CN110799833A - 对晶片保持设备上的电镀的远程检测 - Google Patents

对晶片保持设备上的电镀的远程检测 Download PDF

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Publication number
CN110799833A
CN110799833A CN201880043013.3A CN201880043013A CN110799833A CN 110799833 A CN110799833 A CN 110799833A CN 201880043013 A CN201880043013 A CN 201880043013A CN 110799833 A CN110799833 A CN 110799833A
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CN
China
Prior art keywords
sensor
plating
cup
target area
electroplating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880043013.3A
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English (en)
Chinese (zh)
Inventor
拉詹·阿罗拉
杰瑞德·赫尔
杰森·丹尼尔·马尔切蒂
史蒂文·T·迈耶
詹姆斯·R·齐布里达
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/638,131 external-priority patent/US10416092B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN110799833A publication Critical patent/CN110799833A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201880043013.3A 2017-06-29 2018-06-27 对晶片保持设备上的电镀的远程检测 Pending CN110799833A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/638,131 2017-06-29
US15/638,131 US10416092B2 (en) 2013-02-15 2017-06-29 Remote detection of plating on wafer holding apparatus
PCT/US2018/039827 WO2019006009A1 (en) 2017-06-29 2018-06-27 REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS

Publications (1)

Publication Number Publication Date
CN110799833A true CN110799833A (zh) 2020-02-14

Family

ID=64741927

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880043013.3A Pending CN110799833A (zh) 2017-06-29 2018-06-27 对晶片保持设备上的电镀的远程检测

Country Status (5)

Country Link
JP (1) JP7145893B2 (https=)
KR (1) KR102654656B1 (https=)
CN (1) CN110799833A (https=)
TW (1) TW201920946A (https=)
WO (1) WO2019006009A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023109463A1 (zh) * 2021-12-14 2023-06-22 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
CN119487387A (zh) * 2024-03-28 2025-02-18 株式会社荏原制作所 检测装置以及检测方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100571B2 (ja) * 2018-12-13 2022-07-13 株式会社荏原製作所 めっき可能な基板の枚数を予測する予測モデルを構築する方法、不具合を引き起こす構成部材を予想するための選択モデルを構築する方法、およびめっき可能な基板の枚数を予測する方法
US12247310B2 (en) * 2020-04-30 2025-03-11 Lam Research Corporation Lipseal edge exclusion engineering to maintain material integrity at wafer edge
KR20250041087A (ko) * 2022-08-26 2025-03-25 가부시키가이샤 에바라 세이사꾸쇼 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271989A (ja) * 1992-03-26 1993-10-19 Nippon Steel Corp 電解処理設備の鋼帯用エッジマスクの設定方法
US6071387A (en) * 1997-10-30 2000-06-06 Ohba; Kazuo Automatic plating method and apparatus thereof
CN2504283Y (zh) * 2001-10-31 2002-08-07 宝山钢铁股份有限公司 水平电镀槽用边缘罩自动跟踪带钢装置
US6491978B1 (en) * 2000-07-10 2002-12-10 Applied Materials, Inc. Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors
CN2655200Y (zh) * 2003-06-20 2004-11-10 陈仁甫 机电数码和激光监控系统
US20100259747A1 (en) * 2007-10-26 2010-10-14 Arkray, Inc. Sample detector and measurement device equipped with the same
CN103434647A (zh) * 2013-09-11 2013-12-11 中国民航大学 一种能够消除环境干扰的飞机残冰监测装置
US20140230855A1 (en) * 2013-02-15 2014-08-21 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
CN205501444U (zh) * 2016-02-22 2016-08-24 东莞市希锐自动化科技股份有限公司 自动滚镀线

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3937206B2 (ja) * 1999-09-14 2007-06-27 エスアイアイ・ナノテクノロジー株式会社 位置制御装置
JP4453840B2 (ja) * 2006-02-03 2010-04-21 Ｔｄｋ株式会社 電極組立体およびめっき装置
US7894037B2 (en) * 2007-07-30 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20120261254A1 (en) * 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
KR102092416B1 (ko) * 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271989A (ja) * 1992-03-26 1993-10-19 Nippon Steel Corp 電解処理設備の鋼帯用エッジマスクの設定方法
US6071387A (en) * 1997-10-30 2000-06-06 Ohba; Kazuo Automatic plating method and apparatus thereof
US6491978B1 (en) * 2000-07-10 2002-12-10 Applied Materials, Inc. Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors
CN2504283Y (zh) * 2001-10-31 2002-08-07 宝山钢铁股份有限公司 水平电镀槽用边缘罩自动跟踪带钢装置
CN2655200Y (zh) * 2003-06-20 2004-11-10 陈仁甫 机电数码和激光监控系统
US20100259747A1 (en) * 2007-10-26 2010-10-14 Arkray, Inc. Sample detector and measurement device equipped with the same
US20140230855A1 (en) * 2013-02-15 2014-08-21 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
CN103434647A (zh) * 2013-09-11 2013-12-11 中国民航大学 一种能够消除环境干扰的飞机残冰监测装置
CN205501444U (zh) * 2016-02-22 2016-08-24 东莞市希锐自动化科技股份有限公司 自动滚镀线

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023109463A1 (zh) * 2021-12-14 2023-06-22 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
US12573019B2 (en) 2021-12-14 2026-03-10 Acm Research (Shanghai), Inc. Electroplating chamber leakage plating warning method and system
CN119487387A (zh) * 2024-03-28 2025-02-18 株式会社荏原制作所 检测装置以及检测方法

Also Published As

Publication number Publication date
WO2019006009A1 (en) 2019-01-03
JP2020526660A (ja) 2020-08-31
JP7145893B2 (ja) 2022-10-03
TW201920946A (zh) 2019-06-01
KR102654656B1 (ko) 2024-04-05
KR20200014440A (ko) 2020-02-10

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