued the back with resin abrasive tools down at 150 ℃～210 ℃ and solidified 2～14 hours, obtain the processing of semi-finished product sapphire crystal and use resin abrasive tools;
(4) processing of semi-finished product sapphire crystal is carried out the back finishing with resin abrasive tools, resin abrasive tools is used in the sapphire crystal that obtains completing processing.
Wherein the molding mass weight proportion is following:
10～35 parts of bortz powders
15～40 parts in thermosetting resin powder
20～50 parts of fillers
0.1～3 part of silicon carbide whisker
0.5～2 part of wetting agent.
The thermosetting resin powder is one or more the composition in phenol-formaldehyde resin powder, polyimide resin powder, modified phenolic resin cosmetics, the modified polyimide resin powder; Filler is one or more the composition in metal powder, the metal oxide powder; Silicon carbide whisker is that granularity is that 1～10 μ m, draw ratio are cube phase beta crystal silicon carbide whisker of 20-50; Wetting agent is aqueous silane coupler.
The specific embodiment
How further specify the present invention below in conjunction with concrete embodiment realizes.
Embodiment 1
Cube phase beta crystal silicon carbide whisker 0.5 gram, 300 order copper powders, 40 grams, KH550 silicone couplet 1 gram with 40/45 bortz powder, 20 grams, PF2802A phenol-formaldehyde resin powder 30 grams, granularity 3 μ m draw ratios 30 batch mixing l hour, obtain molding mass; Molding mass is packed in the mould with Φ 200 * 20T * 5 matrixes, under 200 ℃, 3MPa, molding mass compression moulding on matrix, is incubated precuring in 40 minutes, the demoulding obtains the pre-curing resin grinding tool; The pre-curing resin grinding tool is continued the back down at 200 ℃ solidified 10 hours, obtain the semi-finished product resin abrasive tools; The semi-finished product resin abrasive tools is removed burring and overlap with silicon carbide grinding wheel to be obtained Φ 200 * 20T * 5 sapphire crystals processing and uses resin abrasive tools.
Embodiment 2
Cube phase beta crystal silicon carbide whisker 1 gram, 300 order copper powders, 40 grams, KH550 silicone couplet 1 gram with 50/60 bortz powder, 25 grams, EXP0019 phenol-formaldehyde resin powder 30 grams, granularity 5 μ m draw ratios 30 batch mixing l hour, obtain molding mass; Molding mass is packed in the mould with Φ 200 * 20T * 5 matrixes, under 200 ℃, 3MPa, molding mass compression moulding on matrix, is incubated precuring in 40 minutes, the demoulding obtains the pre-curing resin grinding tool; The demoulding obtains the pre-curing resin grinding tool; The pre-curing resin grinding tool is continued the back down at 200 ℃ solidified 12 hours, obtain the semi-finished product resin abrasive tools; The semi-finished product resin abrasive tools is removed burring and overlap with silicon carbide grinding wheel to be obtained Φ 200 * 20T * 5 sapphire crystals processing and uses resin abrasive tools.
Embodiment 3
Cube phase beta crystal silicon carbide whisker 0.3 gram, 300 order copper powders, 25 grams, 300 order zinc oxide, 20 grams, KH550 silicone couplet 1 gram with 40/45 bortz powder, 15 grams, PF2802A phenol-formaldehyde resin powder 30 grams, granularity 3 μ m draw ratios 30; Batch mixing l hour, obtain molding mass; Molding mass is packed in the mould with Φ 200 * 20T * 5 matrixes, under 200 ℃, 3MPa, molding mass compression moulding on matrix, is incubated precuring in 40 minutes, the demoulding obtains the pre-curing resin grinding tool; The pre-curing resin grinding tool is continued the back down at 200 ℃ solidified 10 hours, obtain the semi-finished product resin abrasive tools; The semi-finished product resin abrasive tools is removed burring and overlap with silicon carbide grinding wheel to be obtained Φ 200 * 20T * 5 sapphire crystals processing and uses resin abrasive tools.
Claims (8)
1. resin abrasive tools is used in a sapphire crystal processing, and its preparation method is following:
(1) bortz powder, heat reactive resin powder, filler, silicon carbide whisker and wetting agent are carried out batch mixing by the example ratio, obtain molding mass;
(2) molding mass is packed in the mould with matrix, under 140 ℃～210 ℃ of temperature, pressure 2～10MPa, molding mass compression moulding on matrix, is incubated precuring in 30～60 minutes, the demoulding obtains the processing of precuring sapphire crystal and uses resin abrasive tools;
(3) processing of precuring sapphire crystal is continued the back with resin abrasive tools down at 150 ℃～200 ℃ and solidified 2～14 hours, obtain the processing of semi-finished product sapphire crystal and use resin abrasive tools;
(4) processing of semi-finished product sapphire crystal is carried out the back finishing with resin abrasive tools, resin abrasive tools is used in the sapphire crystal that obtains completing processing.
2. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that the molding mass weight proportion is following:
10～35 parts of bortz powders
15～40 parts in thermosetting resin powder
20～50 parts of fillers
0.1～3 part of silicon carbide whisker
0.5～2 part of wetting agent.
3. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said thermosetting resin powder is one or more the composition in phenol-formaldehyde resin powder, polyimide resin powder, modified phenolic resin cosmetics, the modified polyimide resin powder.
4. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said filler is one or more the composition in metal powder, the metal oxide powder.
5. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said silicon carbide whisker is a cube phase beta crystal silicon carbide whisker.
6. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said silicon carbide whisker granularity is 1～10 μ m.
7. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said silicon carbide whisker draw ratio is 20-50.
8. resin abrasive tools is used in a kind of sapphire crystal processing as claimed in claim 1, it is characterized in that said wetting agent is aqueous silane coupler.
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| CN2011104489403A CN102513944A (en) | 2011-12-29 | 2011-12-29 | Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool |
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| CN2011104489403A CN102513944A (en) | 2011-12-29 | 2011-12-29 | Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool |
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| CN103009271A (en) * | 2012-11-29 | 2013-04-03 | 桂林金刚石工业有限公司 | One side tapered diamond resin grinding wheel and production process thereof |
| CN103406840A (en) * | 2013-07-12 | 2013-11-27 | 上海川禾实业发展有限公司 | Method for preparing magnetic grinding disc for metallographic phase |
| CN103521752A (en) * | 2013-09-26 | 2014-01-22 | 秦皇岛星晟科技有限公司 | Method for machining abrasive wheel with metal and resin composite material matrix |
| CN103624697A (en) * | 2013-12-27 | 2014-03-12 | 云南光电辅料有限公司 | Ceramic grinding tool manufacturing method |
| CN103624698A (en) * | 2013-12-27 | 2014-03-12 | 云南光电辅料有限公司 | Thermal-curing resin grinding tool manufacturing method |
| CN103962977A (en) * | 2014-04-28 | 2014-08-06 | 佛山市鼎顺科技有限公司 | Dry grinding wheel and manufacturing method thereof |
| CN105234842A (en) * | 2015-10-12 | 2016-01-13 | 长沙岱勒新材料科技股份有限公司 | Diamond resin grinding tool material and diamond resin grinding wheel |
| CN105437088A (en) * | 2014-08-29 | 2016-03-30 | 王双喜 | Diamond grinding wheel containing resin binder |
| CN105666349A (en) * | 2016-01-26 | 2016-06-15 | 沈阳中科超硬磨具磨削研究所 | Resin CBN grinding wheel for grinding plane of control valve bush of fuel spray nozzle |
| CN105798782A (en) * | 2014-12-30 | 2016-07-27 | 安泰科技股份有限公司 | Diamond resin grinding wheel and preparation method thereof |
| CN106002665A (en) * | 2016-05-30 | 2016-10-12 | 莒南县合兴磨料磨具公共技术服务中心 | Resin grinding wheel and preparation method thereof |
| CN106346376A (en) * | 2016-08-29 | 2017-01-25 | 南安市铂克装饰工程有限公司 | Resin binder concrete grinding and polishing wafer and preparing method thereof |
| CN106392909A (en) * | 2016-08-30 | 2017-02-15 | 湖北东方玉扬电子科技有限公司 | High-speed grinding plate applied to brake pad grinder and manufacturing method of high-speed grinding plate |
| CN107263342A (en) * | 2017-06-07 | 2017-10-20 | 广州立启森科技有限公司 | Printed wiring board grinding brush wheel resin abrasive disc and its manufacture method |
| CN108453619A (en) * | 2017-12-30 | 2018-08-28 | 苏州赛尔科技有限公司 | The thinned grinding wheel of Sapphire Substrate |
| CN108890542A (en) * | 2018-05-30 | 2018-11-27 | 安徽佑开科技有限公司 | A kind of anti-attenuation resin wheel formula |
| CN109623684A (en) * | 2018-12-29 | 2019-04-16 | 江苏华东砂轮有限公司 | A kind of grinding wheel low-temperature setting technique |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09302197A (en) * | 1996-03-13 | 1997-11-25 | Toray Ind Inc | Coating-resistant thermoplastic resin composition and its production |
| CN1623731A (en) * | 2003-12-05 | 2005-06-08 | 浙江工业大学 | Whisker-shaped abrasive emery cutter |
| CN101966694A (en) * | 2010-10-15 | 2011-02-09 | 江苏省新型复合研磨材料及制品工程技术研究中心 | High-performance elastic composite abrasive sheet and preparation method thereof |
-
2011
- 2011-12-29 CN CN2011104489403A patent/CN102513944A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09302197A (en) * | 1996-03-13 | 1997-11-25 | Toray Ind Inc | Coating-resistant thermoplastic resin composition and its production |
| CN1623731A (en) * | 2003-12-05 | 2005-06-08 | 浙江工业大学 | Whisker-shaped abrasive emery cutter |
| CN101966694A (en) * | 2010-10-15 | 2011-02-09 | 江苏省新型复合研磨材料及制品工程技术研究中心 | High-performance elastic composite abrasive sheet and preparation method thereof |
Non-Patent Citations (5)
| Title |
|---|
| 刘民强 等: "树脂磨具低温硬化研究与应用", 《金刚石与磨料磨具工程》, no. 2, 31 December 2001 (2001-12-31), pages 47 * |
| 周海 等: "蓝宝石晶片纳米级超光滑表面加工技术研究", 《金刚石与磨料磨具工程》, no. 5, 31 October 2005 (2005-10-31) * |
| 李伟 等: "SiC晶须强化树脂的磨损特性及其在磨削加工中的应用", 《金刚石与磨料磨具工程》, no. 6, 31 December 2004 (2004-12-31), pages 4 - 8 * |
| 王孝琪 等: "CSD金刚石树脂结合剂砂轮的研制与应用", 《金刚石与磨料磨具工程》, no. 4, 31 August 2004 (2004-08-31), pages 34 - 35 * |
| 王秦生 等: "金刚石树脂磨具的改进", 《金刚石与磨料磨具工程》, no. 4, 31 August 2004 (2004-08-31), pages 25 - 30 * |
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Application publication date: 20120627 |