CN208005011U - A kind of silicon wafer cutting device with watering cooling function - Google Patents
A kind of silicon wafer cutting device with watering cooling function Download PDFInfo
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- CN208005011U CN208005011U CN201820209429.5U CN201820209429U CN208005011U CN 208005011 U CN208005011 U CN 208005011U CN 201820209429 U CN201820209429 U CN 201820209429U CN 208005011 U CN208005011 U CN 208005011U
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- main body
- telescopic rod
- water
- apparatus main
- water tank
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Abstract
The utility model discloses a kind of silicon wafer cutting devices with watering cooling function, including apparatus main body, supporting rod, supporting rack, idler wheel, water tank, fixture block and discharge outlet, it is connected with the first telescopic rod below the hydraulic telescopic rod, it is connected with motor below first telescopic rod, and laser knife is inlaid with inside motor, the supporting rod is installed on apparatus main body both sides, it is connected with spring on the right side of the clamping plate, the idler wheel is installed on support frame bottom, the water tank is installed below apparatus main body, it is connected with water pipe above the water outlet, guide rail is installed above the hydraulic telescopic rod, and guide rail both sides are equipped with lead screw, sliding block is installed among the guide rail.This has the silicon wafer cutting device of watering cooling function, is provided with water tank, water tank is internally provided with water pump, reconnecting water pipe by pump sump makes water enter nozzle, silicon chip is sprayed, generated heat when to reduce cutting, lubrication can also be played the role of when processing.
Description
Technical field
The utility model is related to silicon chip cutter technical field, specially a kind of silicon chip cutting with watering cooling function
Device.
Background technology
With economic prosperity, the continuous raising of people's living standard, the development of production technology is become better and better, people
It is more and more harsher to the utilization of oneself time, in life, our requirements for equipment are higher and higher, it is desirable to be able to by right
Innovating to improve the working efficiency of equipment for equipment, reduces the working time, improves service efficiency, be allowed to play maximum valence
Value significantly develops with the development of science and technology, the silicon wafer cutting device with watering cooling function has, its development is given
People bring great convenience when being cut to silicon chip.Silicon wafer cutting device currently on the market cannot be such that silicon chip obtains
It is fixed well, during being cut to silicon chip, many heats can be distributed, the service life of device can be influenced in this way.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of silicon wafer cutting device with watering cooling function
Background technology propose currently on the market silicon chip cannot be made to be well fixed, during being cut to silicon chip,
The problem of many heats can be distributed, the service life of device can be influenced in this way.
To achieve the above object, the utility model provides the following technical solutions：Including apparatus main body, supporting rod, supporting rack,
Idler wheel, water tank, fixture block and discharge outlet, described device body top is provided with rack, and is connected with hydraulic pressure below rack and stretches
Contracting bar, the hydraulic telescopic rod lower section are connected with the first telescopic rod, are connected with motor below first telescopic rod, and in motor
Portion is inlaid with laser knife, and the supporting rod is installed on apparatus main body both sides, and is connected with clamping plate, the clamping plate above apparatus main body
Right side is connected with spring, and sliding panel is provided on the right side of spring, and support frame as described above is installed below apparatus main body, and in supporting rack
Portion is inlaid with the second telescopic rod, and regulation button is connected on the right side of second telescopic rod, and the idler wheel is installed on support frame bottom,
The water tank is installed below apparatus main body, and water tank is internally provided with water pump, and water inlet, and water are provided on the left of the water pump
Pump top is provided with water outlet, water pipe is connected with above the water outlet, and be connected with fixed block, the fixed block above water pipe
Right side is provided with nozzle, and the fixture block is installed on the left of water tank, and is connected with rotary shaft above fixture block, and the discharge outlet is set to
Both sides above and below apparatus main body, and backing plate is provided among discharge outlet, guide rail, and guide rail two are installed above the hydraulic telescopic rod
Side is equipped with lead screw, and sliding block is equipped among the guide rail.
Preferably, it is stretching structure between described device main body and supporting rack, and is between supporting rack and the second telescopic rod
Socket.
Preferably, it is stretching structure between the hydraulic telescopic rod and laser knife, and is sliding between laser knife and guide rail
Connection.
Preferably, it to be slidably connected between the clamping plate and sliding panel, and is structure as a whole between clamping plate and sliding panel.
Preferably, the water tank is by being snap-in structure between fixture block and apparatus main body, and between apparatus main body and fixture block
For rotational structure, and the rotation angle range of fixture block is 0-90 °.
Preferably, there are two the discharge outlet is arranged altogether, and discharge outlet is symmetrically distributed in the both sides up and down of apparatus main body.
Compared with prior art, the utility model has the beneficial effects that：This has the silicon chip cutting dress of watering cooling function
It sets：
1. being provided with water tank, water tank is internally provided with water pump, and reconnecting water pipe by pump sump makes water enter nozzle, right
Silicon chip is sprayed, generated heat when to reduce cutting, can also be played the role of lubrication when processing, be made to cut
The efficiency cut improves, while extra water can be flow in water tank again by discharge outlet, play the role of recycling；
2. being provided with clamping plate, when being processed silicon chip, needing that silicon chip is made to be fixed, clamping plate can fix silicon chip,
Clamping plate can carry out left and right activity by spring, so as to which the silicon chip of different in width is clamped；
3. being provided with hydraulic telescopic rod, laser knife is allow to move up and down, keeps the range that silicon chip is cut wider, simultaneously
By stretching, laser knife preferably can be cleaned and be replaced, avoids laser cutter position is too low from being inconvenient to clean and replace；
4. being provided with fixture block, water tank can be made to fix in a device, fixture block can be opened by rotary shaft, convenient in water tank
Water replaced, be also convenient for Tank Injection Water.
Description of the drawings
Fig. 1 is this practicality main view cross-sectional view；
Fig. 2 is the utility model overlooking structure diagram；
Fig. 3 is partial enlargement structural representation at the utility model A.
In figure：1, apparatus main body, 2, rack, 3, hydraulic telescopic rod, the 4, first telescopic rod, 5, motor, 6, laser knife, 7,
Supporting rod, 8, clamping plate, 9, spring, 10, sliding panel, 11, supporting rack, the 12, second telescopic rod, 13, regulation button, 14, idler wheel,
15, water tank, 16, water pump, 17, water inlet, 18, water outlet, 20, water pipe, 21, fixed block, 22, nozzle, 23, fixture block, 24, rotation
Axis, 25, discharge outlet, 26, backing plate, 27, guide rail, 28, lead screw, 29, sliding block.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：Including apparatus main body 1, rack 2, hydraulically extensible
Bar 3, the first telescopic rod 4, motor 5, laser knife 6, supporting rod 7, clamping plate 8, spring 9, sliding panel 10, supporting rack 11, second are flexible
Bar 12, regulation button 13, idler wheel 14, water tank 15, water pump 16, water inlet 17, water outlet 18, water pipe 19, fixed block 20, nozzle
21, fixture block 22, rotary shaft 23, discharge outlet 24, backing plate 25, guide rail 26, lead screw 27 and sliding block 28,1 top of apparatus main body are provided with
Rack 2, and 2 lower section of rack is connected with hydraulic telescopic rod 3, is stretching structure between apparatus main body 1 and supporting rack 11, and prop up
It is socket between support 11 and the second telescopic rod 12, cutting can be facilitated with the height of regulating device main body 1, under hydraulic telescopic rod 3
Side is connected with the first telescopic rod 4, is stretching structure between hydraulic telescopic rod 3 and laser knife 6, and between laser knife 6 and guide rail 26
To be slidably connected, laser knife 6 can be made to be moved left and right, increase cut coverage, while laser knife 6 can carry out stretching up and down,
Facilitate cutting, be also convenient for carrying out height adjusting to laser knife 6, easy to clean, 4 lower section of the first telescopic rod is connected with motor 5, and electricity
Laser knife 6 is inlaid with inside machine 5, supporting rod 7 is installed on 1 both sides of apparatus main body, and 1 top of apparatus main body is connected with clamping plate 8, presss from both sides
It to be slidably connected between plate 8 and sliding panel 10, and is structure as a whole between clamping plate 8 and sliding panel 10, clamping plate 8 can be such that silicon chip obtains
It is fixed to better, so that clamping plate 8 is moved by spring 9, the silicon chip of different in width can be clamped, 8 right side of clamping plate is connected with
Spring 9, and 9 right side of spring is provided with sliding panel 10, supporting rack 11 is installed on 1 lower section of apparatus main body, and 11 inside edge of supporting rack
Embedded with the second telescopic rod 12,12 right side of the second telescopic rod is connected with regulation button 13, and idler wheel 14 is installed on 11 bottom of supporting rack, water
Case 15 is installed on 1 lower section of apparatus main body, and water tank 15 is internally provided with water pump 16, and water tank 15 passes through fixture block 22 and apparatus main body 1
Between be snap-in structure, and between apparatus main body 1 and fixture block 22 be rotational structure, and the rotation angle range of fixture block 22 be 0-
90 °, the water of water tank 15, which can be sprayed by water pump 16 from nozzle 21, sprinkles water to silicon chip, reduces what machine cutting was distributed
Heat, water tank 15 can be dismantled by fixture block 22, and 15 water filling of feed-tank and cleaning, 16 left side of water pump is facilitated to be provided with water inlet
17, and 16 top of water pump is provided with water outlet 18,18 top of water outlet is connected with water pipe 19, and 19 top of water pipe is connected with fixation
Block 20,20 right side of fixed block are provided with nozzle 21, and fixture block 22 is installed on 15 left side of water tank, and 22 top of fixture block is connected with rotary shaft
23, discharge outlet 24 is set to about 1 both sides of apparatus main body, and backing plate 25 is provided among discharge outlet 24, and discharge outlet 24 is arranged altogether
There are two, and discharge outlet 24 is symmetrically distributed in the both sides up and down of apparatus main body 1, and water pump 16 can be made to spray extra water, passed through
Discharge outlet 24 is flow in water tank 15, can reach the effect that water is recycled, and 3 top of hydraulic telescopic rod is equipped with guide rail 26,
And 26 both sides of guide rail are equipped with lead screw 27, and sliding block 28 is equipped among guide rail 26.
Operation principle：When having the silicon wafer cutting device of watering cooling function using this, first above apparatus main body 1
Rack 2 is for placing motor 5, and motor 5 makes laser knife 6 work, and hydraulic telescopic rod 3 can drive laser knife 6 to stretch,
The height for adjusting laser knife 6, laser knife 6 is facilitated to be moved left and right with sliding block 28 by the lead screw 27 of 26 both sides of guide rail, make to swash
The range that finishing tool 6 is cut is wider, and clamping plate 8 makes sliding panel 10 be moved left and right, make clamping plate 8 for fixing silicon chip by spring 9
Can be clamped the silicon chip of different in width, 15 inside of water tank can water filling, absorbed water by the water pump 16 inside water tank 15, sucking
Water connects water pipe 19 by water outlet 18 and is sprayed from nozzle 21, plays the role of carrying out watering cooling to apparatus main body 1, fixed
Block 20 makes water pipe be fixed, and water tank 15 is fixed by fixture block 22, and fixture block 22 can be opened by rotary shaft 23, convenient pair
Water tank 15 carries out water filling and dismounting, is also convenient for cleaning water tank, the height of 12 adjustable apparatus main body 1 of the second telescopic rod, convenience pair
Silicon chip is cut, and regulation button 13 belongs to this for fixing the second telescopic rod 12, the content not being described in detail in this explanation
The prior art well known to skilled artisan.
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art is come
Say, still can with technical scheme described in the above embodiments is modified, or to which part technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (6)
1. a kind of silicon wafer cutting device with watering cooling function, including apparatus main body（1）, supporting rod（7）, supporting rack
（11）, idler wheel（14）, water tank（15）, fixture block（22）And discharge outlet（24）, it is characterised in that：Described device main body（1）Top is set
It is equipped with rack（2）, and rack（2）Lower section is connected with hydraulic telescopic rod（3）, the hydraulic telescopic rod（3）Lower section is connected with
First telescopic rod（4）, first telescopic rod（4）Lower section is connected with motor（5）, and motor（5）Inside is inlaid with laser knife
（6）, the supporting rod（7）It is installed on apparatus main body（1）Both sides, and apparatus main body（1）Top is connected with clamping plate（8）, the folder
Plate（8）Right side is connected with spring（9）, and spring（9）Right side is provided with sliding panel（10）, support frame as described above（11）It is installed on device
Main body（1）Lower section, and supporting rack（11）Inside is inlaid with the second telescopic rod（12）, second telescopic rod（12）Right side is connected with
Regulation button（13）, the idler wheel（14）It is installed on supporting rack（11）Bottom, the water tank（15）It is installed on apparatus main body（1）Under
Side, and water tank（15）It is internally provided with water pump（16）, the water pump（16）Left side is provided with water inlet（17）, and water pump（16）On
Side is provided with water outlet（18）, the water outlet（18）Top is connected with water pipe（19）, and water pipe（19）Top is connected with fixation
Block（20）, the fixed block（20）Right side is provided with nozzle（21）, the fixture block（22）It is installed on water tank（15）Left side, and fixture block
（22）Top is connected with rotary shaft（23）, the discharge outlet（24）It is set to apparatus main body（1）Upper and lower both sides, and discharge outlet（24）
Centre is provided with backing plate（25）, the hydraulic telescopic rod（3）Top is equipped with guide rail（26）, and guide rail（26）Both sides are equipped with silk
Bar（27）, the guide rail（26）Centre is equipped with sliding block（28）.
2. a kind of silicon wafer cutting device with watering cooling function according to claim 1, it is characterised in that：The dress
Set main body（1）With supporting rack（11）Between be stretching structure, and supporting rack（11）With the second telescopic rod（12）Between for socket.
3. a kind of silicon wafer cutting device with watering cooling function according to claim 1, it is characterised in that：The liquid
Press telescopic rod（3）With laser knife（6）Between be stretching structure, and laser knife（6）With guide rail（26）Between to be slidably connected.
4. a kind of silicon wafer cutting device with watering cooling function according to claim 1, it is characterised in that：The folder
Plate（8）With sliding panel（10）Between to be slidably connected, and clamping plate（8）With sliding panel（10）Between be structure as a whole.
5. a kind of silicon wafer cutting device with watering cooling function according to claim 1, it is characterised in that：The water
Case（15）Pass through fixture block（22）With apparatus main body（1）Between be snap-in structure, and apparatus main body（1）With fixture block（22）Between for rotation
Rotation structure, and fixture block（22）Rotation angle range be 0-90 °.
6. a kind of silicon wafer cutting device with watering cooling function according to claim 1, it is characterised in that：The row
The mouth of a river（24）Altogether there are two settings, and discharge outlet（24）It is symmetrically distributed in apparatus main body（1）Both sides up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820209429.5U CN208005011U (en) | 2018-02-07 | 2018-02-07 | A kind of silicon wafer cutting device with watering cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820209429.5U CN208005011U (en) | 2018-02-07 | 2018-02-07 | A kind of silicon wafer cutting device with watering cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208005011U true CN208005011U (en) | 2018-10-26 |
Family
ID=63886091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820209429.5U Expired - Fee Related CN208005011U (en) | 2018-02-07 | 2018-02-07 | A kind of silicon wafer cutting device with watering cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208005011U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110435026A (en) * | 2019-08-11 | 2019-11-12 | 赫晓苓 | A kind of photovoltaic slice device that can cut conversion and break-resistance in real time |
| CN110774464A (en) * | 2019-11-06 | 2020-02-11 | 徐州如轩电气配件有限公司 | Silicon wafer cutting equipment with silicon dioxide |
| CN113399845A (en) * | 2021-05-27 | 2021-09-17 | 安徽中科春谷激光产业技术研究院有限公司 | Laser cutting device |
-
2018
- 2018-02-07 CN CN201820209429.5U patent/CN208005011U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110435026A (en) * | 2019-08-11 | 2019-11-12 | 赫晓苓 | A kind of photovoltaic slice device that can cut conversion and break-resistance in real time |
| CN110435026B (en) * | 2019-08-11 | 2021-06-04 | 安徽伟迈信息技术有限公司 | Photovoltaic section device capable of cutting, converting and preventing breakage in real time |
| CN110774464A (en) * | 2019-11-06 | 2020-02-11 | 徐州如轩电气配件有限公司 | Silicon wafer cutting equipment with silicon dioxide |
| CN113399845A (en) * | 2021-05-27 | 2021-09-17 | 安徽中科春谷激光产业技术研究院有限公司 | Laser cutting device |
| CN113399845B (en) * | 2021-05-27 | 2022-12-20 | 安徽中科春谷激光产业技术研究院有限公司 | Laser cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20200207 |