CN110767104A - LED display screen and preparation method thereof - Google Patents
LED display screen and preparation method thereof Download PDFInfo
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- CN110767104A CN110767104A CN201810827538.8A CN201810827538A CN110767104A CN 110767104 A CN110767104 A CN 110767104A CN 201810827538 A CN201810827538 A CN 201810827538A CN 110767104 A CN110767104 A CN 110767104A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 49
- 239000012790 adhesive layer Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000003086 colorant Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
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- 150000003818 basic metals Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Power Engineering (AREA)
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Abstract
The invention discloses a preparation method of an LED display screen, which comprises the following steps: presetting a temporary jig consisting of a first base plate with a plurality of placing grooves and a cover plate, and alternately placing R, G and B three-color LEDs in the placing grooves through inlets of the placing grooves; attaching the temporary jig by using a side cover, replacing the cover plate by using an LED substrate, and attaching each LED to the LED substrate; and removing the first substrate and the side cover, sealing the LED substrate, and connecting the circuit board with the LED substrate to obtain the LED display screen. According to the invention, the LED is placed in the placing groove of the temporary jig, the cover plate of the temporary jig is replaced by the LED substrate, and the LED substrate and the LED are pressed together, so that the LED and the LED substrate are quickly connected, and the production efficiency of the LED screen can be greatly improved.
Description
Technical Field
The invention relates to the field of display screens, in particular to an LED display screen and a preparation method thereof.
Background
With the continuous development of LED display screens, the MINI LED or MICRO LED display screens are receiving attention due to their characteristics of high brightness, high contrast, ultra-high resolution and color saturation. The MINI LED or MICRO LED display screen is composed of a plurality of LED (R, G, B) arrays, and each LED can be independently driven, so that the MINI LED or MICRO LED display screen also has the advantages of electricity saving, high response speed and the like. However, in the current MINI LED or MICRO LED display screen, LEDs need to be clamped one by one on a PCB during the manufacturing process, and the LED solder feet are precisely aligned with the PCB pads, which has a high requirement on the technology and manufacturing precision of the manufacturer, and on the other hand, when a large number of LEDs are transferred, a large amount of time needs to be divided by manually performing bonding alignment, so that the production efficiency of the MINI LED or MICRO LED display screen is low.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention aims to provide an LED display screen and a manufacturing method thereof, which can realize the bonding alignment of LEDs while realizing the transfer of LEDs rapidly.
The technical scheme of the invention is as follows:
a preparation method of an LED display screen comprises the following steps:
presetting a temporary jig consisting of a first base plate with a plurality of placing grooves and a cover plate, and alternately placing R, G and B three-color LEDs in the placing grooves through inlets of the placing grooves, wherein the colors of the LEDs in the same placing groove are the same;
attaching the temporary jig by adopting a side cover, replacing the cover plate by adopting an LED substrate, and attaching each LED to the LED substrate;
and replacing the first substrate with a transparent layer, removing the side cover, simultaneously sealing the LED substrate, and connecting the circuit board with the LED substrate to obtain the LED display screen.
The preparation method of the LED display screen comprises the following steps of attaching the side cover to the temporary jig, replacing the cover plate with the LED substrate, and attaching the LEDs to the LED substrate:
attaching the temporary jig by adopting a side cover and removing the cover plate, wherein the side cover covers the inlet of the placing groove;
the LED substrate is provided with a conductive adhesive layer in a pressing mode, is positioned on one side, away from the first substrate, of the LED and is electrically connected with the LEDs through the conductive adhesive layer.
The preparation method of the LED display screen comprises the following steps of replacing the first substrate with the transparent layer, removing the side cover, sealing the LED substrate, and connecting the circuit board and the LED substrate to obtain the LED display screen, wherein the steps of:
removing the first substrate and the side cover, and coating screen sealing glue along the circumferential direction to perform side screen sealing on the LED substrate;
and carrying out upper screen sealing on the LED substrate by adopting a transparent layer, and connecting the circuit board with the LED substrate to manufacture the LED display screen, wherein the transparent layer covers the light emitting surface of the LED.
According to the preparation method of the LED display screen, the transparent layer is one of transparent glass or a film.
According to the preparation method of the LED display screen, the light emitting surfaces of the R, G and the three-color LED B are attached to the first substrate.
The manufacturing method of the LED display screen comprises the step of arranging a plurality of placing grooves on the LED display screen, wherein the number of the placing grooves is multiple of three.
The manufacturing method of the LED display screen comprises the steps that at least one LED is placed in the placing grooves, and the number of the LEDs placed in each placing groove is the same.
According to the preparation method of the LED display screen, the LED substrate further comprises a metal wire layer and a second substrate, the conductive adhesive layer, the metal wire layer and the second substrate are stacked in sequence, and each LED is fixed on the second substrate through the conductive adhesive layer and is electrically connected with the metal wire layer.
According to the manufacturing method of the LED display screen, the conductive adhesive layer is an ACF adhesive layer, and metal conductive particles are arranged in the ACF adhesive layer so as to electrically connect the LED pins with the metal layer through the metal conductive particles.
The LED display screen is prepared by the preparation method of the LED display screen.
Has the advantages that: according to the invention, the LED is placed in the placing groove of the temporary jig, the cover plate of the temporary jig is replaced by the LED substrate, and the LED substrate and the LED are pressed together, so that the LED and the LED substrate are quickly connected, and the production efficiency of the LED screen can be greatly improved.
Drawings
Fig. 1 is a flowchart of an embodiment of a method for manufacturing an LED display screen according to the present invention.
Fig. 2 is a schematic structural diagram of a first substrate in the method for manufacturing an LED display screen according to the present invention.
Fig. 3 is a schematic structural diagram of a temporary jig in the LED display screen manufacturing method provided by the present invention.
Fig. 4 is a schematic view of a temporary jig provided with LEDs in the LED display screen manufacturing method provided by the present invention.
Fig. 5 is a schematic structural diagram of an LED display screen according to the method for manufacturing an LED display screen of the present invention after attaching a side cover.
Fig. 6 is a schematic view of an LED display screen provided by the present invention after a cover plate is removed.
Fig. 7 is a schematic diagram of an LED substrate attached in the LED display screen manufacturing method provided by the present invention.
Fig. 8 is a schematic structural diagram of a viewing angle of an LED substrate in the LED display screen manufacturing method provided by the present invention.
Fig. 9 is a schematic structural diagram of another viewing angle of the LED substrate in the LED display screen manufacturing method provided by the present invention.
Fig. 10 is a schematic structural diagram of another viewing angle of the LED substrate in the LED display screen manufacturing method provided by the present invention.
Fig. 11 is a schematic structural diagram of an LED display panel manufacturing method provided by the present invention after removing the first substrate and the side plate.
Fig. 12 is a schematic view of an LED display screen after a sealing layer is attached in the manufacturing method of the present invention.
Fig. 13 is a schematic view of an LED display screen after a transparent layer is attached in the manufacturing method of the present invention.
Fig. 14 is a schematic structural diagram of an LED display screen provided in the present invention.
Detailed Description
The invention provides an LED display screen and a preparation method thereof, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment provides a method for manufacturing an LED display screen, as shown in fig. 1, the method includes the steps of:
s10, presetting a temporary jig consisting of a first base plate with a plurality of placing grooves and a cover plate, and alternately placing R, G LEDs and B three-color LEDs in the placing grooves through inlets of the placing grooves, wherein the colors of the LEDs in the same placing groove are the same;
s20, attaching the temporary jig by adopting a side cover, and attaching the LEDs to the LED substrate while replacing the cover plate by adopting the LED substrate;
s30, replacing the first substrate with a transparent layer, removing the side cover, simultaneously sealing the LED substrate, and connecting the circuit board with the LED substrate to obtain the LED display screen.
According to the invention, R, G and B three-color LEDs are sequentially placed in each placing groove 2 of the temporary jig, the R, G and B three-color LEDs are fixed by the temporary jig, and then the LED substrate is adopted to replace the cover plate and is pressed with the R, G and B three-color LEDs, so that a plurality of R, G and B three-color LEDs are simultaneously aligned and pressed with the LED substrate, the LEDs are rapidly transferred, and the production efficiency of the LEDs is improved.
Specifically, in step S10, the temporary jig is a jig for manufacturing the LED display screen. As shown in fig. 2 and 3, the temporary jig includes a first base plate 1 having a plurality of placement grooves 2, and a cover plate 3, the cover plate 3 is detachably attached to the first base plate 1, and forms a box structure having a side opening with the first base plate 1, the plurality of placement grooves 2 are located in the box structure, and a placement groove inlet 4 of each placement groove 2 is communicated with the side opening, so that each LED can be pushed into the placement groove 2 through the placement groove inlet 4 and positioned by the placement groove 2. In this embodiment, the first substrate 1 includes a first substrate 1 body, and 2 first side plates disposed in parallel and a second side plate disposed perpendicular to the first side plates are disposed around the first substrate 1 body. A plurality of baffles are arranged on the body of the first base plate 1 along the extending direction of the first side plate, and the baffles and the first side plate form the plurality of placing grooves 2. The heights of the first side plate, the second side plate and the plurality of baffles are equal.
The width of the placing groove 2 is matched with the width of an LED to be placed, the depth of the placing groove 2 is matched with the thickness of the LED to be placed, and the length of the placing groove 2 can be determined according to the size of the LED display screen. So that the LED can be pushed into the placement groove 2 and can also be positioned by the placement groove 2. In this embodiment, the two adjacent placing grooves 2 may be isolated by a baffle plate, and the thickness of the baffle plate is equal to the interval between two adjacent color LEDs. Certainly, in practical application, the baffle between two adjacent placing grooves 2 can be replaceable, that is, the baffle is detachably connected with the first substrate 1, so that the baffle can be replaced according to the interval requirement of various colors of LEDs of the LED display screen to be processed, and the universality of the jig is improved.
Meanwhile, in the present embodiment, as shown in fig. 4, the LEDs include R color LEDs 5, G color LEDs 6, and B color LEDs 7, the three color LEDs are alternately pushed into the placement grooves 2, at least one LED is placed in each placement groove 2, and the colors and the numbers of the LEDs placed in each placement groove 2 are the same. In practical application, a plurality of placing grooves 2 can be sorted (for example, sorting is performed according to the placing sequence of the placing grooves 2), R color LEDs are sequentially pushed into the placing grooves 2 in the first sorting, G color LEDs are sequentially pushed into the placing grooves 2 in the second sorting after the placing grooves 2 in the first sorting are filled, B color LEDs are sequentially pushed into the placing grooves 2 in the third sorting after the placing grooves 2 in the second sorting are filled, and the above process is repeated until all the placing grooves 2 are filled after the placing grooves 2 in the third sorting are filled, so that R, G and B three-color LEDs (5, 6, 7) are uniformly arranged, and the color saturation of the LED display screen is improved. In addition, in order to provide the color saturation of the LED display screen, R, G of the LED display screen configuration and the number of LEDs of B color are the same, that is, the number of the placement grooves 2 is a multiple of 3. Of course, in the modified embodiment of the present embodiment, the color and number of the LEDs disposed in each of the disposition slots 2 and the arrangement of the R, G and the B three-color LEDs may be determined according to the disposition relationship of the R, G and the B three-color LEDs in the LED display screen, and the description thereof is not repeated here.
Further, when pushing the LED into the placing groove 2, the light emitting surface of the LED faces the first substrate 1 so as to push the LED into the placing groove 2, and the flatness of the light emitting surface of the LED is better than that of the leg surface, so that when pushing the LED into the placing groove 2, the friction between the LED and the placing groove 2 can be reduced, and the LED can be conveniently pushed into the placing groove 2. Meanwhile, the abrasion to the LED welding foot surface in the pushing process can be reduced, the probability of poor contact between welding and the circuit board 12 is reduced, and therefore the quality of the LED is improved.
In step S20, as shown in fig. 5, the side cover 8 is used to cover the side opening of the temporary fixture, when the side cover 8 is attached to the temporary fixture, the temporary fixture is sealed into a sealed box, and the LED is located in the sealed box. In addition, as shown in fig. 6, after the side cover 8 is attached to the temporary jig, the cover plate 3 covering the first substrate 1 is removed to expose the fillet surface of the LED. The light emitting surface of the LED faces the first substrate 1, the cover plate 3 covers the first substrate 1, and the LED is located in a box formed by the first substrate 1 and the cover plate 3, so that the solder leg surface of the LED faces the cover plate 3, and when the cover plate 3 is removed, the solder leg surface of the LED is exposed.
Exemplarily, attaching the side cover to the temporary jig, replacing the cover plate with an LED substrate, and attaching each LED to the LED substrate specifically include:
s21, attaching the temporary jig by adopting a side cover and removing the cover plate, wherein the side cover covers the inlet of the placing groove;
and S22, pressing the LED substrate provided with the conductive adhesive layer on the first substrate, wherein the LED substrate is positioned on one side of the LED, which is far away from the first substrate, and is electrically connected with the LEDs through the conductive adhesive layer.
Specifically, as shown in fig. 7, the LED substrate is provided with a conductive adhesive layer, the LED substrate is assembled on the first substrate 1, and the LED substrate covers the LEDs and the LEDs are electrically connected to the LED substrate through the conductive adhesive layer. That is to say, the welding surfaces of the LEDs face the LED substrate, and the welding surfaces of the LEDs are in contact with the conductive adhesive layer. In addition, when the LED substrate is assembled on the first substrate, the LED substrate is pressed, so that the LEDs are attached to the LED substrate.
As shown in fig. 8-10, the LED substrate is a TFT substrate, the TFT substrate further includes a metal wire layer 92 and a second substrate 91, and the conductive adhesive layer 93, the metal wire layer 92 and the second substrate 91 are sequentially stacked. The conductive adhesive layer 93 contacts with the LEDs, and the LEDs are attached to the second substrate 91 through the conductive adhesive layer 93. The conductive adhesive layer 93 may be an ACF adhesive layer, in which metal conductive particles 931 are doped, and when the bonding surface of the LED is substantially attached to the second substrate through the ACF adhesive layer, the bonding pins 51 of the LED are embedded in the ACF adhesive layer, and the metal conductive particles 931 in the ACF adhesive layer are used as conduction and conducted with metal wires disposed on the second substrate 91. Wherein the second substrate 91 may have the metal wire layer 92 formed thereon in the form of coating, developing, and etching. In addition, since the ACF glue layer may send an overflow imagine during the pressing process, the size of the ACF glue layer is smaller than the second basic portion, so that the ACF glue layer may be prevented from overflowing the second substrate 91 during the pressing process.
Further, in step S30, as shown in fig. 11, the side cover 8 and the first substrate 1 are left with the LED and the LED substrate attached to the LED substrate. In addition, in order to fix the LEDs on the LED substrate for shielding, as shown in fig. 12, a shielding layer 10 formed by shielding is disposed along the circumferential direction of the LED array formed by the LEDs to seal the circumferential direction of the LED array, so as to prevent light generated by the LED array from leaking from the circumferential direction. In this embodiment, the sealing may be performed by using a sealing adhesive, that is, the sealing adhesive is coated on the LED substrate.
Exemplarily, replacing the first substrate with a transparent layer, removing the side cover, simultaneously sealing the LED substrate, and connecting the circuit board with the LED substrate to obtain the LED display screen specifically includes:
s31, removing the first substrate and the side cover, and carrying out side screen sealing on the LED substrate along the circumferential direction;
and S32, carrying out upper screen sealing on the LED substrate by adopting a transparent layer, and connecting the circuit board with the LED substrate to obtain the LED display screen, wherein the transparent layer covers the light emitting surface of the LED.
Specifically, as shown in fig. 13, the transparent layer 11 covers the light emitting surface of the LED, and covers and fixes the LEDs through the transparent layer 11, and meanwhile, the light generated by the LEDs can be radiated through the transparent layer 11, wherein the transparent layer 11 may be transparent glass or a transparent film. As shown in fig. 14, the circuit board 12 is connected to the LED basic metal wire layer 92, and is connected to an external driver through the circuit board 12 to drive the display screen. The circuit board 12 may be a PCB or FPC line.
The invention provides an LED display screen, as shown in FIG. 14, the LED display screen is prepared by the preparation method of the LED display screen. The LED display screen comprises an LED array and an LED substrate, wherein the LED array is pressed on the LED substrate. As shown in fig. 9 to 11, the LED basically comprises the TFT basically comprising a conductive adhesive layer 93, a metal wire layer 92 and a second substrate 91, wherein the conductive adhesive layer 93, the metal wire layer 92 and the second substrate 91 are stacked in sequence. The conductive adhesive layer 93 contacts with the LEDs, and the LEDs are attached to the second substrate 91 through the conductive adhesive layer 93. The conductive adhesive layer 93 may be an ACF adhesive layer, in which metal conductive particles 931 are doped, and when the bonding surface of the LED is substantially attached to the second substrate through the ACF adhesive layer, the bonding pins 51 of the LED are embedded in the ACF adhesive layer, and the metal conductive particles 931 in the ACF adhesive layer are used as conduction and conducted with metal wires disposed on the second substrate 91. Wherein the second substrate 91 may have the metal wire layer 92 formed thereon in the form of coating, developing, and etching. In addition, since the ACF glue layer may send an overflow imagine during the pressing process, the size of the ACF glue layer is smaller than the second basic portion, so that the ACF glue layer may be prevented from overflowing the second substrate 91 during the pressing process.
In addition, the LED display screen further includes a transparent layer 11 located on the light emitting surface of the LED array and a sealing layer 10 disposed around the LED array, where the transparent layer 11 may be used to cover and fix each LED, and meanwhile, light generated by each LED may be irradiated out through the transparent layer 11, and the transparent layer 11 may be transparent glass or a transparent film. The screen sealing layer 10 is used for fixing and sealing the periphery of the LED array. In addition, the LED display screen further comprises a circuit board 12, wherein the circuit board 12 is connected with the LED basic metal wire layer 92, and is connected with an external driver through the circuit board 12 to drive the display screen. The circuit board 12 may be a PCB or FPC line.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A preparation method of an LED display screen is characterized by comprising the following steps:
presetting a temporary jig consisting of a first base plate with a plurality of placing grooves and a cover plate, and alternately placing R, G and B three-color LEDs in the placing grooves through inlets of the placing grooves, wherein the colors of the LEDs in the same placing groove are the same;
attaching the temporary jig by adopting a side cover, replacing the cover plate by adopting an LED substrate, and attaching each LED to the LED substrate;
and replacing the first substrate with a transparent layer, removing the side cover, simultaneously sealing the LED substrate, and connecting the circuit board with the LED substrate to obtain the LED display screen.
2. The method for manufacturing the LED display screen according to claim 1, wherein the attaching the temporary jig by using the side cover, replacing the cover plate by using the LED substrate, and attaching the LEDs to the LED substrate specifically comprises:
attaching the temporary jig by adopting a side cover and removing the cover plate, wherein the side cover covers the inlet of the placing groove;
the LED substrate is provided with a conductive adhesive layer in a pressing mode, is positioned on one side, away from the first substrate, of the LED and is electrically connected with the LEDs through the conductive adhesive layer.
3. The method for manufacturing the LED display screen according to claim 1, wherein the step of replacing the first substrate with the transparent layer, removing the side cover, sealing the LED substrate, and connecting the circuit board with the LED substrate to manufacture the LED display screen specifically comprises the steps of:
removing the first substrate and the side cover, and coating screen sealing glue along the circumferential direction to perform side screen sealing on the LED substrate;
and carrying out upper screen sealing on the LED substrate by adopting a transparent layer, and connecting the circuit board with the LED substrate to manufacture the LED display screen, wherein the transparent layer covers the light emitting surface of the LED.
4. The method for manufacturing the LED display screen according to claim 3, wherein the transparent layer is one of transparent glass or a film.
5. The method for manufacturing the LED display screen according to claim 1, wherein light emitting surfaces of the R, G and B three-color LEDs are attached to the first substrate.
6. The method for manufacturing the LED display screen according to claim 1, wherein the number of the plurality of placing grooves is a multiple of three.
7. The method for manufacturing an LED display screen according to claim 1, wherein at least one LED is placed in the placement grooves, and the number of the LEDs placed in each placement groove is the same.
8. The method for manufacturing the LED display screen according to claim 1, wherein the LED substrate further comprises a metal wire layer and a second substrate, the conductive adhesive layer, the metal wire layer and the second substrate are sequentially stacked, and each LED is fixed on the second substrate through the conductive adhesive layer and is electrically connected with the metal wire layer.
9. The manufacturing method of the LED display screen according to claim 8, wherein the conductive adhesive layer is an ACF adhesive layer, and metal conductive particles are arranged in the ACF adhesive layer so as to electrically connect the LED pins with the metal layer through the metal conductive particles.
10. An LED display screen, characterized in that the LED display screen is prepared by the method for preparing the LED display screen according to any one of claims 1 to 9.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810827538.8A CN110767104B (en) | 2018-07-25 | 2018-07-25 | LED display screen and preparation method thereof |
| PCT/CN2019/097334 WO2020020176A1 (en) | 2018-07-25 | 2019-07-23 | Led display screen and manufacturing method therefor |
| EP19841475.7A EP3828952A4 (en) | 2018-07-25 | 2019-07-23 | Led display screen and manufacturing method therefor |
| US17/257,449 US11769786B2 (en) | 2018-07-25 | 2019-07-23 | LED display screen and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810827538.8A CN110767104B (en) | 2018-07-25 | 2018-07-25 | LED display screen and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110767104A true CN110767104A (en) | 2020-02-07 |
| CN110767104B CN110767104B (en) | 2021-09-28 |
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| US (1) | US11769786B2 (en) |
| EP (1) | EP3828952A4 (en) |
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Also Published As
| Publication number | Publication date |
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| WO2020020176A1 (en) | 2020-01-30 |
| US11769786B2 (en) | 2023-09-26 |
| US20210225931A1 (en) | 2021-07-22 |
| EP3828952A4 (en) | 2022-05-04 |
| EP3828952A1 (en) | 2021-06-02 |
| CN110767104B (en) | 2021-09-28 |
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