CN110774464A - Silicon wafer cutting equipment with silicon dioxide - Google Patents
Silicon wafer cutting equipment with silicon dioxide Download PDFInfo
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- CN110774464A CN110774464A CN201911073438.1A CN201911073438A CN110774464A CN 110774464 A CN110774464 A CN 110774464A CN 201911073438 A CN201911073438 A CN 201911073438A CN 110774464 A CN110774464 A CN 110774464A
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- cutting
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- blade
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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Abstract
The invention relates to a silicon wafer cutting device with silicon dioxide. The silicon wafer cutting equipment with the silicon dioxide comprises a cutting frame, wherein a transverse groove is formed in the outer surface of the upper end of the cutting frame, a cutting main body is arranged in the transverse groove, a blade is arranged at the lower end of the cutting main body, two sections of moving parts are arranged on the inner wall of the transverse groove, the cutting main body moves in the transverse groove, and the blade moves downwards when the cutting main body passes through the moving parts; the cutting main body comprises a cutting shell, the upper end face of the cutting shell is open, the upper end of the outer wall of the cutting shell is movably connected with an outer ring, the outer surface of the outer ring is fixedly connected with outer teeth, and the rotating part of the transverse groove is a latch matched with the outer teeth; the inner surface of the outer ring is fixedly connected with inner teeth, and the cutting main body is positioned in the cutting shell and driven by the inner teeth; the silicon wafer cutting equipment with the silicon dioxide is simple in structure, convenient to operate, flexible to use, beneficial to cutting of silicon wafers and other brittle materials and the like, low in preparation cost and convenient to popularize and use.
Description
Technical Field
The invention belongs to the technical field of experimental cutting, and particularly relates to cutting equipment for a silicon wafer with silicon dioxide.
Background
Monocrystalline silicon is a relatively active non-metallic element, is an important component of crystal materials, and is in the front of the development of new materials. The solar photovoltaic power generation and heat supply semiconductor material is mainly used as a semiconductor material and utilizes solar photovoltaic power generation, heat supply and the like. Since solar energy has the advantages of cleanness, environmental protection, convenience and the like, in the last thirty years, the solar energy utilization technology has been developed greatly in the aspects of research and development, commercial production and market development, and becomes one of the new industries for rapid and stable development in the world; in a laboratory, when the performance of a silicon wafer is researched and tested in many aspects, a silicon wafer block is often required to be cut, the traditional cutting is manual cutting, direct scribing is carried out, and a diamond pen or other blades are used for direct cutting, but the edge of the silicon wafer obtained by the method is irregular, and particularly when the silicon wafer is formed by monocrystalline silicon and silicon dioxide on the surface of the monocrystalline silicon, the traditional scribing and the traditional breaking-off manner are easy to damage the silicon wafer, and the silicon wafer is wasted.
Disclosure of Invention
The invention aims to solve the problems and provide a silicon wafer cutting device with simple structure and reasonable design.
The invention realizes the purpose through the following technical scheme:
the utility model provides a cutting equipment for silicon chip with silica, includes the cutting frame, the cross slot has been seted up to the upper end surface of cutting frame, be provided with the cutting main part in the cross slot, the lower extreme of cutting main part is provided with the blade, the cross slot inner wall is provided with two sections moving parts, the cutting main part removes in the cross slot, the blade moves down when the cutting main part passes through moving part.
As a further optimization scheme of the invention, the cutting main body comprises a cutting shell, the upper end face of the cutting shell is open, the upper end of the outer wall of the cutting shell is movably connected with an outer ring, outer teeth are fixedly connected to the outer surface of the outer ring, and the rotating part of the transverse groove is a latch matched with the outer teeth.
As a further optimized scheme of the invention, the inner surface of the outer ring is fixedly connected with inner teeth, and the cutting main body further comprises a driving body which is positioned in the cutting shell, driven by the inner teeth and rotates unidirectionally.
As a further optimized scheme of the invention, a driving block is arranged on the outer surface of the driving body and matched with the inner teeth, the driving block comprises a fixed section and a movable section, a rotating shaft is connected between the fixed section and the movable section, a limiting plate is fixedly connected to the outer surface of one side of the fixed section, and the limiting plate limits the movable section to rotate towards one side.
As a further optimized scheme of the invention, the cutting shell is provided with a moving part, the inner surface of the moving part is provided with a connecting thread, the moving part is connected with a moving plate through the connecting thread, the moving plate is located in the moving part and moves up and down, and the upper end of the moving plate is fixedly connected with the driving body.
As a further optimized scheme of the invention, the upper end of the blade is provided with a blade shell, and the upper end of the blade shell is movably connected with the moving plate; the inner surface of the cutting shell is located below the moving portion and is fixedly connected with a limiting block, and the limiting block limits rotation of the blade shell.
As a further preferable aspect of the present invention, an upper cover is movably connected to an upper end of the driving body, and the upper cover is rotatable around the upper end of the driving body.
As a further optimization scheme of the invention, the inner surface of the cutting frame starts to be provided with a limiting groove, the outer surface of the cutting main body is fixedly connected with a limiting block, and the limiting block is in limiting fit with the limiting groove.
As a further optimization scheme of the invention, the outer surface of one end of the cutting frame is fixedly connected with a marking block, the marking block is a transparent plate, and the outer surface of the marking block is provided with scale marks.
As a further optimization scheme of the invention, an auxiliary box is fixedly connected to the outer surface of one side of the cutting frame, a controller, a motor, a screw fixed with an output shaft of the motor, a bearing seat movably connected to the other end of the screw and a connecting sheet sleeved on the surface of the screw are arranged in the auxiliary box, the output end of the controller is electrically connected with the input end of the motor, and the other end of the connecting sheet penetrates through the side wall of the auxiliary box and is fixedly connected with the cutting main body.
The invention has the beneficial effects that: the cutting frame is used for assisting the blade to cut, so that the cutting edge of the silicon wafer can be smoother, meanwhile, the device can realize the effect that the blade gradually moves downwards along with the horizontal movement of the axis in the repeated horizontal cutting movement, the traditional silicon wafer and the silicon wafer body with a protective film can be conveniently cut in a layered mode or in a regular mode, and the device can be additionally connected and controlled by the aid of the linear reciprocating driving mechanism, so that people can conveniently and directly use the device; the whole device is simple in structure, convenient to operate, flexible to use, beneficial to cutting silicon wafers and other brittle materials and the like, low in preparation cost and convenient to popularize and use.
Drawings
FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;
FIG. 2 is a schematic view of the internal structure of embodiment 1 of the present invention;
FIG. 3 is a schematic view of the internal structure of the cutting body of the present invention;
FIG. 4 is a schematic view of the external structure of the cutting body of the present invention;
FIG. 5 is a schematic view of the internal structure of a cutting frame according to embodiment 1 of the present invention;
FIG. 6 is a top plan view of the outer ring and drive body of the present invention;
FIG. 7 is a schematic diagram of the structure of the drive block of the present invention;
FIG. 8 is a schematic view of the overall structure of embodiment 2 of the present invention;
FIG. 9 is a schematic view of the overall structure of embodiment 3 of the present invention;
fig. 10 is a schematic view of the internal structure of an auxiliary tank in embodiment 3 of the present invention.
In the figure: 1. a cutting frame; 2. a transverse groove; 21. a rotating part; 3. cutting the main body; 30. cutting the shell; 31. a drive body; 32. an upper cover; 33. a drive block; 331. a rotating shaft; 332. a limiting plate; 34. an outer ring; 341. an outer tooth; 342. internal teeth; 35. a moving part; 36. a blade shell; 361. a blade; 37. moving the plate; 38. a limiting block; 39. a movement limiting block; 4. a limiting groove; 5. marking blocks; 6. an auxiliary tank; 61. a controller; 62. a motor; 63. a screw; 64. connecting sheets; 65. and a bearing seat.
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
Example 1
As shown in fig. 1 to 6, a cutting apparatus for silicon wafers with silicon dioxide comprises a cutting frame 1, wherein a transverse groove 2 is formed in an outer surface of an upper end of the cutting frame 1, a cutting main body 3 is arranged in the transverse groove 2, a blade 361 is arranged at a lower end of the cutting main body 3, two sections of moving portions 35 are arranged on an inner wall of the transverse groove 2, the cutting main body 3 moves in the transverse groove 2, and the blade 361 moves downward when the cutting main body 3 passes through the moving portions 35.
The cutting body 3 comprises a cutting shell 30, the upper end surface of the cutting shell 30 is open, the upper end of the outer wall of the cutting shell 30 is movably connected with an outer ring 34, the outer surface of the outer ring 34 is fixedly connected with outer teeth 341, and the rotating part 21 of the transverse groove 2 is a latch matched with the outer teeth 341; the inner teeth 342 are fixedly connected to the inner surface of the outer ring 34, and the cutting body 3 further includes a driving body 31 which is positioned in the cutting housing 30, is driven by the inner teeth 342, and rotates in a single direction; the outer surface of the driving body 31 is provided with a driving block 33, the driving block 33 is matched with the inner teeth 342, the driving block 33 comprises a fixed section and a movable section, a rotating shaft 331 is connected between the fixed section and the movable section, the rotating shaft 331 is composed of a shaft body and a rotating spring, the elastic force of the spring assists the movable section to reset, the outer surface of one side of the fixed section is fixedly connected with a limiting plate 332, and the limiting plate 332 limits the movable section to rotate towards one side; the cutting housing 30 is provided with a moving part 35, the inner surface of the moving part 35 is provided with a connecting thread, the moving part 35 is connected with a moving plate 37 through the connecting thread, the moving plate 37 moves up and down in the moving part 35, and the upper end of the moving plate 37 is fixedly connected with the driving body 31; the upper end of the blade 361 is provided with a blade shell 36, and the upper end of the blade shell 36 is movably connected with the moving plate 37; the inner surface of the cutting shell 30 is positioned below the moving part 35 and is fixedly connected with a limiting block 38, and the limiting block 38 limits the rotation of the blade shell 36; the upper end of the driving body 31 is movably connected with an upper cover 32, and the upper cover 32 can rotate around the upper end of the driving body 31; the inner surface of the cutting frame 1 starts to be provided with a limiting groove 4, the outer surface of the cutting main body 3 is fixedly connected with a limiting block 39, and the limiting block 39 is in limiting fit with the limiting groove 4;
when the cutting body 3 is used, the cutting body is limited by the limiting block 39 to slide transversely in the cutting frame 1, when a user moves into the rotating part 21 in the transverse groove 2 by using the cutting body 3, the latch arranged in the rotating part 21 is matched with the external gear 341 on the surface of the outer ring 34, so that the internal gear 342 drives the driving body 31 to rotate under the rotation of the outer ring 34, the driving body 31 drives the moving plate 37 to rotate, the moving plate 37 moves downwards in the moving part 35 because the moving plate 37 is connected with the moving part 35 by the screw thread, the moving plate 37 is movably connected with the upper end of the blade shell 36, namely, the moving plate 37 drives the blade shell 36 to move downwards, namely, the blade 361 extends downwards, the extending distance is determined by the number of rotation turns of the moving plate 37 and the screw thread on the surfaces of the moving plate 37 and the moving part 35, because the driving body 31 rotates unidirectionally under the driving of the outer ring 34 (the driving block 33 is limited, therefore, the blade 361 is not moved down again when the cutting body 3 slides out of the rotating part 21, and the whole device is convenient for manual control use.
When the device is used, the upper cover 32 is limited and movably connected with the upper end face of the cutting main body 3, and the upper cover 32 can freely rotate around the axis of the upper cover 32 on the outer surface of the cutting main body 3, so that in the embodiment, an experimenter or a cutter can directly hold the upper cover 32 with a hand, so that the device can slide when the device is used, and only the device needs to be moved back and forth between the rotating parts 21 when the device does not want to move downwards.
Example 2
In this embodiment, a silicon wafer cutting device with silicon dioxide, includes cutting frame 1, horizontal groove 2 has been seted up to the upper end surface of cutting frame 1, be provided with cutting main part 3 in the horizontal groove 2, the lower extreme of cutting main part 3 is provided with blade 361, the 2 inner walls in horizontal groove are provided with two sections moving parts 35, cutting main part 3 removes in horizontal groove 2, blade 361 moves down when cutting main part 3 passes through moving part 35. The cutting body 3 comprises a cutting shell 30, the upper end surface of the cutting shell 30 is open, the upper end of the outer wall of the cutting shell 30 is movably connected with an outer ring 34, the outer surface of the outer ring 34 is fixedly connected with outer teeth 341, and the rotating part 21 of the transverse groove 2 is a latch matched with the outer teeth 341; the inner teeth 342 are fixedly connected to the inner surface of the outer ring 34, and the cutting body 3 further includes a driving body 31 which is positioned in the cutting housing 30, is driven by the inner teeth 342, and rotates in a single direction; the outer surface of the driving body 31 is provided with a driving block 33, the driving block 33 is matched with the inner teeth 342, the driving block 33 comprises a fixed section and a movable section, a rotating shaft 331 is connected between the fixed section and the movable section, the rotating shaft 331 is composed of a shaft body and a rotating spring, the elastic force of the spring assists the movable section to reset, the outer surface of one side of the fixed section is fixedly connected with a limiting plate 332, and the limiting plate 332 limits the movable section to rotate towards one side; the cutting housing 30 is provided with a moving part 35, the inner surface of the moving part 35 is provided with a connecting thread, the moving part 35 is connected with a moving plate 37 through the connecting thread, the moving plate 37 moves up and down in the moving part 35, and the upper end of the moving plate 37 is fixedly connected with the driving body 31; the upper end of the blade 361 is provided with a blade shell 36, and the upper end of the blade shell 36 is movably connected with the moving plate 37; the inner surface of the cutting shell 30 is positioned below the moving part 35 and is fixedly connected with a limiting block 38, and the limiting block 38 limits the rotation of the blade shell 36; the upper end of the driving body 31 is movably connected with an upper cover 32, and the upper cover 32 can rotate around the upper end of the driving body 31; the inner surface of the cutting frame 1 starts to be provided with a limiting groove 4, the outer surface of the cutting main body 3 is fixedly connected with a limiting block 39, and the limiting block 39 is in limiting fit with the limiting groove 4; as shown in fig. 7, in order to make the cutting position of the blade 361 more accurate, a reticle block 5 is fixedly connected to the outer surface of one end of the cutting frame 1, the reticle block 5 is a transparent plate, scale marks are arranged on the outer surface of the reticle block 5, the scale marks indicate the direction of the moving axis of the cutting blade 361, and reticle lines indicating the position distance are further arranged, so that people can conveniently position the blade 361, and people can conveniently use the cutting blade 361.
When the silicon wafer positioning device is used, a user can firstly perform scribing treatment on the surface of the silicon wafer to scribe the position needing to be cut or split, then the whole device is positioned by using the reticle block 5 and the scale marks on the surface of the reticle block 5, and then the operation is performed, so that the silicon wafer positioning device is practical.
Example 3
In this embodiment, a silicon wafer cutting device with silicon dioxide, includes cutting frame 1, horizontal groove 2 has been seted up to the upper end surface of cutting frame 1, be provided with cutting main part 3 in the horizontal groove 2, the lower extreme of cutting main part 3 is provided with blade 361, the 2 inner walls in horizontal groove are provided with two sections moving parts 35, cutting main part 3 removes in horizontal groove 2, blade 361 moves down when cutting main part 3 passes through moving part 35. The cutting body 3 comprises a cutting shell 30, the upper end surface of the cutting shell 30 is open, the upper end of the outer wall of the cutting shell 30 is movably connected with an outer ring 34, the outer surface of the outer ring 34 is fixedly connected with outer teeth 341, and the rotating part 21 of the transverse groove 2 is a latch matched with the outer teeth 341; the inner teeth 342 are fixedly connected to the inner surface of the outer ring 34, and the cutting body 3 further includes a driving body 31 which is positioned in the cutting housing 30, is driven by the inner teeth 342, and rotates in a single direction; the outer surface of the driving body 31 is provided with a driving block 33, the driving block 33 is matched with the inner teeth 342, the driving block 33 comprises a fixed section and a movable section, a rotating shaft 331 is connected between the fixed section and the movable section, the rotating shaft 331 is composed of a shaft body and a rotating spring, the elastic force of the spring assists the movable section to reset, the outer surface of one side of the fixed section is fixedly connected with a limiting plate 332, and the limiting plate 332 limits the movable section to rotate towards one side; the cutting housing 30 is provided with a moving part 35, the inner surface of the moving part 35 is provided with a connecting thread, the moving part 35 is connected with a moving plate 37 through the connecting thread, the moving plate 37 moves up and down in the moving part 35, and the upper end of the moving plate 37 is fixedly connected with the driving body 31; the upper end of the blade 361 is provided with a blade shell 36, and the upper end of the blade shell 36 is movably connected with the moving plate 37; the inner surface of the cutting housing 30 is located below the moving portion 35 and is fixedly connected with a limiting block 38, the limiting block 38 limits the rotation of the blade shell 36, in this embodiment, the blade shell 36 may be a square cutting shell, the two shells are connected in a snap-fit manner, and the blade 361 is clamped and fixed, so that the cutter can be conveniently replaced when the cutter is worn or other brittle materials are cut, and this way is also the existing cutter fixing means, and the description is not repeated herein; the upper end of the driving body 31 is movably connected with an upper cover 32, and the upper cover 32 can rotate around the upper end of the driving body 31; the inner surface of the cutting frame 1 starts to be provided with a limiting groove 4, the outer surface of the cutting main body 3 is fixedly connected with a limiting block 39, and the limiting block 39 is in limiting fit with the limiting groove 4; as shown in fig. 9 and 10, the whole device is further modified to electrically control the movement, so that when the blade is repeatedly transversely cut, the blade moves downwards for a certain distance every time a transverse cutting cycle is completed, and is used for testing cutting or cutting a silicon wafer surface protection layer; the outer surface of one side of the cutting frame 1 is fixedly connected with an auxiliary box 6, a controller 61, a motor 62, a screw 63 fixed with an output shaft of the motor 62, a bearing seat 65 movably connected with the other end of the screw 63 and a connecting sheet 64 sleeved on the surface of the screw 63 are arranged in the auxiliary box 6, the output end of the controller 61 is electrically connected with the input end of the motor 62, the other end of the connecting sheet 64 penetrates through the side wall of the auxiliary box 6 and is fixedly connected with the cutting main body 3, the motor 62 can adopt a stepping motor and a corresponding speed reducer in the embodiment, the controller 61 is used for controlling the number of rotating turns of the motor 62, the controller matched with the stepping motor can be adopted and can also adopt an external single chip microcomputer control system to control, the period of the transverse operation of the blade 361 can be calculated by utilizing the number of rotating turns of the motor 62, so as to, the positive and negative rotation of the motor 62 facilitates the controlled repetitive movement of the blade 361 for design and control by the operator.
It should be further noted that, the bottom of the cutting frame 1 may be provided with a corresponding base pillar, which may enable the whole cutting frame 1 to be slightly away from the ground, so as to facilitate the protrusion of the blade 361, and meanwhile, when the method is adopted, the length of the silicon wafer cut or split should be smaller than the length of the cutting frame 1, and the base pillar may adopt a corresponding existing anti-sliding design, so as to facilitate people to cause relative sliding and generate a large influence on the silicon wafer when actually cutting and splitting the silicon wafer, the present application utilizes the unique design of the cutting frame 1, so that the cutting edge of the silicon wafer can be smoother after the cutting operation of the blade 361, and meanwhile, the device can realize the effect of gradually moving down along with the horizontal moving axis in the repeated horizontal cutting movement, so as to facilitate the layered cutting or the regular cutting of the traditional silicon wafer and the silicon wafer body with the protective film, the cutting or splitting of silicon chips and other brittle materials is facilitated, and the cutting or splitting device is practical.
Claims (10)
1. The utility model provides a cutting equipment for silicon chip with silica, its characterized in that, includes cutting frame (1), horizontal groove (2) have been seted up to the upper end surface of cutting frame (1), be provided with cutting main part (3) in horizontal groove (2), the lower extreme of cutting main part (3) is provided with blade (361), horizontal groove (2) inner wall is provided with two sections moving part (35), cutting main part (3) remove in horizontal groove (2), blade (361) move down when cutting main part (3) pass through moving part (35).
2. The cutting apparatus for silicon wafer with silicon dioxide as set forth in claim 1, wherein: the cutting main part (3) is including cutting shell (30), the up end of cutting shell (30) is uncovered, and the outer wall upper end swing joint of cutting shell (30) has outer ring (34), the outer fixed surface of outer ring (34) is connected with external tooth (341), rotation portion (21) of cross slot (2) be with external tooth (341) complex latch.
3. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 2, wherein: the inner surface of the outer ring (34) is fixedly connected with inner teeth (342), and the cutting main body (3) further comprises a driving body (31) which is positioned in the cutting shell (30) and driven by the inner teeth (342) and rotates unidirectionally.
4. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 3, wherein: the surface of driving body (31) is provided with drive block (33), drive block (33) and internal tooth (342) cooperation, drive block (33) are including canned paragraph and activity section, be connected with revolving axle (331) between canned paragraph and the activity section, one side external surface fixed connection of canned paragraph has limiting plate (332), limiting plate (332) restriction activity section is to one side rotation.
5. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 4, wherein: the cutting shell (30) is provided with a moving part (35), the inner surface of the moving part (35) is provided with connecting threads, the moving part (35) is connected with a moving plate (37) through the connecting threads, the moving plate (37) is located in the moving part (35) and moves up and down, and the upper end of the moving plate (37) is fixedly connected with a driving body (31).
6. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 5, wherein: the upper end of the blade (361) is provided with a blade shell (36), and the upper end of the blade shell (36) is movably connected with the moving plate (37); the inner surface of the cutting shell (30) is located below the moving part (35) and is fixedly connected with a limiting block (38), and the limiting block (38) limits the rotation of the blade shell (36).
7. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 6, wherein: the upper end of the driving body (31) is movably connected with an upper cover (32), and the upper cover (32) can rotate around the upper end of the driving body (31).
8. The silicon wafer cutting apparatus with silicon dioxide as set forth in any one of claims 1 to 7, wherein: the inner surface of the cutting frame (1) starts to be provided with a limiting groove (4), the outer surface of the cutting main body (3) is fixedly connected with a limiting block (39), and the limiting block (39) is in limiting fit with the limiting groove (4).
9. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 8, wherein: the outer surface of one end of the cutting frame (1) is fixedly connected with a marking block (5), the marking block (5) is a transparent plate, and the outer surface of the marking block (5) is provided with scale marks.
10. The silicon wafer cutting apparatus with silicon dioxide as set forth in claim 9, wherein: the utility model discloses a cutting frame, including cutting frame (1), be provided with controller (61), motor (62), screw rod (63) fixed with motor (62) output shaft, swing joint in bearing frame (65) of the other end of screw rod (63) and cover in connection piece (64) on screw rod (63) surface in the auxiliary box (6), the output of controller (61) and the input electric connection of motor (62), the other end of connection piece (64) runs through the lateral wall of auxiliary box (6), with cutting main part (3) fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911073438.1A CN110774464A (en) | 2019-11-06 | 2019-11-06 | Silicon wafer cutting equipment with silicon dioxide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911073438.1A CN110774464A (en) | 2019-11-06 | 2019-11-06 | Silicon wafer cutting equipment with silicon dioxide |
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| Publication Number | Publication Date |
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| CN110774464A true CN110774464A (en) | 2020-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911073438.1A Withdrawn CN110774464A (en) | 2019-11-06 | 2019-11-06 | Silicon wafer cutting equipment with silicon dioxide |
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| CN (1) | CN110774464A (en) |
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| CN109049374A (en) * | 2018-09-10 | 2018-12-21 | 张玉锦 | A kind of LED light production monocrystal rod cutter device |
| CN209144559U (en) * | 2018-11-20 | 2019-07-23 | 吴江市鑫凤织造有限公司 | A kind of brocade washs space-variant silk face fabric production disconnecting device |
| CN209289368U (en) * | 2018-12-06 | 2019-08-23 | 淮安恒盛海绵有限公司 | A kind of disconnecting device of sponge |
| CN209453635U (en) * | 2018-10-10 | 2019-10-01 | 青岛天地荟食品有限公司 | A kind of pet food cutting apparatus |
| CN209552686U (en) * | 2018-11-16 | 2019-10-29 | 贵阳天星智能包装有限公司 | A kind of trademark printing machine trimming structure |
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2019
- 2019-11-06 CN CN201911073438.1A patent/CN110774464A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203805041U (en) * | 2014-04-18 | 2014-09-03 | 蔡雁行 | Liftable cutting device |
| CN107283657A (en) * | 2017-07-14 | 2017-10-24 | 合肥文胜新能源科技有限公司 | Silicon wafer cutting device |
| CN208005011U (en) * | 2018-02-07 | 2018-10-26 | 江苏利奥新材料科技有限公司 | A kind of silicon wafer cutting device with watering cooling function |
| CN108621314A (en) * | 2018-04-28 | 2018-10-09 | 佛山鼎容软件科技有限公司 | A kind of Production of Transistor that stability is strong silicon chip quantitative cutting device |
| CN109049374A (en) * | 2018-09-10 | 2018-12-21 | 张玉锦 | A kind of LED light production monocrystal rod cutter device |
| CN209453635U (en) * | 2018-10-10 | 2019-10-01 | 青岛天地荟食品有限公司 | A kind of pet food cutting apparatus |
| CN209552686U (en) * | 2018-11-16 | 2019-10-29 | 贵阳天星智能包装有限公司 | A kind of trademark printing machine trimming structure |
| CN209144559U (en) * | 2018-11-20 | 2019-07-23 | 吴江市鑫凤织造有限公司 | A kind of brocade washs space-variant silk face fabric production disconnecting device |
| CN209289368U (en) * | 2018-12-06 | 2019-08-23 | 淮安恒盛海绵有限公司 | A kind of disconnecting device of sponge |
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Application publication date: 20200211 |
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| WW01 | Invention patent application withdrawn after publication |