CN104690654A - Super-hard resin grinding wheel for grinding hard and brittle materials and preparation method of super-hard resin grinding wheel - Google Patents
Super-hard resin grinding wheel for grinding hard and brittle materials and preparation method of super-hard resin grinding wheel Download PDFInfo
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- CN104690654A CN104690654A CN201510078163.6A CN201510078163A CN104690654A CN 104690654 A CN104690654 A CN 104690654A CN 201510078163 A CN201510078163 A CN 201510078163A CN 104690654 A CN104690654 A CN 104690654A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Abstract
The invention discloses a super-hard resin grinding wheel for grinding hard and brittle materials. The super-hard resin grinding wheel is prepared from the following raw materials in part by weight: 10-23 parts of liquid phenolic resin, 5-15 parts of a pore-forming agent, 1-3 parts of a coupling agent, 1-5 parts of a reinforcing agent, 40-70 parts of diamond and 10-17 parts of a curing agent. According to the invention, the grinding wheel can obtain uniformly distributed pores and a high porosity by adopting a novel pore forming method, a novel foaming agent used for foaming is not limited by the upper limit of the quantity of solids, and cannot pollute the ground objects or reduce the grinding quality, and the chip holding capability of the grinding wheel can be improved by virtue of the increase of the porosity; the self-sharpening capability, durability and chip space of the grinding wheel are improved; the roughness of the grinding surface can reach nanoscale; the processing quality is high.
Description
Technical field
The invention belongs to emery wheel technical field, specifically disclose a kind of superhard resin wheel for crisp and hard material grinding and preparation method thereof.
Background technology
Resin extra hard material grinding wheel is mainly made up of abrasive particle, bonding agent and pore.Abrasive particle is abrasive grinding wheel work major part.Bonding agent plays cementation in emery wheel, and General Requirements has better cementitiousness to abrasive particle, and has good mechanical performance and self-sharpening, has good processing performance so that processing and manufacturing.In emery wheel, pore is freestanding substantially, plays a part to hold bits and heat radiation.Such as when carrying out precision wafer grinding, pore plays the effect holding bits in silicon chip grinding process, wheel topography can be prevented, grinding fluid is stored on the other hand in grinding process, improve emery wheel heat-conduction effect, improve wheel life to a certain extent, when some workpiece are required to be polished to certain condition, high porosity seems particularly important.
Emery wheel, when the hard crisp workpiece material of grinding, should have following technical requirement: require that emery wheel layer tissue uniformity is high, can continue need not repair from sharp; Because fragile material removal total amount is large, so higher to the appearance bits functional requirement of emery wheel, therefore the emery wheel for this processing needs to strengthen the porosity that it forms one of three elements, and the increase of the porosity can improve emery wheel and hold bits function, reduces workpiece burn phenomenon.Mostly abrasive grinding wheel at present for hard brittle workpiece material is that other auxiliary material high temperature such as employing resin-oatmeal, abrasive material etc. is compressing, and it is uneven that the characteristic because of its technique there will be emery wheel layer in pressing process, and self-sharpening is bad.
Mostly porous resin emery wheel was water soluble particle or hollow material to be mixed in the slip of flowing in the past, formed " occupy-place " situation, produced pore.Water soluble particle method mainly joins " occupy-place " in abrasive material by the water soluble particle that can form hole, and resin wheel is when grinding fluid is water-based, and water soluble particle is dissolved in water, and " occupy-place " place forms air hole structure.Hollow material rule in emery wheel, manufactures loose structure by the closed-cell materials that the class of interpolation hollow is spherical.The method of these two kinds employings " occupy-place " manufactures many air hole grinding wheels and can restrict by the upper limit of solid substance quantity, causes the porosity upper limit of resin wheel to be restricted; Resin liquid viscosity is large simultaneously, and that causes molding mass mixes difficulty greatly, and this causes the gas cell distribution of resin wheel uneven to a certain extent; In addition, the particle that this " occupy-place " method is introduced can pollute grinding object-hard brittle material or reduce its grinding quality.
Summary of the invention
The object of the present invention is to provide the superhard resin wheel of a kind of gross blow hole for grinding brittle materials, this superhard resin wheel has good structural homogenity and high porosity, have good grinding performance to hard brittle material, grinding surface roughness can reach nanoscale; And provide the preparation method of this emery wheel simultaneously.
For a superhard resin wheel for crisp and hard material grinding, be made up of the raw material of following weight portion: liquid phenolic resin 10-23 part, pore binder 5-15 part, coupling agent 1-3 part, reinforcing agent 1-5 part, diamond 40-70 part, curing agent 10-17 part.
In order to obtain the good superhard resin wheel of quality, liquid phenolic resin is bonding agent, and viscosity is 200Pas; Described coupling agent is Z-6173, coupling agent Z-6173 is a kind of functionalization silicone products, and it can strengthen the interaction in mixing material between polymer one filler, includes alkoxyl and alkyl functional group, improve the dispersiveness that inorganic filler is with organic polymer, analyze pure rank; Described diamond grit 5-10 μm; Reinforcing agent is chromium oxide, and chromium oxide granularity is 5-15 μm; Pore binder is Tween 80, analyze pure rank and more than; Curing agent is GH-01; The mass ratio of described diamond and liquid phenolic resin is (4-6): 1.
Below introduce each material that superhard resin wheel in the present invention is used:
Liquid phenolic resin is a kind of many components, new technology that is multi-level, Deep catalytic is made, and its feature is that molecular weight uniform is moderate, and the loose of moulding material and dry wetting can be made to reach optimum state, even if still can keep its characteristic season in high temperature, high humility.The mixed liquor of liquid resin liquid also available water and methyl alcohol that the present invention uses adjusts viscosity arbitrarily, is suitable for grinding tool manufacture.
Pore binder, can use Organic pore binder, water soluble particle and hollow material etc., also can use some gas forming agent, such as spherical foamed styrene etc.In addition the pore binder used in the present invention is organic system Tween 80.Tween 80 chemistry polyoxyethylene 20 sorbitol anhydride list by name has acid esters, belong to mixture, it take anhydrous sorbitol as skeleton, side chain connects 3 ethylene oxide chains with water-wet behavior, 1 aliphatic chain with lipophilic characteristics, therefore Tween 80 belongs to amphiphilic nonionic surfactant, can be miscible with water, methyl alcohol, ethanol, chloroform etc., there is good characteristic of solubilizing.Resin liquid can be emulsified into evenly tiny bubble.Good selection as pore binder of the present invention.
Coupling agent and reinforcing agent are that combination degree is good in order to make between abrasive material and bonding agent.Also other coupling agent and reinforcing agent be can use, Z-6173 and reinforcing agent chromium oxide are not limited to.
Diamond abrasive can use monocrystalline, from sharp and polymorphic, according to grinding condition, can choose a kind of or be greater than a kind of diamond abrasive.The diamond of granularity M5/10, M6/8, M4/6 can meet the present invention and use.
The preparation method of the above-mentioned superhard resin wheel for crisp and hard material grinding, comprises the following steps:
(1) in diamond, add coupling agent and acetone, in ultrasound machine ultrasonic 15-25min post-drying must process after diamond for subsequent use;
(2) at bath temperature 50-60 DEG C, at the uniform velocity add blowhole binder in liquid phenolic resin after stirring 1-3min to 900-1100 r/min under 800-1000 r/min stirs (drop by drop to add, not directly pour into), stir > 5min again and become milky foam to liquid phenolic resin from rufous liquid, pore-creating completes, then under 1300-1600r/min stirs, at the uniform velocity reinforcing agent is added, then (divide three times) in 3min and add the diamond after process in step (1), after stirring 3-7min, again in bath temperature 45-50 DEG C, 500-700r/min adds (dropping) curing agent under stirring, be poured in mould after stirring > 1min, 2-3h is incubated at 55-60 DEG C, after compound is hardening, follow-up heating curve is set, 60-70 DEG C of intensification 20min, insulation 60min, 70-80 DEG C of intensification 20min, insulation 60min, 80-100 DEG C of intensification 20min, insulation 30min, 100-120 DEG C of intensification 20min, is down to room temperature after 120-150 DEG C of insulation 2-6h and get final product.
The present invention take liquid phenolic resin as bonding agent, can evenly enter in the gap that formed between abrasive particle, even tissue, uniformity are good, emery wheel layer non-uniform phenomenon can be avoided, the superhard resin wheel porosity of the present invention is 40-70%, 3 rupture strengths of emery wheel joint block are 2-5MPa, even air hole distribution and pore size 50-200um.
The pore forming process that the present invention is novel, makes emery wheel obtain equally distributed pore and high porosity; Wherein novel foaming agent foam, be not limited to the upper limit of solid substance quantity, can not pollute grinding object or reduce grinding quality, and the porosity can increase raising emery wheel appearance bits function, all improving from sharp ability, durability and chip space of emery wheel of the present invention, grinding surface roughness can reach nanoscale, and crudy is high.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention 1 medium plain emery wheel ESEM micro-structure diagram;
Fig. 2 is 8 cun of silicon chip surface roughness Ra value of the embodiment of the present invention 1 medium plain emery wheel grinding.In figure, X-axis marks the 5th of the corresponding grinding silicon chip of 1-20 difference of wafers, and the 10th, 15,20,25,30,35,40,45,50,55,60,65,70,75,80, the surface roughness Ra value of 85,90,95,100.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated, but scope of the present invention is not limited in this.
In following embodiment, liquid phenolic resin is liquid phenolic resin PF2130, and viscosity is 200Pas; Coupling agent Z-6173 is for analyzing pure rank; Described diamond is monocrystalline type diamond, granularity 5-10 μm; Chromium oxide granularity is 5-15 μm; Curing agent is GH-01; Tween 80 is for analyzing pure rank.
embodiment 1
For the superhard resin wheel of crisp and hard material grinding, be made up of the raw material of following weight portion: liquid phenolic resin 18 parts, Tween 80 8 parts, coupling agent Z-6173 3 parts, 3 parts, chromium oxide (granularity 8 μm), 68 parts, diamond (granularity 8 μm), curing agent GH-01 13 parts.
The preparation of superhard resin wheel comprises the following steps:
(1) in diamond, add coupling agent Z-6173 and acetone, in ultrasound machine ultrasonic 20min post-drying must process after diamond for subsequent use;
(2) liquid phenolic resin is poured in beaker, bath temperature 50 DEG C, after 900 r/min stir 3min, at the uniform velocity drip Tween 80, bath temperature 55 DEG C, 900 r/min stir 10min and become milky foam to liquid phenolic resin from rufous liquid, pore-creating completes, then under 1500r/min stirs, at the uniform velocity add chromium oxide and stir 3min, then in two minutes, divide the diamond added for three times in step (1) after process, after stirring 5min, again in bath temperature 45 DEG C, 600r/min drips curing agent under stirring, be poured in mould after stirring 1min, 3h is incubated at 55 DEG C, after compound is hardening, follow-up heating curve is set, 60-70 DEG C of intensification 20min, insulation 60min, 70-80 DEG C of intensification 20min, insulation 60min, 80-100 DEG C of intensification 20min, insulation 30min, 100-120 DEG C of intensification 20min, is down to the room temperature demoulding after 150 DEG C of insulation 4h and get final product.
embodiment 2
For the superhard resin wheel of crisp and hard material grinding, be made up of the raw material of following weight portion: liquid phenolic resin 10 parts, Tween 80 5 parts, coupling agent Z-6173 1 part, 1 part, chromium oxide (granularity 10 μm), 40 parts, diamond (granularity 5 μm), curing agent GH-01 10 parts.
The preparation of superhard resin wheel comprises the following steps:
(1) in diamond, add coupling agent Z-6173 and acetone, in ultrasound machine ultrasonic 25min post-drying must process after diamond for subsequent use;
(2) liquid phenolic resin is poured in beaker, bath temperature 55 DEG C, after 1000 r/min stir 2min, at the uniform velocity drip Tween 80, bath temperature 55 DEG C, 1000r/min stirs 8min and becomes milky foam to liquid phenolic resin from rufous liquid, pore-creating completes, then under 1300r/min stirs, at the uniform velocity add chromium oxide and stir 3min, then in 3 minutes, divide the diamond added for three times in step (1) after process, after stirring 6min, again in bath temperature 48 DEG C, 700r/min drips curing agent under stirring, be poured in mould after stirring 1min, 2h is incubated at 60 DEG C, after compound is hardening, follow-up heating curve is set, 60-70 DEG C of intensification 20min, insulation 60min, 70-80 DEG C of intensification 20min, insulation 60min, 80-100 DEG C of intensification 20min, insulation 30min, 100-120 DEG C of intensification 20min, is down to the room temperature demoulding after 120 DEG C of insulation 6h and get final product.
embodiment 3
For the superhard resin wheel of crisp and hard material grinding, be made up of the raw material of following weight portion: liquid phenolic resin 23 parts, Tween 80 15 parts, coupling agent Z-6173 2 parts, 5 parts, chromium oxide (granularity 15 μm), 70 parts, diamond (granularity 10 μm), curing agent GH-01 17 parts.
The preparation of superhard resin wheel comprises the following steps:
(1) in diamond, add coupling agent Z-6173 and acetone, in ultrasound machine ultrasonic 15min post-drying must process after diamond for subsequent use;
(2) liquid phenolic resin is poured in beaker, bath temperature 60 DEG C, after 800 r/min stir 3min, at the uniform velocity drip Tween 80, bath temperature 55 DEG C, 1100r/min stirs 5min and becomes milky foam to liquid phenolic resin from rufous liquid, pore-creating completes, then under 1600r/min stirs, at the uniform velocity add chromium oxide and stir 2min, then in 3 minutes, divide the diamond added for three times in step (1) after process, after stirring 3min, again in bath temperature 50 DEG C, 500r/min drips curing agent under stirring, be poured in mould after stirring 3min, 2.5h is incubated at 58 DEG C, after compound is hardening, follow-up heating curve is set, 60-70 DEG C of intensification 20min, insulation 60min, 70-80 DEG C of intensification 20min, insulation 60min, 80-100 DEG C of intensification 20min, insulation 30min, 100-120 DEG C of intensification 20min, is down to the room temperature demoulding after 140 DEG C of insulation 5h and get final product.
nonferromagnetic substance is evaluated
Emery wheel ESEM micro-structure diagram obtained in embodiment as shown in Figure 1;
The emery wheel of method manufacture in above-described embodiment 1 is carried out to the test of the thinning performance of silicon chip back side.
grinding test condition:
Grinding machine: Disco DFG840
Emery wheel specification: corase grind axle Disco 320#
Finishing wheel size: 209*22.5*158*3.5*5
Grinding order: first roughly grind and refine afterwards
Grinding process parameters:
Speed of grinding wheel spindle: 4500rpm;
Grinding fluid: deionized water;
Workpiece material: silicon chip, N-type 100 orientation, diameter 200mm(8 cun), original depth 700um;
Removal amount: 550 um
Load plate rotating speed: 180/180/180rpm
No-spark rate of withdraw: 3rev
Emery wheel refines silicon chip, carries out thinning back side grinding experiment at least 100 silicon chips, and as shown in Figure 2, the silicon chip that grinding-wheel grinder cuts out demonstrates metastable Ra value to silicon chip Ra value result, and silicon chip surface Ra value reaches nanoscale.The nonferromagnetic substance of this type emery wheel is suitable for the back side grinding of silicon chip very much, realizes excellent effect, can obtain stable operation parameter, therefore can be fragile material attrition process for the manufacture method of this type of superhard porous resin emery wheel and contributes.
In embodiment, abrasive material employs diamond abrasive, and abrasive species is not limited in monocrystalline, polycrystalline, on this several types sharp, the abrasive material of other type also can be used to manufacture porous resin emery wheel, and the present invention is applicable equally.
Claims (3)
1. the superhard resin wheel for crisp and hard material grinding, it is characterized in that, be made up of the raw material of following weight portion: liquid phenolic resin 10-23 part, pore binder 5-15 part, coupling agent 1-3 part, reinforcing agent 1-5 part, diamond 40-70 part, curing agent 10-17 part.
2., as claimed in claim 1 for the superhard resin wheel of crisp and hard material grinding, it is characterized in that, described coupling agent is Z-6173; Described diamond is granularity 5-10 μm; Reinforcing agent is chromium oxide, and chromium oxide granularity is 5-15 μm; Pore binder is Tween 80; Curing agent is GH-01; The mass ratio of described diamond and liquid phenolic resin is (4-6): 1.
3. the preparation method of the superhard resin wheel for crisp and hard material grinding described in claim 1 or 2, is characterized in that, comprise the following steps:
(1) in diamond, add coupling agent and acetone, the diamond after ultrasonic 15-25min post-drying must process is for subsequent use;
(2) at 50-60 DEG C, blowhole binder is added in liquid phenolic resin after stirring 1-3min to 900-1100 r/min under 800-1000 r/min stirs, stir > 5min again and become milky foam to liquid phenolic resin from rufous liquid, then under 1300-1600r/min stirs, reinforcing agent is added, then in 3min, add the diamond after process in step (1), after stirring 3-7min, again in 45-50 DEG C, 500-700r/min adds curing agent under stirring, be poured in mould after stirring > 1min, 2-3h is incubated at 55-60 DEG C, 60-70 DEG C of intensification 20min, insulation 60min, 70-80 DEG C of intensification 20min, insulation 60min, 80-100 DEG C of intensification 20min, insulation 30min, 100-120 DEG C of intensification 20min, is down to room temperature after 120-150 DEG C of insulation 2-6h and get final product.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN105290985A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Ultra-hard resin grinding wheel |
| CN106674454A (en) * | 2016-12-30 | 2017-05-17 | 珠海邦瑞合成材料有限公司 | Powdery phenolic resin for diamond grinding block and preparation method thereof |
| CN108724026A (en) * | 2018-05-10 | 2018-11-02 | 郑州磨料磨具磨削研究所有限公司 | A kind of resin wheel, preparation method and application for cadmium zinc telluride crystal wafer grinding |
| CN109048697A (en) * | 2018-08-30 | 2018-12-21 | 郑州磨料磨具磨削研究所有限公司 | A kind of preseptum to put the first edge on a knife or a pair of scissors for saw blade, preparation method and application |
| CN109277955A (en) * | 2018-08-30 | 2019-01-29 | 郑州磨料磨具磨削研究所有限公司 | A kind of grinding wheel, preparation method and application for the grinding of QFN semiconductor sealing material |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105290996A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Manufacturing method for super-hard resin grinding wheel |
| CN105290985A (en) * | 2015-11-23 | 2016-02-03 | 郑州磨料磨具磨削研究所有限公司 | Ultra-hard resin grinding wheel |
| CN106674454A (en) * | 2016-12-30 | 2017-05-17 | 珠海邦瑞合成材料有限公司 | Powdery phenolic resin for diamond grinding block and preparation method thereof |
| CN108724026A (en) * | 2018-05-10 | 2018-11-02 | 郑州磨料磨具磨削研究所有限公司 | A kind of resin wheel, preparation method and application for cadmium zinc telluride crystal wafer grinding |
| CN108724026B (en) * | 2018-05-10 | 2019-11-15 | 郑州磨料磨具磨削研究所有限公司 | A kind of resin wheel, preparation method and application for cadmium zinc telluride crystal wafer grinding |
| CN109048697A (en) * | 2018-08-30 | 2018-12-21 | 郑州磨料磨具磨削研究所有限公司 | A kind of preseptum to put the first edge on a knife or a pair of scissors for saw blade, preparation method and application |
| CN109277955A (en) * | 2018-08-30 | 2019-01-29 | 郑州磨料磨具磨削研究所有限公司 | A kind of grinding wheel, preparation method and application for the grinding of QFN semiconductor sealing material |
| CN109048697B (en) * | 2018-08-30 | 2019-10-01 | 郑州磨料磨具磨削研究所有限公司 | A kind of preseptum to put the first edge on a knife or a pair of scissors for saw blade, preparation method and application |
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