CN110797285A - Pin bending processing machine in transistor manufacturing process and processing method thereof - Google Patents
Pin bending processing machine in transistor manufacturing process and processing method thereof Download PDFInfo
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- CN110797285A CN110797285A CN201911090962.XA CN201911090962A CN110797285A CN 110797285 A CN110797285 A CN 110797285A CN 201911090962 A CN201911090962 A CN 201911090962A CN 110797285 A CN110797285 A CN 110797285A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention relates to a pin bending machine in a transistor manufacturing process, which comprises a bottom plate, a conveying actuating mechanism, an intermittent conveying driving mechanism, a portal frame and a bending mechanism, wherein the conveying actuating mechanism is fixedly arranged on the bottom plate and used for conveying transistors, the intermittent conveying driving mechanism is used for driving the conveying actuating mechanism, the portal frame is fixedly arranged on the bottom plate, the bending mechanism is arranged on the portal frame, and the conveying actuating mechanism penetrates through the middle position below the portal frame; the machine provided by the invention can complete the automatic pipelining operation of transistor conveying and pin bending under the manual cooperation, has a simple mechanical structure, is easy to maintain, has low equipment cost, can solve the problem of inconvenient manual operation in the actual production and processing process, improves the processing efficiency, and meets the production and processing requirements of small electronic element factories.
Description
Technical Field
The invention relates to the technical field of electronic element processing, and particularly provides a pin bending processing machine in a transistor manufacturing process and a processing method thereof.
Background
The transistor is a solid semiconductor device (including diode, triode, field effect transistor, thyristor, etc., sometimes referred to as bipolar device), and has multiple functions of detection, rectification, amplification, switching, voltage stabilization, signal modulation, etc. The transistor, which is a type of variable current switch, is capable of controlling an output current based on an input voltage. Unlike common mechanical switches (such as Relay and switch), the transistor utilizes an electrical signal to control the on/off of the transistor, and the switching speed can be very fast, and the switching speed in a laboratory can reach more than 100 GHz.
The pins, also called pins, are the connections from the internal circuit of the transistor to the peripheral circuit, and all the pins form the interface of the transistor. In the actual processing and production process of the transistor, the pins need to be bent, and the purpose of bending and forming the pins of the transistor is to deform the pins of the transistor into an expected shape in a mechanical mode so as to meet the process requirements of size, stress release, heat dissipation, height and the like in the insertion process.
In the pin bending process, streamlined processing production is realized for a large-scale electronic component factory, but for some small-scale electronic component factories, the equipment investment cost of a complete set of assembly line is too high, so that in the actual bending processing process of the transistor, the bending processing of the pin is basically carried out manually, the size of the transistor is relatively small, the manual processing is inconvenient, the processing efficiency is low, and the production benefit is directly influenced.
Based on the problems, the invention provides a pin bending processing machine in a transistor manufacturing procedure and a processing method thereof.
Disclosure of Invention
In order to solve the above problems, the present invention provides a pin bending machine and a method for processing the pin bending machine in a transistor manufacturing process, which can solve the above problems in the background art.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose: a transistor manufacturing process pin bending machine comprises a bottom plate, a conveying actuating mechanism, an intermittent conveying driving mechanism, a portal frame and a bending mechanism, wherein the conveying actuating mechanism is fixedly arranged on the bottom plate and used for conveying transistors, the intermittent conveying driving mechanism is used for driving the conveying actuating mechanism, the portal frame is fixedly arranged on the bottom plate, the bending mechanism is arranged on the portal frame, the conveying actuating mechanism penetrates through the middle position below the portal frame, and the transistor manufacturing process pin bending machine comprises:
the conveying executing mechanism comprises two rotating roller frames fixedly arranged on the bottom plate, a plurality of rotating rollers uniformly distributed and rotatably arranged between the two rotating roller frames, a conveying belt sleeved on all the rotating rollers and bearing trays arranged on the conveying belt and uniformly distributed along the conveying belt and used for placing transistors, when the transistors are placed in the bearing trays, pins on two sides of the transistors respectively point to one side of the rotating roller frames on two sides, and the moving distance of the conveying belt is the distance between the central planes of two adjacent bearing trays in each intermittent conveying process of the intermittent conveying driving mechanism;
the bending mechanism comprises two fixed bending blocks, two guide frames fixedly arranged on the inner side wall of the portal frame, a driving air cylinder fixedly arranged at the central position of the top of the portal frame, two driving connecting rods symmetrically and hinged to the end part of the output end of the driving air cylinder, two movable bending blocks with the top part being hinged to the two driving connecting rods in a one-to-one correspondence manner, and two tension springs with one ends being fixedly connected with the two movable bending blocks in a one-to-one correspondence manner, the output end of the driving air cylinder penetrates through the top part to the lower part of the portal frame, the fixed bending blocks are fixedly arranged on each roller frame, the bending surfaces of the two fixed bending blocks are arranged in a back-to-back manner, the back-to-back arrangement direction is vertical to the conveying direction of the conveying belt, the two guide frames are distributed in a mirror image manner relative to the conveying executing mechanism, and two guide rails which are arranged in parallel, two on the leading truck guide direction downwardly extending is handed over and can constitute isosceles right triangle with water flat line on same vertical plane, every two on the leading truck equal slidable mounting has between the guide rail the activity piece of buckling, two the other end of extension spring is connected respectively and is close to on the leading truck, the atress direction of extension spring with be connected rather than the direction of leading truck is parallel, two the activity piece of buckling and two fixed piece one-to-one sets up, the face of buckling of activity piece with the face of buckling of fixed piece sets up relatively.
Preferably, the intermittent conveying driving mechanism comprises a folding plate frame fixedly arranged on the bottom plate, a reciprocating cylinder horizontally and fixedly arranged on the outer side wall of the folding plate frame, a sliding block fixedly arranged at the output end of the reciprocating cylinder, a connecting rod hinged on the sliding block and a rocker hinged with the connecting rod, the output direction of the reciprocating cylinder is parallel to the conveying direction of the conveying belt, the folding plate frame is L-shaped and lies on the bottom plate horizontally, the inner side wall of the folding plate frame is provided with a guide chute with a sliding guide direction parallel to the output direction of the reciprocating cylinder, the sliding block is arranged on the guide sliding groove in a sliding manner, the rocker is fixedly arranged at the shaft end of one of the rotating rollers, and the rocker is rotatably arranged on the folding plate frame, and when the rocker rotates to the lowest position, the bottom of the rocker is higher than the upper end surface of the bottom plate.
Preferably, the bottom of the bearing tray is provided with a columnar connecting block connected with the conveying belt.
Preferably, the upper end of the bearing tray is provided with a rectangular placing groove for limiting the transistor to be placed in.
Preferably, the positions of the placing grooves, which are close to the roller frames on the two sides, are provided with avoidance notches which avoid the pins.
Preferably, the bending surface of the fixed bending block and the bending surface of the movable bending block are a pair of two sections of bending structures which are arranged in a matched mode.
In addition, the invention also provides a processing method of the pin bending machine in the transistor manufacturing procedure, which comprises the following specific steps:
s1, starting a machine: starting the intermittent conveying driving mechanism to enable the intermittent conveying driving mechanism to drive the conveying belt to perform intermittent conveying, and synchronously starting a driving cylinder of the bending mechanism to enable the conveying actuating mechanism and the bending mechanism of the whole machine to be in a coordinated waiting working state;
s2, putting in a transistor: sequentially putting the transistors into each bearing tray of the conveying section to be bent on one side of the bending mechanism;
s3, bending and processing the pins: after the transistor is intermittently conveyed to the position right below the bending mechanism along with the conveying belt, the pin of the transistor below is bent by the conveying pause intermittent bending mechanism;
s4: taking down a transistor: and taking the transistor which is subjected to the bending processing out of each bearing tray of the conveying section at the other side of the bending mechanism.
The technical scheme has the following advantages or beneficial effects:
1. the invention provides a pin bending processing machine in a transistor manufacturing process, which can bend pins of a transistor by matching a manual machine, wherein the manual machine only needs to be responsible for putting in the transistor to be processed and taking out the processed transistor, in a mechanical working area, an intermittent conveying driving mechanism can intermittently drive a conveying executing mechanism to drive the transistor to intermittently convey forwards, the put-in transistor is sequentially conveyed to the lower part of a bending mechanism, the bending mechanism can bend the pins of the transistor at the conveying pause interval, the pin bending processing of different types of transistors with pin distribution on two sides and pin distribution on one side can be met by two groups of fixed bending blocks and movable bending blocks which are oppositely arranged, generally speaking, the automatic flow operation of transistor conveying and pin bending can be completed by the machine under the manual cooperation, the mechanical structure is simple and easy to maintain, the equipment cost is low, can change the inconvenient problem of manual operation in the production and processing process of reality, improves machining efficiency, satisfies the production and processing demand of small-size electronic component factory.
2. The invention provides a pin bending processing machine in a transistor manufacturing process.A conveying actuating mechanism is driven by an intermittent conveying driving mechanism, and the intermittent conveying driving mechanism only relates to a driving device of a reciprocating cylinder.
Drawings
The invention and its features, aspects and advantages will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. The drawings, in which like numerals refer to like parts throughout the several views and which are not necessarily drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic perspective view of a pin bending machine in a transistor manufacturing process according to one embodiment of the present invention;
FIG. 2 is a diagram of a working status of a pin bending machine in a transistor manufacturing process according to the present invention;
FIG. 3 is a schematic perspective view of a pin bending machine for a transistor manufacturing process according to another embodiment of the present invention;
FIG. 4 is an enlarged, fragmentary, schematic view at A of FIG. 3 of the present invention;
fig. 5 is a front view of a pin bending machine in a transistor manufacturing process according to the present invention.
In the figure: 1. a base plate; 2. a conveying actuator; 21. a roller frame; 22. a rotating roller; 23. a conveyor belt; 24. a support tray; 241. connecting blocks; 242. a placement groove; 2421. avoiding gaps; 3. an intermittent conveyance drive mechanism; 31. folding plate frames; 311. a guide chute; 32. a reciprocating cylinder; 33. a slider; 34. a connecting rod; 35. a rocker; 4. a gantry; 5. a bending mechanism; 51. fixing the bending block; 52. a guide frame; 521. a guide rail; 53. a driving cylinder; 54. a drive link; 55. moving the bending block; 56. a tension spring.
Detailed Description
The following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings for the purpose of providing those skilled in the art with a more complete, accurate and thorough understanding of the concept and technical solution of the present invention, and to facilitate the implementation thereof, but not to limit the present invention.
Referring to the attached drawings 1-5, a pin bending machine in a transistor manufacturing process comprises a bottom plate 1, a conveying actuator 2 fixedly mounted on the bottom plate 1 and used for conveying transistors, an intermittent conveying driving mechanism 3 used for driving the conveying actuator 2, a portal frame 4 fixedly mounted on the bottom plate 1 and a bending mechanism 5 arranged on the portal frame 4, wherein the conveying actuator 2 penetrates through the lower middle position of the portal frame 4, and the following components:
the conveying executing mechanism 2 comprises two rotating roller frames 21 fixedly welded on the bottom plate 1, three rotating rollers 22 uniformly distributed and rotatably mounted between the two rotating roller frames 21, a conveying belt 23 sleeved on the three rotating rollers 22 and bearing trays 24 arranged on the conveying belt 23 and uniformly distributed along the conveying belt 23 and used for placing transistors, when the transistors are placed in the bearing trays 24, pins on two sides of the transistors point to one side of the rotating roller frames 21 on two sides respectively, and the moving distance of the conveying belt 23 is the distance between the central planes of the two adjacent bearing trays 24 in each intermittent conveying process of the intermittent conveying driving mechanism 3;
the conveying executing mechanism 2 intermittently conveys the transistors forward under the driving of the intermittent conveying driving mechanism 3, and moves the distance between the central planes of two adjacent bearing trays 24 (the central plane is the central plane of the bearing tray 24 perpendicular to the moving direction) at each time, so that the conveying executing mechanism 2 drives one transistor to pass through the lower part of the bending mechanism 5, and it should be noted that after the bearing trays 24 are uniformly distributed and installed on the belt surface, in the process of sleeving the conveying belt 23, the conveying belt 23 should be adjusted to ensure that the bearing trays 24 which move intermittently in sequence can appear under the bending mechanism 5 one by one.
The bending mechanism 5 comprises two fixed bending blocks 51, two guide frames 52 fixedly arranged on the inner side wall of the portal frame 4 through bolts, a driving air cylinder 53 fixedly arranged at the central position of the top of the portal frame 4 through bolts, two driving connecting rods 54 symmetrically and hingedly arranged at the end part of the output end of the driving air cylinder 53, two movable bending blocks 55 with the tops being correspondingly and hingedly arranged with the two driving connecting rods 54 one by one, and two tension springs 56 with one ends being fixedly connected with the two movable bending blocks 55 one by one in a welding way, the output end of the driving air cylinder 53 penetrates from the top to the bottom of the portal frame 4, each roller frame 21 is fixedly provided with the fixed bending blocks 51 through bolts, the bending surfaces of the two fixed bending blocks 51 are arranged back to back, the back-to-back arrangement direction is vertical to the conveying direction of the conveying belt 23, the two guide frames 52 are distributed in a mirror image relative to the conveying executing mechanism 2, the two guide rails 521 which are arranged in parallel and extend, the guide directions of the guide rails 521 on the two guide frames 52 extend downwards to intersect with the horizontal line to form an isosceles right triangle on the same vertical plane (namely, the two guide frames 52 are both deviated to the inner side, and the guide frames 52 form an included angle of 45 degrees with the horizontal direction), a movable bending block 55 is slidably mounted between the two guide rails 521 on each guide frame 52, the other ends of the two tension springs 56 are respectively welded on the adjacent guide frames 52, the stress direction of the tension springs 56 is parallel to the guide direction of the guide frames 52 connected with the tension springs, the two movable bending blocks 55 are arranged in one-to-one correspondence with the two fixed bending blocks 51, and the bending surface of the movable bending block 55 is arranged opposite to the bending surface of the fixed bending blocks 51.
After the transistor is intermittently conveyed to a position right below the bending mechanism 5 by the conveying executing mechanism 2, in the process of intermittently suspending conveying, the bending mechanism 5 bends the pins on the transistor, specifically, as shown in fig. 5, initially, the two driving connecting rods 54 are in a horizontal state, when bending is performed, the driving cylinder 53 pulls the two driving connecting rods 54 upward, the opening angles of the two driving connecting rods 54 gradually decrease, then the two movable bending blocks 55 slide obliquely downward along the guide frame 52, the movable bending blocks 55 press the fixed bending blocks 51, then bending of the pins is completed under the cooperation of the movable bending blocks 55 and the fixed bending blocks 51, after bending is completed, the driving cylinder 53 drives the two movable bending blocks 55 to return to the initial position, and the bent transistor is continuously conveyed forward under the driving of the conveying belt 23.
Further, the intermittent conveying driving mechanism 3 includes a folding plate frame 31 fixedly welded on the bottom plate 1, a reciprocating cylinder 32 fixedly horizontally mounted on the outer side wall of the folding plate frame 31 by a bolt, a slide block 33 fixedly mounted on the output end of the reciprocating cylinder 32 by a bolt, a connecting rod 34 hingedly mounted on the slide block 33, and a rocker 35 hingedly connected with the connecting rod 34, the output direction of the reciprocating cylinder 32 is parallel to the conveying direction of the conveying belt 23, the folding plate frame 31 is L-shaped and lies on the bottom plate 1, a guide chute 311 parallel to the output direction of the reciprocating cylinder 32 is provided on the inner side wall of the folding plate frame 31, the slide block 33 is slidably mounted on the guide chute 311, the rocker 35 is fixedly mounted on the shaft end of one of the rotating rollers 22 (specifically, as shown in fig. 1, the rocker 35 is welded with the shaft end of the first rotating roller 22), and the rocker 35 is rotatably, the rocker 35 is at its bottom above the upper end surface of the base plate 1 when it is pivoted to its lowermost position.
The intermittent conveying driving mechanism 3 drives the conveying belt 23 of the conveying executing mechanism 2 to intermittently move forward, specifically, the intermittent output is performed by controlling the reciprocating output of the reciprocating cylinder 32 (the reciprocating cylinder 32, including the driving cylinder 53, is directly commercially available, and the pneumatic automatic control technology is the prior art, and can be technically realized), a reciprocating output process is taken as an action process, as shown in fig. 2, in the processing working state shown in the figure, a transistor to be bent is just under the bending mechanism 5 to wait for immediate bending processing, the output end of the reciprocating cylinder 32 is at the initial stage, when the bending mechanism 5 finishes one-round bending of the transistor pin below, the reciprocating cylinder 32 is started again to perform one-round reciprocating output, and the push-pull slide block 33 drives the rocker 35 to drive the rotating roller 22 connected with the rocker 35 to rotate exactly one circle, in the machine provided by the invention, the rotating roller 22 rotates one circle to drive the conveying belt 23 to move forward by a circumferential distance which also corresponds to the distance between the central planes of two adjacent bearing trays 24, so that the conveying executing mechanism 2 drives the transistors to intermittently convey forward under the driving of the intermittent conveying driving mechanism 3, so that the transistors are sequentially conveyed to the position right below the bending mechanism 5.
Further, a columnar connecting block 241 connected to the conveyor belt 23 is provided at the bottom of the supporting tray 24. The bottom of the connecting block 241 may be glued on the surface of the conveying belt 23, and the support tray 24 may be mounted on the connecting block 241 by bolt fastening, and the contact between the connecting block 241 and the conveying belt 23 is small and does not affect the movement of the conveying belt 23.
Further, a rectangular placing groove 242 for limiting the transistor to be placed is formed in the upper end of the bearing tray 24; the positions of the placing groove 242 close to the two side roller frames 21 are provided with avoiding notches 2421 avoiding the pins. The device can be used for limiting the transistor to be placed, so that the transistor is better positioned at a working position to be processed.
Further, the bending surface of the fixed bending block 51 and the bending surface of the movable bending block 55 are a pair of two-stage bending structures which are matched with each other. In this embodiment, a two-segment bending structure is adopted, which can meet the requirement of a transistor in which a pin is bent in two segments, but only the first segment bending can be performed according to the length of the pin.
It should be noted that fig. 2 is a processing operation state diagram of the processing machine according to the present invention, in which a transistor with two pins on both sides is shown, but the processing operation state diagram is not limited to bending the pins of the transistor with the structure, and may be other transistors with different pin distribution characteristics, which is summarized as that the processing operation state diagram may be a double-sided distribution or a single-sided distribution.
In addition, the invention also provides a processing method of the pin bending machine in the transistor manufacturing procedure, which comprises the following specific steps:
s1, starting a machine: starting a reciprocating cylinder 32 of the intermittent conveying driving mechanism 3 to enable the intermittent conveying driving mechanism 3 to drive the conveying belt 23 to perform intermittent conveying, and synchronously starting a driving cylinder 53 of the bending mechanism 5 to enable the conveying executing mechanism 2 and the bending mechanism 5 of the whole machine to be in a coordinated state to be operated;
s2, putting in a transistor: placing the transistors into the placing grooves 242 of the bearing trays 24 of the conveying section to be bent on one side of the bending mechanism 5 in sequence, and leading out pins on the transistors from the avoiding notches 2421;
s3, bending and processing the pins: after the transistors are intermittently conveyed to the position right below the bending mechanism 5 along with the conveying belt 23, the pins of the transistors below are bent at the conveying pause intermittent bending mechanism 5;
s4: taking down a transistor: the transistor which has completed the bending process is taken out from each of the support trays 24 located at the conveying section on the other side of the bending mechanism 5.
Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention and are not described herein.
The above description is of the preferred embodiment of the invention. It is to be understood that the invention is not limited to the particular embodiments described above, in that devices and structures not described in detail are understood to be implemented in a manner common in the art; it will be understood by those skilled in the art that various changes and modifications may be made, or equivalents may be modified, without departing from the spirit of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (7)
1. The utility model provides a transistor manufacturing process pin processing machinery of buckling, includes bottom plate (1), fixed mounting be used for carrying the transistor transport actuating mechanism (2) on bottom plate (1), be used for driving carry actuating mechanism (2) intermittent type transport actuating mechanism (3), fixed mounting be in portal frame (4) on bottom plate (1) and set up buckle mechanism (5) on portal frame (4), its characterized in that: the conveying actuating mechanism (2) penetrates through the lower middle position of the portal frame (4), wherein:
the conveying executing mechanism (2) comprises two rotating roller frames (21) fixedly mounted on the bottom plate (1), a plurality of rotating rollers (22) which are uniformly distributed and rotatably mounted between the two rotating roller frames (21), a conveying belt (23) sleeved on all the rotating rollers (22) and bearing trays (24) which are arranged on the conveying belt (23) and uniformly distributed along the conveying belt (23) and used for placing transistors, when the transistors are placed in the bearing trays (24), pins on two sides of the transistors respectively point to one sides of the rotating roller frames (21) on two sides, each intermittent conveying process of the intermittent conveying driving mechanism (3) is carried out, and the moving distance of the conveying belt (23) is the distance between the central planes of the two adjacent bearing trays (24);
the bending mechanism (5) comprises two fixed bending blocks (51), two guide frames (52) fixedly installed on the inner side wall of the portal frame (4), a driving cylinder (53) fixedly installed at the central position of the top of the portal frame (4), two driving connecting rods (54) symmetrically and hinged to the end part of the output end of the driving cylinder (53), two movable bending blocks (55) with the tops and two tension springs (56) with one ends and two movable bending blocks (55) fixedly connected in a one-to-one correspondence manner, wherein the two movable bending blocks (55) are hinged to the two driving connecting rods (54) in a one-to-one correspondence manner, the output end of the driving cylinder (53) penetrates through the top of the portal frame (4) to the lower side, each rotating roller frame (21) is fixedly provided with the fixed bending blocks (51), the bending faces of the two fixed bending blocks (51) are arranged in a back-to-back manner, and the back-to-set direction is perpendicular to the conveying direction of the conveying, the two guide frames (52) are distributed in a mirror image mode relative to the conveying actuating mechanism (2), the guide frames (52) are provided with two guide rails (521) which are arranged in parallel and extend obliquely downwards, the guide directions of the guide rails (521) on the two guide frames (52) extend downwards to intersect with each other to form an isosceles right triangle with the horizontal line on the same vertical plane, the movable bending block (55) is arranged between the two guide rails (521) on each guide frame (52) in a sliding manner, the other ends of the two tension springs (56) are respectively connected to the adjacent guide frames (52), the stress direction of the tension spring (56) is parallel to the guide direction of the guide frame (52) connected with the tension spring, the two movable bending blocks (55) and the two fixed bending blocks (51) are arranged in a one-to-one correspondence manner, the bending surface of the movable bending block (55) is opposite to the bending surface of the fixed bending block (51).
2. The transistor manufacturing process pin bending machine according to claim 1, wherein: intermittent type carry actuating mechanism (3) including fixed mounting fold board frame (31), horizontal fixed mounting on bottom plate (1) break up reciprocating cylinder (32), fixed mounting on the lateral wall of fold board frame (31) are in slider (33), the articulated installation of reciprocating cylinder (32) output link (34) on slider (33) and with rocker (35) that link (34) are articulated to be connected, the output direction of reciprocating cylinder (32) with the direction of delivery of conveyer belt (23) is parallel, fold board frame (31) are L shape and lie for the next time on bottom plate (1), be equipped with on the inside wall of fold board frame (31) slide direction with parallel direction runner (311) of the output direction of reciprocating cylinder (32), slider (33) slidable mounting be in on direction runner (311), rocker (35) fixed mounting is in one of them the axle head of live-roller (22), and the rocker (35) is rotatably arranged on the folding plate frame (31), and when the rocker (35) rotates to the lowest position, the bottom of the rocker is higher than the upper end surface of the bottom plate (1).
3. The transistor manufacturing process pin bending machine according to claim 1, wherein: the bottom of the bearing tray (24) is provided with a columnar connecting block (241) connected with the conveying belt (23).
4. The transistor manufacturing process pin bending machine according to claim 1, wherein: the upper end of the bearing tray (24) is provided with a rectangular placing groove (242) for limiting and placing the transistor.
5. The transistor manufacturing process pin bending machine according to claim 4, wherein: and avoiding notches (2421) for avoiding the pins are arranged at the positions, close to the two side roller frames (21), of the placing grooves (242).
6. The transistor manufacturing process pin bending machine according to claim 1, wherein: the bending surface of the fixed bending block (51) and the bending surface of the movable bending block (55) are a pair of two-section bending structures which are matched with each other.
7. The transistor manufacturing process pin bending machine according to claim 1, wherein: the machining method for bending the transistor pin by adopting the machine is as follows:
s1, starting a machine: starting the intermittent conveying driving mechanism (3) to enable the intermittent conveying driving mechanism (3) to drive the conveying belt (23) to perform intermittent conveying, and synchronously starting a driving cylinder (53) of the bending mechanism (5) to enable the conveying executing mechanism (2) and the bending mechanism (5) of the whole machine to be in a coordinated waiting working state;
s2, putting in a transistor: sequentially putting the transistors into each bearing tray (24) of a conveying section to be bent on one side of the bending mechanism (5);
s3, bending and processing the pins: after the transistors are intermittently conveyed to the position right below the bending mechanism (5) along with the conveying belt (23), the pins of the transistors below are bent by the conveying pause intermittent bending mechanism (5);
s4: taking down a transistor: and taking the transistor which is subjected to the bending processing out of each bearing tray (24) of the conveying section at the other side of the bending mechanism (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911090962.XA CN110797285A (en) | 2019-11-09 | 2019-11-09 | Pin bending processing machine in transistor manufacturing process and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911090962.XA CN110797285A (en) | 2019-11-09 | 2019-11-09 | Pin bending processing machine in transistor manufacturing process and processing method thereof |
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| CN110797285A true CN110797285A (en) | 2020-02-14 |
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| CN201911090962.XA Withdrawn CN110797285A (en) | 2019-11-09 | 2019-11-09 | Pin bending processing machine in transistor manufacturing process and processing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113333628A (en) * | 2021-05-21 | 2021-09-03 | 田文勇 | Pin dog-ear device is used in piezo-resistor production |
| CN113458281A (en) * | 2021-07-06 | 2021-10-01 | 覃利 | Forming machine for semiconductor integrated processing |
| CN113996724A (en) * | 2021-10-21 | 2022-02-01 | 先之科半导体科技(东莞)有限公司 | Pin bending device of silicon carbide diode |
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2019
- 2019-11-09 CN CN201911090962.XA patent/CN110797285A/en not_active Withdrawn
Cited By (5)
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| CN113333628A (en) * | 2021-05-21 | 2021-09-03 | 田文勇 | Pin dog-ear device is used in piezo-resistor production |
| CN113458281A (en) * | 2021-07-06 | 2021-10-01 | 覃利 | Forming machine for semiconductor integrated processing |
| CN113458281B (en) * | 2021-07-06 | 2023-01-13 | 深圳市豪锐科技有限公司 | Forming machine for semiconductor integrated processing |
| CN113996724A (en) * | 2021-10-21 | 2022-02-01 | 先之科半导体科技(东莞)有限公司 | Pin bending device of silicon carbide diode |
| CN113996724B (en) * | 2021-10-21 | 2022-08-09 | 先之科半导体科技(东莞)有限公司 | Pin bending device of silicon carbide diode |
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Application publication date: 20200214 |
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