CN112223108A - Formula and manufacturing method of diamond grinding pad - Google Patents
Formula and manufacturing method of diamond grinding pad Download PDFInfo
- Publication number
- CN112223108A CN112223108A CN202010893684.8A CN202010893684A CN112223108A CN 112223108 A CN112223108 A CN 112223108A CN 202010893684 A CN202010893684 A CN 202010893684A CN 112223108 A CN112223108 A CN 112223108A
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- China
- Prior art keywords
- diamond
- grinding
- agent
- percent
- powder
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a formula and a manufacturing method of a diamond grinding pad, which comprises the following raw materials in percentage by weight: adding the diamond powder, the adhesive, the hollow glass beads, other fillers and a wetting agent into a mixing tank in proportion, stirring and heating to 50 ℃; opening a low-shear mixer, adding the auxiliary agent, and dispersing the mixed material for 30 min; after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material; adding the materials into a grinding pad die, and curing and molding. The invention can meet the requirement of precision grinding of workpieces made of glass, ceramics, sapphire and the like, only uses water as a lubricating coolant during production, and has good grinding force and stability, low grinding surface roughness and less deep scratches.
Description
Technical Field
The invention relates to the technical field of precision grinding and polishing consumables, in particular to a formula and a manufacturing method of a diamond grinding pad.
Background
The grinding scheme of a diamond (diamond) grinding pad and water instead of a grinding disc and grinding fluid is a trend of the development of the grinding industry, and has the advantages of reducing waste liquid discharge, being more convenient to use, good in stability and the like; however, the existing diamond polishing pad generally has the defects of poor self-sharpening property, poor uniformity and serious scratch.
CN201510814362.9 belongs to a superhard resin grinding wheel, which is prepared from the following raw materials in parts by weight: 15-25 parts of epoxy resin liquid, 15-20 parts of diluent, 0.5-1 part of coupling agent, 0.5-1 part of hollow sphere, 40-60 parts of diamond and 10-15 parts of curing agent. According to the invention, through carrying out oven foaming and sieving on the hollow balls, the porosity and the aperture of the grinding wheel can be well controlled, the porosity of the prepared grinding wheel can reach 50-60%, and the aperture is 100 plus one 200 mu m, the prepared grinding wheel has high structure uniformity, can be continuously self-sharpened without trimming, has high porosity and good chip capacity, has a low substrate surface damage layer, has good grinding performance on substrate materials, improves the processing efficiency and reduces the processing cost. But is only suitable for high-speed and rapid cutting and is not suitable for low-speed grinding and polishing.
CN201510819655.6 discloses a method for preparing a superhard resin grinding wheel, which comprises the following steps: firstly, drying the hollow spheres in an oven at the temperature of 80-100 ℃ for 0.5-4h, uniformly mixing the hollow spheres with diamond, and then sieving the mixture through a 100-mesh and 120-mesh sieve; secondly, stirring and heating the epoxy resin liquid for 2-5 minutes in a water bath at the temperature of 70-80 ℃, adding a diluent and a coupling agent, continuously stirring and heating for 5-10 minutes, adding the mixture of the hollow spheres and the diamonds obtained in the step I, and continuously stirring and heating for 5-10 minutes; thirdly, reducing the temperature of the water bath in the second step to 55-60 ℃, uniformly mixing the diluent and the curing agent, adding the mixture into the slurry obtained in the second step, uniformly stirring, pouring the mixture into a mold, hardening the mixture for 3-8 hours at 80-90 ℃, and then curing the mixture; cooling the material solidified in the step III to room temperature, demoulding to obtain a grinding wheel ring, and processing to obtain the superhard resin grinding wheel. But is only suitable for high-speed and rapid cutting and is not suitable for low-speed grinding and polishing.
Disclosure of Invention
The invention aims to solve the technical problems of high mixing difficulty, poor uniformity, poor cutting performance, serious grinding scratch and the like of the conventional nano injection molding material, and provides a formula and a manufacturing method of a diamond grinding pad.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the formula of the diamond grinding pad comprises the following raw materials in percentage by weight:
10 to 30 percent of diamond powder
20 to 60 percent of adhesive
10 to 30 percent of hollow glass beads
0 to 20 percent of other fillers
0.5 to 3 percent of auxiliary agent.
In the invention, the hollow glass beads have the function of reducing the resin strength of the adhesive, and the manufactured resin grinding pad can increase self-sharpening property. The hollow cavity of the hollow glass bead can store part of water after being opened in the grinding process, and the part of water plays a role in cooling and lubricating in the grinding process, so that deep scratches caused in the grinding process are reduced. In addition, as the surface energy of the smooth sphere of the hollow glass bead is smaller, the hollow glass bead is not easy to agglomerate when being added into resin, and the viscosity of the resin is hardly increased, so that the mixing and the use are convenient; after the mixed material is vacuumized, the porosity of the material is generated by the hollow glass beads, and the porosity of the grinding pad is stable and uniform.
In the technical scheme, the diamond powder is one of single crystal, polycrystal and polycrystal-like, and the particle size of the diamond powder is 1-50 microns. The particle size of the diamond dust determines the efficiency and roughness of the grinding.
In the technical scheme, the adhesive is one or more of thermosetting phenolic resin, epoxy resin, urea resin, acrylate and polyurethane. In the invention, the adhesive is used for bonding all the components, so that the grinding pad is convenient to form.
In the technical scheme, the other fillers are one or more of calcium carbonate powder, talcum powder, wollastonite powder, aluminum hydroxide and kaolin. In the present invention, the other fillers function to improve the compounding viscosity and the strength of the polishing pad.
In the technical scheme, the auxiliary agent is one or more of a coupling agent, a cross-linking agent, a flatting agent, a thickening agent, a wetting agent and a defoaming agent. In the invention, the wetting agent is used for improving the surface wettability of the powder and the mixing uniformity. The coupling agent has the functions of reducing the viscosity of the synthetic resin melt, improving the dispersion degree of the filler to improve the processing performance, and further ensuring that the product obtains good surface quality and mechanical, thermal and electrical properties. The cross-linking agent is used for generating chemical bonds among linear molecules, so that the linear molecules are mutually connected to form a net structure, and the strength and the elasticity of the product are improved. The leveling agent can effectively reduce the surface tension of the resin product and improve the leveling property and uniformity of the resin product. The thickener functions as a dispersion medium instead of an organic solvent.
In order to further solve the defects of the prior art, the invention also provides a method for manufacturing the diamond polishing pad, which comprises the following steps according to the formula:
step one, premixing: adding the adhesive, the diamond powder, the hollow glass beads and other fillers into a mixing tank in proportion, stirring and heating to 50 ℃;
step two, main mixing: opening a low-shear mixer, controlling the shear force to be less than 20Mpa, preventing the hollow glass beads from being broken, adding the auxiliary agent, dispersing the mixed material for 30min, and improving the viscosity and the uniformity of the mixed material;
step three, bubble removal: after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material;
step four, forming: adding the materials into a grinding pad die, and curing and molding.
In the above technical scheme, in the first step, the stirring speed is 60-100rpm, and the stirring time is 15-30 min.
In the above technical scheme, in the second step, the stirring speed during mixing is 300-600 rpm.
The invention has the beneficial effects that: the precision grinding machine can meet the precision grinding of workpieces made of glass, ceramics, sapphire and the like, only uses water as a lubricating coolant during production, and has good grinding force and stability, low grinding surface roughness and less deep scratches.
Drawings
FIG. 1 is a graph comparing the removal rate and the number of grinds for formulation 1 of the example of the present invention and a conventional formulation.
FIG. 2 is a graph comparing the roughness Ra and the number of times of polishing for the formulation 1 according to the example of the present invention and the conventional formulation.
FIG. 3 is a graph comparing the removal rate and the number of grinds for formulation 2 of the example of the present invention and a conventional formulation.
FIG. 4 is a graph comparing the roughness Ra and the number of polishing times for the formula 2 according to the example of the present invention and the conventional formula.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Comparative example-general formulation:
diamond powder (diamond powder) 50%
40 percent of epoxy resin
8 percent of talcum powder
And 2% of a coupling agent.
Adding diamond powder, epoxy resin, talcum powder and coupling agent into a mixing tank, and stirring and mixing for 30min at the rotating speed of 500 rpm; after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material; adding the materials into a grinding pad die, and curing and molding.
Example-inventive formulation 1:
20um diamond powder 28%
55 percent of liquid phenolic resin
Hollow glass bead 15%
And 2% of a coupling agent.
Adding liquid phenolic resin, diamond powder and hollow glass beads into a mixing tank in proportion, stirring and heating to 50 ℃; opening a low-shear mixer, adding a coupling agent, mixing and dispersing for 30 min; after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material; adding the materials into a grinding pad die, and curing and molding.
The diamond polishing pad manufactured according to formulation 1 of the present invention was tested by polishing a flat glass using a flat surface polishing machine, and the removal thickness of the glass and the roughness of the surface of the glass were measured after the same polishing time, as shown in fig. 1 and 2, and the results showed that the removal rate of formulation 1 was stable and the surface roughness was lower.
Example-inventive formulation 2
9um diamond powder 15%
50 percent of epoxy adhesive
Hollow glass bead 10%
20 percent of coarse whiting powder (the whiteness is 93 percent)
2 percent of coupling agent
And 3% of wetting agent.
Adding the epoxy adhesive, the diamond powder, the hollow glass beads and the heavy calcium carbonate powder into a mixing tank in proportion, stirring and heating to 50 ℃; opening a low-shear mixer, adding a wetting agent and a coupling agent, mixing and dispersing for 30 min; after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material; adding the materials into a grinding pad die, and curing and molding.
The diamond polishing pad manufactured according to formulation 2 of the present invention was tested by using a method of polishing a ceramic wafer using a flat surface polishing machine, and the removal rate of the ceramic wafer and the roughness of the glass surface were tested after the same polishing time, as shown in fig. 3 and 4, and the results showed that the removal rate of formulation 2 was stable and the surface roughness was lower.
The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. The formula of the diamond grinding pad is characterized by comprising the following raw materials in percentage by weight:
10 to 30 percent of diamond powder
20 to 60 percent of adhesive
10 to 30 percent of hollow glass beads
0 to 20 percent of other fillers
0.5 to 3 percent of auxiliary agent.
2. The formulation of claim 1, wherein: the diamond powder is one of single crystal, polycrystal and polycrystal-like, and the particle size of the diamond powder is 1-50 mu m.
3. The formulation of claim 1, wherein: the adhesive is one or more of thermosetting phenolic resin, epoxy resin, urea resin, acrylate and polyurethane.
4. The formulation of claim 1, wherein: the other fillers are one or more of calcium carbonate powder, talcum powder, wollastonite powder, aluminum hydroxide and kaolin.
5. The formulation of claim 1, wherein: the auxiliary agent is one or more of a cross-linking agent, a flatting agent, a thickening agent, a wetting agent and a defoaming agent.
6. A method for manufacturing a diamond polishing pad according to any one of claims 1 to 5, comprising the steps of:
step one, adding an adhesive, diamond powder, hollow glass beads and other fillers into a mixing tank in proportion, stirring and heating to 50 ℃;
opening the low-shear mixer, controlling the shear force to be less than 20Mpa, adding the auxiliary agent, and dispersing the mixed material for 30 min;
step three, after the material mixing is finished, opening a vacuum device to remove bubbles mixed in the material;
and step four, adding the materials into a grinding pad die, and curing and molding.
7. The method of claim 6, wherein the polishing pad comprises: in the first step, the stirring speed is 60-100rpm, and the stirring time is 15-30 min.
8. The method of claim 6, wherein the polishing pad comprises: in the second step, the stirring speed during mixing is 300-600 rpm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010893684.8A CN112223108A (en) | 2020-08-31 | 2020-08-31 | Formula and manufacturing method of diamond grinding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010893684.8A CN112223108A (en) | 2020-08-31 | 2020-08-31 | Formula and manufacturing method of diamond grinding pad |
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| Publication Number | Publication Date |
|---|---|
| CN112223108A true CN112223108A (en) | 2021-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010893684.8A Pending CN112223108A (en) | 2020-08-31 | 2020-08-31 | Formula and manufacturing method of diamond grinding pad |
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| CN (1) | CN112223108A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040231245A1 (en) * | 2002-12-04 | 2004-11-25 | Showa Denko K.K. | Composite material and processing method using the material |
| CN103737499A (en) * | 2014-01-08 | 2014-04-23 | 苏州赛力精密工具有限公司 | End face super grinding special metal ceramic CBN (Cubic Boron Nitride) grinding wheel and preparation method thereof |
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN106078539A (en) * | 2016-07-29 | 2016-11-09 | 无锡市三峰仪器设备有限公司 | A kind of thin resin grinding wheel of high cutting ratio |
| CN108789135A (en) * | 2018-05-25 | 2018-11-13 | 湖北鼎龙控股股份有限公司 | Chemical mechanical polishing pads |
| CN110842800A (en) * | 2019-11-26 | 2020-02-28 | 惠安宇信金刚石工具有限公司 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
| CN111360706A (en) * | 2020-03-19 | 2020-07-03 | 惠安宇信金刚石工具有限公司 | Polishing pad, preparation method thereof and application thereof in marble polishing |
-
2020
- 2020-08-31 CN CN202010893684.8A patent/CN112223108A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040231245A1 (en) * | 2002-12-04 | 2004-11-25 | Showa Denko K.K. | Composite material and processing method using the material |
| CN103737499A (en) * | 2014-01-08 | 2014-04-23 | 苏州赛力精密工具有限公司 | End face super grinding special metal ceramic CBN (Cubic Boron Nitride) grinding wheel and preparation method thereof |
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN106078539A (en) * | 2016-07-29 | 2016-11-09 | 无锡市三峰仪器设备有限公司 | A kind of thin resin grinding wheel of high cutting ratio |
| CN108789135A (en) * | 2018-05-25 | 2018-11-13 | 湖北鼎龙控股股份有限公司 | Chemical mechanical polishing pads |
| CN110842800A (en) * | 2019-11-26 | 2020-02-28 | 惠安宇信金刚石工具有限公司 | Diamond resin bonding agent abrasive disc and preparation method and application thereof |
| CN111360706A (en) * | 2020-03-19 | 2020-07-03 | 惠安宇信金刚石工具有限公司 | Polishing pad, preparation method thereof and application thereof in marble polishing |
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Application publication date: 20210115 |
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