JP2006344694A - Enamel substrate for mounting light-emitting element, light-emitting element module, illumination device, display device and traffic signal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an enamel substrate for mounting a light-emitting element which has high rigidity, is sufficient in mounting performance, extendability and usability, and to provide a light-emitting element module in which the light-emitting element is mounted on this substrate, an illumination device, and a display device and a traffic signal which have the light-emitting element module. <P>SOLUTION: The enamel substrate for mounting a light-emitting element in which the surface of a core metal layer is covered with an enamel layer is characterized to have a bending portion on one or more sides of the substrate. The light-emitting element module is characterized in that the light-emitting element is mounted on the enamel substrate for mounting a light-emitting element. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention includes a light emitting element mounting hollow substrate for mounting a plurality of light emitting elements such as light emitting diodes (hereinafter referred to as LEDs), a light emitting element module having the light emitting elements mounted on the substrate, and the light emitting element module. The present invention relates to a lighting device, a display device, and a traffic signal.

In order to integrate a plurality of LEDs into a module, it is necessary to assemble a chip-like LED or an LED supplied in the form of a shell or surface mount package on an electric circuit board. Hereinafter, the LED assembled on the substrate is referred to as an “LED module”.
1A and 1B are diagrams showing an example of a conventional LED module 3. FIG. 1A is a plan view of the LED module 3, and FIG. 1B is a cross-sectional view. This LED module 3 has a configuration in which a plurality of LEDs 2 are arranged and mounted in a lattice shape on the upper surface of a substrate 1 provided with an electric circuit. At the corners of the substrate 1, mounting through holes 4 for mounting the LED modules 3 to a desired apparatus main body are formed.

  In a light-emitting element module such as the LED module, a hollow substrate formed by coating a core metal with a hollow layer can be cited as a substrate on which good heat dissipation is obtained and a large number of LEDs can be mounted.

  In order to improve the light extraction efficiency of the LED 2 to be mounted on the substrate 1, a mortar-shaped reflection cup portion 9 is formed by pressing or cutting the core metal 5 before attaching the enamel layer 6 made of glass. And the LED 2 may be mounted on the bottom surface. 2A and 2B are diagrams illustrating an LED module using the substrate 1 having the reflective cup portion 9, FIG. 2A is a plan view of the reflective cup portion 9, and FIG. 2B is a cross-sectional view. This substrate 1 is formed by covering a core metal 5 made of a steel plate or the like with a hollow layer 6, and a mortar-shaped reflective cup portion 9 is provided on the light emitting element mounting surface, and a conductive layer is provided on the hollow layer 6. A body electrode 7 is provided. The LED 2 is mounted on the bottom surface of the reflection cup portion 9 and is electrically connected to the electrode 7 by a gold wire 8.

  In order to mount a large number of LEDs in an LED module having such a reflective cup portion, it is necessary to provide a large number of reflective cup portions on the substrate as shown in FIG. FIG. 3 is a diagram illustrating an LED module in which a large number of LEDs 2 are mounted on a substrate 10. FIG. 3 (a) is a plan view of the LED module, (b) is a front sectional view, and (c) is a side sectional view. is there. Eleven reflecting cup portions 9 are provided on the upper surface side (light emitting element mounting surface) of the substrate 10, and mounting through holes 4 are formed in the four corners of the substrate 10. The LEDs 2 are mounted on the bottom surfaces of the respective reflective cup portions 9 in the same manner as shown in FIG.

  In such a substrate structure, the core metal of the enamel substrate is in a state of being cut out from one side as the number of reflection cup portions is increased. Therefore, as shown in FIG. 4, the neutral axis (P) in the thickness direction of the substrate 10 and the central axis (Q) of the substrate 10 are displaced, and the neutral axis (P) and the central axis (Q) are shifted. When the enamel treatment is performed in the state, the thermal history given in the treatment process is very high temperature, so that the deformation is caused by the difference in the thermal expansion coefficient between the adhering enamel layer and the core metal. As a result, as shown in FIG. 5, the substrate 10 is warped (R). Further, even for an enamel substrate that does not have the reflective cup portion, warpage may occur due to uneven thickness of the enamel layer attached to the front and back surfaces.

These phenomena are particularly noticeable when the core metal is thin and the substrate area is large. Moreover, it tends to appear remarkably in the longitudinal direction of the substrate.
When the substrate is warped as described above, there is a problem that the flatness of the bottom surface of the reflecting cup portion is lowered, and the LED mounting operation becomes difficult. Further, since the warpage of the substrate becomes large, there is a problem that when mounting with an automatic mounting machine, the height error of the mounting surface and the backlash at the time of mounting occur, making automatic mounting difficult. Furthermore, since the flatness of the bottom surface is lowered, there is a problem that the LED cannot be sufficiently bonded to the substrate, and the LED is easily peeled off from the substrate.

  When using a plurality of LED modules in combination, provide a structure that can supply power to each LED module, or connect each module with an electric wire or use a plug-in type connector terminal. Is used.

  6A and 6B are diagrams illustrating the case where the power supply wire 12 is connected to the LED module 11. FIG. 6A is a plan view of the LED module 11, and FIG. 6B is a front view. The LED module 11 has power supply wires 12 soldered to corners of the light emitting element mounting surface. However, since the enamel substrate is mainly a steel plate, it has a high heat capacity and is difficult to heat. Therefore, the wettability of the solder is very poor, and the soldering work is very difficult. Furthermore, even when the electric wire is attached, when the electric wire is used, the connector needs to be attached to the electric wire, which increases the number of steps. Furthermore, when the LED module 11 is handled, there is a possibility that an expected amount of light cannot be obtained because the electric wire blocks the light beam, and that a part of the light source becomes a shadow of the electric wire and does not become a uniform light emitting surface. was there.

  7 and 8 are diagrams illustrating a structure in which a plurality of LED modules can be connected using plug-in connector terminals, and FIG. 7A is a plan view of the LED module 13 for that purpose. b) is a front view. Moreover, Fig.8 (a) is a top view which shows the state which connected the some LED module, (b) is the front view. This LED module 13 has protrusions (tabs 14) for plug-in connection terminals on both sides of the substrate. An electrode circuit formed on the light emitting element mounting surface is extended on the surface of the tab 14. When this LED module 13 is connected to another LED module 13, as shown in FIG. 8, the insertion type terminal 15 is used, and each tab 14 is inserted into the insertion type terminal 15, thereby each LED module 13. The module 13 is electrically and mechanically connected.

  However, in this method, an extra gap is generated between the LED modules 13 by the length of the plug-in type terminal 15, and a uniform light emitting surface cannot be obtained in the connected state. It was unsuitable for applications that wanted to be arranged in density.

  The present invention has been made in view of the above circumstances, and has a high rigidity, high mountability, a light-emitting element mounting enamel substrate having excellent expandability and usability, a light-emitting element module having a light-emitting element mounted on the substrate, and the It is an object of the present invention to provide a lighting device, a display device, and a traffic signal having a light emitting element module.

  In order to achieve the above object, the present invention is a light-emitting element mounting enamel substrate in which a core metal surface is covered with an enamel layer, and has a bent portion on one or more sides of the substrate. A hollow substrate for mounting a light emitting element is provided.

In the light-emitting element mounting enamel substrate of the present invention, it is preferable that the bent portion includes a side parallel to the longitudinal direction.
The height of the bent part is preferably in the range of 0.5 mm to 0.8 mm.

In the light emitting device mounting enamel substrate of the present invention, it is preferable that the bent portion includes a side parallel to the short side direction.
The height of the bent portion is preferably 5 mm or more.

  In the light-emitting element mounting enamel substrate of the present invention, it is preferable that the bent portion has at least one fixing structure for joining with a bent portion of another substrate.

  In the light emitting device mounting enamel substrate of the present invention, the fixing structure is preferably a through hole having a hole diameter of 2 mm or more.

  In the light emitting element mounting enamel substrate according to the present invention, a light emitting element driving electrical wiring portion is provided on the light emitting element mounting surface of the substrate, and a circuit pattern electrically connected to the electrical wiring portion is provided in the bent portion. It is preferable to be provided.

  The present invention also provides a light emitting element module, wherein a light emitting element is mounted on the light emitting element mounting enamel substrate according to the present invention.

  In the light emitting element module of the present invention, a plurality of light emitting element modules are connected by abutting the bent portions provided on the light emitting element mounting enamel substrate, and each light emitting element module is provided by a fixing structure provided on each bent portion. Is preferably fixed.

  Moreover, this invention provides the illuminating device, display apparatus, and traffic signal apparatus which have the said light emitting element module based on this invention.

Since the enamel substrate for mounting a light emitting element of the present invention is provided with a bent portion on one or more sides of the substrate, the rigidity can be increased as compared with a substrate having a flat plate shape. The degree of occurrence of substrate warpage due to processing can be reduced, the light emitting element mounting position can be flattened, and the mountability and mounting reliability of the light emitting element can be improved.
Since the light emitting device module of the present invention is formed by mounting the light emitting device on the light emitting device mounting hollow substrate of the present invention having high rigidity, the light emitting device module has high rigidity, high connection reliability of the light emitting device, and is inexpensive. Can be provided.
Further, by using the bent portion as a connecting portion with other light emitting element modules, a large number of light emitting element modules can be easily connected without using a terminal for insertion, etc. Sometimes it is possible to reduce the number of man-hours for attaching the electrode wires and the power supply wires to the enamel substrate, improving the workability, and providing a light-emitting element module with a desired area easily and at low cost. it can.
Further, it is possible to substantially eliminate the interval between modules required when using the plug-in type terminal, it is possible to improve the mounting density of the light emitting elements, and to easily arrange the light spots evenly. Therefore, a high quality light source can be provided.
Further, when a plurality of light emitting element modules are combined, the height of the light emitting elements on the mounting surface can be made uniform, and a planar large-area light emitter can be configured.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 9 is a view showing an embodiment of the present invention, FIG. 9 (a) is a plan view of a light emitting element mounting enamel substrate 20A, (b) is a left side view thereof, and (c) is a front view thereof. (D) is the bottom view. A hollow substrate 20A for mounting a light emitting element according to the present embodiment has a rectangular shape in plan view, and a large number of reflecting cup portions 21 are provided on the light emitting element mounting surface, and bent portions 23 are provided on two long sides. . The height of the bent portion 23 is preferably in the range of 0.5 mm to 0.8 mm.

  The basic configuration of the light emitting element mounting enamel substrate 20A of the present embodiment is the same as that of the substrate 1 shown in FIG. That is, the light-emitting element mounting enamel substrate 20A is formed by covering the core metal with the enamel layer 6, and a mortar-shaped reflective cup portion 21 is provided on the light-emitting element mounting surface. An electric wiring portion (not shown) for driving a light emitting element made of a conductor is provided. In addition, mounting through holes 22 are formed in the four corners of the substrate.

  The material for the core metal used for the light emitting element mounting enamel substrate 20A is not particularly limited as long as it is a metal capable of forming a hollow layer firmly on the surface, and for example, a low carbon steel plate or the like is used. The enamel layer covering the core metal is formed by baking glass powder or the like.

  The reflection cup portion 21 provided on the light emitting element mounting surface of the light emitting element mounting enamel substrate 20A is formed in a mortar shape having a flat bottom surface and a slope surface. The slope angle of the slope surface is about 30 ° to 70 °, preferably about 40 ° to 60 °.

An example of the manufacturing method of the light emitting element mounting enamel substrate 20A will be described.
First, a low carbon steel plate or the like for preparing a core metal is prepared, cut into a rectangular shape, and subjected to a bending process on the long side to form a bent portion 23 having a height of 0.5 mm to 0.8 mm. Further, machining is performed to form the reflective cup portion 21 at the light emitting element mounting position, thereby producing a core metal.
Next, the core metal is immersed in a liquid in which glass powder is dispersed in a suitable dispersion medium, a counter electrode is disposed in the vicinity, a voltage is applied between the core metal and the counter electrode, and the glass powder is cored. Electrodeposit on metal surface. After electrodeposition, the core metal is pulled up from the liquid, dried, placed in a heating furnace and heated in a predetermined temperature range, and the glass powder is baked on the surface of the core metal to form a thin and uniform enamel layer. 9A is obtained.

  When a light-emitting element is mounted on the light-emitting element mounting enamel substrate 20A of the present embodiment to form a light-emitting element module, the light-emitting element such as an LED is attached to the bottom surface of the reflective cup portion 21 as shown in FIGS. It is mounted on and electrically connected to the electrical wiring part by a wire such as a gold wire.

  As the light emitting element mounted on the light emitting element mounting enamel substrate 20A, an LED is preferable. When the light emitting element module is applied to a lighting device, a white LED is preferable as the light emitting element. As this white LED, for example, a blue LED made of a gallium nitride (GaN) -based semiconductor is combined with one or more phosphors that are excited by blue light and emit visible light other than blue such as yellow. It is desirable to use a white LED or the like. The phosphor is desirably mixed and dispersed in a transparent resin (not shown) for sealing the light emitting element mounted on the substrate. However, other red, green, or other light emitting LEDs may be used.

  Hereinafter, based on an Example, this invention is demonstrated more concretely.

[Example 1]
A hollow substrate 20A for mounting a light emitting device according to the present invention shown in FIG. 9 was produced.
On the upper surface of the ultra-low carbon steel plate, a mortar-shaped reflection cup portion 21 was provided in a 4 × 7 grid at intervals of 7.5 mm. However, these four corners were not the reflection cup part 21 but the through hole 22 of φ2.5 mm.

A bending portion 23 was formed by bending the long side of the steel sheet in a direction such that the reflective cup portion 21 of the steel sheet was on the front side, and a core metal was obtained.
A hollow material mainly composed of glass was electrodeposited on the surface of the obtained core metal. Thereafter, enamel treatment was performed to form an enamel layer made of glass. The film thickness of the enamel layer was controlled so as to be in the range of 50 to 200 μm. Further, a silver paste or a copper paste was printed on the surface having the cup structure and baked to produce an electric wiring portion for driving the light emitting element, thereby obtaining a light emitting element mounting enamel substrate 20A.

  The dimensions of the thus obtained light-emitting element mounting enamel substrate 20A were 30 mm in width, 52.5 mm in length, and 1.2 mm in substrate thickness, and the substrate height including the bent portion 23 was 2 mm.

  An LED chip as a light emitting element is mounted inside the reflective cup portion 21 of the light emitting element mounting enamel substrate 20A by a method such as die bonding or wire bonding, and electrically connected to the electric wiring portion of the substrate to produce a light emitting element module. did.

  The cross-sectional secondary moment of the light emitting element mounting enamel substrate 20A was about 4.7 times as great as that of the 1.2 mm thick flat plate enamel substrate having the same width.

The height of the warp of the central portion generated in the enamel processing step is 80 μm for the flat plate, and it is difficult to use it with an automatic mounting machine.
On the other hand, the substrate manufactured in this example had a warpage of about 15 μm, the warpage was reduced to about 20%, and even when applied to an automatic mounting machine, it was possible to suppress the warp amount without any problem.
Furthermore, since the total height of the substrate is 2 mm, mounting using an automatic mounting machine or the like was possible. Furthermore, when this automatic mounting machine is used, a groove corresponding to the bent portion provided on the substrate is provided in the conveying system of the automatic mounting machine, so that the fixing to the conveying system can be easily performed.

[Example 2]
A hollow substrate 20B for mounting a light emitting element according to the present invention shown in FIG. 10 was produced. Further, a large number of light emitting elements were mounted on the substrate as shown in FIG. 11 to produce a light emitting element module 24 shown in FIG. 10A is a plan view of a hollow substrate 20B for mounting light emitting elements, FIG. 10B is a front view thereof, FIG. 10C is a left front view thereof, FIG. 10D is a right side view thereof, and FIG. It is. 12A is a plan view of the light emitting element module 24, and FIG. 12B is a front view thereof.

  On the upper surface of the ultra-low carbon steel plate, the reflective cup portions 21 were provided in a 4 × 7 grid at intervals of 7.5 mm. Subsequently, the short side of the steel plate was bent so that the reflecting cup portion 21 of the steel plate was on the front side, and a bent portion 23 was formed. Further, through holes 22 were provided at both corners of the bent portion 23 to produce a core metal.

  An enamel material mainly composed of glass was electrodeposited on the surface of the core metal, and then enamel treatment was performed to form an enamel layer made of glass by baking. The film thickness of the enamel layer was controlled so as to be in the range of 50 to 200 μm.

In the electrodeposition, the surface parallel to the normal direction of the arranged electrode tends to be hard to be covered with glass. Therefore, in this embodiment, the cup is attached so that the electrodeposition is evenly applied to the bent portion. Electrodeposition was performed by providing electrodes not only in the normal direction of the surface to be provided but also in the normal direction of the bent surface.
In addition, even when electrodeposition is performed using this method, there is a concern that the thickness of the glass coating at the bent portion is sufficient, but as a result of conducting a 1000 V withstand voltage test, It was confirmed that there was no pinhole.

  The dimensions of the enamel substrate thus obtained were 30 mm in width, 52.5 mm in length, 1.2 mm in substrate thickness, and the height of the entire substrate including the bent portion 23 was 6.2 mm. Further, two through-holes 22 having a diameter of 2.6 mm were provided in the bent portions 23 provided on both short sides of the substrate. The arrangement of the bent portion 23 and the through hole 22 is left-right asymmetric.

  An electric wiring part capable of driving the LED chip was formed on the upper surface side of this enamel substrate, and a light emitting element mounting enamel substrate 20B shown in FIG. 10 was produced. Further, a circuit pattern was also formed around the through hole 22 provided in the bent portion 23. This circuit pattern was electrically connected to the electrical wiring portion provided on the upper surface side. A circuit as shown in FIG. 11 is configured so that the bent portions A and C, and B and D have the same potential by the wiring.

  Next, an LED chip is mounted inside the reflection cup portion 22 of the light emitting device mounting enamel substrate 20B by a method such as die bonding or wire bonding, and is electrically connected to the electric wiring portion of the substrate to produce the light emitting device module 24. did.

  In the light emitting element module 24 thus obtained, an anode is connected to the position A of the bent portion 23 and a cathode is connected to the position B as shown in FIG. 12, and the LED chip mounted in the reflecting cup portion 21 is operated. did it. For connection between the power supply wire 26 and the module, as shown in FIG. 12B, a connection terminal 25 such as a round connection terminal or a tip-open connection terminal was used.

  Further, the same light emitting element module 24 is prepared, and as shown in FIG. 13, the surfaces C and D of the short side bent portion 23 of one light emitting element module 24 and the surface of the bent portion 23 of the other light emitting element module 24 are prepared. A 'and B' are mated. A φ2.5 mm through hole 22 drilled in the bent portion 23 is passed through a M2.5 pan screw 27 and a nut 28 is tightened to show two surfaces, a surface CD and a surface A′B ′. By fastening in this way, one module and the other module are electrically connected, and the other module can be driven simultaneously by a power source driving the one module. With the two LED modules connected, the light spots of the LEDs maintained a pitch of 7.5 mm, and uniform light emission could be performed on the entire light emitting surface.

  Further, this connection method is not limited to only two connections, but the number of connections can be increased to 3, 4,... According to the capacity of the power supply unit as shown in FIG. 14A is a plan view of a state in which two light emitting element modules 24 are connected, FIG. 14B is a front view thereof, FIG. 14C is a plan view of a state in which three light emitting element modules 24 are connected, and FIG. It is the front view.

In this embodiment, the emphasis is placed on the position alignment and the like, and the fixing method is such that the pan screw 27 is passed through the through hole and the nut 28 is tightened. For example, it may be fixed by clamping with a clamp or the like. Since the bending portion has a height of 5 mm, M2.5 spacers widely used for linking such members and fixing to external cases can be used.
In this embodiment, the bent portions A and B, and C and D of the module are asymmetrical. Therefore, when an incorrect connection is attempted, the positions of the two modules are shifted. Lighting can be prevented.
In addition to the method used in this embodiment, it is desirable to have a structure in which protrusions and the like are provided to prevent connection on the opposite side.

[Example 3]
A light emitting element module 24 according to the present invention shown in FIG. 15 was produced. 15A is a plan view of the light emitting element module 24, FIG. 15B is a front view thereof, FIG. 15C is a left front view thereof, FIG. 15D is a right side view thereof, and FIG.
On the upper surface of the ultra-low carbon steel plate, the reflective cup portions 21 were provided in a 2 × 7 lattice shape at intervals of 7.5 mm. Subsequently, the short side of the steel plate was bent so that the reflective cup portion 21 of the steel plate was on the front side, the bent portion 23 was formed, and a core metal was produced.
Next, the core metal was subjected to enamel treatment in the same manner as in Example 2 to produce an enamel substrate.

  The dimensions of the hollow substrate thus obtained were 15 mm in width, 52.5 mm in length, 1.2 mm in substrate thickness, and the height of the entire substrate including the bent portion 23 was 6.2 mm. One through hole 22 having a diameter of 2.6 mm was provided in the center of the bent portion 23 provided on both short sides of the substrate.

  On the upper surface side of the enamel substrate, an electric wiring part capable of driving the LED chip was produced to obtain a light emitting element mounting enamel substrate. Further, a circuit pattern is also produced around the through hole 22 provided in the bent portion 23. This circuit pattern and the substrate pattern provided on the upper surface side are electrically connected.

  Next, an LED chip was mounted by a method such as die bonding or wire bonding inside the reflection cup portion 21 of the light emitting device mounting enamel substrate, and electrically connected to the electric wiring portion of the substrate to produce a light emitting device module. The electric circuit at this time was configured as shown in FIG.

  In the light emitting element module 24 manufactured in this way, the LED chip mounted on the reflection cup portion 21 could be operated by connecting the anode at the position of the bent portion A and the cathode at the position of the bent portion B.

  Further, the same light emitting element module 24 is prepared, and the bent portion B of one module and the bent portion A 'of the other module are arranged in a face-to-face manner as shown in FIG. It is possible to electrically and mechanically connect one module and the other module by performing fastening such as tightening with a nut through a bolt in a through hole drilled in the bent portion. By connecting a power source to the surface A of the bent portion 23 and the surface B ′ of the bent portion 23 of the other module, the two light emitting element modules 24 can be driven simultaneously.

  In the connected state, the light spot of the LED is continuous at 7.5 mm pitch at the connecting portion between one light emitting element module 24 and the other light emitting element module 24, and emits light uniformly over the entire light emitting surface. Could be done.

Further, this connection method is not limited to two connection, and the number of connections can be increased to three, four,... According to the rated voltage value of the power supply unit.
Further, when this module connection method is used, as shown in FIG. 18, the light emission direction of each module can be rotated around the normal passing through the center of the through hole 22 of the bent portion 23. Therefore, it is possible to irradiate light in various directions.

  Although not adopted in Example 2 and Example 3, in these Examples as well as Example 1, it is possible to produce a module having high bending rigidity by bending the long side portion. It is.

It is a figure which illustrates the conventional LED module, (a) is a top view, (b) is sectional drawing. It is a figure which illustrates the LED module using the board | substrate which has a reflective cup part, (a) is a top view of a reflective cup part, (b) is sectional drawing. It is a figure which illustrates the LED module which mounted many LED on the board | substrate, (a) is a top view of a LED module, (b) is front sectional drawing, (c) is side sectional drawing. FIG. 4 is a front view for explaining a deviation between a neutral axis in the thickness direction and a central axis in the LED module of FIG. 3. It is sectional drawing explaining the curvature of a board | substrate. It is a figure which illustrates the electric wire connection method in the conventional LED module, (a) is a top view of an LED module, (b) is a front view. It is a figure which illustrates the LED module using a plug-in type terminal, (a) is a top view, (b) is a front view. 7 shows a state in which a plurality of LED modules shown in FIG. 7 are connected, (a) is a plan view, and (b) is a front view. It is a figure which shows the hollow substrate for light emitting element mounting produced in Example 1 which concerns on this invention, (a) is a top view, (b) is a left view, (c) is a front view, (d) is a bottom view. It is. It is a figure which shows the hollow substrate for light emitting element mounting produced in Example 2 which concerns on this invention, (a) is a top view, (b) is a front view, (c) is a left view, (d) is a right view. FIG. 4E is a bottom view. FIG. 6 is an electric circuit image diagram of a light emitting element module manufactured in Example 2. It is a figure which shows the light emitting element module produced in Example 2, (a) is a top view, (b) is a front view. It is a figure explaining the connection method of the light emitting element module produced in Example 2. FIG. The connection state of the light emitting element module produced in Example 2 is shown, (a) is a plan view when two units are connected, (b) is a front view when two units are connected, and (c) is a plan view when three units are connected. , (D) is a front view when three units are connected. It is a figure which shows the light emitting element module produced in Example 3, (a) is a top view, (b) is a front view, (c) is a left view, (d) is a right view, (e) is a bottom view. FIG. FIG. 5 is an electric circuit image diagram of a light emitting element module manufactured in Example 3. It is a figure explaining the connection method of the light emitting element module produced in Example 3. FIG. 6 is a front view illustrating a connected state of the light emitting element modules manufactured in Example 3. FIG.

Explanation of symbols

20A, 20B ... Light-emitting element mounting hollow substrate, 21 ... Reflecting cup part, 22 ... Through hole, 23 ... Bending part, 24 ... Light-emitting element module, 25 ... Connection terminal, 26 ... Power supply wire, 27 ... Pan screw, 28 ... Nut.

Claims (13)

  A light-emitting element mounting enamel substrate having a core metal surface coated with a hollow layer, wherein the light-emitting element mounting enamel substrate has a bent portion on one side or more of the substrate.   The enamel substrate for mounting a light emitting element according to claim 1, wherein the bent portion includes a side parallel to the longitudinal direction.   The enamel substrate for mounting a light emitting element according to claim 2, wherein the height of the bent portion is in the range of 0.5 mm to 0.8 mm.   The enamel substrate for mounting a light emitting element according to claim 1, wherein the bent portion includes a side parallel to a short side direction.   The enamel substrate for mounting light-emitting elements according to claim 4, wherein the height of the bent portion is 5 mm or more.   6. The enamel substrate for mounting a light-emitting element according to claim 1, wherein the bent portion has at least one fixing structure for joining with a bent portion of another substrate.   The light emitting element mounting enamel substrate according to claim 6, wherein the fixing structure is a through hole having a hole diameter of φ2 mm or more.   The light emitting element driving surface of the substrate is provided with an electric wiring portion for driving the light emitting element, and the bent portion is provided with a circuit pattern electrically connected to the electric wiring portion. The enamel substrate for light emitting element mounting in any one of 1-7.   A light emitting element module, wherein the light emitting element is mounted on the enamel substrate for mounting the light emitting element according to claim 1.   A plurality of light emitting element modules are connected by abutting bent portions provided on a hollow substrate for mounting light emitting elements, and each light emitting element module is fixed by a fixing structure provided at each bent portion. The light emitting device module according to claim 9.   The illuminating device which has a light emitting element module of Claim 9 or 10.   The display apparatus which has a light emitting element module of Claim 9 or 10. A traffic signal having the light emitting element module according to claim 9.

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