CN110783359B - 一种量子点led显示面板及其制造方法 - Google Patents
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Abstract
本发明公开一种量子点LED显示面板及其制造方法,将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条,将通过红色量子点、绿色量子点涂布后的基本显示单元LED封装条转移到LED显示面板的基板上形成LED显示面板的LED矩阵,每行相邻的红、绿、蓝色单元依次组成一个像素单元,红色单元LED封装条为蓝光LED芯片表面依次向外涂布红色量子点层、阻隔层及遮光层;绿色单元LED封装条为蓝光LED芯片表面依次向外涂布绿色量子点层、阻隔层及遮光层。本发明采用将蓝光LED整体封装成条,整体封装成条的LED封装条在转移到显示面板的基板上时LED的转移次数减少,极大提升了制造效率,同时,在大面积的转印使得量子点材料能够均匀覆盖在蓝光LED芯片封装体表面,显示效果更好。
Description
技术领域
本发明涉及LED显示技术领域,尤其涉及一种量子点LED显示面板及其制造方法。
背景技术
目前,Mini-LED、Micro-LED的显示技术日益受到显示市场的关注。Mini-LED和Micro-LED都还处于开发攻坚阶段,因为其LED巨量转移的问题,在产品制造方面还存在很大的困难需要克服,以目前的制造能力,如果制造一台目前市面较为普遍的55寸4K×2K显示面板需要三个月左右的时间。目前所采取的方案是R、G、B像素打样为一颗像素,图1示出了R、G、B打样为一颗像素的Mini-LED或Micro-LED面板结构,如图1所示,一颗像素由红色R、绿色G、蓝色B组成,其中的R单元11采用红色LED、G单元12采用绿色LED、B单元13采用蓝色LED,显示面板的每个像素10由封装由红色LED11、绿色LED12和蓝色LED13作为基本像素单元排列组成Mini-LED或Micro-LED面板。图2示出了图1的Mini-LED或Micro-LED显示面板制造的过程原理图,如图2所示,这种Mini-LED或Micro-LED显示面板的制造至少包含三个步骤:步骤1,将红色LED11、绿色LED12和蓝色LED13转移进行三色LED封装,步骤2,将三色LED进行整体封装,步骤3,将三色LED进行巨量转移,形成图1所示的Mini-LED或Micro-LED显示面板。
为了使得显示效果更好,现有技术还有将量子点技术与Mini-LED或Micro-LED结合起来制造的量子点Mini-LED或Micro-LED面板,图3示出了这种结合量子点技术的Mini-LED或Micro-LED面板结构,基于图1的Mini-LED或Micro-LED面板结构,采用量子点技术的Mini-LED或Micro-LED面板结构中,每个像素10中的R单元21采用蓝光LED加红色量子点材料构成,G单元22采用蓝光LED加绿色量子点材料构成,B单元13则采用蓝光LED构成。图4示出了图3的量子点Mini-LED或Micro-LED显示面板制造的过程原理图,如图4所示,这种量子点Mini-LED或Micro-LED显示面板的制造至少包含三个步骤:步骤1,将蓝色LED13转移进行三色LED封装,此处因仅采用蓝光LED,三色LED封装是对蓝色LED进行封装,通过后续步骤再形成三色LED,步骤2,将三色LED进行整体封装并转印红色量子点材料,步骤3,将三色LED转印绿色量子点材料最终形成三色LED封装,步骤4,将三色LED进行巨量转移,形成图3所示的量子点Mini-LED或Micro-LED显示面板。
然而,无论是图1中的普通Mini-LED或Micro-LED面板,还是图3中结合量子点技术的Mini-LED或Micro-LED面板都无法克服LED巨量转移需要大量转移时间的问题,以4K×2K分辨率的显示面板为例,图1中的Mini-LED或Micro-LED显示面板中单颗LED转移3840×2160×3=24883200次,三颗单色LED封装为一颗像素之后再转移3840×2160=8294400,整个制造过程涉及LED转移24883200+8294400=33177600次,转移如此巨量的LED不仅耗时,而且生产良率也会受到很大的影响。图3中量子点Mini-LED或Micro-LED显示面板的LED转移也以4K×2K分辨率的显示面板为例,其单颗LED转移3840×2160×3=24883200次,三颗单色LED封装为一颗像素后再转移3480×2160=8294400,整个制造过程同样涉及LED转移24883200+8294400=33177600次,使得Mini-LED或Micro-LED面板量产效率很低。
因此,现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足之处,本发明为解决现有技术缺陷和不足,提出了一种全部使用蓝光LED作为显示像素单元中的R、G、B单元的新型量子点LED显示面板及其制造方法,以及采用这种结构的量子点LED显示面板。
本发明解决技术问题所采用的技术方案如下:
一种量子点LED显示面板,该LED显示面板包括基板及设置在基板上的LED矩阵,所述LED矩阵按照纵向红、绿、蓝色单元间隔依次排列LED封装条,每行相邻的红、绿、蓝色单元依次组成一个像素单元,其中,所述LED矩阵全部采用蓝光LED,红色单元LED封装条为蓝光LED芯片表面依次向外涂布红色量子点层、阻隔层及遮光层;绿色单元LED封装条为蓝光LED芯片表面依次向外涂布绿色量子点层、阻隔层及遮光层;所述红色单元LED封装条、绿色单元LED封装条的遮光层是涂布在间隔的两颗蓝光LED的相交部位。
作为进一步的改进技术方案,所述红色单元LED封装条的蓝光LED芯片表面涂布的红色量子点层是通过喷墨打印或转印上的。
作为进一步的改进技术方案,所述绿色单元LED封装条的蓝光LED芯片表面涂布的绿色量子点层是通过喷墨打印或转印上的。
作为进一步的改进技术方案,所述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。
作为进一步的改进技术方案,所述遮光层为树脂或油墨。
本发明还提出了一种量子点LED显示面板的制造方法,制造上述的LED显示面板,包括如下制造步骤:
将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条;
将封装成三色基本显示单元LED封装条的红色单元LED封装条上向外依次涂布红色量子点层、阻隔层;
将封装成三色基本显示单元LED封装条的绿色单元LED封装条上涂布绿色量子点层、阻隔层;
在所述红色单元LED封装条和绿色LED封装条间隔的两颗蓝光LED相交部位涂布遮光层;
将通过红色量子点、绿色量子点涂布后的三色基本显示单元LED封装条转移到LED显示面板的基板上形成LED显示面板的LED矩阵。
作为进一步的改进技术方案,所述将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条具体包括如下步骤:
根据LED显示面板的大小将单颗蓝光LED转移到LED封装条上;
再将三列单颗蓝光LED构成的LED封装条整体封装组成三色基本显示单元LED封装条。
作为进一步的改进技术方案,所述红色单元LED封装条的蓝光LED芯片表面涂布的红色量子点层是通过喷墨打印或转印上的。
作为进一步的改进技术方案,所述绿色单元LED封装条的蓝光LED芯片表面涂布的绿色量子点层是通过喷墨打印或转印上的。
作为进一步的改进技术方案,所述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。
作为进一步的改进技术方案,所述遮光层为树脂或油墨。
与现有技术相比较,本发明量子点LED显示面板采用将蓝光LED整体封装成条,整体封装成条的LED封装条在转移到显示面板的基板上时LED的转移次数大大减少,极大提升了制造效率,同时,较大面积的转印使得量子点材料能够均匀覆盖在蓝光LED芯片封装体表面,显示效果更好。这也使得Mini-LED或Micro-LED向实用化大大迈进了一步。
附图说明
图1是现有技术Mini-LED或Micro-LED显示面板的组成结构原理图。
图2是图1的Mini-LED或Micro-LED显示面板制造的过程原理图。
图3是现有技术量子点Mini-LED或Micro-LED显示面板的组成结构原理图。
图4是图3的量子点Mini-LED或Micro-LED显示面板制造的过程原理图。
图5是本发明量子点LED显示面板的组成结构原理图。
图6是图5中量子点LED显示面板的红、绿、蓝色单元组成的LED封装条的纵截面局部剖视结构原理图。
图7是图5中量子点LED显示面板制造的过程原理图。
图8是图5中量子点LED显示面板的红、绿色单元LED封装条的光路原理结构图。
图9是本发明量子点LED显示面板的制造方法的流程图。
具体实施方式
为使本发明的目的、技术方案及优点更加清楚、明确,以下参照附图并举实施例对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
要克服现有技术Mini-LED或Micro-LED显示面板制造过程中的LED巨量转移难题,本发明提出一种制造简单、高效的量子点LED显示面板,可以大大降低LED巨量转移的数量,提升生产效率,同时, 使得该量子点LED显示面包那具有较佳的显示效果。
图5示出了本发明量子点LED显示面板的组成结构原理图,结合图6示出的图5中量子点LED显示面板的红、绿、蓝色单元组成的LED封装条的纵截面局部剖视结构原理图来看,该LED显示面板包括基板70及设置在基板70上的LED矩阵,所述LED矩阵按照纵向红、绿、蓝色单元间隔依次排列LED封装条,包括红色LED封装条40、绿色LED封装条50和蓝色LED封装条60,每行相邻的红、绿、蓝色LED单元41、51、61依次组成一个像素单元,其中,所述LED矩阵全部采用蓝光LED,红色单元LED封装条40为蓝光LED芯片表面依次向外涂布红色量子点层、阻隔层及遮光层;绿色单元LED50封装条为蓝光LED芯片表面依次向外涂布绿色量子点层、阻隔层及遮光层;蓝色单元LED封装条60表面无需涂布任何涂层;所述红色单元LED封装条40、绿色单元LED封装条50的遮光层42、52是涂布在间隔的两颗蓝光LED的相交部位。
从图5结构可见,与上述图1和图3中的Mini-LED或Micro-LED显示面板结构不同的是,本发明是将蓝光LED封装成条,然后根据需要将红色单元LED封装条40的蓝光LED芯片表面涂布的红色量子点层,该红色量子点层通过喷墨打印或转印到蓝光LED芯片封装条表面。同理,在蓝光LED芯片封装条表面涂布绿色量子点层后形成绿色单元LED封装条50,其中,绿色量子点层也是通过喷墨打印或转印上的。
优选的,所述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。所述遮光层42、52则为树脂或油墨。
图7示出了图5中量子点LED显示面板制造的过程原理图。如图7所示,本发明量子点LED显示面板的简要制造过程包括:步骤1,将单颗蓝光LED61转移到封装条上形成三色LED封装,三色LED封装此时均为蓝色LED封装条40、50、60;步骤2,对三色LED封装中的一列转印上红色量子点层;步骤3,对三色LED封装中的另外一列转印上绿色量子点层;步骤4,通过对蓝光LED封装条中的红色量子点、绿色量子点的转印形成三色LED封装;步骤5,最后将步骤4形成的三色LED封装转移到基板70上形成本发明量子点LED显示面板。其中,上述遮光层42、52的制作,作用是为了避免相邻的蓝光LED上量子点材料激发的光混色,降低显示效果。图8示出了图5中量子点LED显示面板的红、绿色单元LED封装条的光路原理结构图,为了说明,图8中仅示出绿色单元LED封装条的光路原理结构,在上图未采用遮光层时,相邻的蓝光LED45之间出射的光会出现相交,导致混色,而采用遮光层52后,相邻的蓝光LED出射后的光垂直出射,并不相交,保证了显示的效果。遮光层的材料可以采用树脂、油墨等不透光或低透光的材料实现。
上述本发明量子点LED显示面板的制作工序同样以4K×2K分辨率为例,其单颗LED转移为3840×2160×3=24883200次,将其整体封装后LED转移的次数为2160次,相比现有技术大大减少了转移的次数,极大的提升了制造效率,同时,LED之间遮光层的设置 ,减少了LED颗粒之间的光的混色,进一步提高了显示效果。
另外,本发明还提供一种量子点LED显示面板的制造方法,制造上述的LED显示面板,如图9所示,包括如下制造步骤:
步骤S100,将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条。具体包括如下步骤:
根据LED显示面板的大小将单颗蓝光LED转移到LED封装条上;
再将三列单颗蓝光LED构成的LED封装条整体封装组成三色基本显示单元LED封装条。
步骤S200,将封装成三色基本显示单元LED封装条的红色单元LED封装条上向外依次涂布红色量子点层、阻隔层。所述红色单元LED封装条的蓝光LED芯片表面涂布的红色量子点层是通过喷墨打印或转印上的。
步骤S300,将封装成三色基本显示单元LED封装条的绿色单元LED封装条上涂布绿色量子点层、阻隔层。所述绿色单元LED封装条的蓝光LED芯片表面涂布的绿色量子点层是通过喷墨打印或转印上的。
步骤S400,在所述红色单元LED封装条和绿色LED封装条间隔的两颗蓝光LED相交部位涂布遮光层。
步骤S500,将通过红色量子点、绿色量子点涂布后的三色基本显示单元LED封装条转移到LED显示面板的基板上形成LED显示面板的LED矩阵。
上述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。遮光层为树脂或油墨。
其他工作原理与上述量子点LED显示面板的工作原理相同,此处不赘述。
应当理解的是,以上所述仅为本发明的较佳实施例而已,并不足以限制本发明的技术方案,对本领域普通技术人员来说,在本发明的精神和原则之内,可以根据上述说明加以增减、替换、变换或改进,而所有这些增减、替换、变换或改进后的技术方案,都应属于本发明所附权利要求的保护范围。
Claims (11)
1.一种量子点LED显示面板,该LED显示面板包括基板及设置在基板上的LED矩阵,其特征在于,所述LED矩阵按照纵向红、绿、蓝色单元间隔依次排列LED封装条,每行相邻的红、绿、蓝色单元依次组成一个像素单元,其中,所述LED矩阵全部采用蓝光LED,红色单元LED封装条为蓝光LED芯片表面依次向外涂布红色量子点层、阻隔层及遮光层;绿色单元LED封装条为蓝光LED芯片表面依次向外涂布绿色量子点层、阻隔层及遮光层;所述红色单元LED封装条、绿色单元LED封装条的遮光层是涂布在间隔的两颗蓝光LED的相交部位;
分别为红色单元LED封装条、绿色单元LED封装条和蓝色单元LED封装条的三列LED封装条依次排列组成三色基本显示单元LED封装条。
2.根据权利要求1所述的量子点LED显示面板,其特征在于,所述红色单元LED封装条的蓝光LED芯片表面涂布的红色量子点层是通过喷墨打印或转印上的。
3.根据权利要求1所述的量子点LED显示面板,其特征在于,所述绿色单元LED封装条的蓝光LED芯片表面涂布的绿色量子点层是通过喷墨打印或转印上的。
4.根据权利要求1至3任一项所述的量子点LED显示面板,其特征在于,所述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。
5.根据权利要求4所述的量子点LED显示面板,其特征在于,所述遮光层为树脂或油墨。
6.一种量子点LED显示面板的制造方法,制造如权利要求1至5任一项所述的LED显示面板,其特征在于,包括如下制造步骤:
将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条;
将封装成三色基本显示单元LED封装条的红色单元LED封装条上向外依次涂布红色量子点层、阻隔层;
将封装成三色基本显示单元LED封装条的绿色单元LED封装条上涂布绿色量子点层、阻隔层;
在所述红色单元LED封装条和绿色LED封装条间隔的两颗蓝光LED相交部位涂布遮光层;
将通过红色量子点、绿色量子点涂布后的三色基本显示单元LED封装条转移到LED显示面板的基板上形成具有LED矩阵的LED显示面板。
7.根据权利要求6所述的一种量子点LED显示面板的制造方法,其特征在于,所述将蓝光LED芯片转移并整体封装成三色基本显示单元LED封装条具体包括如下步骤:
根据LED显示面板的大小将单颗蓝光LED转移到LED封装条上;
再将三列单颗蓝光LED构成的LED封装条整体封装组成三色基本显示单元LED封装条。
8.根据权利要求6所述的一种量子点LED显示面板的制造方法,其特征在于,
所述红色单元LED封装条的蓝光LED芯片表面涂布的红色量子点层是通过喷墨打印或转印上的。
9.根据权利要求6所述的一种量子点LED显示面板的制造方法,其特征在于,所述绿色单元LED封装条的蓝光LED芯片表面涂布的绿色量子点层是通过喷墨打印或转印上的。
10.根据权利要求6至9任一项所述的一种量子点LED显示面板的制造方法,其特征在于,所述红色量子点层或绿色量子点层的量子点材料为硒化镉、磷化铟或钙钛矿。
11.根据权利要求10任一项所述的一种量子点LED显示面板的制造方法,其特征在于,所述遮光层为树脂或油墨。
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