CN112852110A - Antistatic epoxy plastic packaging material and preparation method thereof - Google Patents
Antistatic epoxy plastic packaging material and preparation method thereof Download PDFInfo
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 23
- 239000004033 plastic Substances 0.000 title abstract description 19
- 239000005022 packaging material Substances 0.000 title abstract description 11
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 61
- 229920006336 epoxy molding compound Polymers 0.000 claims abstract description 24
- 239000003054 catalyst Substances 0.000 claims abstract description 19
- 239000006229 carbon black Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 11
- 150000004714 phosphonium salts Chemical class 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 239000003063 flame retardant Substances 0.000 claims description 8
- 235000010919 Copernicia prunifera Nutrition 0.000 claims description 6
- 244000180278 Copernicia prunifera Species 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000006082 mold release agent Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 150000003003 phosphines Chemical class 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 229920013822 aminosilicone Polymers 0.000 claims description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 125000001246 bromo group Chemical group Br* 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000000486 o-cresyl group Chemical group [H]C1=C([H])C(O*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/002—Methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/52—Improvements relating to the production of bulk chemicals using catalysts, e.g. selective catalysts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an antistatic epoxy plastic package material and a preparation method thereof. By adjusting the premixing process of the release agent in the epoxy molding compound, the distribution of the release agent in the epoxy molding compound is more uniform, the stability of the release force in the semiconductor packaging engineering is improved, and the occurrence of local electrostatic damage in the packaging engineering is inhibited. By adjusting the use ratio of the phosphonium salt catalyst and the phosphonium salt catalyst in the epoxy plastic packaging material and the addition amount of the carbon black, the volume resistivity of the epoxy plastic packaging material is reduced, so that the charge accumulation capacity of the epoxy plastic packaging material is weakened, and the risk of electrostatic discharge is reduced, thereby reducing the charge accumulation capacity on the surface of a packaging product, finally effectively inhibiting the occurrence of electrostatic discharge in the packaging engineering, and improving the yield in the semiconductor packaging engineering.
Description
Technical Field
The invention belongs to the field of epoxy molding compound application, and relates to an anti-static epoxy molding compound and a preparation method thereof.
Background
With the increasing demand for chip integration, chip packages are also developed in the direction of small size and high density, and in order to meet the development demand, Ball Grid Array packages (BGA) are developed and applied in a large number in the packaging and plastic packaging process.
When the Electrostatic charge in the packaging material contacts with a low-potential object, the high current and high heat generated at the moment of Electrostatic Discharge (ESD) can break through the internal circuit of the chip, causing the electronic product to fail. Therefore, the high density of the circuit cells inevitably increases the risk of sensitivity to static electricity.
ESD protection during packaging is generally considered only from a device and method of operation perspective, with little consideration given to the ESD impact of the packaging material. The main material of the packaging and plastic packaging process is Epoxy Molding Compound (EMC for short). EMC is a polymer material used for semiconductor packaging, and its main function is to protect chips and interconnections from external moisture, impact, and the like. In EMC characteristics, the excessive release force and volume resistivity are main factors causing ESD damage; the demoulding force is too large, so that the friction force is increased and the electrostatic charge is increased during EMC demoulding; meanwhile, too high volume resistivity may reduce EMC static damping capability.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the anti-static epoxy plastic package material and the preparation method thereof, so that the stability of the demolding force is improved, the volume resistivity of the epoxy plastic package material is reduced, the generation of static electricity release in the packaging process can be effectively inhibited, and the yield in the semiconductor packaging engineering is improved.
The antistatic epoxy molding compound is characterized by being mainly prepared from the following components in parts by weight: 40-100 parts of epoxy resin, 40-100 parts of curing agent, 480-1500 parts of filler, 15-150 parts of flame retardant, 2-10 parts of catalyst, 2-10 parts of release agent, 1.6-14 parts of carbon black and 1-10 parts of coupling agent; the release agent is formed by mixing a natural release agent and a synthetic release agent according to a mass ratio of 4: 1.
Further, the carbon black has an average particle diameter of 23 to 25mm, a specific surface area of 100-115m2/g, and an oil absorption of 100cm3/100g。
Further, the filler is silica or alumina.
Further, the natural mold release agent is carnauba and the synthetic mold release agent is PE.
Further, the flame retardant is bromine epoxy resin or Sb2O3The catalyst is amine or phosphide, and the binder is siloxane or amino silicone oil.
Further, the epoxy resin can be one or more of bisphenol A structure epoxy, biphenyl structure epoxy, naphthalene structure epoxy and o-cresol structure epoxy.
Further, the curing agent is one or more of a linear phenolic resin and an elastic hardening agent.
The preparation method of the antistatic epoxy molding compound is characterized by comprising the following steps:
(1) premixing a natural release agent and a synthetic release agent according to the mass ratio of 4:1, premixing the natural release agent and the synthetic release agent with epoxy resin, and stirring and mixing the materials by a high-speed stirrer;
(2) premixing a natural release agent and a synthetic release agent according to a mass ratio of 4:1, and stirring and mixing the premixed release agent, a curing agent, a flame retardant, carbon black and a coupling agent by a high-speed stirrer;
(3) and (3) finally mixing the epoxy molding compound mixed in the steps (1) and (2), a filler and a catalyst.
Further, the catalyst is formed by mixing phosphonium salt and phosphine salt according to the mass ratio of 4: 3.
Among the characteristics of epoxy molding compounds, the factors influencing electrostatic discharge are mainly mold release force and volume resistivity. The demolding force comes from the frictional resistance between the epoxy molding compound and the surface of the mold in the demolding process, and the large friction causes a large amount of charges to be accumulated on the surface of the demolded epoxy molding compound, so that the chip is easily damaged when the demolded epoxy molding compound contacts a low-voltage device; the higher the volume resistivity, the stronger the epoxy molding compound has the ability to accumulate charge, and the greater the risk of electrostatic discharge. Therefore, the reduction of the mold release force and the volume resistivity of the epoxy molding compound is an effective measure for improving the yield of the chip.
The invention discloses a method for reducing the demolding force of an epoxy molding compound, which is to improve the traditional mixing process, improve the mixing proportion of a demolding agent and adjust the using amount of carbon black. The dispersibility of the traditional mixing process is poor, the release agent is premixed for the first time through the optimization of the formula of the epoxy plastic package material (filtered Master Batch, MMB), the dispersibility of the release agent is improved, the release agent is mixed in the epoxy resin fully and uniformly, the release agent can be favorably dispersed into the plastic package material fully, the release force of each part of the whole plastic package material is uniform, the phenomenon of overlarge local release force can be effectively prevented, and the occurrence of local static damage in the packaging engineering is restrained.
The two release agents used in the invention are respectively a natural release agent and a synthetic release agent, the melting point of the natural release agent is lower than that of the synthetic release agent, the dispersibility of the natural release agent is better than that of the synthetic release agent, but the lubricating effect of the synthetic release agent is better than that of the natural release agent. In terms of adhesion, natural mold release agents are significantly higher than synthetic ones. The two release agents are used simultaneously and mixed according to a certain proportion to achieve proper lubricating effect and bonding force.
The invention takes carbon black as a coloring agent, the volume resistivity is greatly reduced by adjusting the using amount of the carbon black, and the minimum volume resistivity of the plastic packaging material can reach 1.8 multiplied by 1010Ω cm. The crosslinking reactivity of the epoxy resin can influence the volume resistivity of EMC, and the invention simultaneously mixes two catalysts of phosphonium salt and phosphonium salt in the crosslinking reaction to ensure that the network structure of the reaction product is looser and has good mechanical property and dielectric property. By passing1H-NMR and DSC are used for analyzing the compactness and volume resistivity of the cross-linking reaction of samples prepared by phosphonium salt and phosphine salt catalysts with different proportioning ratios, and when phosphonium is usedSalt and phosphonium salt catalysts were prepared by reacting 4:3 the mixed catalyst has a remarkable effect on the reduction of the volume resistivity.
Detailed Description
The present invention will be further illustrated by the following specific examples, which are to be construed as merely illustrative, and not limitative of the remainder of the disclosure in any way whatsoever.
The antistatic epoxy plastic package material is mainly prepared from the following components in parts by weight: 40-100 parts of epoxy resin, 40-100 parts of curing agent, 480-1500 parts of filler, 15-150 parts of flame retardant, 2-10 parts of catalyst, 2-10 parts of release agent, 1.6-14 parts of carbon black and 1-10 parts of coupling agent; the release agent is formed by mixing a natural release agent and a synthetic release agent according to a mass ratio of 4: 1.
The antistatic epoxy molding compound was prepared according to the raw material ratios described in table 1.
Table 1 raw material compounding table
The preparation process comprises the following steps:
(1) premixing natural release agent carnauba and synthetic release agent PE according to the mass ratio of 4:1, premixing with epoxy resin, and stirring and mixing by a high-speed stirrer;
(2) premixing a natural release agent carnauba and a synthetic release agent PE according to a mass ratio of 4:1, and stirring and mixing the premixed release agent, a curing agent, a flame retardant, carbon black and a coupling agent by a high-speed stirrer;
(3) and (3) finally mixing the epoxy molding compound mixed in the steps (1) and (2), a filler and a catalyst.
In example 1, two comparative experiments were carried out according to the carbon black selection, one using a material having an average particle diameter of 24mm and a specific surface area of 110m2Oil absorption of 100 cm/g3100g of carbon black, marked 1A; one group adopts the average particle size of 20mm and the specific surface area of 140m2Oil absorption of 131 cm/g3/100g of carbon black and labeled 1B; the volume resistivity of the molding compound was examined by two comparative experiments. The volume resistivity of the plastic packaging materials prepared from 1A and 1B is 1.8 multiplied by 10 respectively10Ω*cm、3.2×1010Ω cm. The carbon black used in 1A is shown to have better performance in reducing volume resistivity of the molding compound.
Example 1 has a lower volume resistivity and a slower reaction rate than the molding compound prepared in example 2. After the phosphonium salt catalyst and the phosphine salt catalyst are compounded according to the proportion of 4:3, the use of the phosphonium salt catalyst reduces the ring-opening reaction rate of epoxy groups in the crosslinking reaction of the epoxy plastic packaging material, so that the net structure of a reaction product is looser, the volume resistivity of the epoxy plastic packaging material is reduced, the capacity of accumulating charges on the surface of a packaged product is reduced, and finally the generation of electrostatic discharge in the packaging engineering is effectively inhibited.
The natural release agent, namely carnauba, has the melting point of 85 ℃ and the binding power of 105 Kgf; the melting point of the synthetic release agent PE was 98 ℃ and the adhesion was 62 Kgf. The use of synthetic release agents can significantly reduce release forces, but can affect their adhesion. When the carnauba and the PE are used according to the mass ratio of 4:1, the standard of mass production of the plastic package material can be achieved.
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.
Claims (9)
1. The antistatic epoxy molding compound is characterized by being mainly prepared from the following components in parts by weight: 40-80100 parts of epoxy resin, 40-80100 parts of curing agent, 480-10001500 parts of filler, 15-150 parts of flame retardant, 0.2-310 parts of catalyst, 0.12-310 parts of release agent, 1.6-2414 parts of carbon black and 0.011-410 parts of coupling agent; the release agent is formed by mixing a natural release agent and a synthetic release agent according to a mass ratio of 4: 1.
2. According to claimThe epoxy-based molding compound of claim 1, wherein the carbon black has an average particle diameter of 23 to 25mm and a specific surface area of 100 to 115m2Oil absorption of 100 cm/g3/100g。
3. The epoxy-based molding compound of claim 1, wherein the filler is silica or alumina.
4. The epoxy-based molding compound of claim 1, wherein the natural mold release agent is carnauba and the synthetic mold release agent is PE.
5. The antistatic epoxy molding compound of claim 1, wherein the flame retardant is bromine epoxy resin or Sb2O3The catalyst is amine or phosphide, and the binder is siloxane or amino silicone oil.
6. The method for preparing the antistatic epoxy molding compound of claim 1, wherein the epoxy resin may be one or more of bisphenol A structural epoxy, biphenyl structural epoxy, naphthalene structural epoxy, and o-cresol structural epoxy.
7. The method for preparing the antistatic epoxy molding compound of claim 2, wherein the curing agent is one or more of a phenol novolac resin and an elastic hardener.
8. The method for preparing antistatic epoxy molding compound according to claim 1, further characterized by improving the premixing process of the release agent:
(1) premixing a natural release agent and a synthetic release agent according to the mass ratio of 4:1, premixing the natural release agent and the synthetic release agent with epoxy resin, and stirring and mixing the materials by a high-speed stirrer;
(2) premixing a natural release agent and a synthetic release agent according to a mass ratio of 4:1, and stirring and mixing the premixed release agent, a curing agent, a flame retardant, carbon black and a coupling agent by a high-speed stirrer;
(3) and (3) finally mixing the epoxy molding compound mixed in the steps (1) and (2), a filler and a catalyst.
9. The method for preparing the antistatic epoxy molding compound according to claim 8, wherein: the catalyst is formed by mixing phosphonium salt and phosphine salt according to the mass ratio of 4: 3.
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| CN110776716A (en) * | 2019-10-10 | 2020-02-11 | 天津凯华绝缘材料股份有限公司 | Epoxy plastic packaging material for high-thermal-conductivity and high-magnetic-induction packaging and preparation method and application thereof |
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2021
- 2021-02-08 CN CN202110172456.6A patent/CN112852110A/en active Pending
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