CN110776716A - Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof - Google Patents
Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof Download PDFInfo
- Publication number
- CN110776716A CN110776716A CN201910956506.2A CN201910956506A CN110776716A CN 110776716 A CN110776716 A CN 110776716A CN 201910956506 A CN201910956506 A CN 201910956506A CN 110776716 A CN110776716 A CN 110776716A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy
- coupling agent
- molding compound
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 36
- 239000004593 Epoxy Substances 0.000 title claims description 21
- 239000004033 plastic Substances 0.000 title claims description 20
- 229920003023 plastic Polymers 0.000 title claims description 20
- 239000005022 packaging material Substances 0.000 title claims description 14
- 238000002360 preparation method Methods 0.000 title description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 57
- 239000003822 epoxy resin Substances 0.000 claims abstract description 50
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 50
- 239000007822 coupling agent Substances 0.000 claims abstract description 48
- 229920006336 epoxy molding compound Polymers 0.000 claims abstract description 31
- 230000006698 induction Effects 0.000 claims abstract description 18
- 239000011256 inorganic filler Substances 0.000 claims abstract description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 14
- 239000003607 modifier Substances 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 41
- 238000002156 mixing Methods 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 14
- -1 phosphorus compound Chemical class 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 8
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000001993 wax Substances 0.000 claims description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 229910018605 Ni—Zn Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- BEIPAQAWWIDDLX-UHFFFAOYSA-N [Si].[Fe].[Mo] Chemical compound [Si].[Fe].[Mo] BEIPAQAWWIDDLX-UHFFFAOYSA-N 0.000 claims description 5
- 235000013869 carnauba wax Nutrition 0.000 claims description 5
- 239000004203 carnauba wax Substances 0.000 claims description 5
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- RGBIPJJZHWFFGE-UHFFFAOYSA-N cyclohexa-2,5-diene-1,4-dione;triphenylphosphane Chemical compound O=C1C=CC(=O)C=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RGBIPJJZHWFFGE-UHFFFAOYSA-N 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 claims description 4
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 125000002883 imidazolyl group Chemical group 0.000 claims description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000012170 montan wax Substances 0.000 claims description 3
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 150000004714 phosphonium salts Chemical group 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 229920000428 triblock copolymer Polymers 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000002425 crystallisation Methods 0.000 abstract description 3
- 230000008025 crystallization Effects 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 description 11
- 239000000843 powder Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000005303 weighing Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention relates to an epoxy molding compound for high-thermal-conductivity high-magnetic-induction packaging, which is prepared from epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a release agent, a modifier and a composite coupling agent. After the epoxy molding compound is subjected to 260-degree reflow soldering, the epoxy molding compound can pass the requirement of JEDEC level2 reliability grade, the layering rate is less than 5%, and the epoxy molding compound has excellent moldability, reflow resistance and reliability. The high-thermal-conductivity magnetic induction packaging body obtained by the invention is uniform in crystallization, has unique high magnetic conductivity performance and has better low magnetic conductivity loss.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to an epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging, and a preparation method and application thereof.
Background
The epoxy plastic package material mainly comprises epoxy resin, a crosslinking curing agent, a curing accelerator, an additive and the like. The material has many outstanding characteristics, such as good thermal stability, insulation property, adhesion, good mechanical property, excellent molding process property, low cost and the like, and is widely applied to the field of electronic component packaging, thereby becoming one of the most important electronic chemical materials at present. With the development of advanced microelectronic technology, electronic packages are becoming thinner and thinner. The traditional powder package and solvent-containing liquid package are gradually replaced by molded injection products due to package defects and damage to the environment, and particularly, the package form is more widely adopted to realize lightness, thinness and miniaturization of products in modular circuits and integrated circuits.
Because the magnetic induction packaging form is changed from powder packaging and liquid dipping to die pressing injection molding, the filler is metal alloy and high heat conduction material, and because the temperature born by the plastic packaging material is higher in the packaging and reflow soldering processes, the plastic packaging material can generate larger expansion and internal stress. The plastic packaging material and the chip are easily layered, and the product can crack even popcorn phenomenon in serious conditions, so that the reliability of the product is greatly influenced. Meanwhile, the inductance device has the limitation of volume reduction, and the current packaging product has poor heat conductivity, low magnetic conductivity and poor inductance performance.
Through searching, the following patent publications related to the patent application of the invention are found:
1. a super heat-resistant high-thermal-conductivity epoxy molding compound (CN109467881A) for semiconductor packaging is provided, which comprises the following components: 45-127.5 parts of epoxy resin, 60-300 parts of curing agent, 3.75-10.35 parts of ion trapping agent, 3.9-15 parts of low-stress modifier, 3-6.75 parts of coupling agent, 0.9-9 parts of accelerator, 525-672.25 parts of solid filler, 3-12 parts of release agent, 2.25-5.25 parts of flame retardant and 1.5-2.25 parts of colorant. According to the super-heat-resistant high-heat-conductivity epoxy plastic packaging material for semiconductor packaging, ester ring type epoxy resin, heterocyclic type epoxy resin, naphthalene ring type epoxy resin and polyfunctional epoxy resin are added to serve as resin matrixes, the resin has a rigid structure, so that molecular chains are not prone to moving, and meanwhile, due to the fact that the resin has a polyfunctional structure, cross-linking density of the resin after curing can be increased, so that the effect of increasing glass transition temperature of the material is achieved, and heat resistance of the material is increased.
2. A preparation method (CN109517336A) of a semiconductor packaging super-heat-resistant high-thermal-conductivity epoxy molding compound is provided, which provides a preparation method of a semiconductor packaging super-heat-resistant high-thermal-conductivity epoxy molding compound, and the raw materials comprise the following components: 45-127.5 parts of epoxy resin, 60-300 parts of curing agent, 3.75-10.35 parts of ion trapping agent, 3.9-15 parts of low-stress modifier, 3-6.75 parts of coupling agent, 0.9-9 parts of accelerator, 525-672.25 parts of solid filler, 3-12 parts of release agent, 2.25-5.25 parts of flame retardant and 1.5-2.25 parts of colorant. The method of the invention carries out pretreatment and high-speed dispersion on the epoxy plastic packaging material mixture, and then adds the mixture into an open mill for mixing, and can effectively solve the mixing uniformity of raw materials by changing a premixing mode, especially the uniformity of components with small addition content. Compared with the prior art, the mixing method provided by the invention has the main differences that the operability of the product used at the client is improved well, the mixing of all components is facilitated, the stability of the product is better, and the prepared epoxy plastic packaging material has extremely high glass transition temperature and higher heat conductivity coefficient.
3. A powder fiber modified epoxy molding compound and a preparation method thereof (CN109370160A) are provided, and the powder fiber modified epoxy molding compound is characterized by comprising the following components: 40-74 parts of epoxy resin A, 45-140 parts of curing agent B, 0.1-3 parts of accelerator C, 440-800 parts of inorganic filler D, 15-150 parts of flame retardant E, 260 parts of fiber powder F100, 0.05-3 parts of release agent G, 0.01-4 parts of coupling agent H, 0-3 parts of colorant I and 0-3 parts of modifier J. The invention creatively adopts the fiber powder in the epoxy plastic package material: the glass fiber, the aramid fiber or the carbon fiber are ground and sieved to obtain powder meeting the requirement of particle size, and the powder is added into the epoxy plastic package material after being treated by a special method, so that the epoxy plastic package material is endowed with higher strength performance, heat conduction performance, wear resistance performance, antistatic performance and other performances.
By contrast, the present patent application is substantially different from the above patent publications.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging, a preparation method and application thereof, and the epoxy molding compound can pass the requirement of JEDEC level2 reliability grade after reflow soldering at 260 ℃, has the layering rate of less than 5 percent and has excellent formability, reflux resistance and reliability. The high-thermal-conductivity magnetic induction packaging body obtained by the invention is uniform in crystallization, has unique high magnetic conductivity performance and has better low magnetic conductivity loss.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the epoxy plastic packaging material is prepared from epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a release agent, a modifier and a composite coupling agent.
Moreover, the weight parts of each component are as follows:
1-15 parts of epoxy resin, 1-15 parts of curing agent, 0.01-0.5 part of curing accelerator, 80-97 parts of inorganic filler, 0.01-1 part of release agent, 0.05-2 parts of modifier and 0.1-2 parts of composite coupling agent.
The epoxy resin is one or a composition of more than two of polyaromatic epoxy resin, cyclopentadiene epoxy resin, o-cresol epoxy resin and flexible epoxy resin;
or the curing agent is one or a composition of more than two of polyaromatic curing agent, linear phenolic resin curing agent and high molecular weight anhydride curing agent;
or the curing accelerator is imidazole, phosphorus compound or amidine compound;
or the inorganic filler is one or more of a combined material of pretreated ferrite, a benzene-free rubber treating agent CrB, an iron powder core, Mn-Zn, Ni-Zn, iron-nickel 50 and iron-silicon-molybdenum.
The polyaromatic epoxy resin is an epoxy resin containing a biphenyl type or naphthalene type structure, and is represented by the following formula (1) or (2) or (3) or (4) or (5):
or the curing accelerator is one or a composition of more than two of 2-methylimidazole, 2-phenyl-4-methylimidazole, triphenylphosphine, diazabicyclo, triphenylphosphine-1, 4-benzoquinone addition product and quaternary phosphonium salt;
alternatively, the polyaromatic curing agent is represented by the following formula (6) or (7):
or the pretreated ferrite is composed of a main material and an auxiliary material; wherein the main material is ferric oxide, copper oxide, zinc oxide or nickel oxide, and the auxiliary material is bismuth oxide, silicon oxide, magnesium oxide or cobalt oxide; and adding a binder into the main material and the auxiliary material, and stirring and mixing at high speed and high temperature to obtain the pretreated ferrite.
The release agent is one or more than two of 1# carnauba wax, polyethylene glycol wax, polyethylene wax, montan wax and stearic acid.
Moreover, the composite coupling agent is prepared by mixing and compounding the following coupling agents in parts by weight:
coupling agent 1: 5-40 parts of gamma-glycidyl ether oxypropyltrimethoxysilane;
coupling agent 2: 5-20 parts of gamma- (methacryloyloxy) propyl trimethoxy silane;
coupling agent 3: 10-50 parts of N-phenyl-gamma-aminopropyltrimethoxysilane;
20-40 parts of one or the combination of two of a coupling agent 4 and a coupling agent 5; wherein, the coupling agent 4: gamma-mercaptopropyl trimethoxysilane, coupling agent 5: bis- [ gamma- (triethoxysilyl) propyl ] tetrasulfide;
coupling agent 6: 5-15 parts of a compound of isopropyl triisostearate.
Moreover, the modifier is a triblock copolymer of silicon rubber particles, epoxy modified silicone oil and polystyrene-b-polydimethylsiloxane-b-polystyrene.
Also, the average particle diameter of the silicone rubber particles was 5 μm.
The preparation method of the epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging comprises the following steps:
the components are uniformly mixed by a high-speed mixer, extruded by a double-screw extruder at the temperature of 80-150 ℃, cooled, crushed and pre-pressed to form, and the epoxy plastic packaging material for high-heat-conductivity and high-magnetic induction packaging is obtained.
The epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging is applied to packaging.
The invention has the advantages and positive effects that:
1. after the epoxy molding compound is subjected to 260-degree reflow soldering, the epoxy molding compound can pass the requirement of JEDEC level2 reliability grade, the layering rate is less than 5%, and the epoxy molding compound has excellent moldability, reflow resistance and reliability. The high-thermal-conductivity magnetic induction packaging body obtained by the invention is uniform in crystallization, has unique high magnetic conductivity performance and better low magnetic conductivity loss, the magnetic conductivity can reach more than 4000, and the magnetic conductivity loss rate is less than 5%.
2. The epoxy molding compound disclosed by the invention can effectively improve the injection plasticity, the caking property, the flexibility and the reliability of the epoxy molding compound and effectively reduce the water absorption rate of a product by combining the magnetic heat-conducting filler with multiple organic materials such as polyaromatic epoxy resin, cyclopentadiene epoxy, flexible epoxy resin, polyaromatic curing agent, linear phenolic curing agent and the like. The dual requirements of the mold release property and the adhesion property can be achieved by controlling the dosage of the mold release agent. The modifier is added to eliminate the curing stress of epoxy. By using the pretreated ferrite, the iron powder core, Mn-Zn, Ni-Zn, iron-nickel 50, iron-silicon-molybdenum and the like, the addition amount of the filler is controlled to be more than 80%, and the heat conducting property and the magnetic induction property are ensured. The addition of the compound coupling agent can greatly improve the bonding strength between the plastic packaging material and the chip, simultaneously improve the binding force between the filler and the resin and increase the high-temperature strength. Through the improvement of the above aspects, the adhesiveness, the toughness, the water absorption rate, the heat conducting property and the magnetic conductance property of the product are all improved.
Detailed Description
The following detailed description of the embodiments of the present invention is provided for the purpose of illustration and not limitation, and should not be construed as limiting the scope of the invention.
The raw materials used in the invention are conventional commercial products unless otherwise specified; the methods used in the present invention are conventional in the art unless otherwise specified.
The epoxy plastic packaging material is prepared from epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a release agent, a modifier and a composite coupling agent.
Preferably, the weight parts of each component are as follows:
1-15 parts of epoxy resin, 1-15 parts of curing agent, 0.01-0.5 part of curing accelerator, 80-97 parts of inorganic filler, 0.01-1 part of release agent, 0.05-2 parts of modifier and 0.1-2 parts of composite coupling agent.
The epoxy resin is one or a composition of more than two of polyaromatic epoxy resin, cyclopentadiene epoxy resin, o-cresol epoxy resin and flexible epoxy resin;
or the curing agent is one or a composition of more than two of polyaromatic curing agent, linear phenolic resin curing agent and high molecular weight anhydride curing agent;
or the curing accelerator is imidazole, phosphorus compound or amidine compound;
or the inorganic filler is one or more of a combined material of pretreated ferrite, a benzene-free rubber treating agent CrB, an iron powder core, Mn-Zn, Ni-Zn, iron-nickel 50 and iron-silicon-molybdenum.
The polyaromatic epoxy resin is an epoxy resin containing a biphenyl type or naphthalene type structure, and is represented by the following formula (1) or (2) or (3) or (4) or (5):
or the curing accelerator is one or a composition of more than two of 2-methylimidazole, 2-phenyl-4-methylimidazole, triphenylphosphine, diazabicyclo, triphenylphosphine-1, 4-benzoquinone addition product and quaternary phosphonium salt;
alternatively, the polyaromatic curing agent is represented by the following formula (6) or (7):
or the pretreated ferrite is composed of a main material and an auxiliary material; wherein the main material is ferric oxide, copper oxide, zinc oxide or nickel oxide, and the auxiliary material is bismuth oxide, silicon oxide, magnesium oxide or cobalt oxide; and adding a binder into the main material and the auxiliary material, and stirring and mixing at high speed and high temperature to obtain the pretreated ferrite.
Preferably, the release agent is one or more than two of 1# carnauba wax, polyethylene glycol wax, polyethylene wax, montan wax and stearic acid.
Preferably, the composite coupling agent is prepared by mixing and compounding the following coupling agents in parts by weight:
coupling agent 1: 5-40 parts of gamma-glycidyl ether oxypropyltrimethoxysilane;
coupling agent 2: 5-20 parts of gamma- (methacryloyloxy) propyl trimethoxy silane;
coupling agent 3: 10-50 parts of N-phenyl-gamma-aminopropyltrimethoxysilane;
20-40 parts of one or the combination of two of a coupling agent 4 and a coupling agent 5; wherein, the coupling agent 4: gamma-mercaptopropyl trimethoxysilane, coupling agent 5: bis- [ gamma- (triethoxysilyl) propyl ] tetrasulfide;
coupling agent 6: 5-15 parts of a compound of isopropyl triisostearate.
Preferably, the modifier is silicone rubber particles, epoxy modified silicone oil, polystyrene-b-polydimethylsiloxane-b-polystyrene triblock copolymer.
Preferably, the silicone rubber particles have an average particle size of 5 μm.
The preparation method of the epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging comprises the following steps:
the components are uniformly mixed by a high-speed mixer, extruded by a double-screw extruder at the temperature of 80-150 ℃, cooled, crushed and pre-pressed to form, and the epoxy plastic packaging material for high-heat-conductivity and high-magnetic induction packaging is obtained.
The epoxy molding compound for high-thermal-conductivity and high-magnetic-induction packaging is applied to packaging.
Example 1
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 80 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 2
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 3
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 4
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 110 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 5
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 120 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 6
Weighing the components according to the proportion in the table 1, uniformly mixing, melting and mixing the mixed materials in a double-screw extruder at 120 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Comparative example:
uniformly mixing 80% of silica powder, 8% of epoxy resin 1, 7% of curing agent 1, 3% of flame retardant, 0.5% of carnauba wax, 0.5% of KH560 and 0.5% of curing agent accelerator 1, melting and mixing the mixed materials in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake machine, and testing the performance index of the product.
The specific raw materials in each example can be as follows:
inorganic filler:
inorganic filler 1: the mixture of ferrite, iron-nickel 50 and iron-silicon-molybdenum with the median particle size of 15 mu m is pretreated;
inorganic filler 2: Mn-Zn and Ni-Zn mixture with the median particle size of 15 mu m.
Epoxy resin:
epoxy resin 1: epoxy resin shown as a structural formula (1);
epoxy resin 2: epoxy resin shown as structural formula (2);
epoxy resin 3: epoxy resin shown as a structural formula (3);
epoxy resin 4: epoxy resin shown as structural formula (4);
epoxy resin 5: the epoxy resin is shown as a structural formula (5).
Curing agent:
curing agent 1: a curing agent represented by the structural formula (6);
curing agent 2: the curing agent is shown as a structural formula (7).
Curing accelerator:
curing accelerator 1: 2-methylimidazole (formed in four countries of japan);
curing accelerator 2: triphenylphosphine (long root chemistry);
curing accelerator 3: triphenylphosphine-1, 4-benzoquinone adduct.
Releasing agent:
1 part of release agent, 1:1# carnauba wax;
and (2) release agent: polyethylene glycol wax;
and (3) release agent: polyethylene wax.
Coupling agent:
coupling agent 1: gamma-glycidyl ether propyl trimethoxysilane;
coupling agent 2: gamma- (methacryloyloxy) propyltrimethoxysilane;
coupling agent 3: n-phenyl-gamma-aminopropyltrimethoxysilane;
coupling agent 4: gamma-mercaptopropyl-trimethoxysilane;
coupling agent 5: bis- [ gamma- (triethoxysilyl) propyl ] tetrasulfide;
coupling agent 6: a compound of isopropyl triisostearate.
Table 1 material composition table for examples 1-6
The properties of the products of the examples of the invention are shown in the following table:
TABLE 2 Properties of the examples
As can be seen from the above examples and comparative examples, the moisture absorption rate of the epoxy molding compound with the magnetic conductive material as the filler is lower than that of the common molding compound product, the thermal conductivity is significantly higher than that of the conventional molding compound, and the magnetic conductive loss rate is lower than that of the conventional molding compound.
Although the embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that: various substitutions, changes and modifications are possible without departing from the spirit and scope of the invention and the appended claims, and therefore the scope of the invention is not limited to the embodiments disclosed.
Claims (10)
1. The utility model provides a high heat conduction high magnetic induction encapsulates uses epoxy plastic envelope material which characterized in that: the epoxy plastic package material is prepared from epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a release agent, a modifier and a composite coupling agent.
2. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 1, wherein: the weight parts of each component are as follows:
1-15 parts of epoxy resin, 1-15 parts of curing agent, 0.01-0.5 part of curing accelerator, 80-97 parts of inorganic filler, 0.01-1 part of release agent, 0.05-2 parts of modifier and 0.1-2 parts of composite coupling agent.
3. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 1, wherein: the epoxy resin is one or a composition of more than two of polyaromatic epoxy resin, cyclopentadiene epoxy resin, o-cresol epoxy resin and flexible epoxy resin;
or the curing agent is one or a composition of more than two of polyaromatic curing agent, linear phenolic resin curing agent and high molecular weight anhydride curing agent;
or the curing accelerator is imidazole, phosphorus compound or amidine compound;
or the inorganic filler is one or more of a combined material of pretreated ferrite, a benzene-free rubber treating agent CrB, an iron powder core, Mn-Zn, Ni-Zn, iron-nickel 50 and iron-silicon-molybdenum.
4. The high thermal conductivity and high magnetic induction packaging epoxy molding compound according to claim 3, wherein: the polyaromatic epoxy resin is an epoxy resin containing a biphenyl type or naphthalene type structure, and is shown as the following formula (1) or (2) or (3) or (4) or (5):
or the curing accelerator is one or a composition of more than two of 2-methylimidazole, 2-phenyl-4-methylimidazole, triphenylphosphine, diazabicyclo, triphenylphosphine-1, 4-benzoquinone addition product and quaternary phosphonium salt;
alternatively, the polyaromatic curing agent is represented by the following formula (6) or (7):
or the pretreated ferrite is composed of a main material and an auxiliary material; wherein the main material is ferric oxide, copper oxide, zinc oxide or nickel oxide, and the auxiliary material is bismuth oxide, silicon oxide, magnesium oxide or cobalt oxide; and adding a binder into the main material and the auxiliary material, and stirring and mixing at high speed and high temperature to obtain the pretreated ferrite.
5. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 1, wherein: the release agent is one or more than two of 1# carnauba wax, polyethylene glycol wax, polyethylene wax, montan wax and stearic acid.
6. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 1, wherein: the composite coupling agent is prepared by mixing and compounding the following coupling agents in parts by weight:
coupling agent 1: 5-40 parts of gamma-glycidyl ether oxypropyltrimethoxysilane;
coupling agent 2: 5-20 parts of gamma- (methacryloyloxy) propyl trimethoxy silane;
coupling agent 3: 10-50 parts of N-phenyl-gamma-aminopropyltrimethoxysilane;
20-40 parts of one or the combination of two of a coupling agent 4 and a coupling agent 5; wherein, the coupling agent 4: gamma-mercaptopropyl trimethoxysilane, coupling agent 5: bis- [ gamma- (triethoxysilyl) propyl ] tetrasulfide;
coupling agent 6: 5-15 parts of a compound of isopropyl triisostearate.
7. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 1, wherein: the modifier is silicon rubber particles, epoxy modified silicone oil and polystyrene-b-polydimethylsiloxane-b-polystyrene triblock copolymer.
8. The epoxy molding compound for high thermal conductivity and high magnetic induction packaging of claim 7, wherein: the average particle diameter of the silicone rubber particles is 5 μm.
9. The method for preparing the epoxy molding compound for high thermal conductivity and high magnetic induction packaging according to any one of claims 1 to 8, wherein: the method comprises the following steps:
the components are uniformly mixed by a high-speed mixer, extruded by a double-screw extruder at the temperature of 80-150 ℃, cooled, crushed and pre-pressed to form, and the epoxy plastic packaging material for high-heat-conductivity and high-magnetic induction packaging is obtained.
10. The use of the epoxy molding compound for high thermal conductivity and high magnetic induction packaging according to any one of claims 1 to 8 in packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910956506.2A CN110776716A (en) | 2019-10-10 | 2019-10-10 | Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910956506.2A CN110776716A (en) | 2019-10-10 | 2019-10-10 | Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110776716A true CN110776716A (en) | 2020-02-11 |
Family
ID=69385955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910956506.2A Pending CN110776716A (en) | 2019-10-10 | 2019-10-10 | Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110776716A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111899954A (en) * | 2020-07-28 | 2020-11-06 | 江苏科化新材料科技有限公司 | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof |
| CN112852110A (en) * | 2021-02-08 | 2021-05-28 | 温州大学激光与光电智能制造研究院 | Antistatic epoxy plastic packaging material and preparation method thereof |
| CN113604181A (en) * | 2021-08-12 | 2021-11-05 | 深圳市铂科新材料股份有限公司 | Film for improving inductance of inductor and preparation method and application thereof |
| CN113969125A (en) * | 2021-09-24 | 2022-01-25 | 法拉新材料(连云港)有限公司 | High-adhesion anti-cracking epoxy powder composition and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831137A (en) * | 2009-03-13 | 2010-09-15 | 江苏中鹏电子有限公司 | Epoxy resin composition for packaging semiconductors |
| US20120302667A1 (en) * | 2011-05-23 | 2012-11-29 | Cheil Industries, Inc. | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same |
| WO2017027389A1 (en) * | 2015-08-07 | 2017-02-16 | Qorvo Us, Inc. | Flip chip module with enhanced properties |
| CN107868411A (en) * | 2017-11-28 | 2018-04-03 | 天津盛远达科技有限公司 | A kind of paster integrated antenna package epoxy-plastic packaging material |
| CN108054148A (en) * | 2017-12-08 | 2018-05-18 | 广东美的制冷设备有限公司 | Intelligent power module and its manufacturing method, air conditioner |
-
2019
- 2019-10-10 CN CN201910956506.2A patent/CN110776716A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831137A (en) * | 2009-03-13 | 2010-09-15 | 江苏中鹏电子有限公司 | Epoxy resin composition for packaging semiconductors |
| US20120302667A1 (en) * | 2011-05-23 | 2012-11-29 | Cheil Industries, Inc. | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same |
| WO2017027389A1 (en) * | 2015-08-07 | 2017-02-16 | Qorvo Us, Inc. | Flip chip module with enhanced properties |
| CN107868411A (en) * | 2017-11-28 | 2018-04-03 | 天津盛远达科技有限公司 | A kind of paster integrated antenna package epoxy-plastic packaging material |
| CN108054148A (en) * | 2017-12-08 | 2018-05-18 | 广东美的制冷设备有限公司 | Intelligent power module and its manufacturing method, air conditioner |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111899954A (en) * | 2020-07-28 | 2020-11-06 | 江苏科化新材料科技有限公司 | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof |
| CN112852110A (en) * | 2021-02-08 | 2021-05-28 | 温州大学激光与光电智能制造研究院 | Antistatic epoxy plastic packaging material and preparation method thereof |
| CN113604181A (en) * | 2021-08-12 | 2021-11-05 | 深圳市铂科新材料股份有限公司 | Film for improving inductance of inductor and preparation method and application thereof |
| CN113604181B (en) * | 2021-08-12 | 2023-09-15 | 深圳市铂科新材料股份有限公司 | Film for improving inductance of inductor and preparation method and application thereof |
| CN113969125A (en) * | 2021-09-24 | 2022-01-25 | 法拉新材料(连云港)有限公司 | High-adhesion anti-cracking epoxy powder composition and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110776716A (en) | Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof | |
| CN103436019B (en) | A kind of high heat conductive insulating heat conductive silica gel pad and preparation method thereof | |
| CN109206961A (en) | A kind of graphene conductive heat-conductive coating and preparation method thereof | |
| CN104312147A (en) | Zinc oxide whisker/graphene nanosheet synergistically modified cyanate ester resin heat conduction composite and preparation method thereof | |
| JP2012522848A (en) | Epoxy resin composition | |
| CN113881190A (en) | Epoxy resin composite material for packaging power electronic transformer and preparation method thereof | |
| CN107189103B (en) | A kind of conductive filler, preparation method and the usage | |
| CN102936341A (en) | Polyimide resin synthesis method | |
| CN110317562B (en) | Organic silicon modified epoxy pouring sealant | |
| CN101885901A (en) | Biphenyl-structure-contained epoxy resin/montmorillonite nano composite material | |
| CN107459770A (en) | A kind of high-termal conductivity polyether-ether-ketone composite material and preparation method thereof | |
| CN113583388A (en) | Heat-conducting epoxy resin composite material and preparation method thereof | |
| CN113402847A (en) | Low-filling high-thermal-conductivity polymer composite material and preparation method thereof | |
| CN106751711A (en) | Fluorine substituted ethylene based polyalcohol resin combination, prepreg and laminate | |
| CN116178954B (en) | Bismaleimide resin composite material for carbon fiber prepreg tape and preparation method thereof | |
| JPH0468345B2 (en) | ||
| JPS61101522A (en) | Sealing resin composition | |
| CN107955335B (en) | Preparation method of epoxy resin composition prepared by using stirrer | |
| CN110607014A (en) | Preparation method of high-strength high-toughness electromagnetic shielding composite material | |
| CN101921479A (en) | Cyanate resin base composite material and preparation method thereof | |
| CN111187514A (en) | Insulating and heat-conducting PPS composite material and preparation method thereof | |
| JPS61293219A (en) | Sealing resin composition | |
| CN102863744A (en) | High-power packaging epoxy resin composition with good forming performances | |
| JPS61101523A (en) | Sealing resin composition | |
| CN116836520A (en) | Resin composition, electrical insulation member prepared from same, and preparation method of electrical insulation member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200211 |
|
| RJ01 | Rejection of invention patent application after publication |